CN210877993U - Processing system for wave soldering spraying scaling powder - Google Patents

Abstract

The utility model relates to the wave-soldering processing field, in particular to a processing system for spraying soldering flux in wave-soldering; the processing system comprises a tool, a spraying mechanism for spraying soldering flux and a sensing mechanism for sensing the position of a spraying area, wherein the tool comprises a support frame for placing a PCB to be processed and at least one furnace passing opening arranged on the support frame and used as the spraying area, and the spraying mechanism is used for spraying the soldering flux on the spraying area according to a sensing signal generated after the sensing mechanism senses the spraying area; compared with the prior art, the utility model discloses a design a system of processing for wave-soldering spraying scaling powder, realize that the scaling powder only can spray the region that needs the wave-soldering processing, need not all to carry out the scaling powder spraying to whole PCB board tool, reduced the waste of scaling powder effectively.

Description

Processing system for wave soldering spraying scaling powder

Technical Field

The utility model relates to a wave-soldering processing field, concretely relates to system of processing for wave-soldering spraying scaling powder.

Background

Wave soldering is to make the soldering surface of the plug-in electronic circuit board directly contact with high temperature liquid tin to achieve the soldering purpose. Wave soldering is a process of forming a solder wave with a specific shape on the liquid surface of a solder tank by molten liquid solder under the action of a pump, placing a PCB inserted with components on a transmission chain, and penetrating the solder wave through a certain specific angle and a certain immersion depth to realize welding of a welding point.

The wave soldering process mainly comprises the steps of installing the PCB on a tool clamp, spraying soldering flux, heating, wave soldering and cooling. In the flux spraying process of wave soldering, a photoelectric sensor is generally adopted to generate a pulse signal which is provided for a spraying area controlled by a PLC (programmable logic controller) to control the flux, and the whole tooling jig is shielded from light, so that the flux can be sprayed on the whole tooling jig; however, in the actual processing of the PCB, the surface mounted components occupy a large proportion, and the area needing wave soldering processing is small, so that the whole PCB assembly jig is subjected to flux spraying, and great waste is caused.

Therefore, designing a processing system capable of directly positioning the area of the PCB board requiring wave soldering processing and spraying the flux is always a problem of intensive research in the field.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a system of processing for wave-soldering spraying scaling powder, overcome prior art, all carry out the scaling powder spraying to whole PCB board frock tool, cause very big extravagant defect.

The utility model provides a technical scheme that its technical problem adopted is: the processing system for spraying the soldering flux for wave soldering is provided, and the preferable scheme is as follows: the processing system comprises a tool, a spraying mechanism for spraying soldering flux and a sensing mechanism for sensing the position of a spraying area, wherein the tool comprises a support frame for placing a PCB to be processed and at least one furnace passing opening arranged on the support frame and used as the spraying area, and the spraying mechanism is used for spraying the soldering flux on the spraying area according to a sensing signal generated after the sensing mechanism senses the spraying area.

The preferred scheme is that a sensing piece matched with the position of the spraying area is arranged on the furnace passing opening, and the sensing mechanism senses the position of the spraying area by sensing the sensing piece.

The tool further comprises at least one fixing component arranged on the support frame and used for fixing a product to be processed.

The fixed assembly comprises a screw fixedly connected with the supporting plate, a pressure head used for pressing a product to be processed and a fixed plate used for connecting the screw and the pressure head, wherein the pressure head is fixedly connected with the fixed plate, and the fixed plate can rotate relative to the screw.

Preferably, the fixing component further comprises an elastic device sleeved on the screw.

Wherein, the preferred scheme is that the support frame is provided with a mounting hole for mounting a fixed component.

Wherein, the preferred scheme is still be provided with the fixed mouth that is used for installing the response piece on crossing the fire door.

Wherein, the preferred scheme does the frock includes that two are crossed the fire door and two induction parts that set up respectively on two fixed mouths of crossing the fire door.

Preferably, the processing system further comprises a conveying track for moving the tool.

Wherein, the preferred scheme is that the spraying mechanism is provided with a control module.

The beneficial effects of the utility model are that, compared with the prior art, the utility model discloses a design a system of processing for wave-soldering spraying scaling powder, realize that scaling powder only can spray to the region that needs the wave-soldering processing, need not all carry out the scaling powder spraying to whole PCB board frock tool, reduced the waste of scaling powder effectively; furthermore, the position of the area to be sprayed is confirmed by arranging the sensor to sense the sensing block, so that the quick and accurate positioning of the area to be sprayed is realized, and the operation is simple.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a first schematic structural diagram of a processing system for wave soldering flux spraying according to the present invention;

FIG. 2 is a schematic structural diagram of a second embodiment of a processing system for spraying flux in wave soldering according to the present invention;

fig. 3 is a schematic structural diagram three of a processing system for wave soldering spraying flux in the present invention;

fig. 4 is a first schematic structural diagram of a fixing assembly according to the present invention;

fig. 5 is a second schematic structural view of the fixing assembly of the present invention;

fig. 6 is a third schematic structural view of the fixing assembly of the present invention;

fig. 7 is a fourth schematic view of the fixing assembly of the present invention;

fig. 8 is a schematic structural view of the mounting hole in the present invention;

fig. 9 is a schematic structural view of the fire hole of the present invention.

Detailed Description

The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1-4, the present invention provides a preferred embodiment of a processing system for wave soldering flux spraying.

Referring to fig. 1 and 2, the processing system for wave soldering spraying of the soldering flux comprises a tool 100, a spraying mechanism 200 for spraying the soldering flux, and a sensing mechanism 300 for sensing the position of a spraying area, wherein the tool 100 comprises a support frame 110 for placing a PCB to be processed, and at least one furnace passing opening a arranged on the support frame 110 and used as the spraying area, and the spraying mechanism 200 is used for spraying the soldering flux on the spraying area according to a sensing signal generated after the sensing mechanism 300 senses the spraying area.

Further, and with reference to fig. 3, the processing system further includes a transfer rail 400 for movement of the tool 100.

Furthermore, the processing system also comprises a control module for controlling the operation of the system, wherein the control module is a controller, in particular to a master device for controlling the starting, speed regulation, braking and reversing of the motor by changing the wiring of a main circuit or a control circuit and changing the resistance value in the circuit according to a preset sequence; the system mainly comprises a program counter, an instruction register, an instruction decoder, a time sequence generator and an operation controller, and is a decision mechanism for issuing commands, namely, the system can coordinate and command the work of the whole computer system/the whole working platform.

The PCB is a printed circuit board, which is also called a PCB and is a provider of electrical connection of electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, improving automation level and production labor rate, and can be divided into single-layer boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards according to the number of layers of the circuit board.

Wave soldering is the soldering process in which the soldering surface of a plug-in board is directly contacted with high-temperature liquid tin to achieve the purpose of soldering, the high-temperature liquid tin keeps an inclined surface, and the liquid tin forms a wave-like phenomenon by a special device, so the wave soldering is called as wave soldering, and the main material of the wave soldering is a soldering tin bar.

Wave soldering process: inserting the element into the corresponding element hole → pre-coating flux → preheating (temperature 90-100 ℃, length 1-1.2m) → wave soldering (220-; specifically, after the circuit board enters the wave soldering machine through the conveyor belt, it passes through some form of flux application device where the flux is applied to the circuit board by wave, foam or spray.

Specifically, a to-be-processed PCB is placed on the support frame 110, the tool 100 is moved to drive the to-be-processed PCB to move together, in the moving process, the sensing mechanism 300 senses a spraying area on the tool 100, generates a sensing signal and sends the sensing signal to the PLC controller, and the PLC controller performs spraying of the soldering flux on the spraying area according to the sensing signal.

Further, and referring to fig. 4, the tooling 100 further includes at least one fixing component disposed on the support frame 110 for fixing a product to be processed.

In this embodiment, the tool 100 is provided with 8 fixing components, namely a fixing component 121 and a fixing component 128.

The fixing assembly is used for pressing the PCB to prevent the PCB from moving in the process of spraying the soldering flux, so that the area to be sprayed is not matched with the actual spraying position.

As shown in fig. 5-7, the present invention provides a preferred embodiment of the securing assembly.

In the present embodiment, taking one of the fixing assemblies 121 as an example (refer to fig. 5), and referring to fig. 6 (wherein fig. 6 is an exploded view of fig. 5, the internal structure of the fixing assembly 510 can be more visually seen), the fixing assembly 121 includes a screw 121.1 for fixedly connecting with the supporting plate, a pressing head 121.2 for pressing the product to be processed, and a fixing plate 121.3 for connecting the screw 121.1 with the pressing head 121.2, wherein the pressing head 121.2 is fixedly connected with the fixing plate 121.3, and the fixing plate 121.3 can rotate relative to the screw 121.1.

Further, the fixing component further comprises an elastic device 121.4 sleeved on the screw, and in this embodiment, the elastic device 121.4 is a spring.

Specifically, the fixing assembly 121 is fixedly connected to the support frame 110 by a screw 121.1, and after the pressing head 121.2 is fixedly connected to the fixing plate 121.3, the pressing head 121.2 can rotate together with the screw 121.1, so that the fixing assembly 121 is away from the surface of the central plate of the support frame 110 when the PCB is placed on the fixture, and further, the PCB is placed on the central plate of the support frame 110, and finally, the pressing head 121.2 is rotated to be rotated onto the PCB (refer to fig. 7) for fixing the PCB and preventing the PCB from moving, thereby improving the spraying quality.

Referring to fig. 8, the present invention provides a preferred embodiment of the mounting hole.

The supporting frame 110 is provided with a mounting hole 111 for mounting a fixing component.

Referring to fig. 9, the present invention provides a preferred embodiment of the taphole.

The tool 100 comprises two furnace passing openings A1 and A2 and two induction pieces A1.11 and A2.11 which are respectively arranged on the two furnace passing openings A1 and A2, furthermore, the ends of the furnace passing openings A1 and A2 are respectively provided with a fixed opening A1.1 and a2.1 for installing the induction pieces A1.11 and A2.11, wherein the induction pieces A1.11 and A2.11 are matched with the positions of the furnace passing openings A1 and A2, and the induction mechanism 300 induces the position of a spraying area by inducing the induction pieces A1.11 and A2.11.

The embodiment also provides a specific implementation mode for spraying the soldering flux by using the tool and the system for spraying the soldering flux in wave soldering, wherein the specific implementation mode comprises the following steps:

1. rotating a ram on a fixture assembly such that the fixture assembly is clear of a surface of a support plate; placing the PCB to be processed on the supporting plate;

2. the pressing head on the fixing component is rotated to rotate to the PCB for fixing the PCB and preventing the PCB from moving, so that the spraying quality is improved;

3. the tool moves towards the spraying mechanism through the conveying rail, and the sensing mechanism senses a sensing block corresponding to a spraying area, generates a sensing signal and sends the sensing signal to the PLC;

4. and the PLC carries out the spraying operation of the soldering flux on the spraying area according to the sensing signal.

The spraying mechanism sprays the soldering flux according to the sensing signals, after the system is used, the spraying mechanism only senses the spraying area provided with the sensing piece and does not sense other areas, and the spraying mechanism only sprays the soldering flux on the spraying area, so that the waste of the soldering flux is effectively reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, which is intended to cover all equivalent changes and modifications made within the scope of the present invention.

Claims (10)

1. The utility model provides a system of processing for wave-soldering spraying scaling powder which characterized in that: the processing system comprises a tool, a spraying mechanism for spraying soldering flux and a sensing mechanism for sensing the position of a spraying area, wherein the tool comprises a support frame for placing a PCB to be processed and at least one furnace passing opening arranged on the support frame and used as the spraying area, and the spraying mechanism is used for spraying the soldering flux on the spraying area according to a sensing signal generated after the sensing mechanism senses the spraying area.

2. The processing system of claim 1, wherein: the furnace passing opening is provided with an induction piece matched with the position of the spraying area, and the induction mechanism induces the position of the spraying area by inducing the induction piece.

3. The processing system of claim 1, wherein: the tool further comprises at least one fixing component arranged on the support frame and used for fixing a product to be processed.

4. The processing system of claim 3, wherein: the fixing assembly comprises a screw, a pressure head and a fixing plate, the screw is used for being fixedly connected with the supporting plate, the pressure head is used for pressing a product to be processed, the fixing plate is used for connecting the screw and the pressure head, the pressure head is fixedly connected with the fixing plate, and the fixing plate can rotate relative to the screw.

5. The processing system of claim 4, wherein: the fixing component also comprises an elastic device sleeved on the screw.

6. The processing system of claim 3, wherein: the support frame is provided with a mounting hole for mounting the fixing component.

7. The processing system of claim 2, wherein: the furnace-passing opening is also provided with a fixing opening for installing an induction piece.

8. The processing system of claim 2, wherein: the frock includes that two are crossed the fire door and two induction parts that set up respectively on two fixed mouths of crossing the fire door.

9. The processing system of claim 1, wherein: the processing system also comprises a conveying track used for moving the tool.

10. The processing system of claim 1, wherein: the spraying mechanism is provided with a control module.

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