JPS5358765A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5358765A JPS5358765A JP13349276A JP13349276A JPS5358765A JP S5358765 A JPS5358765 A JP S5358765A JP 13349276 A JP13349276 A JP 13349276A JP 13349276 A JP13349276 A JP 13349276A JP S5358765 A JPS5358765 A JP S5358765A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- thick film
- solder
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE:To perform adjustment of solder amount by bonding a heat sink to the thick film conductor part within a thick film insulation frame body through the use of Sn-Pb base solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13349276A JPS5358765A (en) | 1976-11-06 | 1976-11-06 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13349276A JPS5358765A (en) | 1976-11-06 | 1976-11-06 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5358765A true JPS5358765A (en) | 1978-05-26 |
Family
ID=15106023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13349276A Pending JPS5358765A (en) | 1976-11-06 | 1976-11-06 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5358765A (en) |
-
1976
- 1976-11-06 JP JP13349276A patent/JPS5358765A/en active Pending
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |