JPS53110465A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS53110465A JPS53110465A JP2619577A JP2619577A JPS53110465A JP S53110465 A JPS53110465 A JP S53110465A JP 2619577 A JP2619577 A JP 2619577A JP 2619577 A JP2619577 A JP 2619577A JP S53110465 A JPS53110465 A JP S53110465A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mitigating
- metals
- electrodes
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To manufacture the element having high adhering strength for electrodes, by mitigating the conditions given to the types of metals in contact with the semiconductor substrate, in laminated metallic electrode constitution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2619577A JPS53110465A (en) | 1977-03-09 | 1977-03-09 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2619577A JPS53110465A (en) | 1977-03-09 | 1977-03-09 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53110465A true JPS53110465A (en) | 1978-09-27 |
JPS6155785B2 JPS6155785B2 (en) | 1986-11-29 |
Family
ID=12186700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2619577A Granted JPS53110465A (en) | 1977-03-09 | 1977-03-09 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53110465A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5728359A (en) * | 1980-07-28 | 1982-02-16 | Fujitsu Ltd | Semiconductor device |
JPS582023A (en) * | 1981-06-26 | 1983-01-07 | Internatl Rectifier Corp Japan Ltd | Planar type semiconductor device |
JPS5954960U (en) * | 1982-10-02 | 1984-04-10 | ロ−ム株式会社 | Electrode structure of semiconductor devices |
JP2012123184A (en) * | 2010-12-08 | 2012-06-28 | Sumitomo Electric Ind Ltd | Semiconductor optical modulation element and method for manufacturing the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5183776A (en) * | 1975-01-20 | 1976-07-22 | Matsushita Electronics Corp | HANDOTAISOSHINOSEIZOHOHO |
JPS51141578A (en) * | 1975-05-19 | 1976-12-06 | Nat Semiconductor Corp | Method of forming gang connecting bump for integrated circuits |
JPS523383A (en) * | 1975-06-24 | 1977-01-11 | Nec Corp | Manufacturing method of semiconductor device electrode |
-
1977
- 1977-03-09 JP JP2619577A patent/JPS53110465A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5183776A (en) * | 1975-01-20 | 1976-07-22 | Matsushita Electronics Corp | HANDOTAISOSHINOSEIZOHOHO |
JPS51141578A (en) * | 1975-05-19 | 1976-12-06 | Nat Semiconductor Corp | Method of forming gang connecting bump for integrated circuits |
JPS523383A (en) * | 1975-06-24 | 1977-01-11 | Nec Corp | Manufacturing method of semiconductor device electrode |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5728359A (en) * | 1980-07-28 | 1982-02-16 | Fujitsu Ltd | Semiconductor device |
JPS582023A (en) * | 1981-06-26 | 1983-01-07 | Internatl Rectifier Corp Japan Ltd | Planar type semiconductor device |
JPS5954960U (en) * | 1982-10-02 | 1984-04-10 | ロ−ム株式会社 | Electrode structure of semiconductor devices |
JPH0440271Y2 (en) * | 1982-10-02 | 1992-09-21 | ||
JP2012123184A (en) * | 2010-12-08 | 2012-06-28 | Sumitomo Electric Ind Ltd | Semiconductor optical modulation element and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6155785B2 (en) | 1986-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |