CN100388446C - Sticking and positioning technology based system and method for chip substrate packaging - Google Patents
Sticking and positioning technology based system and method for chip substrate packaging Download PDFInfo
- Publication number
- CN100388446C CN100388446C CNB2004100461409A CN200410046140A CN100388446C CN 100388446 C CN100388446 C CN 100388446C CN B2004100461409 A CNB2004100461409 A CN B2004100461409A CN 200410046140 A CN200410046140 A CN 200410046140A CN 100388446 C CN100388446 C CN 100388446C
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- carrier plate
- heat
- positioning technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000005516 engineering process Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 238000005538 encapsulation Methods 0.000 claims description 39
- 239000003292 glue Substances 0.000 claims description 30
- 229920000297 Rayon Polymers 0.000 claims description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 239000006071 cream Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000004807 localization Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 45
- 238000012536 packaging technology Methods 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 16
- 230000000694 effects Effects 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000009955 peripheral mechanism Effects 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 pottery Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention discloses a system based on a sticking positioning technique and a method thereof, which can be used for packaging chip substrates. When the method of the present invention is used, a traditional chip packaging technology can be improved. A plurality of chip substrates are placed on a carrier plate and are fixed by heat-resisting adhesive, and chips and relevant electronic parts are installed on the chip substrates through a traditional chip placing technology production line. The production efficiency can be improved, and a large amount of time cost can be saved. The system of the present invention is composed of substrate sticking positioning modules with a substrate sticking positioning function and chip packaging modules.
Description
Technical field
The present invention relates to a kind of chip substrate encapsulation technology method and system of (can replace VPT, Virtual Panel Tooling), it has the ability of improving the traditional die encapsulation technology, and traditional VPT production line is improved to save production cost; And now the indivedual boards with the Chip Packaging production line still can use, and can have low-cost the improvement and the invention of big effect is arranged, and can be used for the place of most of traditional crystal covered chip production lines.
Background technology
As relevant industry cognitive, the capability improving of Chip Packaging production line (as VPT) volume production is that various in recent years chip substrates encapsulates and the foundry vendor actively researches and develops and the project of construction, quote and the shortening of annual repairs service time and the production procedure of its employed technical approach such as tool vacuum fixing base ability board improves or the like the place applicable to various electronic chip application substrates encapsulation, so that reduce maintenance cost and the time cost demand is achieved; As the chip substrate sub-assembly of the numerous small parts of tool, if can use simple and easy effective placement substrate then can avoid the generation possibility of many wastes in man-hour; Similar ground, aspect the improving of mechanical performance, the maintenance period of a certain work board then represent the lifting of production capacity, so production cost is minimized if can prolong; Production procedure so far improves the very important improvement project that can be described as, because the board of Chip Packaging mostly is the machinery that accurate industry is manufactured specially, slightly change, often of a high price, but the board characteristic that can cooperate Chip Packaging is made the improvement of peripheral flow process, relative cost is lower and achieve noticeable achievement, and improving theory at this traditional similar industrial engineering process can use.
(comprising BGA (ball-type palisade multiple substrate), CSP (chip specification base plate for packaging), Flip Chip (covering brilliant substrate) three major types) aspect the IC substrate, wherein the IC substrate amplitude of growing up in recent years is big.Ground such as Taiwan, Korea S and continent are positive in recent years expands the output that increases laminar substrate and continues investment Laser drill machine equipment, makes the competitiveness on its increase substrate production.Following because the compact demand trend of portable electronic product, to impel circuit board towards graph thinning and micropore technical development, add the compact package development of technology, also make the demand of high-order IC substrate improve, the related small size Chip Packaging prospect a slice that makes is good.In order to satisfy the demand of mobile phone board, communication product and auto industry, expect the sustainable development again of following small size Chip Packaging.Therefore be necessary Chip Packaging is done a technical exploitation and a breakthrough.
Though BGA, CSP and Flip chip assembling structure change the extensive application that the relatively more maximum difference of many and traditional Lead frame type structure dress is organic material; Can find the trace of organic materials such as Polyimide, BT, Epoxy from substrate, Solder mask, encapsulating material.Observe from the relevant processing procedure of these materials, its technical connotation is very abundant; Generally can be divided into technology such as substrate manufacture (comprise as raw material exploitation, pressing, etching, increase layer, plating etc.), the exploitation of liquid sealing prescription, the product application of structure dress and reliability test analysis.No matter to raw material developer (chemicals factory), substrate manufacture person (plant substrate) or package design and producer (semiconductor factory, encapsulation factory), understand these materials and processing procedure thereof, further suitable design and the selection of material, should be the only effective means of grasping ultimate BGA, CSP and Flip chip structure dress, the improvement of processing procedure Taiwan science and technology speciality already especially especially.
(wherein be printed onto put brilliant processing procedure indicate precision) as shown in Figure 1, in the existing chip packing producing line, a kind of Chip Packaging sub-assembly is arranged, it has the demand of mounting electronic part and chip, and substrate is generally small pieces tool circuit concatenation ability (similar printed circuit board (PCB)), and generally have the configuration of relatively large chip, therefore the configuration of Chip Packaging production line is generally (placing substrate on carrier)-(printing process)-(putting the part processing procedure)-(putting brilliant processing procedure)-(back welding process)-(follow-up encapsulation procedure), the similar SMT production line of printing process paste solder printing wherein, put the part processing procedure then for placing electronic component, yet substrate is positioned over behind the carrier by (tin cream) printing process and enters behind the production line to the back welding process, the production line printing process of experience is to putting brilliant processing procedure, often need vacuum chuck board (VPT) with clamping substrate print solder paste, make and produce complicated (because VPT has many structure conditions, as required precision and mechanism's complexity).When practical operation Chip Packaging production line, but production line is generally fixing and its order of conversion seldom, and therefore for adapting to product performance, the production procedure arrangement often is difficult to realize efficient operable target.Be used to locate substrate 14 as the reference column 12 on the carrier plate 10 of Fig. 2, the structure of this reference column 12 make cost increase and processing procedure complicated, jack-up substrate 14 is higher than reference column 12 because the traditional printing processing procedure can use vacuum chuck instrument (VPT processing procedure), to make things convenient for print solder paste, make processing procedure complicated, therefore be necessary to be improved.
Therefore for processing procedure being simplified and can being cooperated the production line flow process, and can continue the high efficiency running, be necessary carrier plate 10 (cancellation reference column 12) to simplify, some substrates are fixed on the carrier plate simultaneously, entering the Chip Packaging production line, however this conception be subject to carrier plate 10 detent mechanisms (reference column 12) again must resistant to elevated temperatures condition restriction; This is because the detent mechanism (reference column) on the carrier plate needs by back welding process (heating), detent mechanism tool stationkeeping ability need be arranged and heat-resistingly pass through the Chip Packaging production line with fixing base, finishes encapsulation.Can design and draw though wherein have the mechanism of temperature capacity, yet suitable complexity of its tool and the handling procedure that is difficult for automation are unfavorable for a large amount of productions; But, therefore be necessary to seek a kind of flow process of bigger production capacity of manufacturing to replace present chip encapsulating manufacturing procedure along with the demand market of electronic product is big.
But, heat-resisting viscose glue tool stationkeeping ability newly developed and heat-resisting, heat-resisting and do not solidify during high temperature in back welding process, can adhere substrate on the carrier plate with by the entire chip packing producing line, and place and take off substrate (Substrate) process and save time easily, when using heat-resisting viscose glue, the auxiliary facility design of the automatic clamping and placing of this substrate (Substrate) is desirable advantage easily, the Chip Packaging production system of new wound is just needing this kind ability, cooperate each peripheral facility of further framework, and meet the flow process deploying principle of Industrial Engineering, therefore seek out a kind of technology more easily and make the present invention can have the various situation ability of the many-side handled, therefore developing the present invention realizes above-mentioned demand.
Summary of the invention
Main purpose of the present invention is to provide a kind of framework and Chip Packaging production procedure method of Chip Packaging production system, and can reach to cooperate relevant special-purpose peripheral automaton to implement by the cheap framework of time cost, the application places that can be used for same series of products, different series product etc. can provide low-cost high-quality effect.
To achieve these goals, the present invention is with existing vacuum chuck (VPT, Virtual PanelTooling) formula Chip Packaging production system is invented to improve to become and directly is pasted on the carrier plate, be used the fixedly carrier plate structure of heat-resisting viscose glue, add the peripheral auxiliary board that cooperates, define is of value to the Chip Packaging of practical application production system more economically, more has practical value compared with the prior art.
System of the present invention comprises: substrate adhesion locating module has substrate adhesion positioning function; And chip encapsulation module; Wherein this substrate adhesion locating module is positioned at the front end of chip encapsulation module, and this substrate passes through this said chip package module through this substrate adhesion locating module earlier again when encapsulation; Wherein this substrate adhesion locating module is constituted by a machinery equipment, has vision localization camera and clamping device, with several substrate orientation on a carrier plate; Wherein this chip encapsulation module is constituted by several machinery equipments, has tin cream and lays board, electronic component or chip placement board, heating board and encapsulation board, so that electronic component or chipset are loaded on this substrate.
In the said system, this carrier plate has the heat-resisting viscose glue that is arranged at the precalculated position, this heat-resisting viscose glue with substrate orientation on this carrier plate.
In the said system, this vision localization camera is Charged Coupled Device or contact-type image sensor.
In the said system, this heat-resisting viscose glue is made of silicon, toluene and resin.
In the said system, the material of this carrier plate is glass, pottery, metal or composite material.
In the said system, this clamping device has the suction disc type structure.
In the said system, this electronic component or chip are placed board and are comprised electronic component placement machine and chip placement machine.
In the said system, this substrate adhesion locating module further comprises one with the mobile arm of this substrate sticking on this carrier plate.
In the said system, the some glue precision on this carrier plate is 10-35 μ m.
In the said system, this system further comprises a carrier plate and is coated with the heat-resistant adhesive system comprehensively, and it makes heat-resisting viscose glue point be located at preposition.
In the said system, this carrier plate is coated with the heat-resistant adhesive system comprehensively and comprises carrier plate carrier, heat-resistant adhesive coating glue machine, the initial slaking heater of heat-resisting viscose glue and carrier plate collecting frame.
The inventive method comprises the following step: (1) is located at heat-resisting structure in the precalculated position of carrier plate; (2) several substrates are located at the precalculated position of carrier plate; (3) this board transport is laid board, electronic component or chip through tin cream too and places board, heating board and encapsulation board, with electronic part package on this substrate.
In the said method, this is heat-resisting to be configured to heat-resisting viscose glue.
The present invention has following beneficial effect:
1, reduce man-hour, the output value promotes: this is by the cancellation of reference column, and clamping print solder paste mode that need not traditional VPT makes economic effect reach.
2, simplify board: general VPT tool vacuum fixture, the present invention saves complicated mechanism at least.
3, reduce manpower: processing procedure is simplified reduces the artificial nature, and tradition is placed substrate and implemented by manpower, but this law is automatable manufacture method.
4, subtract maintenance cost: the subsidiary effect of simplifying board equipment.
Description of drawings
Fig. 1 is an existing chip packing producing line flow chart;
Fig. 2 is existing carrier plate bearing substrate schematic diagram;
Fig. 3 is a preferred embodiment substrate sticking schematic diagram of the present invention;
Fig. 4 is a print solder paste subsystem schematic diagram of the present invention; And
Fig. 5 is an embodiment of the invention packing producing line flow chart.
Embodiment
Please refer to the following stated and be operating principle of the present invention, wherein the present invention is for utilizing fixedly multi-piece substrate principle on the carrier plate of heat-resisting viscose glue, with packing producing line by assembling chip and electronic component, this heat-resisting viscose glue can not solidify when meeting with back welding process, so substrate is placed and has been got easily the carrier plate, add the peripheral auxiliary board that cooperates, define is of value to the Chip Packaging of practical application production system with saving man-hour.
Please refer to the situation of Fig. 5 for preferred embodiment of the present invention, wherein after quoting heat-resisting viscose glue, the configuration of Chip Packaging production line of the present invention can be embodied as (the adhesion substrate is on the carrier plate)-(printing process)-(putting the part processing procedure)-(putting brilliant processing procedure)-(back welding process)-(follow-up encapsulation procedure), this kind arrangement is for adapting to the production line that multi-piece substrate assembles together, the centre need not reference column and saves and place the required cost of labor of substrate, makes the placement of substrate surface part be able to low cost and finishes.
Demonstrate principal character of the present invention for understanding, the present invention can be divided into substrate adhesion locating module and chip encapsulation module according to its feature; Sequencing with whole piece Chip Packaging configuration, wherein this substrate adhesion locating module is positioned at the front end of chip encapsulation module, this substrate is adhered locating module again through this chip encapsulation module through this substrate earlier when advancing production line, and substrate adhesion locating module utilizes navigation system, makes several substrates be positioned on the carrier plate to pass through the Chip Packaging production line; And wherein this substrate adhesion locating module is constituted by a machinery equipment, has vision localization camera, mobile arm and clamping device, with several substrate orientation on a carrier plate; And for a Chip Packaging production line, wherein this chip encapsulation module can be several machinery equipments and constitutes, similar to traditional SMT production line, have tin cream and lay board (can be stencil printer), electronic component or chip surface placement board and heating board, so that electronic component is assembled on this substrate.And the superior efficacy that the present invention produced is not for to use the artificial saving of reference column to cause the simplification of peripheral mechanism that production cost is minimized, and can make that economic effect is obvious when producing in a large number, the foundry or the manufacturer of especially general tool Chip Packaging production line, continued operation in 24 hours to a collection of subjob is finished and is just stopped to produce line often, and it is remarkable therefore to improve effect.
Please note that substrate of the present invention 24 shown in Figure 3 is adhered to the situation of carrier plate 20, the precalculated position of wherein heat-resisting viscose glue setting can be four corners or edge gluing conveniently to fix this substrate.
Refer again to substrate of the present invention 24 shown in Figure 4 is adhered to after the carrier plate 20, tin cream is laid board and is coated with tin creams (cooperating steel plate 34) on substrate 24 with scraper 32, therefore processing procedure of the present invention does not need vacuum chuck instrument (as VPT), the processing procedure that can finish for simple low-cost equipment.
Still there is following variation in system of the present invention, and wherein this carrier plate cording has heat-resisting viscose glue to be located at preposition, with substrate orientation thereon; Wherein this vision localization camera can be Charged Coupled Device (CCD, Charge Coupled Device) or contact-type image sensor (CIS, Contract Imagesensor) constitutes again; And wherein this heat-resisting viscose glue composition is at least silicon (Silicon), toluene (toluene) resin (Resin) constitutes; And influence precision for preventing to expand with heat and contract with cold, so the material of this carrier plate is glass or pottery or metal or composite material; Convenient for the jig Design of asking ready-made commercial size again, wherein this clamping device can have the suction disc type structure; And for general Chip Packaging production line, wherein this electronic component or chip placement board comprises electronic component placement machine and chip placement machine; Automation for asking chip to place again, wherein this substrate adhesion locating module further comprise move arm with this substrate sticking on this carrier plate; And for the precision positioning of each board in the processing procedure to cooperate product demand, wherein the some glue precision on this carrier plate can be 10-35 μ m; Cooperate the operation of facility smooth and easy for asking peripheral, the present invention can further comprise a carrier plate and be coated with the heat-resistant adhesive system comprehensively, make heat-resisting viscose glue point be located at preposition, and wherein this carrier plate is coated with heat-resistant adhesive comprehensively and can comprise carrier plate carrier, heat-resisting adhesive plaster glue machine, the initial slaking heater of heat-resisting viscose glue, and carrier plate collecting frame.
A kind of printed circuit board surface adhesion of the present invention technical method uses as above-mentioned system, and it comprises the following step: (1) is located at heat-resisting structure in the precalculated position of carrier plate; (2) several substrates are located at the precalculated position of carrier plate; (3) this board transport is laid board, electronic component or chip through tin cream too and places board, heating board and encapsulation board, with electronic part package on this substrate.Wherein this heat-resisting structure can be heat-resisting viscose glue and forms.
Notice the present invention has following advantage:
1, reduce man-hour, the output value promotes: this is by the cancellation of locating dowel, clamping printing that need not traditional VPT The tin cream mode is so that economic effect is reached.
2, simplify board: general VPT tool vacuum fixture, the present invention saves complicated mechanism at least.
3, reduce manpower: processing procedure is simplified reduces the artificial nature, and tradition is placed substrate and implemented by manpower, but This law is automatable preparation method.
4, subtract maintenance cost: the subsidiary effect of simplifying board equipment.
Claims (14)
1. system that is used for the tool sticking and positioning technology of chip substrate encapsulation is characterized in that it comprises:
Substrate adhesion locating module has substrate adhesion positioning function; And
Chip encapsulation module;
Wherein this substrate adhesion locating module is positioned at the front end of chip encapsulation module, and a substrate passes through the said chip package module through this substrate adhesion locating module earlier again when encapsulation;
Wherein this substrate adhesion locating module is constituted by a machinery equipment, has vision localization camera and clamping device, its with several substrate orientation on a carrier plate;
Wherein this chip encapsulation module is constituted by several machinery equipments, has tin cream and lays board, electronic component or chip placement board, heating board and encapsulation board, and it is loaded on electronic component or chipset on this substrate.
2. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1, it is characterized in that: this carrier plate has the heat-resisting viscose glue that is arranged at the precalculated position, this heat-resisting viscose glue with substrate orientation on this carrier plate.
3. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1, it is characterized in that: this vision localization camera is Charged Coupled Device or contact-type image sensor.
4. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 2, it is characterized in that: this heat-resisting viscose glue is made of silicon, toluene and resin.
5. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1, it is characterized in that: the material of this carrier plate is glass, pottery or metal.
6. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1, it is characterized in that: the material of this carrier plate is a composite material.
7. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1 is characterized in that: this clamping device has the suction disc type structure.
8. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1 is characterized in that: this electronic component or chip are placed board and are comprised electronic component placement machine and chip placement machine.
9. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1 is characterized in that: this substrate adhesion locating module further comprises one with the mobile arm of this substrate sticking on this carrier plate.
10. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 1, it is characterized in that: this system further comprises a carrier plate and is coated with the heat-resistant adhesive system comprehensively, and it makes heat-resisting viscose glue point be located at preposition.
11. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 10, it is characterized in that: the some glue precision on this carrier plate is 10-35 μ m.
12. the system that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 10 is characterized in that: this carrier plate is coated with the heat-resistant adhesive system comprehensively and comprises carrier plate carrier, heat-resistant adhesive coating glue machine, the initial slaking heater of heat-resisting viscose glue and carrier plate collecting frame.
13. a method that is used for the tool sticking and positioning technology of chip substrate encapsulation, it uses system according to claim 1, and it comprises the following step:
Heat-resisting structure is located at the precalculated position of carrier plate;
Several substrates are located at the precalculated position of carrier plate;
This board transport is laid board, electronic component or chip through tin cream too places board, heating board and encapsulation board, with electronic part package on this substrate.
14. the method that is used for the tool sticking and positioning technology of chip substrate encapsulation according to claim 13 is characterized in that: this is heat-resisting to be configured to heat-resisting viscose glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100461409A CN100388446C (en) | 2004-06-02 | 2004-06-02 | Sticking and positioning technology based system and method for chip substrate packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100461409A CN100388446C (en) | 2004-06-02 | 2004-06-02 | Sticking and positioning technology based system and method for chip substrate packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1705090A CN1705090A (en) | 2005-12-07 |
| CN100388446C true CN100388446C (en) | 2008-05-14 |
Family
ID=35577449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100461409A Expired - Fee Related CN100388446C (en) | 2004-06-02 | 2004-06-02 | Sticking and positioning technology based system and method for chip substrate packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100388446C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494174B (en) * | 2008-01-25 | 2010-07-21 | 华晶科技股份有限公司 | Image acquisition die set and method for forming same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1165401A (en) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | Testing apparatus for non-packaged semiconductor chip |
| JPH10303225A (en) * | 1997-04-23 | 1998-11-13 | Toshiba Corp | Electronic-part mounting device and its method and rackaging device |
| CN1330400A (en) * | 2000-07-03 | 2002-01-09 | Esec贸易公司 | Method and device for mounting semiconductor chip on flexible chip |
| US20030190795A1 (en) * | 2002-04-08 | 2003-10-09 | Hitachi, Ltd. | Method of manufacturing a semiconductor device |
-
2004
- 2004-06-02 CN CNB2004100461409A patent/CN100388446C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1165401A (en) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | Testing apparatus for non-packaged semiconductor chip |
| JPH10303225A (en) * | 1997-04-23 | 1998-11-13 | Toshiba Corp | Electronic-part mounting device and its method and rackaging device |
| CN1330400A (en) * | 2000-07-03 | 2002-01-09 | Esec贸易公司 | Method and device for mounting semiconductor chip on flexible chip |
| US20030190795A1 (en) * | 2002-04-08 | 2003-10-09 | Hitachi, Ltd. | Method of manufacturing a semiconductor device |
Non-Patent Citations (2)
| Title |
|---|
| SMT生产线设备简介. 顾霭云.世界产品与技术，第5期. 2001 |
| SMT生产线设备简介. 顾霭云.世界产品与技术，第5期. 2001 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1705090A (en) | 2005-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI575670B (en) | Semiconductor device including an independent film layer for embedding and/or spacing semiconductor die | |
| US7969026B2 (en) | Flexible carrier for high volume electronic package fabrication | |
| CN100382266C (en) | Ball mounting method and apparatus for ball grid array packaging substrate | |
| US6723629B2 (en) | Method and apparatus for attaching solder members to a substrate | |
| WO2012068762A1 (en) | Ic chip package of sip system integration level and manufacturing method thereof | |
| US20140073088A1 (en) | Electronic component mounting line and electronic component mounting method | |
| CN104228316B (en) | Machining technology for conducting printing and surface mounting on substrates made of various materials simultaneously and jig structure thereof | |
| JP2008544554A (en) | Flip chip die assembly using thin flexible substrate | |
| CN102623371B (en) | Chip scale package (CSP) chip mounting loading device and mounting method | |
| CN104576426A (en) | Mounting method of flip chip and wafer level chip and mounting jig set | |
| CN102270589A (en) | Method for producing semiconductor components, and corresponding semiconductor component | |
| CN100388446C (en) | Sticking and positioning technology based system and method for chip substrate packaging | |
| CN109461667A (en) | Semiconductor chip packaging bonding apparatus and implementation method | |
| CN109411397A (en) | Semiconductor chip packaging is bonded mould group and bonding technology | |
| CN103730375B (en) | OSP surface processes base plate for packaging molding milling method | |
| TWI235026B (en) | System and method having the adhering and positioning technique for use in chip substrate package | |
| TWI313500B (en) | ||
| CN102543768B (en) | Device and method for forming protective films on chip package | |
| CN205039171U (en) | Solid brilliant device of full -automatic lamp pearl support bowl mouth | |
| CN100477140C (en) | Packing component of semiconductor and preparing method thereof | |
| CN104869751A (en) | PCB and production process thereof | |
| KR100614885B1 (en) | Method for packaging substrate with oriented adhesive and system for the like | |
| CN107808888B (en) | Packaging process of CMOS image sensor | |
| US20080160673A1 (en) | Assembly of thin die coreless package | |
| CN213691967U (en) | Convenient cover pasting mechanism based on substrate strips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: HONGQICHANG SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHANG SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20070615 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20070615 Address after: China Taiwan Taoyuan County Applicant after: D-TEK Technology Co.,Ltd. Address before: Taiwan, China Applicant before: CHANGLIN SCIENCE AND TECHNOLOG |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HONGQI NEW TECHNOLOGY CO., LTD. Free format text: FORMER NAME: HONGQI CHANGLIN TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: China Taiwan Taoyuan County Patentee after: D-TEK TECHNOLOGY Co.,Ltd. Address before: China Taiwan Taoyuan County Patentee before: D-TEK Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080514 |