JPS5773933U - - Google Patents

Info

Publication number
JPS5773933U
JPS5773933U JP1980149864U JP14986480U JPS5773933U JP S5773933 U JPS5773933 U JP S5773933U JP 1980149864 U JP1980149864 U JP 1980149864U JP 14986480 U JP14986480 U JP 14986480U JP S5773933 U JPS5773933 U JP S5773933U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980149864U
Other languages
Japanese (ja)
Other versions
JPS6133643Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980149864U priority Critical patent/JPS6133643Y2/ja
Publication of JPS5773933U publication Critical patent/JPS5773933U/ja
Application granted granted Critical
Publication of JPS6133643Y2 publication Critical patent/JPS6133643Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1980149864U 1980-10-21 1980-10-21 Expired JPS6133643Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980149864U JPS6133643Y2 (en) 1980-10-21 1980-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980149864U JPS6133643Y2 (en) 1980-10-21 1980-10-21

Publications (2)

Publication Number Publication Date
JPS5773933U true JPS5773933U (en) 1982-05-07
JPS6133643Y2 JPS6133643Y2 (en) 1986-10-01

Family

ID=29509238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980149864U Expired JPS6133643Y2 (en) 1980-10-21 1980-10-21

Country Status (1)

Country Link
JP (1) JPS6133643Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary
JPS6229896B2 (en) * 1981-05-15 1987-06-29 Shinkawa Kk

Also Published As

Publication number Publication date
JPS6133643Y2 (en) 1986-10-01

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