CN215972320U

CN215972320U - FPC pad pasting adsorption equipment

Info

Publication number: CN215972320U
Application number: CN202122462882.1U
Authority: CN
Inventors: 琚文彬
Original assignee: Lianying Precision Technology Nantong Co ltd
Current assignee: Lianying Precision Technology Nantong Co ltd
Priority date: 2021-10-12
Filing date: 2021-10-12
Publication date: 2022-03-08
Anticipated expiration: 2031-10-12

Abstract

The application relates to a FPC pad pasting adsorption equipment includes: the side surface of the base is provided with a gas channel, the gas channel is connected with a gas groove arranged on the top surface of the base, a sealing groove for mounting a sealing ring is arranged around the gas groove, and the sealing groove is connected with the bottom surface of the film pasting plate; the top surface of the film pasting plate is provided with an FPC circuit profiling area, an FPC positioning column and a plurality of vacuum suction holes are arranged in the FPC circuit profiling area, the vacuum suction holes are connected with the bottom surface of the film pasting plate, an FPC profiling groove connected with the vacuum suction holes is arranged on the bottom surface of the film pasting plate, and the FPC profiling groove is connected with the gas groove through a gas connecting groove; this application reference column that not only the accessible was equipped with fixes a position FPC circuit board, and the vacuum suction hole that the accessible was equipped with moreover is with the smooth surface that adsorbs at the pad pasting board of FPC circuit board to help artifical pad pasting, increase the efficiency of pad pasting.

Description

FPC pad pasting adsorption equipment

Technical Field

The application relates to the technical field of film sticking, in particular to an FPC film sticking adsorption device.

Background

A Flexible Printed Circuit Board (also called an FPC Flexible Circuit Board) is a Printed Circuit made of a Flexible insulating base material, and has many advantages that a rigid Printed Circuit Board does not have. At present, after the production of the existing FPC flexible circuit board is finished, the surface of the FPC flexible circuit board needs to be pasted with a film so as to reduce the damage of the FPC flexible circuit board in the packaging and transportation processes. However, in the process of manually laminating the film on the FPC flexible circuit board, the problems of warping and deformation are easily caused, so that the positioning and the lamination between the FPC flexible circuit board and the film laminating board are difficult, and the film laminating quality is poor and the efficiency is low. Therefore, an FPC film sticking adsorption device is provided.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the application provides a FPC pad pasting adsorption equipment, has the advantage of location and absorption laminating.

In order to achieve the purpose, the technical scheme of the application is as follows:

an FPC pad pasting adsorption equipment includes: the side surface of the base is provided with a gas channel, the gas channel is connected with a gas groove arranged on the top surface of the base, a sealing groove for mounting a sealing ring is arranged around the gas groove, and the sealing groove is connected with the bottom surface of the film pasting plate; the top surface of pad pasting board is equipped with FPC circuit profile modeling district, be equipped with FPC reference column and a plurality of vacuum suction hole in the FPC circuit profile modeling district, the vacuum suction hole with the bottom surface of pad pasting board is connected, the bottom surface of pad pasting board be equipped with the FPC profile modeling groove of vacuum suction jogged joint, the FPC profile modeling groove pass through the gas connection groove with the gas tank is connected.

According to the technical scheme, a real hole air suction channel is formed among the air channel, the air groove, the FPC profiling groove and the vacuum air suction hole, the FPC positioning column is used for installing and positioning the FPC circuit board, and the vacuum air suction hole is used for adsorbing the FPC circuit board installed in the FPC circuit profiling area on the film pasting board.

As an optimal scheme of this application, the FPC reference column passes through the location guiding hole that the pad pasting board was equipped with, with the locating hole connection that the base was equipped with, be equipped with the seal groove of installation sealing washer around the locating hole, the seal groove with the bottom surface of pad pasting board is connected.

According to the technical scheme, the FPC positioning column is used for installing and positioning the FPC circuit board on the one hand, the film pasting plate and the base on the other hand, and the sealing grooves on the periphery of the positioning holes are used for installing the sealing rings so as to prevent the side face of the FPC positioning column from leaking air.

As an optimal scheme of this application, the pad pasting board with the base passes through screwed connection, the screw is including locating first screw outside the seal groove and locating second screw in the seal groove, the second screw is located one side of base be equipped with the seal groove that the pad pasting board is connected.

Realize above-mentioned technical scheme to it is fixed with pad pasting board and base through the screw, with the gas leakage that reduces screw connection department.

As a preferred scheme of this application, be equipped with on the pad pasting board and get the hand groove, it is located to get the hand groove the both sides in FPC circuit profile modeling district.

The technical scheme is realized so as to facilitate the installation and the taking of the FPC circuit board.

As a preferable scheme of the present application, four gas channels are provided, and the four gas channels are respectively located on four sides of the base and connected with the gas groove.

Realize above-mentioned technical scheme to in vacuum air exhaust from four directions, on the one hand can be used to promote the speed of bleeding, on the other hand can make the FPC circuit board atress on the pad pasting board even.

As a preferred scheme of the present application, the four sides of the base are further provided with interfaces connected with the gas channel, and the interfaces are externally connected with gas pipe joints.

According to the technical scheme, the vacuum air pipe is externally connected through the air pipe connector.

In summary, the present application has the following beneficial effects:

this application embodiment includes through providing a FPC pad pasting adsorption equipment: the side surface of the base is provided with a gas channel, the gas channel is connected with a gas groove arranged on the top surface of the base, a sealing groove for mounting a sealing ring is arranged around the gas groove, and the sealing groove is connected with the bottom surface of the film pasting plate; the top surface of the film pasting plate is provided with an FPC circuit profiling area, an FPC positioning column and a plurality of vacuum suction holes are arranged in the FPC circuit profiling area, the vacuum suction holes are connected with the bottom surface of the film pasting plate, an FPC profiling groove connected with the vacuum suction holes is arranged on the bottom surface of the film pasting plate, and the FPC profiling groove is connected with the gas groove through a gas connecting groove; this application reference column that not only the accessible was equipped with fixes a position FPC circuit board, and the vacuum suction hole that the accessible was equipped with moreover is with the smooth surface that adsorbs at the pad pasting board of FPC circuit board to help artifical pad pasting, increase the efficiency of pad pasting.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is an exploded view of an embodiment of the present application.

Fig. 2 is a schematic partial cross-sectional structure according to the present application.

FIG. 3 is a bottom view of a film pasting board according to the present application.

The corresponding part names indicated by the numbers and letters in the drawings:

1. a base; 2. pasting a film board; 3. a gas channel; 4. an air tank; 5. a sealing groove; 6. an FPC circuit profiling area; 7. FPC locating columns; 8. a vacuum suction hole; 9. an FPC contour groove; 10. a gas connecting groove; 11. a hand taking groove; 12. an interface; 13. an FPC board.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

A FPC pad adsorption device is disclosed, referring to fig. 1, fig. 2 and fig. 3, comprising a base 1 and a pad pasting board 2 arranged on the top surface of the base 1, the top surface of the pad pasting board 2 is provided with a FPC circuit profiling area 6 with the same shape with an FPC circuit board 13, an FPC positioning column 7 used for positioning the FPC circuit board 13 and a plurality of vacuum suction holes 8 used for adsorbing the FPC circuit board 13 on the pad pasting board 2 are arranged in the FPC circuit profiling area 6, the vacuum suction holes 8 are connected with an FPC profiling groove 9 arranged on the bottom surface of the pad pasting board 2, the side edge of the FPC profiling groove 9 is provided with a gas connecting groove 10 connected with the base 1, the base 1 is provided with a gas groove 4 connected with the gas connecting groove 10, the gas groove 4 is connected with a gas channel 3 arranged on the side edge of the base 1, the gas channel 3 is provided with a connector 12, the connector 12 is used for connecting an external gas pipe, so that the connector 12, the gas channel 3, the gas groove 4 and the gas connecting groove 10, A vacuum suction channel is formed between the FPC contour groove 9 and the vacuum suction hole 8.

In this embodiment, the base 1 and the film pasting board 2 are connected through flat head screws, each flat head screw comprises a first flat head screw arranged outside the sealing groove 5 and a second flat head screw arranged in the sealing groove 5, the sealing groove 5 is arranged around the second flat head screw and used for installing a sealing ring and sealing the position of the flat head screw to prevent air leakage at the screw connection part, the sealing groove 5 is arranged around the air groove 4, and the sealing ring connected with the film pasting board 2 is arranged in the sealing groove 5, so that the base 1 and the film pasting board 2 are sealed without air leakage. In other embodiments, the base 1 and the film pasting board 2 can be connected by cross screws or hexagon socket head cap screws.

In this embodiment, FPC reference column 7 is connected through the location guiding hole that is equipped with on the pad pasting board 2, with the locating hole that is equipped with on the base 1, FPC reference column 7 is used for FPC circuit board 13's installation location on the one hand, and on the other hand is used for the installation location of pad pasting board 2 and base 1, and the locating hole is equipped with the seal groove 5 of installation sealing washer all around, and seal groove 5 is connected with the bottom surface of pad pasting board 2 for the locating hole is sealed all around, in order to prevent the side gas leakage of FPC reference column 7.

In the embodiment, the film sticking board 2 is provided with the hand taking grooves 11, and the hand taking grooves 11 are positioned at two sides of the FPC circuit copying area 6 so as to facilitate the installation and taking of the FPC circuit board 13.

In this embodiment, four gas channels 3 are provided, the four gas channels 3 are respectively located on four sides of the base 1 and connected with the gas grooves 4, and the number of the gas grooves 4 is the same as that of the gas channels 3, so that vacuum pumping is performed from four directions when in use, on one hand, the vacuum pumping device can be used for improving the pumping speed, and on the other hand, the force applied to the FPC board 13 on the film sticking board 2 is uniform. In other embodiments, the number of gas channels 3 and gas grooves 4 may be set to more or less than four.

In this embodiment, the number of the FPC imitation grooves 9 is four, and the four FPC imitation grooves 9 are connected with the gas tank 4 through the gas connecting grooves 10, so that the FPC boards 13 on the film sticking board 2 are adsorbed from four directions, and the FPC boards 13 can be smoothly adsorbed on the surface of the film sticking board 2.

Specifically, when in actual use, put into FPC circuit board 13 of waiting the pad pasting into FPC circuit profile modeling district 6 to utilize FPC circuit profile modeling district 6 in the FPC reference column 7 that sets up to be connected with the locating hole on FPC circuit board 13, make FPC circuit board 13 be fixed a position at FPC circuit profile modeling district 6, then, vacuum suction pipe vacuum through interface 12 air pipe joint external connection is bled, adsorb FPC circuit board 13 and smooth at pad pasting board 2, carry out the pad pasting again to FPC circuit board 13, wait to after the pad pasting, stop the vacuum suction pipe and breathe in, finally, take out the FPC circuit board 13 after the pad pasting through getting hand groove 11.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An FPC pad pasting adsorption equipment includes: the sealing device comprises a base (1) and a film pasting plate (2) arranged on the top surface of the base (1), and is characterized in that a gas channel (3) is arranged on the side surface of the base (1), the gas channel (3) is connected with a gas groove (4) arranged on the top surface of the base (1), a sealing groove (5) for mounting a sealing ring is arranged around the gas groove (4), and the sealing groove (5) is connected with the bottom surface of the film pasting plate (2); the top surface of pad pasting board (2) is equipped with FPC circuit profile modeling district (6), be equipped with FPC reference column (7) and a plurality of vacuum suction hole (8) in FPC circuit profile modeling district (6), vacuum suction hole (8) with the bottom surface of pad pasting board (2) is connected, the bottom surface of pad pasting board (2) be equipped with FPC profile modeling groove (9) that vacuum suction hole (8) are connected, FPC profile modeling groove (9) through gas connection groove (10) with gas tank (4) are connected.

2. The FPC film sticking adsorption device according to claim 1, wherein the FPC positioning column (7) is connected with a positioning hole formed in the base (1) through a positioning guide hole formed in the film sticking plate (2), a sealing groove (5) for installing a sealing ring is formed around the positioning hole, and the sealing groove (5) is connected with the bottom surface of the film sticking plate (2).

3. The FPC film sticking adsorption device according to claim 2, wherein the film sticking plate (2) is connected with the base (1) through screws, the screws include a first screw arranged outside the sealing groove (5) and a second screw arranged in the sealing groove (5), and a sealing groove (5) connected with the film sticking plate (2) is arranged on one side of the base (1) of the second screw.

4. The FPC film sticking adsorption device according to claim 3, wherein a hand-fetching groove (11) is formed in the film sticking plate (2), and the hand-fetching groove (11) is located on two sides of the FPC circuit profiling area (6).

5. The FPC pasting adsorption device of claim 1, wherein there are four gas channels (3), and four gas channels (3) are respectively located on four sides of the base (1) and connected with the gas groove (4).

6. The FPC sticking film adsorption device according to claim 5, wherein interfaces (12) connected with the gas channels (3) are further arranged on four sides of the base (1), and the interfaces (12) are externally connected with a gas pipe joint.

7. The FPC pad adsorption device of claim 1, wherein four FPC contour grooves (9) are provided, and the four FPC contour grooves (9) are respectively connected with the gas tank (4) through gas connecting grooves (10).