JPS5539687A - Method of and appratus for producing semiconductor device - Google Patents

Method of and appratus for producing semiconductor device

Info

Publication number
JPS5539687A
JPS5539687A JP11394378A JP11394378A JPS5539687A JP S5539687 A JPS5539687 A JP S5539687A JP 11394378 A JP11394378 A JP 11394378A JP 11394378 A JP11394378 A JP 11394378A JP S5539687 A JPS5539687 A JP S5539687A
Authority
JP
Japan
Prior art keywords
pellet
disposed
tool
magnetic force
high magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11394378A
Other languages
Japanese (ja)
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11394378A priority Critical patent/JPS5539687A/en
Publication of JPS5539687A publication Critical patent/JPS5539687A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/79—Apparatus for Tape Automated Bonding [TAB]

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To easily align a salient elctrode of a material having a high magnetic force with an external lead of a similar marerial, which are provided on a semiconductor pellet, for the purpose of subjecting them to gang bonding by pressing them into contact with each other while utilizing a mangetic field.
CONSTITUTION: A semiconductor pellet 19 having a bump 26, i.e. a salient electrode of a material having a high magnetic force is placed on the central portion of a substrate 18 disposed on a stage 17. Films 25 having an external lead 23 of a material also having a high magnetic force are disposed on both sides of the pellet 19. A tape guide having a cross-sectionally V-shaped bore is then placed over the pellet 19, and an end portion of an electromagnet tool 10 having a coil 11 wound therearound is inserted into the bore. A cylinder 13 is disposed on the upper end surface of the tool 10 via a spring 14. In order to bond the bump 26 and lead 23 to each other, the tool 10 is pushed downwardly by the cylinder 13 to press them while generating a magnetic field thereon.
COPYRIGHT: (C)1980,JPO&Japio
JP11394378A 1978-09-14 1978-09-14 Method of and appratus for producing semiconductor device Pending JPS5539687A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11394378A JPS5539687A (en) 1978-09-14 1978-09-14 Method of and appratus for producing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11394378A JPS5539687A (en) 1978-09-14 1978-09-14 Method of and appratus for producing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5539687A true JPS5539687A (en) 1980-03-19

Family

ID=14625077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11394378A Pending JPS5539687A (en) 1978-09-14 1978-09-14 Method of and appratus for producing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5539687A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57117294A (en) * 1981-01-14 1982-07-21 Matsushita Electric Ind Co Ltd Method of soldering part
JPH08241912A (en) * 1996-02-13 1996-09-17 Hitachi Ltd Manufacture for electronic circuit component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57117294A (en) * 1981-01-14 1982-07-21 Matsushita Electric Ind Co Ltd Method of soldering part
JPH08241912A (en) * 1996-02-13 1996-09-17 Hitachi Ltd Manufacture for electronic circuit component

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