JPS5215272A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5215272A
JPS5215272A JP9173575A JP9173575A JPS5215272A JP S5215272 A JPS5215272 A JP S5215272A JP 9173575 A JP9173575 A JP 9173575A JP 9173575 A JP9173575 A JP 9173575A JP S5215272 A JPS5215272 A JP S5215272A
Authority
JP
Japan
Prior art keywords
semiconductor device
bump
electrodes
electrode
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9173575A
Other languages
Japanese (ja)
Inventor
Masahiro Sekine
Osamu Tadano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9173575A priority Critical patent/JPS5215272A/en
Publication of JPS5215272A publication Critical patent/JPS5215272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE:To reduce the thermal resistance between the bump electrodes and external electrodes and to improve the electrical characteristics by placing a metal plate between the bump electrode and external electrode.
JP9173575A 1975-07-28 1975-07-28 Semiconductor device Pending JPS5215272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9173575A JPS5215272A (en) 1975-07-28 1975-07-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9173575A JPS5215272A (en) 1975-07-28 1975-07-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5215272A true JPS5215272A (en) 1977-02-04

Family

ID=14034763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9173575A Pending JPS5215272A (en) 1975-07-28 1975-07-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5215272A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63113480U (en) * 1987-01-09 1988-07-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63113480U (en) * 1987-01-09 1988-07-21

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