CN105307408A - Vacuum adsorption printing tool - Google Patents

Vacuum adsorption printing tool Download PDF

Info

Publication number
CN105307408A
CN105307408A CN201510560269.XA CN201510560269A CN105307408A CN 105307408 A CN105307408 A CN 105307408A CN 201510560269 A CN201510560269 A CN 201510560269A CN 105307408 A CN105307408 A CN 105307408A
Authority
CN
China
Prior art keywords
box body
hollow box
plate
location
vacuum suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510560269.XA
Other languages
Chinese (zh)
Inventor
杨文杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Enouxi Precision Machinery Manufacturing Co Ltd
Original Assignee
Suzhou Enouxi Precision Machinery Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Enouxi Precision Machinery Manufacturing Co Ltd filed Critical Suzhou Enouxi Precision Machinery Manufacturing Co Ltd
Priority to CN201510560269.XA priority Critical patent/CN105307408A/en
Publication of CN105307408A publication Critical patent/CN105307408A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)

Abstract

The invention discloses a vacuum adsorption printing tool, and the tool is characterized in that the tool comprises a hollow box body and a positioning plate for placing a circuit board. The positioning plate is fixed on the hollow box body in a closed manner, and the central part of the positioning plate is provided with a positioning groove. The positioning groove is provided with a plurality of through holes, and the through holes are communicated with the interior of the hollow box body. The interior of the hollow box body is fixedly provided with a plurality of centres. The surrounding corners of the positioning groove are provided with a plurality of centre holes, and the centres are positioned in the centre holes in a telescoping manner. A side wall of the hollow box body is provided with an air exhaust hole and an inflation hole. The tool can improve printing efficiency, and guarantees the printing equality.

Description

Vacuum suction printing apparatus
Technical field
The present invention relates to a kind of printing apparatus, particularly relate to a kind of vacuum suction printing apparatus.
Background technology
Available circuit plate is usually positioned by some mechanical clamps in printing, these fixtures need the clamping of the manual operations ability completing circuit plate by staff, bother very much, printing efficiency is low, and some circuit boards are directly placed on location-plate and print, without any constraint, circuit board in printing process is caused to occur mobile, cause misprint, can not printing quality be ensured.
Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of vacuum suction printing apparatus, make it have more value in industry.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide one can improve printing efficiency, ensures the vacuum suction printing apparatus of printing quality.
A kind of vacuum suction printing apparatus that the present invention proposes, it is characterized in that: comprise a hollow box body, the location-plate that one power circuit board is placed, described location-plate sealing is fixed on described hollow box body, the centre of described location-plate is provided with location notch, some through holes are offered in described location notch, described through hole is communicated with the inside of described hollow box body, some thimbles are fixed with in described hollow box body, the surrounding corner of described location notch is provided with some centre holes, described thimble is flexible to be positioned in described centre hole, the sidewall of described hollow box body is provided with an aspirating hole and an air-filled pore.
As a further improvement on the present invention, the surrounding madial wall of described location notch is fixed with a circle horizontal projection resilient rubbber cushion, between the bottom of described resilient rubbber cushion and described location notch, leaves gap.
As a further improvement on the present invention, described location notch is rectangle, and described centre hole is four and is distributed in four corners of described location notch, fixedly plugs a rubber ring in described centre hole.
As a further improvement on the present invention, be fixed with four cylinders in described hollow box body, described thimble is vertically fixed on described cylinder, and the sidewall of described hollow box body is provided with four cylinders and connects gas port.
As a further improvement on the present invention, the corner of described location-plate is equipped with pass through aperture, the corner of described hollow box body is equipped with a screwed hole, described location-plate is screwed on described hollow box body.
As a further improvement on the present invention, sealant tape is detachably enclosed around one in the position that described location-plate is connected with described hollow box body.
By such scheme, the present invention at least has the following advantages: circuit board can be made to be placed on location-plate by location notch, bled by aspirating hole, hollow box body inside is made to form vacuum, be sealed on hollow box body by location-plate, through hole in location notch is communicated with the inside of hollow box body, make circuit board in location notch by vacuum suction on location-plate, thus facilitate circuit board to carry out printing operation, avoid occurring in circuit board printing process moving, improve printing efficiency, ensure printing quality, after circuit board is completed for printing, inflate in hollow box body with overcharging gas port, again by the stretching motion of thimble, thus by circuit board jack-up, the circuit board facilitating staff to collect to print, increase work efficiency.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is the structural representation of vacuum suction printing apparatus of the present invention;
Fig. 2 is the schematic diagram of cylinder in the present invention;
Wherein: 1-hollow box body; 2-location-plate; 3-location notch; 4-through hole; 5-thimble; 6-centre hole; 7-aspirating hole; 8-air-filled pore; 9-resilient rubbber cushion; 10-rubber ring; 11-cylinder; 12-cylinder connects gas port; 13-through hole; 14-sealant tape.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Embodiment: a kind of vacuum suction printing apparatus, comprise the location-plate 2 that hollow box body 1, power circuit board is placed, described location-plate sealing is fixed on described hollow box body, the centre of described location-plate is provided with location notch 3, some through holes 4 are offered in described location notch, described through hole is communicated with the inside of described hollow box body, some thimbles 5 are fixed with in described hollow box body, the surrounding corner of described location notch is provided with some centre holes 6, described thimble is flexible to be positioned in described centre hole, and the sidewall of described hollow box body is provided with aspirating hole 7 and an air-filled pore 8.Circuit board can be made to be placed on location-plate by location notch, bled by aspirating hole, hollow box body inside is made to form vacuum, be sealed on hollow box body by location-plate, through hole in location notch is communicated with the inside of hollow box body, make circuit board in location notch by vacuum suction on location-plate, thus facilitate circuit board to carry out printing operation, avoid occurring in circuit board printing process moving, improve printing efficiency, ensure printing quality, after circuit board is completed for printing, inflate in hollow box body with overcharging gas port, again by the stretching motion of thimble, thus by circuit board jack-up, the circuit board facilitating staff to collect to print, increase work efficiency.
The surrounding madial wall of described location notch is fixed with a circle horizontal projection resilient rubbber cushion 9, between the bottom of described resilient rubbber cushion and described location notch, leaves gap.Circuit board can be made just to be located bottom location notch and between resilient rubbber cushion by during vacuum suction by the effect of resilient rubbber cushion.
Described location notch is rectangle, and described centre hole is four and is distributed in four corners of described location notch, fixedly plugs a rubber ring 10 in described centre hole.Can make to form sealing state between thimble and centre hole by rubber ring.
Be fixed with four cylinders 11 in described hollow box body, described thimble is vertically fixed on described cylinder, and the sidewall of described hollow box body is provided with four cylinders and connects gas port 12.The stretching motion of thimble is controlled by cylinder.
The corner of described location-plate is equipped with pass through aperture 13, the corner of described hollow box body is equipped with a screwed hole, described location-plate is screwed on described hollow box body.
Sealant tape 14 is detachably enclosed around one in the position that described location-plate is connected with described hollow box body.Location-plate is realized and hollow box body is tightly connected by sealant tape.
The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.

Claims (6)

1. a vacuum suction printing apparatus, it is characterized in that: the location-plate comprising a hollow box body, a power circuit board placement, described location-plate sealing is fixed on described hollow box body, the centre of described location-plate is provided with location notch, some through holes are offered in described location notch, described through hole is communicated with the inside of described hollow box body, some thimbles are fixed with in described hollow box body, the surrounding corner of described location notch is provided with some centre holes, described thimble is flexible to be positioned in described centre hole, and the sidewall of described hollow box body is provided with an aspirating hole and an air-filled pore.
2. vacuum suction printing apparatus according to claim 1, is characterized in that: the surrounding madial wall of described location notch is fixed with a circle horizontal projection resilient rubbber cushion, leaves gap between the bottom of described resilient rubbber cushion and described location notch.
3. vacuum suction printing apparatus according to claim 2, is characterized in that: described location notch is rectangle, and described centre hole is four and is distributed in four corners of described location notch, fixedly plugs a rubber ring in described centre hole.
4. vacuum suction printing apparatus according to claim 3, is characterized in that: be fixed with four cylinders in described hollow box body, and described thimble is vertically fixed on described cylinder, and the sidewall of described hollow box body is provided with four cylinders and connects gas port.
5. vacuum suction printing apparatus according to claim 4, is characterized in that: the corner of described location-plate is equipped with pass through aperture, the corner of described hollow box body is equipped with a screwed hole, described location-plate is screwed on described hollow box body.
6. vacuum suction printing apparatus according to claim 5, is characterized in that: sealant tape is detachably enclosed around one in the position that described location-plate is connected with described hollow box body.
CN201510560269.XA 2015-09-07 2015-09-07 Vacuum adsorption printing tool Pending CN105307408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510560269.XA CN105307408A (en) 2015-09-07 2015-09-07 Vacuum adsorption printing tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510560269.XA CN105307408A (en) 2015-09-07 2015-09-07 Vacuum adsorption printing tool

Publications (1)

Publication Number Publication Date
CN105307408A true CN105307408A (en) 2016-02-03

Family

ID=55204005

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510560269.XA Pending CN105307408A (en) 2015-09-07 2015-09-07 Vacuum adsorption printing tool

Country Status (1)

Country Link
CN (1) CN105307408A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107708324A (en) * 2017-09-29 2018-02-16 奥士康科技股份有限公司 Anti-welding nail bed of printed circuit board (PCB) and preparation method thereof
CN108633248A (en) * 2018-07-18 2018-10-09 东莞光韵达光电科技有限公司 A kind of automanual FPC laminating apparatus
CN110124908A (en) * 2019-06-21 2019-08-16 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Wafer vacuum adsorbent equipment
CN110640651A (en) * 2019-09-26 2020-01-03 苏州领裕电子科技有限公司 Universal pinhole type cavity vacuum adsorption clamp
CN111010819A (en) * 2019-12-17 2020-04-14 北京无线电计量测试研究所 Printed board mounting die and method
CN111770647A (en) * 2020-06-04 2020-10-13 北京无线电计量测试研究所 Circuit board tin cream printing frock
CN112996325A (en) * 2021-02-05 2021-06-18 隽美经纬电路有限公司 COP material flexible line way board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020059040A (en) * 2000-12-30 2002-07-12 안민혁 Apparatus to prevent bending of large size substrate board
CN203645925U (en) * 2013-12-18 2014-06-11 深圳市三德冠精密电路科技有限公司 Clamp for conducting strip bonding
CN204183404U (en) * 2014-10-24 2015-03-04 昆山金运新材料科技有限公司 Vacuum absorption device
CN204335165U (en) * 2014-10-22 2015-05-13 深圳市中软信达电子有限公司 A kind of flexible PCB joint tool

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020059040A (en) * 2000-12-30 2002-07-12 안민혁 Apparatus to prevent bending of large size substrate board
CN203645925U (en) * 2013-12-18 2014-06-11 深圳市三德冠精密电路科技有限公司 Clamp for conducting strip bonding
CN204335165U (en) * 2014-10-22 2015-05-13 深圳市中软信达电子有限公司 A kind of flexible PCB joint tool
CN204183404U (en) * 2014-10-24 2015-03-04 昆山金运新材料科技有限公司 Vacuum absorption device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107708324A (en) * 2017-09-29 2018-02-16 奥士康科技股份有限公司 Anti-welding nail bed of printed circuit board (PCB) and preparation method thereof
CN108633248A (en) * 2018-07-18 2018-10-09 东莞光韵达光电科技有限公司 A kind of automanual FPC laminating apparatus
CN108633248B (en) * 2018-07-18 2023-10-31 东莞光韵达光电科技有限公司 Semi-automatic FPC laminating device
CN110124908A (en) * 2019-06-21 2019-08-16 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Wafer vacuum adsorbent equipment
CN110640651A (en) * 2019-09-26 2020-01-03 苏州领裕电子科技有限公司 Universal pinhole type cavity vacuum adsorption clamp
CN111010819A (en) * 2019-12-17 2020-04-14 北京无线电计量测试研究所 Printed board mounting die and method
CN111770647A (en) * 2020-06-04 2020-10-13 北京无线电计量测试研究所 Circuit board tin cream printing frock
CN111770647B (en) * 2020-06-04 2021-12-10 北京无线电计量测试研究所 Circuit board tin cream printing frock
CN112996325A (en) * 2021-02-05 2021-06-18 隽美经纬电路有限公司 COP material flexible line way board
CN112996325B (en) * 2021-02-05 2023-02-21 隽美经纬电路有限公司 COP material flexible line way board

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Application publication date: 20160203