JPS56152242A - Gold foil mounting device - Google Patents

Gold foil mounting device

Info

Publication number
JPS56152242A
JPS56152242A JP5539880A JP5539880A JPS56152242A JP S56152242 A JPS56152242 A JP S56152242A JP 5539880 A JP5539880 A JP 5539880A JP 5539880 A JP5539880 A JP 5539880A JP S56152242 A JPS56152242 A JP S56152242A
Authority
JP
Japan
Prior art keywords
foil
tool
holder
tab
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5539880A
Other languages
Japanese (ja)
Inventor
Takahiro Furuhashi
Masahiro Horii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP5539880A priority Critical patent/JPS56152242A/en
Publication of JPS56152242A publication Critical patent/JPS56152242A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enable to securely mount a gold foil on a lead frame without electric power by allowing a seal holder to hold a tool upon downward movement of the tool and allowing the end of the holder to rub the upper surface of the foil. CONSTITUTION:A lead frame 1 carrying a gold foil 4 on a tab 3 is secured onto the upper surface of a table 12, an elevating block 14 sliding by a cam 16 is engaged with a post 13, and a tool holder 17 having a tool 18 is secured toward the table. When the holder 17 moves downward by a cam 16, the tool 18, because it is formed of metallic elastic body, starts to pinch the foil 4 in the state that it urges the foil 4 downwardly. When the tool is further held by the movement of the cam, it slides to rub the foil 4 on the tab 3. Thus, the relatively soft foil 4 is adhered to the tab 3, and is thus securely connected inexpensively without using a welding machine necessitating large electric power.
JP5539880A 1980-04-28 1980-04-28 Gold foil mounting device Pending JPS56152242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5539880A JPS56152242A (en) 1980-04-28 1980-04-28 Gold foil mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5539880A JPS56152242A (en) 1980-04-28 1980-04-28 Gold foil mounting device

Publications (1)

Publication Number Publication Date
JPS56152242A true JPS56152242A (en) 1981-11-25

Family

ID=12997418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5539880A Pending JPS56152242A (en) 1980-04-28 1980-04-28 Gold foil mounting device

Country Status (1)

Country Link
JP (1) JPS56152242A (en)

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