CN213691967U - Convenient cover pasting mechanism based on substrate strips - Google Patents

Convenient cover pasting mechanism based on substrate strips Download PDF

Info

Publication number
CN213691967U
CN213691967U CN202022567531.2U CN202022567531U CN213691967U CN 213691967 U CN213691967 U CN 213691967U CN 202022567531 U CN202022567531 U CN 202022567531U CN 213691967 U CN213691967 U CN 213691967U
Authority
CN
China
Prior art keywords
cover
cover plate
substrate
carrier
convenient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022567531.2U
Other languages
Chinese (zh)
Inventor
周木火
杨健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiji Semiconductor Suzhou Co ltd
Original Assignee
Taiji Semiconductor Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiji Semiconductor Suzhou Co ltd filed Critical Taiji Semiconductor Suzhou Co ltd
Priority to CN202022567531.2U priority Critical patent/CN213691967U/en
Application granted granted Critical
Publication of CN213691967U publication Critical patent/CN213691967U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to a convenient cover sticking mechanism based on substrate strips, which comprises a carrier and a cover plate, wherein the carrier is used for placing a substrate, the cover plate is arranged on the upper side of the carrier, and the cover plate presses the substrate; the cover plate is provided with a plurality of windows for installing the heat dissipation cover; according to the scheme, the base plate is compressed through the matching of the carrier and the cover plate, so that the base plate can be prevented from being tilted when the cover is attached; when the cover is pasted, the cover pasting precision can be ensured only by placing the heat dissipation cover into the cover plate windowing according to the direction; the bottom of the cover plate is provided with a groove, which can prevent the fixture from being polluted by the overflowing glue so as to prevent the fixture and the substrate from being solidified in the baking process.

Description

Convenient cover pasting mechanism based on substrate strips
Technical Field
The utility model relates to a convenient mechanism of covering based on base plate strip belongs to integrated circuit packaging technology field.
Background
In the manufacturing procedure of FC mounting the heat dissipation cover, most of the FC mounting heat dissipation covers are automatically mounted by using cover mounting equipment, but some small-batch production conditions exist, and the heat dissipation cover needs to be manually mounted, so that a convenient cover mounting mechanism which can be matched with a substrate strip and used for manually mounting the heat dissipation cover needs to be designed, and the mounting precision of the heat dissipation cover is ensured.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a convenient mechanism that covers that pastes based on base plate strip for overcome prior art not enough.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a convenient cover sticking mechanism based on substrate strips comprises a carrier and a cover plate, wherein the carrier is used for placing a substrate, the cover plate is arranged on the upper side of the carrier, and the cover plate presses the substrate; the cover plate is provided with a plurality of windows for installing the heat dissipation cover.
Preferably, the carrier and the cover plate are attracted by a magnet.
Preferably, an avoiding groove is formed in the lower surface of the cover plate and surrounds the windowing.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
according to the convenient cover sticking mechanism based on the substrate strips, the substrate is pressed through the matching of the carrier and the cover plate, so that the substrate can be prevented from being warped when being stuck; when the cover is pasted, the cover pasting precision can be ensured only by placing the heat dissipation cover into the cover plate windowing according to the direction; the bottom of the cover plate is provided with a groove, which can prevent the fixture from being polluted by the overflowing glue so as to prevent the fixture and the substrate from being solidified in the baking process.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
fig. 1 is a schematic structural view of a convenient cover attaching mechanism based on a substrate strip according to the present invention;
fig. 2 is a schematic view of a lower surface structure of the cover plate of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in FIGS. 1-2, a convenient mechanism that covers that pastes based on base plate strip, contain carrier 1 and apron 2, carrier 1 is used for placing base plate 3, and apron 2 sets up the upside at carrier 1, and carrier 1 passes through 6 attractions of magnet with apron 2, makes apron 2 push down base plate 3, prevents that the base plate warpage from causing FC encapsulation back ball rosin joint, fracture.
The cover plate 2 is provided with a plurality of windows 4, the arrangement of the windows 4 is designed according to positions needing to be mounted on the substrate, the windows 4 are used for mounting the heat dissipation covers 5, and the sizes of the windows 4 are designed according to the sizes of the heat dissipation covers 5 needing to be mounted; after the FCA and the underfill are completed, the radiating cover is mounted, and the windowing 4 of the cover plate 2 can enable the radiating cover 5 to be accurately placed at a position where mounting is needed.
The lower surface of the cover plate 2 is provided with an avoiding groove 7, the avoiding groove 7 is arranged around the windowing 4, the cover plate can be prevented from overflowing glue and overflowing to the cover plate when the heat dissipation cover is mounted, the cover plate is polluted, and the cover plate is solidified on the base plate by glue in the post-baking process, so that adverse effects are caused to the process.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims (3)

1. The utility model provides a convenient mechanism of covering that pastes based on base plate strip which characterized in that: the device comprises a carrier (1) and a cover plate (2), wherein the carrier (1) is used for placing a substrate (3), the cover plate (2) is arranged on the upper side of the carrier (1), and the cover plate (2) presses the substrate (3); the cover plate (2) is provided with a plurality of windows (4), and the windows (4) are used for installing the heat dissipation cover (5).
2. The convenient cover attaching mechanism based on the substrate strip as claimed in claim 1, wherein: the carrier (1) and the cover plate (2) are attracted through the magnet (6).
3. The convenient cover attaching mechanism based on the substrate strip as claimed in claim 1, wherein: an avoiding groove (7) is formed in the lower surface of the cover plate (2), and the avoiding groove (7) is arranged around the windowing (4).
CN202022567531.2U 2020-11-09 2020-11-09 Convenient cover pasting mechanism based on substrate strips Active CN213691967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022567531.2U CN213691967U (en) 2020-11-09 2020-11-09 Convenient cover pasting mechanism based on substrate strips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022567531.2U CN213691967U (en) 2020-11-09 2020-11-09 Convenient cover pasting mechanism based on substrate strips

Publications (1)

Publication Number Publication Date
CN213691967U true CN213691967U (en) 2021-07-13

Family

ID=76729000

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022567531.2U Active CN213691967U (en) 2020-11-09 2020-11-09 Convenient cover pasting mechanism based on substrate strips

Country Status (1)

Country Link
CN (1) CN213691967U (en)

Similar Documents

Publication Publication Date Title
GB2579325A (en) High-density interconnecting adhesive tape
US9633972B2 (en) Method for manufacturing semiconductor display panel
CN112992878B (en) Chip transfer method and display device
CN208384933U (en) A kind of miniatureization LED matrix
CN103935548B (en) Screen protection layer erecting device and method
TW202114868A (en) Attaching apparatus, intermediary mechansim thereof, and attaching method
CN102623371B (en) Chip scale package (CSP) chip mounting loading device and mounting method
CN216960683U (en) Real-time alignment mounter based on vision
CN213691967U (en) Convenient cover pasting mechanism based on substrate strips
US20130161673A1 (en) Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same
CN116779732A (en) Micro-LED chip batch transfer device and batch transfer welding method
CN216120346U (en) Component for LED chip mass transfer welding process
CN112201736B (en) MiniLED matrix backlight board, manufacturing method thereof and notebook computer
CN116154048A (en) Method for preparing LED device based on surface patch
CN206236955U (en) The eutectic structure of semiconductor laser chip encapsulation
CN1123931C (en) Manufacturing of electronic module
CN210223966U (en) Anti-warping jig for substrate
CN210272320U (en) Packaging structure for preventing layering
US7666714B2 (en) Assembly of thin die coreless package
CN111867245A (en) MiniLED substrate, module and module manufacturing method
CN107148199B (en) Heat-conducting graphite gasket and preparation method thereof
CN111916551A (en) LED luminous piece manufacturing method, LED luminous piece and luminous device
CN111276590A (en) Frame type support structure LED packaging technology
CN221262413U (en) Micro-display chip paster frock
CN203645925U (en) Clamp for conducting strip bonding

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant