JPH0442555A - Pickup apparatus for chip-shaped part and pickup method - Google Patents

Abstract

PURPOSE:To reduce frequency in generation of fault of chip-shaped parts at the time of pickup operation by lowering adhesive force by irradiating, with an energy beam, the region where the angled portions of chip-shaped parts are fixed with adhesive force, and sticking upward a plurality of areas spaced apart in the length more than the specified distance on the diagonal line of the square bottom surface with a sticking means which collides with an adhesive tape from the opposite side of the adhesive surface. CONSTITUTION:A sticking pin 3d is arranged at the position spaced apart by 5% or more of the diagonal line of the bottom surface from the angled area of a semiconductor chip 2 fixed in the region irradiated by the ultraviolet ray and is in contact from the rear side of an expand tape 1. Only the angled part of each semiconductor chip 2 is irradiated with the ultraviolet ray from a ultraviolet ray source 6. After irradiation of the ultraviolet ray, a mask 7 is removed and the semiconductor chip 2 is sticked upward by a sticking means having the sticking pins 3a to 3d. At the time of sticking operation, since a semiconductor chip 2 is sticked up at a plurality of points with the sticking pins 3a to 3d, stress generated by the sticking operation is not concentrated to the one point and is dispersed. Thereby frequency of generation of defects such as crack and missing in the semiconductor chip 2 may be reduced.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for peeling off chip-shaped components such as semiconductor chips that are adhesively fixed to an adhesive tape such as an expandable tape one by one from the adhesive tape. The present invention relates to a device and method for picking up.

[Conventional technology]

In the manufacturing process of semiconductor devices, hybrid ICs, etc., chip-shaped components such as semiconductor chips that are adhesively fixed on adhesive tape such as expandable tape are peeled off from the adhesive tape, picked up, and placed on a predetermined substrate. Die bonding and storage in a predetermined tray are performed. Then, in order to make it easier for the chip-shaped component to peel off from the adhesive tape, the chip-shaped component is pushed up from the back side of the adhesive tape (the side to which the chip-shaped component is not fixed) using a push-up bottle to facilitate the peeling of the adhesive tape. is being carried out.

However, chip-shaped components picked up from adhesive tapes as described above, especially recent large-scale integrated circuit devices, have become larger and flatter.

For this reason, excessive stress is applied to the chip-shaped component when the chip-shaped component is pushed up, and the frequency with which defects such as cracks and chips occur in the chip-shaped component increases. Under these circumstances, it has been proposed to use a plurality of push-up bins to push up each corner of the chip-like component, thereby preventing the concentration of stress that occurs in the chip-like component during push-up, and thereby reducing the frequency of defects in the chip-like component. Ta. Furthermore, by biasing one of the plurality of push-up bins toward the center of the chip-shaped component, it is possible to promote peeling of the adhesive tape and reduce the frequency of defects occurring in the chip-shaped component during pickup. proposed (for example, Jitsugan 1986-562)
(See No. 63).

Moreover, some adhesive tapes are known to have their adhesive strength reduced by being irradiated with energy rays such as ultraviolet rays. Therefore, in order to reduce defects that occur in chip-shaped parts when they are picked up from above the adhesive tape, it is desirable to irradiate the adhesive tape with energy rays such as ultraviolet rays before picking up the chip-shaped parts.

[Problem to be solved by the invention]

However, when the entire surface of the adhesive tape is irradiated with energy rays such as ultraviolet rays in order to weaken the adhesive strength of the adhesive tape, the adhesive strength of the entire adhesive tape decreases. For this reason, −
While picking up one chip-like part, other chip-like parts may be displaced from their fixing positions or may come off from the adhesive tape. In addition, if you pick up a part of the chip-like parts that are adhesively fixed on the adhesive tape and try to store the remaining chip-like parts with the remaining chip-like parts adhesively fixed on the adhesive tape, some external force may be applied during storage. However, there are inconveniences such as the fixed position of the chip-shaped component being shifted or the chip-shaped component peeling off from the adhesive tape, and it is not suitable for re-storing the chip-shaped component.

Therefore, in view of the above-mentioned circumstances, the present invention aims to reduce the frequency of occurrence of defects in chip-shaped parts during pickup, and to re-save chip-shaped parts left on the adhesive tape while adhesively fixed with strong adhesive force. The purpose is to make it possible.

[Means to solve the problem]

In order to achieve the above-mentioned object, in the present invention, energy rays such as ultraviolet rays are irradiated to the adhesive surface of the adhesive tape, where the corners of the chip-shaped parts are adhesively fixed, to increase the adhesive strength of that area. At the same time, from the corner of the chip-like component fixed to the area irradiated with the energy beam, it comes into contact with the adhesive tape from the side opposite to the adhesive surface at multiple locations that are 5% or more away from the diagonal length of the rectangular bottom surface. The chip-shaped component is pushed up by the pushing up means.

[Effect]

By doing so, concentration of stress generated in the chip-shaped component when the chip-shaped component is pushed up is prevented, and the frequency of occurrence of defects in the chip-shaped component due to pushing up is reduced. In addition, the adhesive tape peels off from the negative part of the chip-shaped component fixed to the part where the adhesive strength has decreased due to UV irradiation, and this causes the adhesive tape to peel off smoothly from the entire bottom surface of the chip-shaped component. be done.

[Example] Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.

FIG. 1 schematically shows the characteristic parts of a semiconductor chi-knob pickup device to which the present invention is applied. This pickup device pushes up a plurality of semiconductor chips 2 adhesively fixed to the adhesive surface of the expandable tape 1 one by one from the back side of the expandable tape 1 (the side where the semiconductor chips 2 are not adhesively fixed). Push-up bottle 3a~3
d, and a collet 5 for sucking and holding the pushed up semiconductor chips 2 one by one from the front side of the expand band tape 1 and peeling them off from the expand band tape 1.
, an ultraviolet source 6 that irradiates ultraviolet rays from the back side of the expandable tape 1, and a mask 7 that is placed between the ultraviolet source 6 and the expandable tape 1 and that transmits the ultraviolet rays only in a predetermined portion. We are prepared. An adhesive material whose adhesive strength decreases when irradiated with ultraviolet rays is applied to the front side of the expanded tape 1, and the expanded tape 1 is made of a stretchable resin or the like that transmits ultraviolet rays. Therefore, if the extended tape 1 is irradiated with ultraviolet rays from the back side, the adhesive strength of the portion irradiated with ultraviolet rays will be reduced. The mask 7 is formed with a through hole 7a perforated in such a portion so that only the portion corresponding to the corner of each semiconductor chip 2 fixed to the expandable tape 1 transmits ultraviolet rays, or , only that part is made of UV-transparent material. Therefore, when the ultraviolet rays are irradiated from the ultraviolet ray source 6 to the extract band tape 1 with this mask 7 in between, each semiconductor chip 2 of the portion of the extract band tape 1 where each semiconductor chip 2 is fixed is
The adhesive force is reduced only in the areas where the corners of the tape are fixed. That is, in this embodiment, the mask 7 and the ultraviolet source 6 constitute an ultraviolet irradiation means that irradiates ultraviolet rays only to the portions where the corners of each semiconductor chip 20 are fixed.

The push-up means for pushing up the semiconductor chip 2 from the back side of the expanded tape 1 includes the four push-up pins 38 to 3d as described above. These push-up bottles are placed at four locations at least 5% of the diagonal length of the rectangular bottom of the semiconductor chip 2 from the corner of the semiconductor chip 2 fixed to the part where the adhesive strength has decreased due to irradiation with ultraviolet rays. It comes into contact with the back side of the expandable tape 1 and pushes up the semiconductor chip 2. Figure 2 shows push-up pin 3.
The arrangement of a to 3d is shown enlarged in relation to the bottom surface of the semiconductor chip 2. Note that in the figure, the hatched area is the area irradiated with ultraviolet light. As shown, in this embodiment, there are four push-up bins 38-3.
Among the push-up pins 3a to 3C of the push-up pins 3a to 3C are placed in positions where they come into contact from the back side of the expandable tape 1 to the corners of the semiconductor chip 2, which are fixed in areas not irradiated with ultraviolet rays, and the push-up pins 3d are irradiated with ultraviolet rays. from the corner of the semiconductor chip 2 that is fixed to the part where the tape comes into contact with the back side of the expandable tape 1 at a position that is 5% or more away from the diagonal length of the bottom surface (a position near the center of the semiconductor chip 2). It is located.

Next, a description will be given of how the semiconductor chip on the extended tape is picked up by the pickup device described above.

First, when the expandable tape 1 to which a plurality of semiconductor chips 2 are adhesively fixed is set in a pickup device, the mask 7 is positioned in accordance with the arrangement of the semiconductor chips 2. The ultraviolet light source 6 irradiates only the corners of each semiconductor chip 2 with ultraviolet light. After the ultraviolet irradiation, the mask 7 is removed, and the semiconductor chip 2 is pushed up by a pushing up means having push up pins 3a to 3d. During this push-up, the semiconductor chip 2 is pushed up at multiple locations by the push-up bins \3a to 3d.
Stress caused by push-up is no longer concentrated in one place, but is now dispersed, causing defects such as cracks and chips to occur on the semiconductor chip 2.
The frequency with which this occurs has been reduced. Then, when the semiconductor chip 2 is pushed up, the adhesive strength of the part irradiated with ultraviolet rays has decreased, so that the expandable tape 1 is peeled off from the corner part of the semiconductor chip 2 fixed there. 5 of the diagonal length from the corner of this semiconductor chip 2
Since there is no push-up bottle within 5%, the expandable tape 1 starts to peel off from the corner, and the expandable tape 1 within a radius area of at least 5% of the diagonal length from the corner starts to peel off. This situation is shown in FIG. The semiconductor chip 2 is pushed up by the collet 5 positioned above the semiconductor chip 2.
is held by suction, and as the collet 5 rises, the semiconductor chip 2 is peeled off from the expanded tape 1 and picked up. Note that at this time, the semiconductor chip 2
When a part of the outer periphery of the adhesive area to which is adhesively fixed (in this example, the corner part of the semiconductor chip 2 which is fixed to the area irradiated with ultraviolet rays) peels off, the peeling of that part triggers Even if the adhesive strength of the entire adhesive area is not reduced, peeling progresses smoothly over the entire adhesive area. Therefore, even if the semiconductor chip is large and flat, the semiconductor chip can be easily peeled off from the expanded tape and picked up without increasing the vacuum suction force of the collet 5.

Furthermore, even if a part of the semiconductor chips 2 adhesively fixed on the expandable tape 1 is picked up and the remaining semiconductor chips 2 are to be stored while being adhesively fixed on the expandable tape 1, Since the area irradiated with ultraviolet rays is limited and the adhesive strength of the entire adhesive area where the semiconductor chip 2 is fixed is not reduced, the semiconductor chip 2 left on the expandable tape 1 is attached with a strong adhesive. It is possible to re-save it while it is firmly fixed with adhesive.

By the way, the above-mentioned ultraviolet ray irradiation itself involves condensing the ultraviolet rays emitted from the ultraviolet source 6 and guiding the ultraviolet rays by a light guide or the like to direct a spot light of the ultraviolet rays to the corner of each semiconductor chip 2. It is also possible to irradiate each time sequentially. However, as in the above-described embodiment, the mask 7
Once UV irradiation is performed all at once using a push-up device, the semiconductor chips can be picked up in just two steps: the push-up process using the push-up means and the pick-up process using the collet. It is possible to shorten the time (takt time).

Next, the results of an experiment in which the present invention was applied to picking up a 51-square semiconductor chip will be described.

The adhesive fixing force of semiconductor chips is about 300 before UV irradiation.
g, and the adhesive fixing force after irradiating ultraviolet rays to the portion where the corner of the semiconductor chip was fixed was 250 g.

In this case, when I performed the pickup mentioned above,
The frequency of defects such as cracks in semiconductor chips that occur during push-up can be reduced by irradiating the entire adhesive area with ultraviolet rays and increasing the adhesive strength by 100%.
This was comparable to the conventional case in which the temperature was lowered to g. In addition, since the portion where the adhesive strength is reduced by irradiation with ultraviolet rays is limited, the semiconductor chip 2 left on the expanded tape 1 could be re-preserved with sufficient adhesive strength for re-preservation.

Note that the present invention is not limited to the embodiments described above, and various modifications are possible.

For example, in the above-mentioned embodiment, an example is shown in which the present invention is applied to the pickup of a semiconductor chip 1 that is adhesively fixed on an expanded band tape 1, but the present invention is not limited to this, and the adhesive The present invention is also applicable to picking up chip-shaped components such as chip capacitors and chip resistors that are adhesively fixed to tape.

Furthermore, in the above-mentioned embodiments, ultraviolet rays are used as the energy rays, but depending on the adhesive material used in the adhesive tape such as expanded tape, it is also possible to use energy rays that can efficiently reduce the adhesive strength of the adhesive tape. Preferably, for example, for an adhesive tape coated with an adhesive whose adhesive strength is efficiently reduced by irradiation with infrared rays,
It is preferable to use infrared rays as the energy beam.

Furthermore, regarding the pushing up means, in the above-mentioned embodiments,
Although the configuration has four push-up pins, the push-up pins do not necessarily need to be provided, and the portion that contacts the adhesive tape such as the expandable tape may be flat. Even in this case, it can be said that the adhesive tape contacts the adhesive tape at a plurality of locations when viewed microscopically. However, in this case, measures such as cutting out the part to prevent the push-up means from coming into contact within a radius of 5% of the diagonal length from the corner of the semiconductor chip fixed to the part to be irradiated with ultraviolet rays should be taken. It is necessary to take the following steps.

[Effects of the Invention] As explained above, according to the present invention, concentration of stress that occurs in chip-shaped parts when pushing up the chip-shaped parts is prevented, and the frequency of occurrence of defects such as cracks in the chip-shaped parts due to pushing up is reduced. yield is improved.

In addition, the adhesive tape peels off from the corner of the chip-shaped component fixed to the part where the adhesive strength has decreased due to UV irradiation, and this causes the adhesive tape to peel off smoothly from the entire bottom surface of the chip-shaped component. be done. Therefore, it is possible to pick up chips smoothly without reducing the adhesive strength of the entire adhesive area where chip-shaped parts are adhesively fixed, and even when UV rays are irradiated all at once, the chip-shaped parts left on the adhesive tape can be picked up easily. It is possible to re-store parts while fixing them on adhesive tape with strong adhesive force.

[Brief explanation of drawings]

FIG. 1 is a diagram schematically showing the characteristic parts of a pickup device to which the present invention is applied, FIG. 2 is a diagram showing the arrangement of push-up pins in relation to the bottom surface of a semiconductor chip, and FIG. FIG. 3 is a diagram showing how the stretch tape peels off from the corner portion. 1... Exband tape, 2... Semiconductor chip,
3a, 3b, 3c, 3d... push-up pin, 5...
Collet, 6...UV source, 7...Mask.

Claims (1)

[Claims] 1. A collet holds a plurality of chip-shaped parts adhesively fixed to the adhesive surface of an adhesive tape with a rectangular bottom surface whose adhesive strength decreases by irradiation with energy rays, and the components are peeled off from the adhesive tape and picked up. The device comprises a means for irradiating an energy beam onto a portion of the adhesive surface to which a corner of each chip-like component is fixed, out of a portion of the adhesive surface to which each chip-like component is adhesively fixed; from the corner of the chip-like part fixed to the part where the chip-like part is attached, and pushes up the chip-like part by coming into contact with the adhesive tape from the side opposite to the adhesive surface at multiple locations separated by 5% or more of the diagonal length of the rectangular bottom surface. A pick-up device for chip-shaped parts, comprising a push-up means. 2. A method in which a plurality of chip-shaped parts, whose adhesive strength decreases due to irradiation with energy rays, are adhesively fixed to the adhesive surface of the adhesive tape at the rectangular bottom surface, are held one by one by a collet, and are picked up by being peeled off from the adhesive tape. a step of irradiating an energy beam to a portion of the adhesive surface where each chip-like component is adhesively fixed, a portion where a corner of each chip-like component is fixed; and a step of irradiating the portion irradiated with the energy beam. a step of pushing up the chip-like component by abutting against the adhesive tape from the opposite side to the adhesive surface at multiple locations spaced apart by 5% or more of the diagonal length of the rectangular bottom from the corner of the chip-like component fixed to the corner of the chip-like component; A method for picking up chip-like parts, characterized by comprising: