JPS55150242A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS55150242A
JPS55150242A JP5836079A JP5836079A JPS55150242A JP S55150242 A JPS55150242 A JP S55150242A JP 5836079 A JP5836079 A JP 5836079A JP 5836079 A JP5836079 A JP 5836079A JP S55150242 A JPS55150242 A JP S55150242A
Authority
JP
Japan
Prior art keywords
resin
seal
back surface
plate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5836079A
Other languages
Japanese (ja)
Inventor
Kenji Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5836079A priority Critical patent/JPS55150242A/en
Publication of JPS55150242A publication Critical patent/JPS55150242A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a resin seal having preferable moisture resistance by fixing a semiconductor element having an electrode on its back surface onto a substrate made partially at least of magnetic substance, connecting therebetween as predetermined, and then bringing the substrate into contact with the resin sealing mold by a magnetically attracting force. CONSTITUTION:A semiconductor element 12 formed with an electrode on its back surface is fixed onto a copper heat dissipating plate 11 with magnetic material coated with nickel plating on the back surface, and electrode terminal on the surface of the element 12 is bonded using wires to the lead terminals 13, 14', 13'' of the lead frame formed on the heat dissipating plate 11. Resin 14 is formed on the radiator plate 11 over the element 12 as a seal, and a resin sealing mold (not shown) having projection for forming the hole 15 is brought into contact with the substrate by utilizing the magnetic material on the back surface of the plate 11 to seal the resin. Thereafter, the mold is removed. Thus, the plate 11 may not move during sealing operation to obtain a seal having high moisture resistance inexpensively.
JP5836079A 1979-05-11 1979-05-11 Manufacture of semiconductor device Pending JPS55150242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5836079A JPS55150242A (en) 1979-05-11 1979-05-11 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5836079A JPS55150242A (en) 1979-05-11 1979-05-11 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS55150242A true JPS55150242A (en) 1980-11-22

Family

ID=13082145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5836079A Pending JPS55150242A (en) 1979-05-11 1979-05-11 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS55150242A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62261133A (en) * 1986-05-08 1987-11-13 Matsushita Electronics Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62261133A (en) * 1986-05-08 1987-11-13 Matsushita Electronics Corp Manufacture of semiconductor device

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