CN100388446C - Sticking and positioning technology based system and method for chip substrate packaging - Google Patents
Sticking and positioning technology based system and method for chip substrate packaging Download PDFInfo
- Publication number
- CN100388446C CN100388446C CNB2004100461409A CN200410046140A CN100388446C CN 100388446 C CN100388446 C CN 100388446C CN B2004100461409 A CNB2004100461409 A CN B2004100461409A CN 200410046140 A CN200410046140 A CN 200410046140A CN 100388446 C CN100388446 C CN 100388446C
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- chip
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- positioning technology
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Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100461409A CN100388446C (en) | 2004-06-02 | 2004-06-02 | Sticking and positioning technology based system and method for chip substrate packaging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100461409A CN100388446C (en) | 2004-06-02 | 2004-06-02 | Sticking and positioning technology based system and method for chip substrate packaging |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1705090A CN1705090A (en) | 2005-12-07 |
CN100388446C true CN100388446C (en) | 2008-05-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100461409A Expired - Fee Related CN100388446C (en) | 2004-06-02 | 2004-06-02 | Sticking and positioning technology based system and method for chip substrate packaging |
Country Status (1)
Country | Link |
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CN (1) | CN100388446C (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101494174B (en) * | 2008-01-25 | 2010-07-21 | 华晶科技股份有限公司 | Image acquisition die set and method for forming same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1165401A (en) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | Testing apparatus for non-packaged semiconductor chip |
JPH10303225A (en) * | 1997-04-23 | 1998-11-13 | Toshiba Corp | Electronic-part mounting device and its method and rackaging device |
CN1330400A (en) * | 2000-07-03 | 2002-01-09 | Esec贸易公司 | Method and device for mounting semiconductor chip on flexible chip |
US20030190795A1 (en) * | 2002-04-08 | 2003-10-09 | Hitachi, Ltd. | Method of manufacturing a semiconductor device |
-
2004
- 2004-06-02 CN CNB2004100461409A patent/CN100388446C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1165401A (en) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | Testing apparatus for non-packaged semiconductor chip |
JPH10303225A (en) * | 1997-04-23 | 1998-11-13 | Toshiba Corp | Electronic-part mounting device and its method and rackaging device |
CN1330400A (en) * | 2000-07-03 | 2002-01-09 | Esec贸易公司 | Method and device for mounting semiconductor chip on flexible chip |
US20030190795A1 (en) * | 2002-04-08 | 2003-10-09 | Hitachi, Ltd. | Method of manufacturing a semiconductor device |
Non-Patent Citations (2)
Title |
---|
SMT生产线设备简介. 顾霭云.世界产品与技术,第5期. 2001 |
SMT生产线设备简介. 顾霭云.世界产品与技术,第5期. 2001 * |
Also Published As
Publication number | Publication date |
---|---|
CN1705090A (en) | 2005-12-07 |
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ASS | Succession or assignment of patent right |
Owner name: HONGQICHANG SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHANG SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20070615 |
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Effective date of registration: 20070615 Address after: China Taiwan Taoyuan County Applicant after: D-TEK Technology Co.,Ltd. Address before: Taiwan, China Applicant before: CHANGLIN SCIENCE AND TECHNOLOG |
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Owner name: HONGQI NEW TECHNOLOGY CO., LTD. Free format text: FORMER NAME: HONGQI CHANGLIN TECHNOLOGY CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: China Taiwan Taoyuan County Patentee after: D-TEK TECHNOLOGY Co.,Ltd. Address before: China Taiwan Taoyuan County Patentee before: D-TEK Technology Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20080514 |