WO2007060955A1

WO2007060955A1 - Metal material for electrical and electronic component and method for manufacturing same, and electrical and electronic component using such metal material for electrical and electronic component

Info

Publication number: WO2007060955A1
Application number: PCT/JP2006/323236
Authority: WO
Inventors: Toshio Tani; Akira Morii; Akihiro Suzukine; Chikahito Sugahara
Original assignee: The Furukawa Electric Co., Ltd.
Priority date: 2005-11-25
Filing date: 2006-11-21
Publication date: 2007-05-31
Also published as: JP2007173208A; TW200738905A; JP5074725B2

Abstract

A metal material for electrical and electronic components is provided. The metal material has two or more multilayer insulating coating layers (2) at least on an area where insulation is required on a metal base material (1), and has sufficient withstand voltage. A method for manufacturing such metal material is also provided. In the method, a coating step of coating with a fluid-state coating material at least the area where insulation is required on the metal base material (1) and drying the coating material is performed a plurality of times.

Description

Specification

Metal material for electric and electronic parts, method for producing the same, and electric and electronic parts using the metal material for electric and electronic parts

Technical field

[0001] The present invention relates to a metal material for electric and electronic parts, a method for producing the same, and an electric and electronic part using the metal material.

Background art

[0002] High-frequency components such as ceramic resonators, crystal oscillators, voltage controlled oscillators (VCOs), SAW filters, diplexers, power plastics, baluns, LPFs, BPFs, dielectric duplexers, etc. mounted on printed circuit boards of electrical and electronic equipment , Liquid crystal drivers (LCDs), keyboards, motherboard connectors such as printed circuit board side connectors, FPC cable side connection connectors, board-to-board connectors, and various modules that combine these are electromagnetic waves, communication noise, and static electricity. It is used by covering it with electrical and electronic parts such as metal cases, covers, housings, and caps. As the electric and electronic devices are being ported, for example, the volume of a memory card is reduced to one-tenth or less of the conventional size, and accordingly, the electric and electronic components are reduced in size, thickness, and height. The height of module parts is 5mm or less, and individual parts are divided by 2mm and are approaching 1mm.

[0003] In such a small, thin, and low profile, an electrical / electronic component is inserted with a sheet-like insulating film at a required location in the electrical / electronic component in order to ensure sufficient insulation with the built-in component. In addition, electric and electronic parts using a metal material having an insulating film on a metal base material, which improved the workability of this method and reduced the manufacturing cost, were proposed. Disclosure of the invention

[0004] In the conventional electric and electronic parts described above, insulation, particularly withstand voltage, cannot be sufficiently obtained. In switches and connectors, insulation is broken because a high voltage is applied between the metal case and the insulation film. Sometimes caused. Increasing the thickness of the insulation film to increase the dielectric strength is contrary to the small size, thinness, and low profile of electrical and electronic parts. In other words, both are in a trade-off relationship.

[0005] For these reasons, the present inventors have made an insulating film on a metal material in an electric / electronic component. Focusing on improving the insulation without increasing the thickness, the method was examined. As a result, the influence of foreign matter such as dust and dust mixed in the insulation film and deteriorating the insulation can be reduced by forming the insulation film on the metal substrate in multiple layers, and bubbles harmful to the insulation can be obtained. As a result, the present invention was completed through further studies.

An object of the present invention is to provide a metal material suitable for miniaturization, thinning, or low profile of an electric / electronic component mounted on an electric / electronic device, a manufacturing method thereof, and an electric / electronic component using the metal material. Is to provide.

[0006] According to the present invention, the following means are provided:

(1) A metal material for electrical and electronic parts, which is provided with two or more multilayer insulation coating layers on at least a place where insulation is required on a metal substrate, and has a dielectric strength resistance.

[0007] (2) The electricity according to item (1), wherein at least one layer of the multilayer insulating coating layer is colored, and the automatic detection rate of insulation defects of the multilayer insulating coating layer is improved by the coloring. Metal materials for electronic parts.

[0008] (3) The metal for electrical and electronic parts as set forth in (1), wherein a coating step of applying a fluid coating material and drying it is applied to at least a place on the metal substrate that requires insulation. Material manufacturing method.

[0009] (4) A method for producing a metal material for electrical and electronic parts, in which a coating process is applied a plurality of times to apply and dry a fluidized coating on at least a place requiring insulation on a metal substrate, the coating process A method for producing a metal material for electrical and electronic parts as described in (2) above, wherein a colorant is added to the fluid coating material applied in at least one step.

[0010] (5) An electrical / electronic component characterized in that the metal material for electrical / electronic component described in (1) or (2) is used.

[0011] The above and other features and advantages of the present invention will become more apparent from the following description with reference to the accompanying drawings as needed.

Brief Description of Drawings

[FIG. 1] FIGS. 1 (A) and 1 (B) show a metal material for electrical and electronic parts showing a first embodiment of the present invention, FIG. 1 (A) is a plan view, and FIG. B) is a cross-sectional view taken along the line AA in FIG.

[Fig. 2] Fig. 2 is a cross-sectional view of a metal material for electrical and electronic parts showing a second embodiment of the present invention. is there.

FIG. 3 is a plan view of a metal material for electric and electronic parts showing a third embodiment of the present invention.

FIG. 4 is a plan view of a metal material for electrical and electronic parts showing a fourth embodiment of the present invention.

FIG. 5 is a cross-sectional view of a metal material for electrical and electronic parts showing a fifth embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0013] An example of an embodiment of the metal material for electric and electronic parts of the present invention will be specifically described with reference to Figs.

The metal material for electrical and electronic parts of the present invention is excellent in that two or more multilayer insulation coating layers (2) are provided at least on the surface of the metal substrate (1) and on the Z or back surface where insulation is required. It has dielectric strength.

In the metal material shown in FIGS. 1 (A) and 1 (B), two coating layers 2 (2a, 2b) are provided in stripes in the longitudinal direction on one surface of a plate-like metal substrate 1. Is. 1 (A) and 1 (B), FIG. 1 (A) is a plan view, and FIG. 1 (B) is a cross-sectional view taken along the line AA in FIG. 1 (A). Here, one of the two surfaces excluding the surface including the thickness direction of the plate-like metal substrate is called a top or front surface and the other is called a back surface.

[0014] The metal material shown in the cross-sectional view of FIG. 2 includes two insulating coating layers 2 (the first insulating coating layer 2a, A second insulating coating layer 2b) is provided in a stripe shape in the longitudinal direction. (In addition to the illustration, the insulating coating layer 2 may be provided on one side (for example, the back side) of the metal base 1)

[0015] The metal material shown in the plan view of Fig. 3 is obtained by providing two insulating coating layers 2 (2a, 2b) in the form of spots in the longitudinal direction on one surface of a plate-like metal base 1 It is.

The metal material shown in the plan view of FIG. 4 is one in which two insulating coating layers 2 (2a, 2b) are provided in a donut shape on one surface of a plate-like metal substrate 1. In the present invention, the shape of the insulating coating layer is not particularly limited. , Round, donut-shaped, jagged edges, or a mixture of these.

[0017] The metal material shown in the cross-sectional view of FIG. 5 is provided with a first insulating coating layer 2a on each side surface of the plate-like metal substrate 1, and then two layers in places where particularly high insulation is required. The first insulating coating layer 2b is provided and has two insulating coating layers (2).

[0018] The metal material for electrical and electronic parts of the present invention can be produced, for example, as follows.

In other words, a fluidized coating is supplied to the surface of a traveling metal substrate from the discharge port of a coating device, applied, and then heated to volatilize the solvent, and at the same time, cured and chemically reacted to form the first insulating coating. Form a layer. Next, a second coating layer is formed on the same as the first layer. Form third and fourth layers as required.

[0019] In the present invention, the metal base material is a white (Cu—Ni alloy), phosphor bronze (Cu—Sn) having excellent punchability and drawability, and good ductility and springiness. — P-type alloy), 42 alloy (Fe—Ni-type alloy), stainless steel, etc. are preferably used. Among them, phosphor bronze is preferred because it has a good balance of performance. The electrical conductivity of the metal substrate is preferably 5% IACS or more, particularly preferably 10% IACS or more from the viewpoint of electromagnetic shielding, and the relative permeability is preferably 1 or more.

[0020] In the present invention, the metal substrate is produced by a conventional method in which hot rolling, cold rolling, homogenization treatment, and degreasing treatment are performed in this order on the koji obtained by melting and forging a predetermined metal raw material. it can. The shape of the metal substrate is a plate, strip, etc., and its thickness is preferably 0.01-0. 5 mm, especially 0.05-0.2 mm force! / ヽ.

[0021] The metal material for electrical and electronic parts of the present invention has an insulating coating layer provided in multiple layers on the metal base where insulation is required, thereby reducing the influence of foreign matter and bubbles that impair insulation. . The location on the metal substrate that requires insulation is a location where a built-in component that requires insulation approaches or comes into contact when an electrical / electronic component (such as a casing or case) is formed using a metal material.

[0022] In places where foreign matter or bubbles are mixed, the insulation coating layer is thin, so high voltage is applied. When applied, a spark is generated between the metal substrate and the built-in component, causing dielectric breakdown. If there is no foreign material, DC lkV withstand voltage can be obtained even if the insulation coating layer thickness is about 3 μm. Most foreign materials are mixed in a clean box or other clean box when forming the insulating coating layer.

[0023] Electrical and electronic parts are usually required to have a dielectric breakdown voltage of 500V or higher for direct current or alternating current. On the other hand, the thickness of the insulating coating layer is preferably 60 m or less, especially 30 m for a small, thin and low profile. The following is preferred.

[0024] The metal material of the present invention has a multi-layered insulation coating layer provided at a location requiring insulation of the metal base material to enhance insulation. Preferably, for example, the total thickness of the multi-layer insulation coating layer is 25 μm. A dielectric strength of 500V or more can be obtained at m. Therefore, by using this metal substrate, it is possible to reduce the size, thickness, and height of electrical and electronic parts.

[0025] In the present invention, the relationship between the thickness of the first layer of the multilayer insulating coating layer and the thickness of the second and subsequent layers, the relationship between the thickness of the entire multilayer insulating coating layer and the thickness of each layer, and the relative thickness of each layer. The appropriate relationship may be determined as appropriate in consideration of manufacturing conditions. However, if the thickness per layer is too thin, pinholes are likely to be generated, so 2 μm or more is preferable, and 3 μm or more is particularly preferable.

[0026] In the present invention, an arbitrary resin varnish such as polyester-based resin can be used for the fluid coating, and the resin is later subjected to a heating process such as solder bonding or reflow solder mounting. In this case, a heat-resistant resin such as polyimide, polyamideimide, polyamide or epoxy is preferred. In particular, polyimide resin and polyamideimide resin are preferable. In addition, the resin in the fluidized coating forming each layer of the multilayer insulating coating layer may be the same or different. In addition to resin, it is also possible to use a ceramic such as alumina or a layered silicate coated and formed in a green sheet and then baked by heating. The volume resistivity of the multilayer insulating coating layer is preferably ΙΟ ^ Ω 'cm or more, particularly 10 ¹⁴ Ω' cm or more.

[0027] In the case where the coating material to be the insulating coating layer is cured by irradiating with ultraviolet rays (UV) or electron beams (EP), the coating thickness does not include a volatile component such as a solvent. It becomes the coating thickness as it is.

[0028] In the present invention, the multi-layer insulating coating layer is made safe by using a conventionally used apparatus or the like. Can be provided with good productivity. However, in order to provide an insulating coating layer in multiple layers, the fluid coating must be applied with high accuracy. In particular, when applying, the position in the width direction of the metal substrate needs to be set with high accuracy. For that purpose, guide both sides of the metal base

It is preferable to guide in the form of rolls or plates with grooves.

[0029] In the present invention, in order to apply the fluid coating material with high accuracy, a method of supplying the fluid coating material from the discharge port of the coating apparatus is recommended. In this method, the discharge port is fixed at a predetermined position with respect to the width direction of the metal substrate surface, and the fluid coating material discharged from the discharge port is continuously supplied onto the traveling metal substrate. The insulating coating layer is baked by passing through a heating furnace to volatilize the solvent and simultaneously reacting and curing the resin. The coating conditions are selected according to the shape of the insulating coating layer and the type of fluidized coating used. Usually, the discharge pressure is 3 to 50 kgZcm ² , and the distance between the discharge port and the metal substrate is 10 to 200 m.

In the present invention, the cross-sectional shape of the insulating coating layer is arbitrary such as a rectangle, a trapezoid, and an inverted trapezoid, and many of them are narrower than the width of the metal substrate. In some cases, the cross-sectional shape is slanted at both ends, or the upper ends of both ends are partially protruding in a square shape. The shape of the discharge port is preferably approximated to the cross-sectional shape of the insulating coating layer.

[0031] Surface insulation defects such as pinholes that are present in the coating layer and impair insulation properties are easily detected by coloring the multilayer insulating coating layer. This tendency is the same for both the automatic inspection by the image recognition device using an image sensor and the visual inspection. This coloring can be easily performed by adding a coloring agent to the fluidized coating. In the present invention, by coloring at least one of the multilayer insulation coating layers, defects such as pinholes can be automatically detected accurately, and the automatic detection rate of insulation defects in the multilayer insulation coating layer can be improved.

In the present invention, the color of coloring is not particularly limited, and the color tone difference between the defect portion and the defect-free portion clearly appears in all colors.

When the coloring color is an achromatic color (white, gray, black, etc.), black is preferred to have an N value of 3 or less. White has an N value of 8 or more. In the case of chromatic colors (red, yellow, green, etc.), red preferably has a hue of 10R to 10RP, a brightness of 3 to 5, and a saturation of 10 to 14. Yellow is preferably hue 10Y ~: LOYR, lightness 6-8, saturation 10-14. Green is preferably hue 10G ~: LOGY, lightness 5-7, saturation 5-10. Blue has a hue of 5PB-: L0BG, lightness of 3-5, and saturation of 10-14. Purple is preferred to have a hue of 10P to 10PB, lightness of 4 to 6, and saturation of 10 to 14.

In the present invention, an inorganic pigment, an organic pigment, a precursor material of the pigment, a dye, or a mixture thereof is preferably used as the colorant. Carbon black can be used as the black pigmented inorganic pigment. Others include Cu-Cr-Mn, Mn-Fe-Cu, Co-Fe-Cr, Ni-Cu, Cr-Fe, Fe-Cu, Ti-Mn-Cu, Cu-Cr -Complex metal oxides such as Fe can be used. As other inorganic pigments, titanium oxide or the like can be used. Examples of the organic pigment include copper phthalocyanine. Alternatively, a dye such as alin black that is soluble in water or a solvent may be used. Moreover, the processed material which coated these pigments and dyes with rosin etc. may be sufficient.

Of the colored colors, black or matte coloring is preferred, particularly matte black, because of the high-quality appearance, color tone difference from the metal substrate strip, and the fact that it does not reflect light. . When forming a black coating layer, the amount of black pigment into paint varnish, rather preferably is from 0.5 to 60 weight ^_0/0, more preferably from 3 to 30 mass%.

In the present invention, it is also preferable to add a decoloring agent to the fluid coating material in addition to the colorant. As a disinfectant that can be used in the present invention, silica (SiO 2)

2 is preferred. There are wet and dry methods for producing silica, and wet methods include precipitation method and gel method, and silica produced by any method can be used. In addition, colloidal silica, fumed silica, silica with improved dispersibility by coating with rosin and the like can also be used. The silica to be used is selected according to the strength of the resin coating layer, etc. The quenching agent such as silica has an average particle size of preferably 1 to 5 / ζ πι, more preferably 2 to 4 / ζ πι. The amount of added force is preferably 0.2 to 20% by mass, more preferably 1 to 10% by mass.

[0035] A non-silica defatting agent other than silica can also be used. Detergent is added to the paint varnish after adjusting the amount according to the required gloss of the resin film. As with the colorant, the matting agent can be dispersed in the paint varnish to obtain a suitable gloss (dalos).

[0036] By coloring at least one of the multilayer insulating coating layers, defects in the insulating resin coating layer can be detected with extremely high sensitivity, and defective products can be removed. The error rate is the highest At most 25% or less, and 0.5% or less can be realized when the addition amount of the coloring agent and the decoloring agent is suitably adjusted.

[0037] In the present invention, a metal layer such as Ni or Sn can be provided on a metal substrate, and the corrosion resistance, solderability, and adhesion to the insulating coating layer of the metal substrate can be improved. . The metal layer may be provided on the entire surface of the metal substrate or only on the exposed portion of the metal substrate.

[0038] In the present invention, the adhesion of the insulating coating layer is improved by subjecting the metal substrate or metal layer to an organic or inorganic bond base treatment such as silane coupling treatment or titanate coupling treatment. Can do.

[0039] When a metal material of the present invention is used to form a casing of an electrical / electronic component, an insulating coating layer of the metal material can be provided at a location requiring insulation to insulate the built-in component from the casing. The insulating coating layer may be provided inside or outside the housing depending on the positional relationship with a component that requires insulation. The effect is greatly manifested in low-profile housings for built-in elements and connector shield housings.

[0040] The electromagnetic shield of the electrical and electronic component of the present invention is a ceramic mounted on a printed circuit board of a portable device (mobile phone, portable information terminal, notebook computer, digital camera, digital video, game machine, etc.). Individual components such as resonators, crystal oscillators, voltage controlled oscillators, SAW filters, diplexers, force plastics, baluns, LPFs, BPFs, dielectric duplexers, antenna switch modules with multiple built-in individual components, front end modules, RF —Body module, Bluetooth module, image sensor module, tuner module, wireless LAN module, and other modules, or terminals on the printed circuit board side such as LCD driver, LCD, keyboard, motherboard etc. Connector and FPC cable side Connector, board to board, etc. Connector, further 〖This detection switch or a small-sized memory 'connector for the card, and the like removable type or semi-built-in type connector.

[0041] In the metal material for electrical and electronic parts of the invention described in (1), two or more multilayer insulating coating layers 2 are provided at least on the metal base 1 where insulation is required. When the multilayer insulation coating layer is provided in two layers, the first insulation coating layer Even if foreign matter is mixed in, the second layer of healthy insulating coating layer is formed on it, so the influence of the foreign matter is reduced and it has good dielectric strength. In addition, since the thickness per layer can be reduced, bubbles can easily escape. Therefore, the insulating property can be improved without increasing the thickness of the insulating coating layer. In addition, by providing an insulating coating layer only where insulation is required, it is possible to reduce the size and thickness of electrical and electronic parts, save fluidized coatings, and maintain high heat dissipation.

[0042] In the metal material for electrical and electronic parts of the invention described in (2), at least one of the multilayer insulating coating layers is colored, and the automatic detection rate of the insulation defect of the multilayer insulating coating layer by the coloring. Therefore, the appearance inspection of the insulating coating layer can be performed accurately, and the reliability of the metal material is increased.

[0043] The invention described in the above item (3) is a metal material for electrical and electronic parts which is subjected to a coating process of applying a fluid coating material and drying it at least at a place where insulation is required on the metal base material a plurality of times (twice or more). The invention described in the above item (4) is a manufacturing method in which a colorant is added to a fluid coating applied in at least one step of the coating step in the invention described in the above (3), both of which are conventional It can be manufactured using the equipment used, and the manufacturing cost is low.

[0044] Since the electrical / electronic component described in (5) above uses the metal material for electrical / electronic component described in (1) or (2) above, the built-in component and the insulating coating layer are not thickened. Insulation between the two can be secured sufficiently, and it is advantageous for a small, thin and low profile. In addition, when at least one insulating coating layer is colored, the appearance of the insulating coating layer can be accurately inspected, resulting in excellent reliability. In addition, if an insulating coating layer is provided only in locations where insulation is required, fluidized coatings can be saved, electrical and electronic parts can be reduced in size, thickness and height, and high heat dissipation can be maintained.

Example

[0045] Next, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

[0046] Example 1

Electrolytic degreasing, water washing, pickling, water washing, and drying on a metal strip (metal substrate) with a thickness of 0.1 mm and a width of 10 mm Each step of drying (heating) was performed in this order, and then a metal material for electric and electronic parts was manufactured by providing a multilayer insulating coating layer at a location where insulation of each strip was required. JIS alloy C5 210R (phosphor bronze, manufactured by Furukawa Electric Co., Ltd.), C7701R (Yohaku, manufactured by Mitsubishi Electric Metex Co., Ltd.) or SUS304—CPS (stainless steel, manufactured by Nisshin Steel Co., Ltd.) was used for the metal strip.

[0047] The multilayer insulating coating layer discharges varnish (fluid coating) from the rectangular outlet of the coating apparatus perpendicularly to the central portion in the width direction of the traveling metal substrate surface, and then at 300 ° C. The first insulating coating layer was formed in a stripe shape by heating for 30 seconds, and the second and third layers were provided in the same manner. The metal substrate was run with the width direction fixed.

[0048] Two types of varnish were used: a polyimide (PI) solution (made by Arakawa Chemical Co., Ltd.) using n-methyl 2-pyrrolidone as a solvent and a polyamideimide (PAI) solution (made by Tohoku Paint Co., Ltd.). The discharge pressure of the varnish was 10 to 15 kgZcm ² , and the distance between the discharge port and the metal substrate was 20 to 50 / ζ πι. The cross-sectional shape of the insulating coating layer was almost rectangular (thickness 5 μm or more, width 7 mm).

[0049] With respect to the obtained metal material for electric and electronic parts, the withstand voltage resistance was examined by the following method. That is, the metal material was passed so that the insulating coating layer was in contact with the surface of the stainless steel roll. A 0.5 kV DC voltage was applied between the metal and the metal material using a spark tester (manufactured by Clinton), and the number of occurrences of sparks at locations with poor dielectric strength was measured. The test length of the metal material was 100 m each.

[0050] Regarding the metal material, the number of pinholes in the insulating coating layer is checked by automatic visual inspection and visual inspection, and the number of pinholes detected by automatic visual inspection i, the number detected by visual inspection j, and the force are also calculated. The recognition error rate [(j—i) Zj] x ioo% for automatic visual inspection was obtained. Automatic visual inspection uses an image recognition device equipped with a general binary image processing means using binary values, and visual inspection uses a CCD and a microscope (Keyence VH-8000). did. The magnification was 200 times. The test length of the metal material was 5 m each, and the number of tests (n) was 10 each. When the average recognition error rate was less than 5%, the automatic appearance inspection was evaluated as very good (◎), 5-15% as good (◯), and more than 15% as bad (X).

[0051] Example 2 A metal material for electric and electronic parts was produced by the same method as in Example 1 except that at least one layer was coated with a varnish to which a color pigment and a decoloring agent were added. Examined. In addition, automatic appearance inspection was evaluated by the same method as in Example 1 every time the colored layer was coated.

[0052] Comparative Example 1

A metal material for electrical and electronic parts was produced by the same method as in Example 1 except that one insulating coating layer was provided, and the withstand voltage was examined by the same method as in Example 1.

[0053] Table 1 shows the results of Examples 1 and 2 and Comparative Example 1. Table 1 also shows the thickness of the insulating coating layer. The thickness of the coating layer was measured using a micrometer every time one layer was coated. In addition, Table 2 shows the types and amounts of color pigments and disinfectants.

[0054] [Table 1]

table 1

(Ii) ① Complex oxide, ② 鋇 phthalocyanine (see Table 2).

[0055] [Table 2]

Table 2

[0056] The average particle diameters of the colorant and the decoloring agent used are as follows: Carbon black (CB): 0.04 μ ηί

Cu-Cr complex oxide: 0.26

Titanium oxide (TiO): 0.23 μ ηι

2

Copper phthalocyanine: 0.02

Silica (SiO 2): 2. O ^ m

2

As is clear from Table 1, all of the metal materials of the inventive examples (Example 12: No. 116) had zero spark occurrence and excellent dielectric strength. This is because the influence of foreign matter and air bubbles is reduced because the insulating coating layer is formed in multiple layers. In addition, for those with at least one layer colored (No. 1 1 16), automatic inspection of surface defects (pinholes) is performed accurately.

On the other hand, since the metal material of Comparative Example 1 (No. 17 23) had a single insulating coating layer, sparks were generated many times and the dielectric strength resistance was remarkably inferior.

Industrial applicability

[0058] The metal material of the present invention is an electromagnetic shield for electrical and electronic devices, particularly low-profile electrical and electronic components mounted on small and thin portable electrical and electronic devices, or shield connectors, card connectors, and thin switches. Therefore, it is suitable as a metal material for electrical and electronic parts (cases, covers, housings, caps, etc.).

[0059] While this invention has been described in conjunction with its embodiments, we do not intend to limit our invention in any detail of the description unless otherwise specified. The spirit and scope of the invention as set forth in the appended claims I think that it should be interpreted widely without contradicting.

[0060] This application is based on Japanese Patent Application 2005-340515 filed in Japan on January 25, 2005, and Japanese Patent Application 2006-241909 filed in Japan on September 6, 2006. All of which are hereby incorporated herein by reference in their entirety.

Claims

The scope of the claims

[1] A metal material for electrical and electronic parts, which is provided with two or more multilayer insulation coating layers on at least a place where insulation is required on a metal base material, and has a withstand voltage resistance.

[2] The electric / electronic component according to claim 1, wherein at least one of the multilayer insulation coating layers is colored, and the automatic detection rate of insulation defects of the multilayer insulation coating layer is improved by the coloring. Metal material.

[3] The method for producing a metal material for electrical and electronic parts according to [1], wherein a coating step of applying and drying the fluidized coating is performed a plurality of times on at least a place requiring insulation on the metal substrate.

[4] A method for producing a metal material for electrical and electronic parts, in which a fluidized coating is applied and dried at least on a place where insulation is required on a metal substrate, and the coating process is performed a plurality of times. 3. The method for producing a metal material for electrical and electronic parts according to claim 2, wherein a colorant is added to the fluidized coating applied in the step.

[5] An electrical / electronic component characterized in that the metal material for electrical / electronic component according to claim 1 or 2 is used.