JPS5346290A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5346290A
JPS5346290A JP12043276A JP12043276A JPS5346290A JP S5346290 A JPS5346290 A JP S5346290A JP 12043276 A JP12043276 A JP 12043276A JP 12043276 A JP12043276 A JP 12043276A JP S5346290 A JPS5346290 A JP S5346290A
Authority
JP
Japan
Prior art keywords
semiconductor device
conductive plate
cathode electrodes
thyristor
disposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12043276A
Other languages
Japanese (ja)
Other versions
JPS5923115B2 (en
Inventor
Masayuki Asaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP51120432A priority Critical patent/JPS5923115B2/en
Publication of JPS5346290A publication Critical patent/JPS5346290A/en
Publication of JPS5923115B2 publication Critical patent/JPS5923115B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41716—Cathode or anode electrodes for thyristors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To avert contact failure between cathode electrodes and a conductive plate by making common the plural cathode electrodes provided on top of a gate turn-off thyristor and disposing the conductive plate over this.
JP51120432A 1976-10-08 1976-10-08 Mesa type semiconductor device Expired JPS5923115B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51120432A JPS5923115B2 (en) 1976-10-08 1976-10-08 Mesa type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51120432A JPS5923115B2 (en) 1976-10-08 1976-10-08 Mesa type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5346290A true JPS5346290A (en) 1978-04-25
JPS5923115B2 JPS5923115B2 (en) 1984-05-30

Family

ID=14786059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51120432A Expired JPS5923115B2 (en) 1976-10-08 1976-10-08 Mesa type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5923115B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138261A (en) * 1979-04-12 1980-10-28 Nec Corp Semiconductor device
JPS5610961A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Semiconductor device
JPS57114279A (en) * 1981-01-08 1982-07-16 Hitachi Ltd Semiconductor device and manufacture thereof
JPS5871656A (en) * 1981-10-23 1983-04-28 Toshiba Corp Pressure contact semiconductor device
JPS6074571A (en) * 1983-09-30 1985-04-26 Toshiba Corp Semiconductor device and manufacture thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138261A (en) * 1979-04-12 1980-10-28 Nec Corp Semiconductor device
JPS6331946B2 (en) * 1979-04-12 1988-06-27 Nippon Denki Kk
JPS5610961A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Semiconductor device
JPS57114279A (en) * 1981-01-08 1982-07-16 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0136271B2 (en) * 1981-01-08 1989-07-31 Hitachi Ltd
JPS5871656A (en) * 1981-10-23 1983-04-28 Toshiba Corp Pressure contact semiconductor device
JPS6074571A (en) * 1983-09-30 1985-04-26 Toshiba Corp Semiconductor device and manufacture thereof
JPH0542815B2 (en) * 1983-09-30 1993-06-29 Tokyo Shibaura Electric Co

Also Published As

Publication number Publication date
JPS5923115B2 (en) 1984-05-30

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