JPS5395584A - Mesa type semiconductor device - Google Patents

Mesa type semiconductor device

Info

Publication number
JPS5395584A
JPS5395584A JP920277A JP920277A JPS5395584A JP S5395584 A JPS5395584 A JP S5395584A JP 920277 A JP920277 A JP 920277A JP 920277 A JP920277 A JP 920277A JP S5395584 A JPS5395584 A JP S5395584A
Authority
JP
Japan
Prior art keywords
type semiconductor
mesa type
semiconductor device
pressing plate
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP920277A
Other languages
Japanese (ja)
Inventor
Tsuneo Tsukagoshi
Yasumasa Saito
Tadashi Utagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP920277A priority Critical patent/JPS5395584A/en
Priority to DE2757821A priority patent/DE2757821C3/en
Publication of JPS5395584A publication Critical patent/JPS5395584A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
    • H01L29/744—Gate-turn-off devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE:To prevent the cathode and gate electrodes from being shortened by avoiding the pending down of Al, through the constitution of the cathode pressing plate enabling to press the most external part at the top of the mesa type semiconductor element and through the uniform contact of the pressing plate for the entire top area even with concave element.
JP920277A 1976-12-28 1977-02-01 Mesa type semiconductor device Pending JPS5395584A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP920277A JPS5395584A (en) 1977-02-01 1977-02-01 Mesa type semiconductor device
DE2757821A DE2757821C3 (en) 1976-12-28 1977-12-23 Method of manufacturing a mesa semiconductor device with pressure contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP920277A JPS5395584A (en) 1977-02-01 1977-02-01 Mesa type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5395584A true JPS5395584A (en) 1978-08-21

Family

ID=11713888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP920277A Pending JPS5395584A (en) 1976-12-28 1977-02-01 Mesa type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5395584A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129836A (en) * 1984-11-29 1986-06-17 Toshiba Corp Pressure-contact semiconductor device
JPH03222365A (en) * 1990-01-26 1991-10-01 Toshiba Corp Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056880A (en) * 1973-09-17 1975-05-17
JPS51121259A (en) * 1975-04-17 1976-10-23 Agency Of Ind Science & Technol Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056880A (en) * 1973-09-17 1975-05-17
JPS51121259A (en) * 1975-04-17 1976-10-23 Agency Of Ind Science & Technol Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129836A (en) * 1984-11-29 1986-06-17 Toshiba Corp Pressure-contact semiconductor device
JPH03222365A (en) * 1990-01-26 1991-10-01 Toshiba Corp Semiconductor device

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