CN109873068B - Eutectic machine - Google Patents
Eutectic machine Download PDFInfo
- Publication number
- CN109873068B CN109873068B CN201910014348.9A CN201910014348A CN109873068B CN 109873068 B CN109873068 B CN 109873068B CN 201910014348 A CN201910014348 A CN 201910014348A CN 109873068 B CN109873068 B CN 109873068B
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- China
- Prior art keywords
- semiconductor support
- chip
- rack
- positioning device
- plate body
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- 230000005496 eutectics Effects 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 75
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 230000001105 regulatory effect Effects 0.000 claims abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Abstract
The invention discloses a eutectic machine, which comprises a frame, a placing frame, a positioning device, a heating device, a chip frame and a manipulator, wherein the semiconductor support is positioned by the positioning device, the semiconductor support can move along the direction regulated by the positioning device, the heating device is arranged on the positioning device and synchronously heats the semiconductor support, an exposed part is arranged on the positioning device, the exposed part can expose the semiconductor support, so that the manipulator can clamp a chip from the chip frame to the semiconductor support, then press the chip on the semiconductor support, the semiconductor support is heated by the heating device to reach the eutectic temperature, and then the chip and the semiconductor support form eutectic reaction under the pressure of the manipulator, so that the chip and the semiconductor support are combined into a whole.
Description
Technical Field
The invention relates to the field of processing, in particular to a eutectic machine.
Background
The LED lamp and the like are common products at present, an LED chip is required to be mounted on a semiconductor support during manufacturing, the existing manufacturing mode is that a layer of glue is firstly brushed on the semiconductor support through a glue brush, then the chip is stuck on the semiconductor support through a mechanical arm, the mode is required to be subjected to two procedures of glue brushing and sticking, and the sticking effect is easy to lose efficacy due to a large quantity of heat dissipation of the stuck LED chip after the LED lamp is used for a long time, so that the LED lamp is separated.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide production equipment which is simpler and has better effect.
The invention adopts the technical scheme that:
a eutectic machine, comprising:
a frame;
the placing rack is arranged on the rack and used for placing the semiconductor bracket;
the positioning device is used for positioning the semiconductor support, the semiconductor support can move along the direction specified by the positioning device, the positioning device is provided with an exposing part, and the exposing part can expose the semiconductor support;
the heating device is arranged on the positioning device and is used for heating the semiconductor support;
the chip rack is positioned on the rack and is used for placing chips;
and the manipulator is used for clamping the chip on the chip rack and moving to the exposed part so as to be placed on the exposed semiconductor support.
As a further improvement of the above technical scheme, the positioning device comprises a first plate body and a second plate body, the first plate body and the second plate body are covered, a through groove is formed between the first plate body and the second plate body, the semiconductor support can move along the through groove, the exposed part is a through hole arranged on the surface of the first plate body, and the through hole is communicated with the through groove so as to expose the semiconductor support.
As a further improvement of the above technical solution, the first plate body and the second plate body are integrally made.
As a further improvement of the technical scheme, the second plate body is provided with a perforation, the perforation corresponds to the through hole in position, the perforation is communicated with the through groove, the rack is also provided with a pushing device, and the pushing device can penetrate through the perforation to push the semiconductor support.
As a further improvement of the above technical solution, the bottom of the positioning device is further provided with a driving device, and the driving device is used for driving the position of the positioning device, so as to adjust the position of the semiconductor support.
As a further improvement of the above technical solution, the bottom of the chip rack is also provided with a driving mechanism for adjusting the position of the driving rack and thus the position of the chip.
As a further improvement of the above technical solution, a camera guide device is provided above the exposed portion and above the chip rack.
As a further improvement of the technical scheme, the manipulator comprises a mechanical arm and clamping jaws, and the clamping jaws are vacuum chucks.
As a further improvement of the technical scheme, the chip rack further comprises a base, wherein the base is arranged on the rack, one end of the mechanical arm is installed on the base and can move up and down relative to the base, and the mechanical arm can rotate relative to the installation point, so that the vacuum chuck can reciprocate between the chip rack and the exposed part.
As a further improvement of the technical scheme, the mechanical arm is further provided with an air guide hole, and the air guide hole is used for reducing air resistance.
The beneficial effects of the invention are as follows: the semiconductor support is positioned by the positioning device, the semiconductor support can move along the direction specified by the positioning device, the heating device synchronously heats the semiconductor support at the moment, the positioning device is provided with an exposing part, the exposing part can expose the semiconductor support, so that the manipulator can clamp and core the chip to move to the semiconductor support, then the chip is pressed on the semiconductor support, the semiconductor support is heated by the heating device to reach the eutectic temperature, and then the chip and the semiconductor support form eutectic reaction under the pressure of the manipulator, so that the chip and the semiconductor support are combined into a whole.
Drawings
The invention is further illustrated by the following description and examples of the embodiments in conjunction with the accompanying drawings.
FIG. 1 is a schematic view of a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a partial enlarged structure at A in FIG. 1;
FIG. 3 is a schematic view of a preferred structure of the positioning device of the present invention;
FIG. 4 is a schematic view of a manipulator according to a preferred embodiment of the present invention;
fig. 5 is a schematic structural diagram of a conventional semiconductor support.
Detailed Description
Referring to fig. 1 to 5, a eutectic machine includes:
a frame 10;
a mount 20, the mount 20 being provided on the frame 10, the mount 20 being for placing the semiconductor support 70;
the positioning device 30 is used for positioning the semiconductor support 70, the semiconductor support 70 can move along the direction specified by the positioning device 30, the positioning device 30 is provided with an exposing part, and the exposing part can expose the semiconductor support 70;
a heating device provided on the positioning device 30 for heating the semiconductor support 70;
a chip rack 40, wherein the chip rack 40 is positioned on the frame 10, and the chip rack 40 is used for placing chips;
and a robot 50 for holding the chip on the chip carrier 40 and moving to the exposed portion so as to be placed on the exposed semiconductor support 70.
The semiconductor support 70 is positioned by the positioning device 30, the semiconductor support 70 can move along the direction specified by the positioning device 30, at the moment, the heating device synchronously heats the semiconductor support 70, an exposed part is arranged on the positioning device 30, the exposed part can expose the semiconductor support 70, so that the manipulator 50 can clamp a chip to move onto the semiconductor support 70, then the chip is pressed on the semiconductor support 70, the semiconductor support 70 is heated by the heating device to reach the eutectic temperature, and then the chip and the semiconductor support 70 form eutectic reaction under the pressure of the manipulator 50, so that the chip and the semiconductor support 70 are combined together.
The positioning device 30 may be implemented in various ways, and may be a positioning plate, on which a positioning groove is installed, and the semiconductor support 70 is located in the positioning groove and moves along a direction defined by the positioning groove, but as shown in fig. 5, the thickness of the semiconductor support 70 is very thin, and the whole is relatively soft, and the semiconductor support is easy to run, so that the positioning device 30 is further improved, and includes a first plate 31 and a second plate 33, where the first plate 31 and the second plate 33 are covered, a through groove 34 is formed between the first plate 31 and the second plate 33, the semiconductor support 70 can move along the through groove 34, and the exposed portion is a through hole 32 provided on a surface of the first plate 31, and the through hole 32 is in communication with the through groove 34 so as to expose the semiconductor support 70. By the cooperation of the first plate 31 and the second plate 33, the deformation running of the semiconductor support 70 can be further restricted. Of course, the first plate 31 and the second plate 33 may be integrally formed.
In order to prevent the pressure from being insufficient when the manipulator 50 is pressed down, the second plate 33 is further improved, the second plate 33 is provided with a through hole, the through hole corresponds to the through hole 32, the through hole is communicated with the through groove 34, the frame 10 is further provided with a pushing device 35, and the pushing device 35 can pass through the through hole to push the semiconductor support 70. When the manipulator 50 clamps the chip to brake the surface of the semiconductor support 70 and pushes the chip down on the semiconductor support 70, the pushing device 35 pushes up synchronously, and the pressure between the chip and the semiconductor support 70 is effectively ensured by the pushing up of the pushing device 35 and the pushing down action of the manipulator 50, so that the eutectic reaction is completed.
Further improved, the bottom of the positioning device 30 is also provided with a driving device 81, and the driving device 81 is used for driving the position of the positioning device 30, so that the position of the semiconductor support 70 is adjusted, and the position can be adjusted according to actual conditions when the positioning device is used. Similarly, a driving mechanism 80 is also disposed at the bottom of the chip frame 40, and the driving mechanism 80 is used for adjusting the position of the driving frame, thereby adjusting the position of the chip. The drive means 81 and the drive mechanism 80 are preferably two-dimensional displacement means.
Further improvement is made, in order to enable the manipulator 50 to accurately clamp the chip and accurately move to the characteristic position of the semiconductor support 70, a camera guiding device is arranged above the exposed part and above the chip rack 40, and the position of the chip and the position of the surface of the semiconductor support 70 are accurately positioned through camera guiding, so that the movement of the manipulator 50 is controlled.
The manipulator 50 comprises a manipulator arm 51 and a clamping jaw 52, and as most of the existing chips are small in size, the common clamping jaw 52 is difficult to clamp and take, the manipulator arm is further improved, the clamping jaw 52 is a vacuum chuck, and the clamping jaw 52 is sucked through the vacuum chuck, so that the problem can be effectively solved.
Further, the improvement comprises a base 60, wherein the base 60 is arranged on the frame 10, one end of the mechanical arm 51 is arranged on the base 60 and can move up and down relative to the base 60, the mechanical arm 51 can rotate relative to the mounting point, so that the vacuum chuck can reciprocate between the chip rack 40 and the exposed part, the driving device 81 and the driving structure are combined, the mechanical arm 51 can move only in a fixed range, the chip and the semiconductor support 70 are positioned through the guidance of a camera, and then the driving device 81 and the driving structure are driven, so that the positions of the semiconductor support 70 and the chip rack 40 are adjusted, and the chip or the semiconductor support 70 can be aligned with the position of the mechanical gripper, so that the purpose of further controlling errors is realized, and the errors caused by the mechanical gripper are large and are not easy to control in a tiny position.
Further, the mechanical arm 51 is further provided with an air guide hole 53, and the air guide hole 53 is used for reducing air resistance, so that errors caused by mechanical claws are further reduced.
The shelf 20 may be a conventional tray-type shelf 20 because the semiconductor support 70 shown in fig. 5 is mostly packaged in rolls at the time of shipment. Of course, the positioning device 30 and the mount 20 may be replaced with different shapes according to the semiconductor device holder 70.
The foregoing description of the preferred embodiments of the present invention should not be construed as limiting the scope of the invention, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).
Claims (7)
1. A eutectic machine, comprising:
a frame (10);
the placing rack (20) is arranged on the rack (10), and the placing rack (20) is used for placing the semiconductor bracket (70);
the positioning device (30), the positioning device (30) is used for positioning the semiconductor support (70), the semiconductor support (70) can move along the direction regulated by the positioning device (30), the positioning device (30) is provided with an exposing part, and the exposing part can expose the semiconductor support (70);
the heating device is arranged on the positioning device (30) and is used for heating the semiconductor support (70);
a chip rack (40), wherein the chip rack (40) is positioned on the rack (10), and the chip rack (40) is used for placing chips;
a robot arm (50), wherein the robot arm (50) is used for clamping a chip on the chip rack (40) and moving to the exposed part so as to be placed on the exposed semiconductor support (70);
the positioning device (30) comprises a first plate body (31) and a second plate body (33), the first plate body (31) and the second plate body (33) are covered, a through groove (34) is formed between the first plate body (31) and the second plate body (33), the semiconductor support (70) can move along the through groove (34), the exposed part is a through hole (32) arranged on the surface of the first plate body (31), and the through hole (32) is communicated with the through groove (34) so as to expose the semiconductor support (70);
the first plate body (31) and the second plate body (33) are integrally manufactured;
the second plate body (33) is provided with a perforation, the perforation corresponds to the position of the through hole (32), the perforation is communicated with the through groove (34), the rack (10) is also provided with a pushing device (35), and the pushing device (35) can penetrate through the perforation to push the semiconductor support (70).
2. The eutectic machine of claim 1, wherein:
the bottom of the positioning device (30) is also provided with a driving device (81), and the driving device (81) is used for driving the position of the positioning device (30) so as to adjust the position of the semiconductor support (70).
3. The eutectic machine of claim 2, wherein:
the bottom of the chip frame (40) is also provided with a driving mechanism (80), and the driving mechanism (80) is used for adjusting the position of the driving frame so as to adjust the position of the chip.
4. A eutectic machine as claimed in claim 1 or claim 3, wherein:
a camera guiding device is arranged above the exposed part and above the chip frame (40).
5. The eutectic machine of claim 1, wherein:
the manipulator (50) comprises a manipulator arm (51) and clamping jaws (52), and the clamping jaws (52) are vacuum chucks.
6. The eutectic machine of claim 5, wherein:
the chip rack further comprises a base (60), the base (60) is arranged on the rack (10), one end of the mechanical arm (51) is arranged on the base (60) and can move up and down relative to the base (60), and the mechanical arm (51) can rotate relative to the mounting point, so that the vacuum chuck can reciprocate between the chip rack (40) and the exposed part.
7. The eutectic machine of claim 5, wherein:
the mechanical arm (51) is further provided with an air guide hole (53), and the air guide hole (53) is used for reducing air resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014348.9A CN109873068B (en) | 2019-01-08 | 2019-01-08 | Eutectic machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014348.9A CN109873068B (en) | 2019-01-08 | 2019-01-08 | Eutectic machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109873068A CN109873068A (en) | 2019-06-11 |
| CN109873068B true CN109873068B (en) | 2024-03-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910014348.9A Active CN109873068B (en) | 2019-01-08 | 2019-01-08 | Eutectic machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109873068B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808976B (en) * | 2021-11-22 | 2022-03-01 | 武汉琢越光电有限公司 | Automatic eutectic machine of semiconductor chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009194234A (en) * | 2008-02-15 | 2009-08-27 | Renesas Technology Corp | Methods of manufacturing semiconductor device and semiconductor electronic component, and semiconductor electronic component |
| JP2013030607A (en) * | 2011-07-28 | 2013-02-07 | Nissan Motor Co Ltd | Method of manufacturing semiconductor apparatus and semiconductor apparatus |
| JP2015185689A (en) * | 2014-03-24 | 2015-10-22 | 日産自動車株式会社 | Packaging method of semiconductor and manufacturing device for semiconductor component |
| CN205406943U (en) * | 2016-02-26 | 2016-07-27 | 深圳市锐博自动化设备有限公司 | Full -automatic LD chip eutectic device |
| CN207116382U (en) * | 2017-09-05 | 2018-03-16 | 深圳市锐博自动化设备有限公司 | A kind of full-automatic eutectic machine |
| CN209312792U (en) * | 2019-01-08 | 2019-08-27 | 王耀村 | A kind of eutectic machine |
-
2019
- 2019-01-08 CN CN201910014348.9A patent/CN109873068B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009194234A (en) * | 2008-02-15 | 2009-08-27 | Renesas Technology Corp | Methods of manufacturing semiconductor device and semiconductor electronic component, and semiconductor electronic component |
| JP2013030607A (en) * | 2011-07-28 | 2013-02-07 | Nissan Motor Co Ltd | Method of manufacturing semiconductor apparatus and semiconductor apparatus |
| JP2015185689A (en) * | 2014-03-24 | 2015-10-22 | 日産自動車株式会社 | Packaging method of semiconductor and manufacturing device for semiconductor component |
| CN205406943U (en) * | 2016-02-26 | 2016-07-27 | 深圳市锐博自动化设备有限公司 | Full -automatic LD chip eutectic device |
| CN207116382U (en) * | 2017-09-05 | 2018-03-16 | 深圳市锐博自动化设备有限公司 | A kind of full-automatic eutectic machine |
| CN209312792U (en) * | 2019-01-08 | 2019-08-27 | 王耀村 | A kind of eutectic machine |
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| Publication number | Publication date |
|---|---|
| CN109873068A (en) | 2019-06-11 |
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Effective date of registration: 20240326 Address after: One of the first floors, No. 6 Yongxiang 6th Lane, Guangfeng South Road, Leixi 1st Community, Xiaolan Town, Zhongshan City, Guangdong Province, 528415 Patentee after: Zhongshan Xiliang Technology Co.,Ltd. Country or region after: China Address before: 6th Floor, No. 13, Guangle North Road, Lianfeng, Xiaolan Town, Zhongshan City, Guangdong Province, 528400 Patentee before: Wang Yaocun Country or region before: China |