CN203645925U - Clamp for conducting strip bonding - Google Patents
Clamp for conducting strip bonding Download PDFInfo
- Publication number
- CN203645925U CN203645925U CN201320839207.9U CN201320839207U CN203645925U CN 203645925 U CN203645925 U CN 203645925U CN 201320839207 U CN201320839207 U CN 201320839207U CN 203645925 U CN203645925 U CN 203645925U
- Authority
- CN
- China
- Prior art keywords
- conducting strip
- circuit board
- flexible circuit
- hole
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims abstract description 16
- 230000007704 transition Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model belongs to the technical field of flexible circuit board manufacture, and especially relates to a clamp for conducting strip bonding. The clamp is used to bond conducting strips to a flexible circuit board. The clamp comprises a substrate and a cover plate matched with the substrate. The upper surface of the substrate is concavely provided with a positioning groove for the positioning of the flexible circuit board. The cover plate is provided with a plurality of through holes used for accommodating the conducting strips. The arranged positions of the through holes are matched with installation positions which are needed for accommodating the conducting strips and are arranged on the flexible circuit board. In this way, during the process of installing the conducting strips to the flexible circuit board, after the through holes in the cover plate are in one-to-one correspondence to the installation positions which are needed for accommodating the conducting strips are arranged on the flexible circuit board, the conducting strips can be slid into the through holes and be installed to the flexible circuit board, so that workers can install the conducting strips to the flexible circuit board just by sliding the conducting strips into the through holes, the operation is convenient for the workers, the assembling efficiency is high, and the labor intensity of the workers is reduced.
Description
Technical field
The utility model belongs to the technical field of making flexible circuit board, relates in particular to a kind of conducting strip fixture that pastes.
Background technology
Flexible PCB is that the one of making as base material taking polyimides or polyester film has height reliability, excellent flexible printed circuit, be called for short soft board, have that distribution density is high, lightweight, the feature of thin thickness, be widely used in the medium electronic product of digital product, mobile phone and notebook computer.
At present, the assembling to flexible circuit board in factory adds man-hour, conducting strip need to be bonded on the base material of flexible circuit board.In practical operation, workman adopt tweezers by conducting strip positioning bonding one by one on the base material of described flexible circuit board, because the size of conducting strip is less and thinner thickness, workman's operation is very inconvenient, labour intensity is large, is easy to cause the dislocation of conducting strip bonding, and packaging efficiency is low.
Utility model content
The purpose of this utility model is to provide a kind of conducting strip fixture that pastes, and conducting strip accurately and fast can be assembled on the base material of flexible circuit board, is convenient to workman's operation, and packaging efficiency is high, reduces labor strength.
The utility model is achieved in that a kind of conducting strip fixture that pastes, for conducting strip being installed on to the installation position of flexible circuit board, comprise a substrate and be placed in the cover plate on described substrate, the upper surface of described substrate is concaved with the location notch for flexible circuit board is located, and described cover plate offers multiple through holes for holding described conducting strip and aliging with the installation position in described flexible circuit board.
Further, described substrate offers the air vent hole being communicated with described location notch.
Particularly, described air vent hole is extended to the diapire of described location notch by the bottom surface of described substrate.
Particularly, convex with the alignment pin that the location hole in a pair of and described flexible circuit board matches in described location notch, described alignment pin is arranged at respectively the diagonal angle place of described location notch, and described cover plate is provided with the pin-and-hole matching with described shop bolt.
Preferably, the lower surface of described cover plate convexes with the top for being resisted against described flexible circuit board.
Further, described through hole is in being in a lateral direction the equidistant alternate setting of multiple row, equi-spaced apart setting between the described through hole of same row in vertical direction, the setting of mutually staggering between the described through hole between adjacent two row.
Particularly, the depth value of described through hole is more than or equal to or is less than the one-tenth-value thickness 1/10 of described conducting strip.
Particularly, the degree of depth of described through hole and the Thickness Ratio of described conducting strip are between 25:7-50:7.
Particularly, arc transition is all arranged in the inwall intersection of described through hole.
The one that the utility model provides is pasted conducting strip fixture, by a cover plate that has the substrate of location notch and match with substrate is set, and through hole is on the cover board set, the arrangement of this through hole is corresponding with the position that needs to install conducting strip in flexible circuit board, in the time that conducting strip is installed in flexible circuit board, first flexible circuit board is positioned in above-mentioned location notch and is fixed, then cover plate is placed on substrate, conducting strip is slipped in above-mentioned through hole, just can be installed on flexible circuit board, so, only need workman directly conducting strip to be slipped into through hole and just conducting strip can be installed on to flexible circuit board, be convenient to workman's operation, packaging efficiency is high, reduce labor strength.
Brief description of the drawings
Fig. 1 is that in the utility model embodiment, conducting strip is installed on the front schematic view in flexible circuit board by pasting conducting strip fixture;
Fig. 2 pastes the cross-sectional schematic of conducting strip fixture along A-A hatching in Fig. 1.
Description of symbols:
100 paste conducting strip fixture 12 alignment pins
1 substrate 13 air vent holes
2 cover plate 21 through holes
3 flexible circuit board 22 pin-and-holes
4 conducting strip 31 location holes
11 location notchs
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As depicted in figs. 1 and 2, in flexible circuit board 3, need to install multi-disc conducting strip 4, that is to say and on flexible circuitry, there are multiple installation positions that conducting strip 4 need to be installed.The one that embodiment provides is pasted conducting strip fixture 100, exactly conducting strip 4 is installed on the installation position that is installed on rapidly and accurately flexible circuit board 3, it comprises a substrate 1 and is placed in the cover plate 2 on described substrate 1, this cover plate 2 matches with described substrate 1, and this substrate 1 has upper and lower two surfaces, wherein, the upper surface of described substrate 1 is concaved with a location notch 11, the match profiles of the overall size of this location notch 11 and flexible circuit board 3, by this location notch 11, can be fixedly installed flexible circuit board 3.Correspondingly, described cover plate 2 offers multiple through holes 21, and wherein, the installation position in the position of through hole 21 and described flexible circuit board 3 matches, and namely through hole 21 aligns with the installation position in flexible circuit board.So, because the through hole 21 on cover plate 2 is corresponding one by one with the position that needs to install conducting strip 4 in flexible circuit board 3, by conducting strip 4 being placed in to this through hole 21, conducting strip 4 just can be installed in flexible circuit board 3, like this, only need workman directly conducting strip 4 to be slipped into through hole 21 and just conducting strip 4 can be installed on to flexible circuit board 3, and need in flexible circuit board 3, not find the installation position of conducting strip 4, dislocation while simultaneously having avoided conducting strip 4 to install, be convenient to workman's operation, packaging efficiency is high, has reduced labor strength.When practical application, conventionally this cover plate 2 is made by transparent material, is beneficial to workman and observes the installation position of flexible circuit board 3, improve workman's operating speed.The detailed process that conducting strip 4 is installed in flexible circuit board 3 is: first flexible circuit board 3 is positioned in above-mentioned location notch 11 and is fixed, then cover plate 2 is placed on substrate 1, apply stickum in installation position, conventionally adopt silica gel, conducting strip 4 is slipped in above-mentioned through hole 21 again, just conducting strip 4 fixedly can be bonded in flexible circuit board 3.
Particularly, consult shown in Fig. 1, cover plate 2 is provided with four through hole row, these through hole row comprise multiple through holes 21 of linearly arranging, be opened in through hole 21 on cover plate 2 in thering are in a lateral direction four row, four through holes row that are appreciated that this place only as an enforcement for explanation, certainly, also can have more actual user demand and reasonably arrange the columns of through hole 21.Equidistantly alternate between these four through hole row, simultaneously, in vertical direction, between each through hole 21 in same through hole row, it is also equi-spaced apart setting, wherein, the setting of also mutually staggering between the through hole 21 in adjacent two through hole row, also with regard to edge in a lateral direction, adjacent two through holes that list 21 are not on same straight line, and a distance mutually staggers.
In flexible circuit board 3 in Fig. 1, there are 8 chips, on each chip, there are two installation positions, in whole flexible circuit board 3, need to install and fix 16 conducting strips 4.So arrange, can reduce on the one hand the area occupied of flexible circuit board 3, be convenient to typesetting; Be beneficial on the other hand conducting strip 4 and be installed on the waste heat evacuation after flexible circuit board 3.
Particularly, shown in Figure 2, in the present embodiment, the depth value of above-mentioned through hole 21 is greater than the thickness of conducting strip 4.So, be convenient to the upper surface that workman is first placed in conducting strip 4 cover plate 2 and slip into swimmingly again through hole 21, and prevent that conducting strip 4 from moving dislocation.Preferably, the thickness ratio of the degree of depth of through hole 21 and conducting strip 4 is arranged between 25:7-50:7.The thickness of the flexible circuit board 3 in the present embodiment is 0.1mm, plus-minus tolerance 0.03mm.The thickness of this conducting strip 4 is 0.28mm, and the thickness of this cover plate 2 is 1mm.So, laying after conducting strip 4, and be easy to workman and check in each through hole 21, whether there is the conducting strip 4 of placement.Certainly, also the degree of depth of described through hole 21 can be arranged to be of uniform thickness with conducting strip 4, so, when all filling out in all through holes 21 while being placed with conducting strip 4, the upper surface of whole cover plate 2 is complete planes.Be easy to realize instruments monitor, prevent neglected loading conducting strip 4.Also has another situation, the degree of depth of through hole 21 is arranged to be less than to the thickness of this conducting strip 4, also be feasible, so, after being installed on through hole 21, conducting strip 4 can expose top, can further adopt a pressing plate each conducting strip 4 to be implemented to the thrust of vertical this conducting strip 4 simultaneously, thereby ensure good being bonded in described flexible circuit board 3 of conducting strip 4, also ensure the evenness on flexible circuit board 3 surfaces.
Particularly, above-mentioned through hole 21 is square hole.That is to say, the cross section of described square hole is orthogonal, and in the present embodiment, the cross section of this square hole is rectangle.Described rectangular long limit is 7.9mm, and described rectangular minor face is 5.9mm.In the present embodiment, this conducting strip 4 is rectangle, and its four angles place is all provided with fillet for preventing scratch, the profile of this conducting strip 4 and this rectangular match profiles.So, can prevent that conducting strip 4 from rotating in described square hole, further define the position of conducting strip 4, guarantee that conducting strip 4 is installed in flexible circuit board 3 accurately.Preferably, arc transition is all arranged to in the intersection of the inwall of through hole 21.Like this, in the time that conducting strip 4 is positioned over through hole 21, can be easy to slip into by this circular arc wire, reduce again the friction of conducting strip 4 with through hole 21 inwalls simultaneously, moreover, be convenient to actual processing and fabricating.
Further, shown in Figure 2, in order more reliably flexible circuit board 3 to be fixed in location notch 11, the substrate 1 in the present embodiment also offers air vent hole 13, and this air vent hole 13 is communicated with above-mentioned location notch 11.That is to say the inwall of location notch 11 is communicated with the outer surface of this substrate 1.Particularly, this air vent hole 13 is extended to the diapire of described location notch 11 by the bottom surface of described substrate 1, and this air vent hole 13 is straight hole.Like this, in the time that flexible circuit board 3 is fixed in location notch 11, the gas in location notch 11 can be discharged along this air vent hole 13, thereby has guaranteed the evenness of flexible circuit board 3.Certainly, also can pass through this air vent hole 13, location notch 11 is vacuumized, to absorption affinity of enforcement of flexible circuit board 3, guarantee more smooth being fixed in this location notch 11 of flexible circuit board 3.Herein, understandably, when being provided with in flexible circuit board 3 after conducting strip 4, can spray gas by this air vent hole 13, thereby flexible circuit board 3 is discharged to location notch 11, avoid workman to go to damage flexible circuit board 3 while taking.
Further, can be with reference to the discharge of this air vent hole 13 of location arrangements of through hole 21 on cover plate 2, so, can carry out radiating treatment to the installation position in flexible circuit board 3, avoid flexible circuit board 3 wrinkling, in addition, the power of supporting is upwards bestowed in the installation position that also can be inserted in this flexible circuit board 3 in this through hole 21 by thimble, the downforce producing while being bonded in flexible circuit board 3 downwards for balance conducting strip 4.
Certainly; also the center line of this through hole 21 can be set as to folding line; as; through hole 21 is laterally entered and is upwards extended the diapire that is communicated with location notch 11 again by the side of substrate 1; or through hole 21 enters by the upper surface of substrate 1 diapire that bending extension is again communicated with location notch 11; be all feasible, belong to protection range of the present utility model.
Further, in order to locate more accurately flexible circuit board 3, in location notch 11, convex with a pair of alignment pin 12, this alignment pin 12 matches with the location hole 31 in flexible circuit board 3, described alignment pin 12 is arranged at respectively the diagonal angle place of location notch 11, meanwhile, above-mentioned cover plate 2 is provided with and the pin-and-hole 22 of this alignment pin 12 adaptations.So, thin, the light feature of flexible circuit board 3, be placed on this alignment pin 12 by the location hole 31 arranging on it, just can be positioned fast in location notch 11, and the not displacement on occurred level, simultaneously, cover plate 2 presses in flexible circuit board 3 accurately by pin-and-hole 22, make flexible circuit board 3 that vertical displacement not occur, thereby by flexible circuit board 3 three-dimensional localization, improved conducting strip 4 accuracy bonded thereto.
Preferably, in the present embodiment, the upper surface of substrate 1 is concordant with the upper surface of flexible circuit board 3.So, the clamping force that the diapire of the lower surface of cover plate 2 and location notch 11 can contact in face flexible circuit board 3 company's of enforcement face, has avoided local pressure excessive and wrinkling, has guaranteed the evenness of this flexible circuit board 3.Certainly, in the time that flexible circuit board 3 just has certain thickness, the upper surface of substrate 1 being arranged to the form lower than the upper surface of flexible circuit board 3, is also feasible.
In addition, when the upper surface of flexible circuit board 3 is during lower than the upper surface of substrate 1, correspondingly, on cover plate 2, convex with top, the match profiles of this top and this location notch 11, is resisted against flexible circuit board 3 diapire of location notch 11.So, be also feasible, belong to protection range of the present utility model.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (9)
1. one kind is pasted conducting strip fixture, for conducting strip being installed on to the installation position of flexible circuit board, it is characterized in that, comprise a substrate and be placed in the cover plate on described substrate, the upper surface of described substrate is concaved with the location notch for flexible circuit board is located, and described cover plate offers multiple through holes for holding described conducting strip and aliging with the installation position in described flexible circuit board.
2. a kind of conducting strip fixture that pastes according to claim 1, is characterized in that: described substrate offers the air vent hole being communicated with described location notch.
3. a kind of conducting strip fixture that pastes according to claim 2, is characterized in that: described air vent hole is extended to the diapire of described location notch by the bottom surface of described substrate.
4. a kind of conducting strip fixture that pastes according to claim 1, it is characterized in that: in described location notch, convex with the alignment pin that the location hole in a pair of and described flexible circuit board matches, described alignment pin is arranged at respectively the diagonal angle place of described location notch, and described cover plate is provided with the pin-and-hole matching with described shop bolt.
5. a kind of conducting strip fixture that pastes according to claim 1, is characterized in that: the lower surface of described cover plate convexes with the top for being resisted against described flexible circuit board.
6. paste conducting strip fixture according to the one described in any one in claim 1-5, it is characterized in that: described through hole is in being in a lateral direction the equidistant alternate setting of multiple row, equi-spaced apart setting between the described through hole of same row in vertical direction, the setting of mutually staggering between the described through hole between adjacent two row.
7. a kind of conducting strip fixture that pastes according to claim 6, is characterized in that: the depth value of described through hole is more than or equal to or is less than the one-tenth-value thickness 1/10 of described conducting strip.
8. a kind of conducting strip fixture that pastes according to claim 7, is characterized in that: the degree of depth of described through hole and the Thickness Ratio of described conducting strip are between 25:7-50:7.
9. paste conducting strip fixture according to the one described in claim 7 or 8, it is characterized in that: arc transition is all arranged in the inwall intersection of described through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320839207.9U CN203645925U (en) | 2013-12-18 | 2013-12-18 | Clamp for conducting strip bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320839207.9U CN203645925U (en) | 2013-12-18 | 2013-12-18 | Clamp for conducting strip bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203645925U true CN203645925U (en) | 2014-06-11 |
Family
ID=50877139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320839207.9U Expired - Lifetime CN203645925U (en) | 2013-12-18 | 2013-12-18 | Clamp for conducting strip bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203645925U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307408A (en) * | 2015-09-07 | 2016-02-03 | 苏州恩欧西精密机械制造有限公司 | Vacuum adsorption printing tool |
-
2013
- 2013-12-18 CN CN201320839207.9U patent/CN203645925U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307408A (en) * | 2015-09-07 | 2016-02-03 | 苏州恩欧西精密机械制造有限公司 | Vacuum adsorption printing tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140611 |
|
| CX01 | Expiry of patent term |