CN114710882B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN114710882B CN114710882B CN202210316992.3A CN202210316992A CN114710882B CN 114710882 B CN114710882 B CN 114710882B CN 202210316992 A CN202210316992 A CN 202210316992A CN 114710882 B CN114710882 B CN 114710882B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a circuit board and a preparation method thereof. The preparation method of the circuit board comprises the following steps: providing a plate; baking the plate at a preset temperature to enable the plate surface copper thickness of the plate to reach a first preset thickness and enable the hole copper thickness of the plate to reach a second preset thickness; detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient; judging whether the actual expansion coefficient is smaller than or equal to an expansion coefficient threshold value or not; if yes, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate; and exposing and developing the plate, so that the silk-screen printing ink operation is performed only when the actual expansion coefficient of the plate after baking is smaller than or equal to the expansion coefficient threshold value, the precision of the silk-screen printing ink of the plate is ensured, namely the precision of the positions such as solder mask windowing, lamp bead windowing and the like is ensured, the ink is prevented from being formed in the lamp bead or the bonding pad area, and the preparation yield of the circuit board is improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a circuit board and a preparation method thereof.
Background
The Mini LED technology, also called a secondary millimeter light emitting diode, is to change tens of LED lamp beads of a side backlight source of a traditional LCD display screen into thousands, tens of thousands or even more direct type backlight source lamp beads, and realize regional dimming in a small range through dense distribution of a large number of lamp beads, so that higher brightness uniformity and color contrast can be realized in a smaller light mixing distance, the backlight performance of the traditional LCD display device can be greatly improved, and the ultrathin, high color rendering and electricity-saving performances of a terminal product are realized.
In order to adapt to the market development of LED circuit boards, the circuit boards applied to Mini LED backlight products also need to be correspondingly developed. However, the conventional circuit board of LED products has a low yield, especially for circuit boards with high-density micro pads.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a circuit board with higher preparation yield and a preparation method thereof.
The aim of the invention is realized by the following technical scheme:
a preparation method of a circuit board comprises the following steps:
providing a plate;
baking the plate at a preset temperature to enable the plate surface copper thickness of the plate to reach a first preset thickness and enable the hole copper thickness of the plate to reach a second preset thickness;
detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient;
judging whether the actual expansion coefficient is smaller than or equal to an expansion coefficient threshold value or not;
if yes, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate;
and exposing and developing the plate.
In one embodiment, the predetermined temperature is 110 degrees celsius to 230 degrees celsius.
In one embodiment, the step of baking the plate at a predetermined temperature is specifically:
and continuously baking the plate at a preset temperature for a preset time.
In one embodiment, the predetermined time is 3 hours to 7 hours.
In one embodiment, the predetermined time is 4 hours.
In one embodiment, the step of performing a silk screen printing operation on the plate includes:
performing first silk-screen printing operation on the bead surface of the plate to form a first ink area of the ink layer;
and performing a second silk-screen operation on the integrated circuit surface of the plate to form a second ink area of the ink layer, wherein the second ink area is connected with the first ink area.
In one embodiment, the step of detecting the coefficient of expansion and contraction of the plate member to obtain the actual coefficient of expansion and contraction includes:
detecting the expansion and contraction coefficients of the long sides of the plate to obtain actual long-side expansion and contraction coefficients of the plate;
and detecting the expansion and contraction coefficient of the short side of the plate to obtain the actual expansion and contraction coefficient of the short side of the plate.
In one embodiment, the expansion coefficient threshold includes a long-side expansion coefficient threshold and a short-side expansion coefficient threshold;
the step of judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value comprises the following steps:
judging whether the actual long-side expansion coefficient is smaller than or equal to the long-side expansion coefficient threshold;
judging whether the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold value.
In one embodiment, if so, performing a silk-screen operation on the plate to form an ink layer on the surface of the plate specifically includes:
and if the actual long-side expansion and contraction coefficient is smaller than or equal to the long-side expansion and contraction coefficient threshold value and the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold value, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate.
The circuit board is prepared by adopting the preparation method of the circuit board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
according to the preparation method of the circuit board, firstly, the plate is baked at a preset temperature, so that the copper thickness of the plate surface of the plate reaches a first preset thickness, the copper thickness of the hole of the plate reaches a second preset thickness, and the copper thickness of the plate reaches the preparation requirement after being baked; then detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient; then judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value; if so, silk screen printing operation is carried out on the plate to form an ink layer on the surface of the plate, and finally, exposure development is carried out on the plate, so that the silk screen printing ink operation is carried out only when the actual expansion coefficient of the plate after baking is smaller than or equal to the expansion coefficient threshold value, the precision of the silk screen printing ink of the plate is ensured, namely, the precision of the positions such as solder mask windowing, lamp bead windowing and the like is ensured, the ink is prevented from being formed in the lamp bead or bonding pad area, and the preparation yield of the circuit board is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the invention.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The application provides a preparation method of a circuit board, which comprises the following steps: providing a plate; baking the plate at a preset temperature to enable the plate surface copper thickness of the plate to reach a first preset thickness and enable the hole copper thickness of the plate to reach a second preset thickness; detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient; judging whether the actual expansion coefficient is smaller than or equal to an expansion coefficient threshold value or not; if yes, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate; and exposing and developing the plate. Firstly, baking a plate at a preset temperature to enable the copper thickness of the plate surface of the plate to reach a first preset thickness, enabling the copper thickness of a hole of the plate to reach a second preset thickness, and enabling the copper thickness of the plate to reach the preparation requirement after baking; then detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient; then judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value; if so, silk screen printing operation is carried out on the plate to form an ink layer on the surface of the plate, and finally, exposure development is carried out on the plate, so that the silk screen printing ink operation is carried out only when the actual expansion coefficient of the plate after baking is smaller than or equal to the expansion coefficient threshold value, the precision of the silk screen printing ink of the plate is ensured, namely, the precision of the positions such as solder mask windowing, lamp bead windowing and the like is ensured, the ink is prevented from being formed in the lamp bead or bonding pad area, and the preparation yield of the circuit board is improved.
Referring to fig. 1, in order to better understand the circuit board and the preparation method thereof, the circuit board and the preparation method thereof are further explained as follows:
the preparation method of the circuit board is used for preparing the circuit board. In one embodiment, the method of preparation comprises some or all of the following steps:
s101, providing a plate.
In this embodiment, a plate is provided, and the plate is a copper-clad plate. In one embodiment, the plate can be a halogen-free plate, namely a halogen-free copper-clad plate, so that the plate has better environmental protection and no toxicity, and simultaneously has better flame retardant effect and better heat dissipation performance, thereby facilitating the arrangement of high-density lamp beads and miniature bonding pads. In particular, the sheet material may be a TG150 or TG170 halogen free sheet material.
And S103, baking the plate at a preset temperature to enable the plate surface copper thickness of the plate to reach a first preset thickness and enable the hole copper thickness of the plate to reach a second preset thickness.
In this embodiment, the plate is baked at a predetermined temperature, so that the copper thickness of the plate surface of the plate reaches a first predetermined thickness, and the copper thickness of the hole of the plate reaches a second predetermined thickness, so that the copper thickness of the plate reaches the preparation requirement after being baked.
S105, detecting the expansion and contraction coefficient of the plate to obtain the actual expansion and contraction coefficient.
In this embodiment, the coefficient of expansion and contraction of the plate is detected to obtain the actual coefficient of expansion and contraction. Specifically, the detection of the plate is detected by a detector to obtain a first size of the plate after baking, the first size and a second size of the plate before baking are subjected to difference to obtain a size difference of the plate, and the size difference and the second size are subjected to quotient, so that the actual expansion coefficient of the plate is obtained.
S107, judging whether the actual expansion coefficient is smaller than or equal to an expansion coefficient threshold value.
In this embodiment, it is determined whether the actual expansion coefficient is less than or equal to an expansion coefficient threshold. The expansion coefficient threshold is the maximum value of expansion coefficients designed by the circuit board and is used for judging whether the expansion and contraction of the board after baking meets the design reference standard of the circuit board. If the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value, the expansion and contraction of the plate after baking accords with the design reference standard of the circuit board, namely the plate is good; otherwise, the expansion and contraction of the plate after baking does not meet the design reference standard of the circuit board, namely the plate is a defective product.
And S109, if yes, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate.
In this embodiment, if the expansion and contraction of the board after baking meets the design reference standard of the circuit board, the screen printing operation is performed on the board to form an ink layer on the surface of the board, so that the ink layer is reliably formed on the surface of the board. It can be understood that if the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold, the expansion coefficient of the plate after baking accords with the design reference standard of the circuit board, namely the size of the plate after baking accords with the silk screen printing requirement of the plate, so that the adaptation degree of the plate and the silk screen printing plate is good when the plate is subjected to silk screen printing ink, and the reliability of the silk screen printing operation of the plate is improved. If not, the plate is recovered, and the silk screen printing operation is not performed.
And S111, performing exposure development on the plate.
In this embodiment, the plate is exposed and developed, so that a part of the ink on the surface of the plate is exposed, and another part of the ink is not exposed, wherein the exposed ink is polymerized to reliably cure the ink and remain on the plate surface, and finally the unexposed ink is rinsed away by the liquid medicine to expose the area to be soldered, such as the pad area, and the exposed ink remains to protect the circuit.
According to the preparation method of the circuit board, firstly, the plate is baked at the preset temperature, so that the copper thickness of the plate surface of the plate reaches the first preset thickness, the copper thickness of the hole of the plate reaches the second preset thickness, and the copper thickness of the plate reaches the preparation requirement after being baked; then detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient; then judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value; if so, silk screen printing operation is carried out on the plate to form an ink layer on the surface of the plate, and finally, exposure development is carried out on the plate, so that the silk screen printing ink operation is carried out only when the actual expansion coefficient of the plate after baking is smaller than or equal to the expansion coefficient threshold value, the precision of the silk screen printing ink of the plate is ensured, namely, the precision of the positions such as solder mask windowing, lamp bead windowing and the like is ensured, the ink is prevented from being formed in the lamp bead or bonding pad area, and the preparation yield of the circuit board is improved.
In one embodiment, the predetermined temperature is 110 degrees celsius to 230 degrees celsius, so that the plate copper thickness of the plate member is better up to a first predetermined thickness, and the hole copper thickness of the plate member is better up to a second predetermined thickness. In this embodiment, the predetermined temperature may be 160 degrees celsius or 180 degrees celsius. As another example, the predetermined temperature may also be 175 degrees celsius. In order to make the plate surface copper thickness of the plate better reach the first preset thickness and make the hole copper thickness of the plate better reach the second preset thickness, further, the value of the preset temperature is increased and then reduced along with the change of the transportation position of the plate, namely, the preset temperature is not a constant temperature value, so that the plate copper thickness is better solidified, meanwhile, the problem that the copper thickness is easy to deform or other problems caused by sudden high temperature is avoided, the plate surface copper thickness of the plate better reaches the first preset thickness, and the hole copper thickness of the plate better reaches the second preset thickness, so that the actual expansion coefficient of the plate better adapts to the expansion coefficient threshold value, and the defective rate of the plate is reduced. In this embodiment, the predetermined temperature is raised from 110 degrees celsius to 230 degrees celsius and then lowered from 230 degrees celsius to 180 degrees celsius.
Further, the step of baking the plate at a predetermined temperature is specifically: the plate is baked at the preset temperature through the continuous baking oven mechanism, so that the value of the preset temperature is increased and then reduced along with the change of the transportation position of the plate, the problem that the plate is easy to discard after baking is avoided, the actual expansion coefficient after baking is better adapted to the expansion coefficient threshold value, and the defective rate of the plate is reduced. Still further, the continuous oven mechanism includes feed mechanism and a plurality of oven that connect in proper order, and every oven is formed with toasts chamber, feed inlet and discharge gate, and the feed inlet passes through toasting chamber and discharge gate intercommunication, and the discharge gate of the preceding oven of two adjacent ovens communicates with the feed inlet of the next oven, and feed mechanism wears to locate the toasting chamber of a plurality of ovens respectively, makes the plate carry in proper order to a plurality of ovens through feed mechanism in toasting operation in proper order, realizes toasting same plate to different temperatures. Specifically, each plate is respectively conveyed into a plurality of ovens through the conveying mechanism to be baked in sequence, and the temperature change of baking is increased and then reduced, so that the actual expansion coefficient of the plate after being baked is better adapted to the expansion coefficient threshold value, and the defective rate of the plate is reduced. In the present embodiment, the number of ovens is eight, namely, a first oven, a second oven, a third oven, a fourth oven, a fifth oven, a sixth oven, a seventh oven and an eighth oven, and the baking temperature of each oven is kept constant. The baking temperature of the first oven is 110-120 ℃, the baking temperature of the second oven is 130-140 ℃, the baking temperature of the third oven is 150-160 ℃, the baking temperature of the fourth oven is 160-170 ℃, the baking temperature of the fifth oven is 190-210 ℃, the baking temperature of the sixth oven is 210-220 ℃, the baking temperature of the seventh oven is 215-225 ℃, and the baking temperature of the eighth oven is 180-200 ℃, so that the actual expansion coefficient of the plate after baking is better adapted to the expansion coefficient threshold value, and the defective rate of the plate is reduced. In one embodiment, the conveying speed of each plate through the conveying mechanism is equal, so that each plate is subjected to isochronous baking operation at different temperatures through a plurality of different ovens, the actual expansion coefficient of the plate after baking is better adapted to the expansion coefficient threshold value, and the defective rate of the plate is reduced.
In one embodiment, the first predetermined thickness is 16mm to 18mm. In this embodiment, the first predetermined thickness is 17.5mm, so that the plate surface of the plate has better conductivity and puncture resistance, and the copper thickness of the plate surface is moderate. Further, the second predetermined thickness is 18mm to 23mm. In this embodiment, the second predetermined thickness is 20mm, which allows the hole copper thickness of the plate to have good conductivity and puncture resistance, while allowing the hole copper thickness of the plate to be relatively moderate.
In one embodiment, the step of baking the plate at a predetermined temperature is specifically: and continuously baking the plate at a preset temperature for a preset time to ensure that the expansion coefficient of the plate is smaller. In one embodiment, the predetermined time is 3 to 7 hours, so that the expansion and contraction coefficient of the plate is small. In this embodiment, the predetermined time is 4 hours.
In one embodiment, the step of performing a silk screen printing operation on the plate includes: firstly, performing first silk-screen operation on the bead surface of the plate to form a first ink area of the ink layer; and secondly, performing a second silk-screen operation on the integrated circuit surface of the plate to form a second ink area of the ink layer, wherein the second ink area is connected with the first ink area. Therefore, the two silk-screen printing operations of silk-screen printing are respectively carried out on the lamp bead surface and the integrated circuit surface of the plate, so that the surface silk-screen printing of the plate is more flexible, for example, the ink layer structures with different materials are formed according to different requirements of the lamp bead surface and the integrated circuit surface, and meanwhile, the fine silk-screen printing operations can be respectively carried out on the densely distributed lamp beads and the integrated circuit surface of the Mini LED circuit board, so that the circuit board with better yield is prepared.
In one embodiment, the step of detecting the coefficient of expansion and contraction of the plate member to obtain the actual coefficient of expansion and contraction includes: firstly, detecting the expansion and contraction coefficients of the long sides of the plate to obtain the actual long-side expansion and contraction coefficients of the plate; and secondly, detecting the expansion and contraction coefficient of the short side of the plate to obtain the actual expansion and contraction coefficient of the short side of the plate. The expansion coefficient of the long side of the plate and the expansion coefficient of the short side of the plate are detected comprehensively, and the yield of the plate can be judged better. In this embodiment, the expansion coefficient of the long side of the plate is equal to (the dimension of the long side before baking-the dimension of the long side after baking)/the dimension of the long side before baking, and the expansion coefficient of the short side of the plate is equal to (the dimension of the short side before baking-the dimension of the short side after baking)/the dimension of the short side before baking. Specifically, the size of the long side before baking and the size of the short side before baking can be detected by a secondary element detector before the plate is baked, and the size of the long side after baking and the size of the short side after baking can be detected by the secondary element detector after the plate is baked.
In one embodiment, the threshold value of the swell-shrink coefficient includes a threshold value of a long-side swell-shrink coefficient and a threshold value of a short-side swell-shrink coefficient. The step of judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value comprises the following steps: firstly, judging whether the actual long-side expansion coefficient is smaller than or equal to the long-side expansion coefficient threshold value; and secondly, judging whether the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold value. In this embodiment, if the actual long-side expansion coefficient is greater than the long-side expansion coefficient threshold, the plate is recovered and adjusted. On the contrary, if the actual long-side expansion and contraction coefficient is smaller than or equal to the long-side expansion and contraction coefficient threshold, then judging whether the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold, if the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold, then proceeding to step S109; otherwise, the plate is recovered and adjusted, for example, the expansion coefficient of the recovered plate can be readjusted. In one embodiment, the threshold value of the expansion coefficient of the long side is 2/10000-4/10000, and the threshold value of the expansion coefficient of the short side is 1/10000-2/10000, so that the size deviation between the baked plate and the screen printing plate is smaller, and the screen printing precision of the plate is improved. In this embodiment, the long-side expansion coefficient threshold is 3/10000, and the short-side expansion coefficient threshold is 1.5/10000.
In order to improve the preparation yield of the circuit board, further, before the step of performing the silk-screen operation on the plate if yes, the preparation method further comprises the following steps: firstly, performing trial production on a plurality of plates of the same material, namely executing the step S101 to the step S107 on the plurality of plates of the same material; then analyzing the actual expansion and contraction coefficients of the same plurality of plates; if the actual expansion coefficients of the plurality of plates are all larger than the expansion coefficient threshold, after step S107, the plates are pre-stretched, so that expansion and contraction of the plates are adapted to the expansion coefficient threshold, the screen printing precision of the plates is improved, meanwhile, the defective rate of the plates is reduced, and the preparation yield of the plates is improved.
Further, before the step S101 of providing a plate, the preparation method further includes: preparing a plate. In order to further improve the preparation yield of the plate, the material structure of the plate is further adjusted when the plate is prepared. For example, the number of pp layers of the plate is reduced, the glass layer is increased, and the anti-swelling performance of the plate is improved, so that materials are well controlled in manufacturing the plate, and meanwhile, after the step S107, the plate is pre-stretched, so that the swelling and swelling coefficient threshold value of the plate is better adapted, the silk-screen printing precision of the plate is further improved, the defective rate of the plate is reduced, and the manufacturing yield of the plate is further improved.
In one embodiment, if so, performing a silk-screen operation on the plate to form an ink layer on the surface of the plate specifically includes: if the actual long-side expansion coefficient is smaller than or equal to the long-side expansion coefficient threshold value, and the actual short-side expansion coefficient is smaller than or equal to the short-side expansion coefficient threshold value, so that the size of the plate after baking is matched with the size of the screen printing plate, screen printing operation is performed on the plate, an ink layer is formed on the surface of the plate, the ink layer is reliably formed on the surface of the plate, and the defective rate of the circuit board is reduced.
However, due to the expansion and contraction factor of the baking of the plate, the adapting deviation between the screen printing plate and the plate is caused, so that in the screen printing process, substances such as ink or dust and the like are inevitably present on the bonding pad, especially for the circuit board with the high-density micro bonding pad, the conductivity of the circuit board is poor, in one embodiment, if so, the step of performing the screen printing operation on the plate to form the ink layer on the surface of the plate includes: firstly, if yes, performing a silk screen printing process on the plate; secondly, detecting whether foreign matters exist in a region of the plate which is surrounded by a circle with a preset radius of the center of the bonding pad; if foreign matters such as ink exist in the area with the preset diameter in the center of the bonding pad of the plate, recovering and repairing the plate; otherwise, step S111 is performed to ensure that the area with the predetermined diameter at the center of the bonding pad of the board is not subject to foreign matters after solder resist, so that the bonding pad is better exposed after the subsequent ink layer is exposed and developed, and the conductivity of the circuit board is improved. In one embodiment, the predetermined radius is 1.2 mm-1.4 mm, and in the embodiment, the predetermined radius is 1.25mm, so that the bonding pad is better exposed after the subsequent ink layer is exposed and developed, and the conductivity of the circuit board is improved. Further, if it is detected that foreign matter exists in a predetermined diameter area of the center of the pad of the board, the step of recovering and repairing the board is specifically: if foreign matters exist in the area with the preset diameter in the center of the bonding pad of the plate, firstly recovering the plate, and then removing the foreign matters of the plate through a tool; repairing the bonding pads of the plate, for example, performing ink reshaping operation in the area of the plate where foreign matters are removed, so that the bonding pads of the plate are smoother; and finally, quality inspection is carried out on the bonding pads of the plate, so that the preparation yield of the circuit board is improved.
In order to further improve the electrical conductivity of the circuit board, further, after the step of detecting that no foreign matter is present in the area of the board that is surrounded by the predetermined radius of the center of the pad, the step of forming the ink layer on the board surface further includes: and detecting whether the immovable foreign matters exist on the line or not on the surface outside the area of the plate, which is surrounded by the area of the plate and the preset radius of the center of the bonding pad, for example, detecting whether the immovable foreign matters exist on the integrated circuit surface of the plate or not, so that the plate can be cleaned after development, and the preparation yield of the circuit board is improved.
Further, the step of detecting whether there is a foreign matter in a predetermined diameter area of the center of the pad of the board is specifically: and detecting whether foreign matters exist in the preset diameter area of the center of the bonding pad of the plate by adopting the magnifying glass tester so as to better detect whether the foreign matters exist in the preset diameter area of the center of the bonding pad, thereby improving the detection precision of the circuit board. In the embodiment, the magnifying glass is a 40-time mirror, so that the magnifying glass has better inspection precision.
Further, before the step of detecting whether there is a foreign matter in the predetermined diameter region of the center of the pad of the board, and after the step of performing a screen printing process on the board if yes, the step of performing a screen printing operation on the board to form an ink layer on the board surface if yes includes: the film pad is placed on the board detection base table of the board in advance, so that the board is placed on the film pad during detection, the board is prevented from being stuck with foreign matters, meanwhile, friction of the board is avoided, and the convenience of board detection is improved.
In order to prevent dust and other non-ink foreign matters from accumulating on the plate, the ink layer is better fixed on the plate, and the preparation method further comprises the following steps of: firstly, disassembling and assembling a fan and a clean furnace wall; then the oven wall of the oven is cleaned, so that the baking environment of the plate is tidy, and dust and other non-ink foreign matters are prevented from being accumulated on the plate. In one embodiment, the step of cleaning the walls of the oven is specifically: fully soaking the dust-sticking piece in alcohol solution for a preset time; the dust adhering parts after soaking the alcohol are used for adhering dust to the oven walls regularly and sequentially so as to reliably clean the oven walls of the oven. In order to reliably adhere the dust removing piece to the furnace wall, the dust removing piece comprises an installation frame, a rotating shaft and a dust adhering adsorption block, the rotating shaft is rotationally connected to the installation frame, the dust adhering adsorption block is coated on the peripheral wall of the rotating shaft, the dust adhering adsorption block rolls relative to the furnace wall in the dust adhering process of the furnace wall, and the dust adhering piece reliably adheres to the dust removing piece. In this embodiment, the dust-sticking adsorption block is fixed on the outer peripheral wall of the rotating shaft in a coating manner, so that the dust-sticking adsorption block is stationary relative to the rotating shaft, and the dust removal is prevented from being influenced by sliding of the dust-sticking adsorption block relative to the rotating shaft. In one embodiment, the dust-sticking piece further comprises a first elastic sleeve ring and a second elastic sleeve ring, the first elastic sleeve ring and the second elastic sleeve ring are sleeved on the rotating shaft, the first elastic sleeve ring and the second elastic sleeve ring are respectively connected with two ends of the dust-sticking adsorption block, a first clamping buckle and a second clamping buckle are formed on the surface of the rotating shaft, the first elastic sleeve ring is clamped on the first clamping buckle, the second elastic sleeve ring is clamped on the second clamping buckle, the first elastic sleeve ring and the second elastic sleeve ring are both fixed on the rotating shaft, and meanwhile the dust-sticking adsorption block is fast fixed on the rotating shaft.
Further, the first elastic sleeve ring comprises two first arc sleeve members, the two first arc sleeve members are oppositely arranged on the rotating shaft, the two first arc sleeve members are mutually connected in a buckling mode, one of the first arc sleeve members is connected with the first clamping buckle in a clamping mode, and the first elastic sleeve ring is connected with the first clamping buckle in a clamping mode. Still further, the second elastic sleeve ring includes two second arc external member, two second arc external member sets up relatively in the axis of rotation, and two second arc external member mutual buckle connection, one of them second arc external member joint is detained in the second joint, make second elastic sleeve ring joint detain in the second joint, so that first elastic sleeve ring and second elastic sleeve ring all can quick assembly disassembly in the axis of rotation, so that the dust adhesion adsorption block need carry out self-cleaning after gluing the dirt, in addition the dust adhesion adsorption block has the problem of wearing and tearing even corroding through repetitious usage, need carry out periodic replacement to the dust adhesion adsorption block. In this embodiment, one end of one of the first arc-shaped sleeve members is provided with a first clamping protrusion in a protruding manner, and the other end of the first arc-shaped sleeve member is provided with a first clamping groove; the first clamping protrusions of the first arc-shaped sleeve and the first clamping grooves of the first arc-shaped sleeve are opposite in arrangement positions, so that the first clamping protrusions of one first arc-shaped sleeve are clamped into the first clamping grooves of the first arc-shaped sleeve, and meanwhile, the first clamping grooves of the first arc-shaped sleeve are connected with the first clamping protrusions of the first arc-shaped sleeve in a buckling mode, and quick clamping and dismounting of the two first arc-shaped sleeve are achieved. One end of one second arc-shaped sleeve piece is convexly provided with a second clamping protrusion, and the other end of the second arc-shaped sleeve piece is provided with a second clamping groove; the second clamping protrusions of the other second arc-shaped sleeve and the second clamping grooves are opposite in arrangement positions, so that the second clamping protrusions of one second arc-shaped sleeve are clamped into the second clamping grooves of the other second arc-shaped sleeve, and meanwhile, the second clamping grooves of one second arc-shaped sleeve are connected with the second clamping protrusions of the other second arc-shaped sleeve in a clamping manner, so that the two second arc-shaped sleeve can be quickly clamped and disassembled. In one embodiment, each first arc-shaped sleeve and each second arc-shaped sleeve are made of silica gel, so that the furnace walls are not easy to scratch.
Further, before the step of performing the silk screen printing operation on the plate, the preparation method further comprises the following steps: firstly, cleaning a travelling crane by adopting a high-pressure water gun; then placing the supporting plate assembly on the travelling crane; then checking whether the bottom surface of the plate to be subjected to solder mask development is adhered with ink, and if so, cleaning the plate; then place the plate in backup pad subassembly to make the lamp pearl face of plate upwards place, so that follow-up carrying out the solder resist ink, wash the line rumble in advance in addition, make the line rumble be in clean and tidy state, guarantee that follow-up plate does not have the foreign matter when the solder resist ink, improved the quality of plate solder resist ink. In this embodiment, backup pad subassembly includes the green oil backup pad of a plurality of range upon range of settings, avoids plate and line rumble direct contact, ensures that the plate carries out the solder resist ink reliably, avoids simultaneously that line rumble is easy to adhere to the problem of foreign matter, reduces line rumble abluent number of times.
Further, the step of exposing and developing the plate is specifically as follows: and exposing and developing the plate by using an exposure rule according to preset parameters, so that the ink layer is better solidified on the plate. In one embodiment, the predetermined parameter may be 6 to 7 residues to better cure the ink layer to the plate. In one embodiment, the step of performing a silk screen printing operation on the plate includes: firstly, performing first silk-screen operation on the bead surface of the plate to form a first ink area of the ink layer; and secondly, performing a second silk-screen operation on the integrated circuit surface of the plate to form a second ink area of the ink layer, wherein the second ink area is connected with the first ink area. Therefore, the two silk-screen printing operations of silk-screen printing are respectively carried out on the lamp bead surface and the integrated circuit surface of the plate, so that the surface silk-screen printing of the plate is more flexible, for example, the ink layer structures with different materials are formed according to different requirements of the lamp bead surface and the integrated circuit surface, and meanwhile, the fine silk-screen printing operations can be respectively carried out on the densely distributed lamp beads and the integrated circuit surface of the Mini LED circuit board, so that the circuit board with better yield is prepared. In this embodiment, the step of exposing and developing the plate includes: firstly, exposing the bead surface of the plate; and then exposing the integrated circuit surface of the plate to enable the first ink area and the second ink area to be successively solidified on the plate. Because the formation time of the first ink area and the second ink area are different and the performances of the inks of the first ink area and the second ink area are different, the preset parameters of the exposure ruler for exposure and development can be adjusted to different values according to the needs.
Further, after the step of exposing and developing the plate, the manufacturing method further includes: the surface of the plate is subjected to brushing and sand blasting treatment so as to facilitate subsequent gold precipitation operation, and the conductivity of the circuit board is provided. Specifically, the step of brushing and sand blasting the surface of the plate comprises the following steps: the plate after exposure and development is firstly subjected to brushing treatment, and then the plate after brushing treatment is subjected to sand blasting treatment so as to carry out subsequent gold precipitation operation, thereby providing the conductivity of the circuit board. Further, the step of performing the sand blasting treatment on the plate after the brushing treatment specifically comprises the following steps: and (3) carrying out sand blasting on the plate subjected to the sand blasting treatment at the speed of 2.5m/min and the sand blasting pressure of 1.0kg, so that the plate subjected to the sand blasting treatment has good electric conductivity. Further, after the step of brushing and sand blasting the surface of the plate, the preparation method further comprises the steps of: scanning the windowed opening of the lamp bead solder mask of the plate through a CCD camera to obtain the windowed outline data of the lamp bead of the plate; fitting the windowed profile data of the lamp beads of the plate to obtain the actual windowed profile line of the lamp beads of the plate; fitting and comparing the actual contour line data with preset contour line data to obtain a tolerance value of the windowed actual contour of the lamp bead; judging whether the tolerance value of the actual profile of the windowing is smaller than or equal to a preset tolerance value, if so, judging that the solder mask windowing of the plate is unqualified, otherwise, performing the next gold precipitation step, and simultaneously realizing automatic inspection of the solder mask windowing of the lamp beads of the circuit board, thereby improving the preparation efficiency of the circuit board.
The application also provides a circuit board, which is prepared by adopting the preparation method of the circuit board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
according to the preparation method of the circuit board, firstly, the plate is baked at the preset temperature, so that the copper thickness of the plate reaches the first preset thickness, the copper thickness of the hole of the plate reaches the second preset thickness, and the copper thickness of the plate reaches the preparation requirement after being baked; then detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient; then judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value; if so, silk screen printing operation is carried out on the plate to form an ink layer on the surface of the plate, and finally, exposure development is carried out on the plate, so that the silk screen printing ink operation is carried out only when the actual expansion coefficient of the plate after baking is smaller than or equal to the expansion coefficient threshold value, the precision of the silk screen printing ink of the plate is ensured, namely, the precision of the positions such as solder mask windowing, lamp bead windowing and the like is ensured, the ink is prevented from being formed in the lamp bead or bonding pad area, and the preparation yield of the circuit board is improved.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (7)
1. The preparation method of the circuit board is characterized by comprising the following steps:
providing a plate;
baking the plate at a preset temperature to enable the plate surface copper thickness of the plate to reach a first preset thickness and enable the hole copper thickness of the plate to reach a second preset thickness;
detecting the expansion and contraction coefficient of the plate to obtain an actual expansion and contraction coefficient;
judging whether the actual expansion coefficient is smaller than or equal to an expansion coefficient threshold value or not;
if yes, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate;
exposing and developing the plate;
wherein the predetermined temperature is 110 ℃ to 230 ℃,
the step of baking the plate at a predetermined temperature comprises the following steps: and continuously baking the plate at a preset temperature for a preset time, wherein the preset time is 3-7 hours.
2. The method of manufacturing a wiring board according to claim 1, wherein the predetermined time is 4 hours.
3. The method for manufacturing a circuit board according to claim 1, wherein the step of performing the silk-screen operation on the board comprises:
performing first silk-screen printing operation on the bead surface of the plate to form a first ink area of the ink layer;
and performing a second silk-screen operation on the integrated circuit surface of the plate to form a second ink area of the ink layer, wherein the second ink area is connected with the first ink area.
4. The method of manufacturing a circuit board according to claim 1, wherein the step of detecting the expansion and contraction coefficient of the board member to obtain the actual expansion and contraction coefficient comprises:
detecting the expansion and contraction coefficients of the long sides of the plate to obtain actual long-side expansion and contraction coefficients of the plate;
and detecting the expansion and contraction coefficient of the short side of the plate to obtain the actual expansion and contraction coefficient of the short side of the plate.
5. The method for manufacturing a circuit board according to claim 4, wherein the threshold value of the expansion coefficient includes a threshold value of a long-side expansion coefficient and a threshold value of a short-side expansion coefficient;
the step of judging whether the actual expansion coefficient is smaller than or equal to the expansion coefficient threshold value comprises the following steps:
judging whether the actual long-side expansion coefficient is smaller than or equal to the long-side expansion coefficient threshold;
judging whether the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold value.
6. The method for manufacturing a circuit board according to claim 5, wherein,
if yes, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate, wherein the step of forming the ink layer on the surface of the plate comprises the following steps:
and if the actual long-side expansion and contraction coefficient is smaller than or equal to the long-side expansion and contraction coefficient threshold value and the actual short-side expansion and contraction coefficient is smaller than or equal to the short-side expansion and contraction coefficient threshold value, performing silk screen printing operation on the plate to form an ink layer on the surface of the plate.
7. A wiring board prepared by the method of any one of claims 1 to 6.
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| CN202210316992.3A CN114710882B (en) | 2022-03-29 | 2022-03-29 | Circuit board and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104737629A (en) * | 2013-07-15 | 2015-06-24 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency PCB |
| CN113597113A (en) * | 2021-08-03 | 2021-11-02 | 广东依顿电子科技股份有限公司 | Manufacturing method of high-reflectivity white oil circuit board |
| CN114096068A (en) * | 2021-11-30 | 2022-02-25 | 广东依顿电子科技股份有限公司 | Production method of white oil board |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104737629A (en) * | 2013-07-15 | 2015-06-24 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency PCB |
| CN113597113A (en) * | 2021-08-03 | 2021-11-02 | 广东依顿电子科技股份有限公司 | Manufacturing method of high-reflectivity white oil circuit board |
| CN114096068A (en) * | 2021-11-30 | 2022-02-25 | 广东依顿电子科技股份有限公司 | Production method of white oil board |
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