JPS57188839A - Vertical moving mechanism for capillary - Google Patents

Vertical moving mechanism for capillary

Info

Publication number
JPS57188839A
JPS57188839A JP56074027A JP7402781A JPS57188839A JP S57188839 A JPS57188839 A JP S57188839A JP 56074027 A JP56074027 A JP 56074027A JP 7402781 A JP7402781 A JP 7402781A JP S57188839 A JPS57188839 A JP S57188839A
Authority
JP
Japan
Prior art keywords
capillary
shaft
bearing
motor
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56074027A
Other languages
Japanese (ja)
Other versions
JPS6229896B2 (en
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56074027A priority Critical patent/JPS57188839A/en
Publication of JPS57188839A publication Critical patent/JPS57188839A/en
Publication of JPS6229896B2 publication Critical patent/JPS6229896B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Abstract

PURPOSE:To reduce the load of a motor, and to accelerate the speed of vertical motion of the capillary by utilizing an eccentric shaft for the vertical motion of a bonding arm. CONSTITUTION:The bonding arm 11 holding the capillary 10 is fixed to a supporting shaft 15 mounted to a head frame 13 fastened to an XY feeder 12 plane- moving in the XY directions, and energized by means of a spring 22 hung to the hook 20 of the supporting shaft 15 and the hook 21 of a driving block 17 and contacted with a contact bar 18. The eccentric shaft 33 consisting of the amount of eccentricity (e) to which a bearing 32 is set up is fixed to the driving shaft of the motor 31, and the bearing 32 is held by two connecting pins 35, 36 fastened to a driving arm 34 fixed to the driving block 17. Accordingly, the bearing 32 mounted to the eccentric shaft 33 is elevated only by (e) through the revolution of the motor 31, the bonding arm 11 is turned in the A direction centering around the supporting shaft 15, and the capillary 10 is dropped.
JP56074027A 1981-05-15 1981-05-15 Vertical moving mechanism for capillary Granted JPS57188839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074027A JPS57188839A (en) 1981-05-15 1981-05-15 Vertical moving mechanism for capillary

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074027A JPS57188839A (en) 1981-05-15 1981-05-15 Vertical moving mechanism for capillary

Publications (2)

Publication Number Publication Date
JPS57188839A true JPS57188839A (en) 1982-11-19
JPS6229896B2 JPS6229896B2 (en) 1987-06-29

Family

ID=13535232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074027A Granted JPS57188839A (en) 1981-05-15 1981-05-15 Vertical moving mechanism for capillary

Country Status (1)

Country Link
JP (1) JPS57188839A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124971A (en) * 1973-04-02 1974-11-29
JPS5055263A (en) * 1973-09-12 1975-05-15
JPS53144262A (en) * 1977-05-23 1978-12-15 Toshiba Corp Bonding unit for semiconductor device
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS5773933U (en) * 1980-10-21 1982-05-07

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124971A (en) * 1973-04-02 1974-11-29
JPS5055263A (en) * 1973-09-12 1975-05-15
JPS53144262A (en) * 1977-05-23 1978-12-15 Toshiba Corp Bonding unit for semiconductor device
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS5773933U (en) * 1980-10-21 1982-05-07

Also Published As

Publication number Publication date
JPS6229896B2 (en) 1987-06-29

Similar Documents

Publication Publication Date Title
ES2029328T3 (en) PLUNGER DRIVE APPARATUS IN LABEL FIXERS.
KR900009409A (en) Package Rotator
HK1000178A1 (en) Device for carrying out the readying movement of a work piece towards a work station
FR2364073A1 (en) CRANK DRIVE MECHANISM FOR PILGRIM STEP ROLLER OR EQUIVALENT MACHINE
CA2009587A1 (en) Coordinate measuring machine with improved carriage drive system
HK91595A (en) Washing machine with a fastening device for the driving motor
JPS57188839A (en) Vertical moving mechanism for capillary
EP0474260A3 (en) Looping the loop during with cardan suspended gondola for passengers
DK0742170T3 (en) Apparatus for supplying a continuously arriving tape to a station where the tape is processed while stationary
FR2360379A1 (en) Workpiece transfer machine for prodn. line - has rotary cams swaying portal frame mountings with blade spring legs
DE3772118D1 (en) DEVICE FOR DRIVING A VIBRATING PRE-GRIPPER OF A PRINTING MACHINE.
IT8720769A0 (en) DEVICE FOR TRANSFORMING A UNIFORM ROTARY MOTION INTO AN ALTERNATIVE ROTARY MOTION, PARTICULARLY SUITABLE FOR TEXTILE LOOMS.
JPS6452498A (en) Moving apparatus of span call case in sewing machine
GB1503038A (en) Conveyor drive units
SU444585A1 (en) Device for stamping parts
JPS57188840A (en) Load variable mechanism in wire bonder
SU1596156A1 (en) Automatic gearbox
FR2507983B1 (en) DEVICE FOR EXECUTING AN ALTERNATIVE MOTION ON A WINDSCREEN WIPER ARM
SU889153A1 (en) Pendulum-type mechanism for sorting piece elongated objects
KR910013502A (en) Tool holding mechanism for bonder
GB857874A (en) Improvements in or relating to stencilling machines
DE3267454D1 (en) A mold oscillation apparatus for curved-type continuous casting machines
KR860000382B1 (en) Endless chain controller for filter plate removing of filter press
GB1165833A (en) Mechanism for Child's Ride
JPH0140589Y2 (en)