JPH10270532A - Chip supplying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip supplying device, wherein the various workings such as taking-out working of a wafer holder from a magazine, elongating working of a wafer sheet and the direction correcting working for a chip on the wafer sheet are performed as a series of the workings, and these various workings can be smoothly performed in good linkage, in a die bonding device for picking up a chip on a wafer with a collet and mounting the chip on a substrate. SOLUTION: A wafer holder 6 is taken out on a lower guide member 28 at the lower side of a pushing member 26 by a moving arm. When the pushing member 26 is lowered along a feed screw 24, a wafer sheet 7 is landed on a tube body 31 and elongated. Then, a chip 8 is observed with a camera 8. By horizontally rotating the chip 8 based on the result of the observation, the direction of the chip 8 is corrected so as to agree with the direction of a collet 12. Then, the collet 12 picks up the chip 8 and mounts the chip 8 on a substrate 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a chip supply apparatus for supplying chips on a wafer sheet to a collet of a die bonding apparatus.

[0002]

2. Description of the Related Art A die bonding apparatus picks up a chip of a wafer by vacuum suction with a collet and mounts the chip on a substrate such as a printed circuit board or a lead frame. The wafer is bonded with a bond on a wafer sheet stretched over a wafer holder, and is cut into many chips by dicing.

[0003] Since chips cut on a wafer sheet are close to each other and cannot be picked up by a collet as they are, it is necessary to stretch the wafer sheet to separate adjacent chips before picking up chips with the collet. Is performed. Also, the collet has a directionality in the horizontal rotation direction, and the chips on the wafer sheet are not aligned with the collet in the horizontal rotation direction.
It cannot be picked up by collets.

[0004] Therefore, this kind of chip supply device is provided with a wafer sheet stretching mechanism and a wafer holder horizontal rotation mechanism for matching the direction of the chip with the direction of the collet. In addition, since the consumption of wafers in the die bonding apparatus is large, a large number of wafer holders are generally stacked in magazines and stored, and chips on the wafer sheet at the pickup position may be out of stock or the type of chips may be changed. In such a case, a new wafer holder is taken out of the magazine and supplied to the pickup position.

[0005]

As described above, various mechanisms such as a wafer sheet stretching mechanism, a horizontal rotation mechanism of a wafer holder, and a mechanism for taking out a wafer holder from a magazine are attached to a chip supply apparatus in a die bonding apparatus. Is done.

In order to smoothly supply chips to the collet with good workability, it is desirable to operate the above three mechanisms in good cooperation. However, in a conventional chip supply device, these mechanisms are not configured to operate in cooperation with each other, and therefore, a wafer holder exchanging operation or a wafer sheet extending operation due to a shortage of chips on a wafer sheet. It takes a considerable amount of time to perform the above operations, and there is a problem that productivity is not increased accordingly.

Accordingly, an object of the present invention is to provide a chip supply apparatus in a die bonding apparatus capable of performing the above-mentioned various operations in a coordinated and smooth manner.

[0008]

SUMMARY OF THE INVENTION A chip supply apparatus according to the present invention is a chip supply apparatus for supplying chips on a wafer sheet to a collet of a die bonding apparatus, and accommodates a wafer holder on which a wafer sheet is stretched. A magazine, a positioning device for positioning a chip on a wafer sheet at a pickup position by a collet, and a transfer unit for transferring a wafer holder stored in the magazine to the positioning device, wherein the positioning device is disposed below the wafer sheet. A wafer sheet stretching mechanism comprising a cylindrical body, a pressing member for pressing the wafer holder against the upper surface of the cylindrical body by pressing the wafer holder from above, and elongating means for vertically moving the pressing member. And water for horizontally rotating the cylinder and the pressing member integrally. Consists of a rotating mechanism, and the holding-down member, is provided with a guide portion parallel to the guide member of the wafer holder formed in the magazine.

[0009]

According to the above construction, the operation of taking out the wafer holder from the magazine and positioning it on the cylindrical body,
The work of stretching the wafer sheet by pressing it against the cylinder to separate the chips, the work of horizontally rotating the wafer holder to align the direction of the chips on the wafer sheet with the direction of the collet, and the chips on the wafer sheet were out of stock. Then, various operations such as the operation of collecting the wafer holder from the cylindrical body can be smoothly performed as a series of operations.

An embodiment of the present invention will be described below with reference to the drawings. 1 is a side view of a chip supply device according to an embodiment of the present invention, FIG. 2 is a plan view of the chip supply device, FIG. 3 is a sectional view of a positioning device of the chip supply device, FIG. FIGS. 5, 6, and 7 are plan views showing the operation of replacing the wafer holder of the chip supply device.

First, the overall structure of a chip supply device will be described with reference to FIGS. 1 and 2, the chip supply device includes a magazine 1, a chip positioning device 20, and a transfer arm 4. In FIG. 3, reference numeral 6 denotes a donut-shaped wafer holder on which a wafer sheet 7 is stretched. A large number of chips 8 are adhered on the wafer sheet 7. The chip 8 is obtained by cutting a wafer stuck on the wafer sheet 7 into a matrix by dicing.

In FIG. 2, guide portions 2 are formed in multiple stages in a rack shape on the inner surfaces of both sides of the magazine 1. The wafer holder 6 on which the wafer sheet 7 is stretched is accommodated in multiple stages on the guide portion 2. Reference numeral 3 denotes an elevator for moving the magazine 1 up and down. The transfer arm 4 reciprocates between the magazine 1 and the positioning device 20 by driving a moving table (not shown). The transfer arm 4 has a chuck 5 at its tip. The transfer arm 4
The wafer holder 6 in the magazine 1 is chucked by the chuck 5, taken out of the magazine 1, and transferred to the positioning device 20. In the positioning device 20, the wafer holder 6 in which the chips 8 are out of stock is chucked by the chuck 5 and returned into the magazine 1. That is, the transfer arm 4 serves as a transfer unit of the wafer holder 6.

In FIG. 3, a guide rail 10 is provided on the side of the positioning device 20.
The substrate 11 is positioned at 0. Reference numeral 12 denotes a collet of a die bonding apparatus, which picks up the chip 8 on the wafer sheet 7 positioned by the positioning apparatus 20 by vacuum suction, and mounts the chip 8 on the substrate 11.

Next, a stretching mechanism for stretching the wafer sheet 7 stretched on the wafer holder 6 will be described with reference to FIGS. Reference numeral 21 denotes a cylindrical cylinder, and the wafer holder 6 in the magazine 1 is transferred by the transfer arm 4 so that the wafer sheet 7 is located directly above the cylinder 21. A base plate 22 is formed integrally with a lower portion of the cylindrical body 21. Bearings 23 are mounted at four corners of the base plate 22. A vertical feed screw 24 is inserted into the bearing 23. A nut 25 is mounted on the feed screw 24, and a plate-like pressing member 26 is connected to the nut 25.

As shown in FIG. 2, the pressing member 26
A circular opening 27 is opened at the center thereof, and the wafer sheet 7 is exposed to the opening 27. As shown in FIG. 3, a guide member 28 is provided on the lower surface of the pressing member 26. The wafer holder 6 taken out of the magazine 1 by the transfer arm 4 is transferred onto the guide member 28. When the transfer arm 4 transfers the wafer holder 6 in the magazine 1 to the positioning device 20, the guide member 28 is horizontally rotated by a horizontal rotation mechanism (described later) so as to be parallel to the guide portion 2 of the magazine 1, and its orientation is changed. Adjusted.

2 and 3, a pulley 31 is mounted on the lower end of the feed screw 24. A timing belt 32 is adjusted on the pulley 31. A drive pulley 33 is engaged with the timing belt 32. When the motor 34 is driven to rotate the drive pulley 33, the timing belt 32 rotates. Then four feed screws 2
4 rotates simultaneously, the nut 25 moves up and down, and the pressing member 26 integral therewith also moves up and down. That is, the feed screw 24, the nut 25, the pulley 31, the timing belt 3
2, the driving pulley 33, the motor 34, etc.
6 as vertical movement means.

When the transfer arm 4 takes out the wafer holder 6 in the magazine 1, the pressing member 26 is waiting at an upper position shown by a solid line in FIG. 3, and the wafer holder 6 transferred by the transfer arm 4 is guided by the guide. It is transported onto the member 28. Then, when the motor 34 is driven and the pressing member 26 is lowered, the wafer sheet 7 lands on the cylindrical body 21, and when the pressing member 26 is further lowered, the wafer sheet 7 is forcibly stretched, and Are separated from each other (see the wafer sheet 7 shown by a chain line in FIG. 3). When replacing the wafer holder 6 because the chips 8 on the wafer sheet 7 are out of stock or the like, the motor 34 is driven in the reverse direction to raise the pressing member 26, and the wafer holder 6 is moved to the solid line position in FIG. To raise. Then, the chuck 5 of the transfer arm 4 chucks the wafer holder 6, transfers the wafer holder 6 to the magazine 1, and collects it on the guide portion 2.

In FIGS. 1 and 3, reference numeral 60 denotes a die ejector unit. Die ejector unit 60
Is composed of a bracket 61, a main body 62 held on the front side of the bracket 61, and a pepper pot 63 provided on the main body 62. The main body 62 is driven up and down by driving means (not shown). As shown in FIG. 3, the pepper pot 63 rises to a position where it comes into contact with the lower surface of the wafer sheet 7. When the collet 12 picks up the chip 8, the chip 8 is pushed up by the pin 64 in the pepper pot 63. In FIG. 1, reference numeral 65 denotes a camera for observing the position and orientation of the chip 8 on the wafer sheet 7.

Next, the positioning mechanism 40 of the wafer holder 6 will be described with reference to FIGS. In FIG. 1, reference numeral 41 denotes an X table, 42 denotes a Y table provided on the X table 41, 43 denotes a block provided on the Y table 42, and 44 denotes a base plate provided on the block 43. An X-direction rail 45 is provided on the base plate 44. The arm 46 is moved from the base plate 22 integral with the cylinder 21.
Is extending. A roller 47 is mounted on the rear end of the arm 46. A feed screw 48 parallel to the rail 45 and a motor 49 for rotating the feed screw 48 are provided on the base plate 44.
Is provided. A nut 50 is mounted on the feed screw 48. A slider 51 is connected to the nut 50. The slider 51 is slidably fitted on the rail 45. A slider 52 having a U-shaped cross section is mounted on the upper surface of the slider 51, and the roller 47 is fitted to the slider 52.

An arc-shaped guide rail 53 is provided on the front upper surface of the base plate 44 in plan view. Base plate 22
The slider 54 mounted on the lower surface of the slider is slidably fitted on the guide rail 53. In FIG. 2, the motor 4
When the drive screw 9 rotates the feed screw 48, the nut 50 moves along the feed screw 48. Along with this, the base plate 22 and the cylindrical body 21 connected to the nut 50 via the arm 46, the roller 47, and the slider 52 are guided by the guide rail 53 and horizontally rotate integrally. As a result, the wafer holder 6 and the wafer sheet 7 on the cylinder 21 rotate horizontally, and the orientation of the chips 8 on the wafer sheet 7 in the horizontal rotation direction is adjusted. That is, the feed screw 48, the motor 49, the nut 50, the guide rail 53, the slider 54, and the like constitute a horizontal rotation mechanism of the wafer holder 6.

This chip supply device is constructed as described above, and the overall operation will be described next with reference to the drawings.
4 to 7 show a series of operations in the order of operation. FIG.
Moves the wafer holder 6 in the magazine 1 to the positioning device 20
The operation of pulling out onto the cylindrical body 21 is shown. in this case,
First, the X table 41 is driven to bring the cylinder 21 closer to the magazine 1. At this time, the guide portion 2 of the magazine 1 and the guide member 28 on the pressing member 26 side are parallel.

Then, the wafer holder 6 in the magazine 1 is chucked by the chuck 5 of the transfer arm 4 and
Pull out above. Next, as shown in FIG.
Then, the X-table 41 is driven and the wafer holder 6 is moved rightward after the transfer arm 4 is retreated to the side by releasing the chucking state by. The wafer holder 6 at the raised position shown by the solid line in FIG. 3 shows the state at this time. As shown in FIG. 5, in this state, the horizontal direction of the chip 8 on the wafer sheet 7 is slightly inclined.

Next, in FIG. 3, the pressing member 26 is lowered by driving the motor 34. Then, the wafer sheet 7 lands on the upper surface of the cylindrical body 21 and the pressing member 26 is further lowered, whereby the wafer sheet 7 is stretched and the chips 8 on the upper surface are separated from each other (the wafer indicated by a chain line in FIG. 3). See sheet 7 and chip 8).

Next, the chip 8 on the wafer sheet 7 is observed by the camera 65 (FIG. 1), and the orientation of the chip 8 in the horizontal rotation direction is detected. Next, based on this detection result, the motor 4
9 is driven to rotate the feed screw 48. Then, the nut 50 moves to the left along the feed screw 48, whereby the base plate 22 horizontally rotates clockwise along the guide rail 53, the wafer holder 6 also horizontally rotates, and the direction of the chip 8 is corrected. . FIG. 6 shows a state in which this correction has been completed. By correcting the direction of the chip 8 in this manner, the direction of the chip 8 can be matched with the direction of the collet 12.

After the positioning of the chip 8 as described above, the chip 8 is then moved to the substrate 1 by the collet 12.
1 to start the operation to be mounted. The mounting of the chip 8 is performed as follows. In FIG. 1, a camera 6
In step 5, the chip 8 picked up by the collet 12 is observed and its position is detected. Next, the X table 41 and the Y table 42 are driven, and the chip 8 is moved to a position where the collet 12 picks up the chip 8. The pick-up position of the chip 8 by the collet 12 is set at a fixed position.

Next, the collet 12 moves up and down to vacuum-adsorb and pick up the chip 8, and moves above the substrate 11 to mount the chip 8 on the substrate 11. By repeating the above operation, the chips 8 on the wafer sheet 7 are
Are mounted on the substrate 11 one after another.

When the chips 8 on the wafer sheet 7 are out of stock, the wafer holder 6 is replaced as follows. As shown in FIG. 7, by driving the motor 49, the nut 50 is moved rightward along the feed screw 48, thereby horizontally rotating the wafer holder 6 in the counterclockwise direction opposite to the previous direction. 28 for Magazine 1
In parallel with the guide part 2 of FIG. Then, the X table 41,
The Y table 42 is driven so that the positioning device 20 approaches the magazine 1 as in the case shown in FIG. Next, the transfer arm 4 is advanced toward the wafer holder 6 and the chuck 5 chucks the wafer holder 6. Next, transfer arm 4
Is moved toward the magazine 1, and the wafer holder 6 is collected on the vacant guide portion 2 of the magazine 1. Next, the elevator 3 is driven to move the magazine 1 up and down, and a new wafer holder 6 to be used next is brought to the same level as the chuck 5.
The wafer holder 6 is chucked by the chuck 5. The subsequent operation is the same as the operation described above.

[0028]

According to the present invention, the operation of taking out the wafer holder from the magazine and positioning it on the cylinder, the operation of stretching the wafer sheet to separate the chips, and the operation of horizontally rotating the wafer holder to remove the chips on the wafer sheet The operation of adjusting the orientation to the direction of the collet and the operation of collecting the wafer holder from the cylindrical body when the chips on the wafer sheet are out of stock can be smoothly performed as a series of operations.

[Brief description of the drawings]

FIG. 1 is a side view of a chip supply device according to an embodiment of the present invention.

FIG. 2 is a plan view of a chip supply device according to an embodiment of the present invention.

FIG. 3 is a sectional view of a positioning device of the chip supply device according to one embodiment of the present invention;

FIG. 4 is a plan view showing a wafer holder replacing operation of the chip supply device according to the embodiment of the present invention;

FIG. 5 is a plan view showing a wafer holder replacing operation of the chip supply device according to the embodiment of the present invention;

FIG. 6 is a plan view showing a wafer holder replacing operation of the chip supply device according to the embodiment of the present invention;

FIG. 7 is a plan view showing a wafer holder replacing operation of the chip supply device according to the embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Magazine 2 Guide part 4 Transfer arm 6 Wafer holder 7 Wafer sheet 8 Chip 10 Substrate 12 Collet 21 Cylindrical body 24 Feed screw 25 Nut 26 Pressing member 28 Guide member 34 Motor 48 Feed screw 49 Motor 50 Nut 53 Guide rail

Claims (1)

[Claims] 1. A chip supply device for supplying chips on a wafer sheet to a collet of a die bonding apparatus, comprising: a magazine for accommodating a wafer holder on which a wafer sheet is stretched; and a chip on the wafer sheet at a pickup position by the collet. And a transfer means for transferring the wafer holder stored in the magazine to the positioning device, wherein the positioning device presses the cylindrical member arranged below the wafer sheet and the wafer holder from above. A wafer sheet stretching mechanism comprising a pressing member for pressing and stretching the wafer sheet against the upper surface of the cylindrical body, and a vertical moving means for causing the pressing member to perform an up-and-down operation; and integrating the cylindrical body and the pressing member with each other. And a horizontal rotating mechanism for horizontally rotating the pressing member side. , Supply device chip, characterized in that a guide portion parallel to the guide member of the wafer holder formed in the magazine.