JP2006080212A - Electronic component holder and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost electronic component holder which never allows the sticking of a mask thereto and can prevent the bending, damages, etc. of an electronic component at the time of mounting the same, and to provide its manufacturing method. <P>SOLUTION: On a flat base board 1, a heat-resistant sticking layer 2 is formed so that a flexible printed board can be detachably stuck and mounted on the base board 1. Part of the surface of the sticking layer 2 is turned into a non-sticking area 3 corresponding to the shape of the flexible printed board. Since the non-sticking area 3 is formed in the sticking layer 2 according to the shape of the flexible printed board, and is so formed as to contain a portion corresponding to other area than the external shape of the flexible printed board, there is no chance that the electronic component holder and the metal mask stick to each other at the time of printing of a cream solder by the metal mask and defective printing is caused. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component holder used for fixing and transporting an electronic component made of a flexible printed circuit board and the like, and a method for manufacturing the same.

  In recent years, in the field of electronics, a flexible thin flexible printed circuit board (also referred to as an FPC board) is used. This flexible printed circuit board is formed by laminating a circuit conductor on a polyimide film. Electronic components such as inductors, LSIs, capacitors, resistors, and filters are mounted. The electronic component is mounted through cream solder printing using a metal mask, mounting of the electronic component, reflow soldering, and a cutting process.

The electronic component is mounted on the flexible printed circuit board through the processes as described above. At that time, the flexible printed circuit board is flattened and mounted and fixed to the electronic component holder (see Patent Document 1).
This type of electronic component holder is provided with a heat-resistant base board (not shown), and an adhesive layer made of silicone resin or the like is laminated or formed on the base board, and the surface of the adhesive layer is formed. The flexible printed circuit board is detachably adhered to the predetermined area.
JP 2003-113355 A

  The conventional electronic component holder is configured as described above, and in the case of a type for mounting and mounting a plurality of individual pieces of flexible printed circuit boards simultaneously, the flexible printed circuit board is used when cream solder is printed with a metal mask. If the adhesive layer in the area other than the area where the is mounted is exposed, there is a big problem that the metal mask adheres (adheres) to cause poor printing.

  As a method for preventing such adhesion of the metal mask, a means of dividing and arranging the area of the adhesive layer can be considered. However, in the case of this method, it is necessary to individually design and produce a plate according to the flexible printed circuit board, which causes a new problem of incurring high costs. Moreover, since it takes time to design and manufacture in order to cope with individual specifications, there is a high possibility that the lead time becomes long.

  Furthermore, when adjusting the adhesion of the flexible printed circuit board with the adhesion area between the flexible printed circuit board and the adhesive layer, an area with a partially different thickness is formed on the flexible printed circuit board with poor rigidity, and mounting of electronic components There is a problem that sometimes breaks and scratches occur.

  The present invention has been made in view of the above, an inexpensive electronic component holder capable of preventing adhesion of a mask and suppressing occurrence of breakage, scratches and the like during mounting of the electronic component, and a method for manufacturing the same The purpose is to provide.

In the present invention, in order to solve the above-described problem, an electronic component is mounted, and an adhesive layer for detachably mounting the electronic component is provided on the base board, and a part thereof is a non-adhesive region. It is said.
In addition, it is preferable that a non-adhesion area | region contains the location corresponding to areas other than the external shape of the electronic component mounted at least.

In order to solve the above-mentioned problems, the present invention is characterized in that an adhesive layer on which an electronic component is detachably mounted is provided on a base board, and a part thereof is formed in a non-adhesive region.
In addition, a part of adhesion layer can be formed in a non-adhesion area | region by roughening based on a blast process.
Further, a part of the adhesive layer can be formed in the non-adhesive region by surface modification based on ultraviolet irradiation.

  Here, the electronic components in the claims include at least one or more flexible printed boards, ceramic green sheets, glass, semiconductor wafers, dies, inductors, LSIs, capacitors, resistors, filters, and the like. The base board and the adhesive layer are appropriately formed into a rectangle, a square, a polygon, a circle, an ellipse, or the like. Another layer made of an adhesive layer or the like is appropriately interposed between the base board and the adhesive layer. The pressure-sensitive adhesive layer can be provided on the front surface, back surface, or front and back surfaces of the base board, and is preferably made of an elastic elastomer whose surface is modified by irradiation with ultraviolet rays. A plurality of non-adhesive regions are formed so as to include locations corresponding to areas other than the outer shape according to the shape of the electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that the adhesion of a mask can be prevented and it can suppress that a crease | fold, a crack, etc. generate | occur | produce at the time of mounting of electronic components.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, an electronic component holder according to the present embodiment is arranged on a heat-resistant base board 1 and an electronic device (not shown). A heat-resistant adhesive layer 2 for detachably mounting a flexible printed circuit board as a component is formed, and a plurality of non-adhesive regions 3 corresponding to the shape of the flexible printed circuit board are formed on a part of the surface of the elastic adhesive layer 2. And so on.

  The base board 1 is made of a predetermined metal, plastic, ceramic, etc., and both front and back sides are formed into flat rectangles. Hole processing is used to escape the flexible printed circuit board, and it is used for alignment of the flexible printed circuit board. A pin or the like is provided. Examples of the metal include flat SUS, aluminum, iron, and copper, and examples of the plastic include heat-resistant glass epoxy, polyethersulfone, polyetherketone, polyetherimide, polyethersulfide, polyarylate, and polyimide. Can be given.

Examples of the ceramic include alumina, sialon, zirconia, aluminum nitride, silicon nitride, silicon carbide, and titanium nitride.
The base board 1 is set to a thickness of 0.3 mm or more from the viewpoint of securing rigidity, and is formed to a thickness of 5 mm or less in order to avoid becoming unnecessarily heavy.

  The pressure-sensitive adhesive layer 2 is formed on a base board 1 with a predetermined hardness and a rubber hardness of 5 to 60 Hs (JIS A). Examples of the material for the adhesive layer 2 include polyimide silicone rubber, fluorine rubber, urethane elastomer, natural rubber, and cyclopentadiene rubber.

The reason why the rubber hardness of the adhesive layer 2 is 5 to 60 Hs (JIS A) is that when it is less than 5 Hs, the mechanical strength is insufficient and the durability is deteriorated. On the other hand, if it exceeds 60 Hs, the adhesive force is reduced and the flexible printed circuit board cannot be sufficiently retained.
The adhesive strength of the adhesive layer 2 greatly depends on the surface state of the adhesive layer 2. For example, if the surface of the adhesive layer 2 is a mirror surface, the adhesive force is increased, and if the surface of the adhesive layer 2 is a rough surface, the adhesive force is decreased. Therefore, in order to ensure the uniformity of the adhesive strength, it is important to keep the surface state of the adhesive layer 2 uniform.

  As a method for laminating the adhesive layer 2 on the base board 1, for example, a curable composition is applied on the base board 1 by a screen printing method, a dip method, a doctor blade method, a knife coating method, a bar coating method, a spin coating method, or the like. And a curing method. Of course, the present invention is not limited to this, and a method in which the curable composition is formed into a film using a calendar device, an extrusion device, or a press device and bonded onto the base board 1 may be used.

  The adhesive layer 2 is required to be able to withstand the solder reflow temperature when electronic components are mounted. For example, when the material is silicone rubber, a polyimide silicone resin, a fluorinated polyether skeleton having a curable functional group is used. A fluorine-based elastomer having

Each non-adhesive region 3 is formed so as to include a location corresponding to an area other than its outer shape according to the shape of the flexible printed board. This non-adhesive region 3 is a physically rough surface based on a sandblasting process (a process in which sand or the like is strongly blown and rust or scale is removed to clean the masked smooth adhesive layer 2). Or formed by surface modification based on ultraviolet irradiation. The irradiation amount of ultraviolet rays is 500 to 10,000 mJ / mm ² , preferably 2,000 to 6,000 mJ / mm ² .

In the above, when manufacturing an electronic component holder using ultraviolet irradiation, first, a silicone rubber compound is dispensed to a predetermined thickness with a calendar roll, and the silicone rubber compound is heated and cured to form an adhesive layer 2. Form.
Separately, liquid silicone rubber is printed on the surface of the base board 1 having a predetermined thickness by a screen printing method, and the adhesive layer 2 previously formed is bonded to the uncured silicone rubber. Then, the base board 1 and the adhesive layer 2 are integrated to produce an electronic component holder (see FIG. 1).

  After the electronic component holder is manufactured, a pattern mask (not shown) is partially overlapped on the surface of the adhesive layer 2 to expose the region where the non-adhesive region 3 is to be formed, and then ultraviolet rays are illustrated in the region where the non-adhesive region 3 is to be formed. If the surface is modified by irradiating with a non-ultraviolet irradiation device, an electronic component holder having the non-adhesive region 3 can be manufactured (see FIG. 2).

  According to the above configuration, the adhesive layer 2 is formed so that the non-adhesive region 3 is formed according to the shape of the flexible printed circuit board and contains a portion corresponding to an area other than the outer shape of the flexible printed circuit board. When cream solder is printed with a metal mask, the electronic component holder and the metal mask do not adhere to each other, resulting in poor printing.

  In addition, it is not necessary to design and manufacture the plate individually according to the flexible printed circuit board, and the lead time can be shortened without increasing the cost. In addition, it is possible to effectively suppress and prevent the occurrence of breakage and scratches when mounting electronic components. Furthermore, if the region where the non-adhesive region 3 is to be formed is irradiated with ultraviolet rays using a mask, the non-adhesive region 3 having various shapes can be formed very easily.

Embodiments of an electronic component holder and its manufacturing method according to the present invention will be described below.
First, a silicone rubber compound (trade name KE-1510U manufactured by Shin-Etsu Chemical Co., Ltd.) is dispensed to a thickness of 0.2 mm with a calender roll, and the silicone rubber compound is heated and cured to have a thickness of 0.2 mm. A layer was formed on the sheet.

  Separately from the above, a liquid silicone rubber (trade name KE-1800 manufactured by Shin-Etsu Chemical Co., Ltd.) is printed on the surface of the base board to a thickness of 0.02 mm by screen printing, and this uncured silicone rubber is applied to the uncured silicone rubber. The previous adhesive layer was bonded and heated and pressed and the base board and the adhesive layer were integrated to produce an electronic component holder. The base board was an aluminum plate having a thickness of 0.8 mm.

Next, a pattern mask (not shown) is partially overlapped on the surface of the adhesive layer to expose a region where the non-adhesive region is to be formed, and ultraviolet rays are irradiated to the region where the non-adhesive region is to be formed by an ultraviolet irradiation device (not shown) for about 15 minutes. Thus, an electronic component holder with a non-adhesive region could be manufactured.
The mask was black PET having a thickness of 0.25 mm, and the ultraviolet irradiation apparatus was an apparatus having an irradiation intensity capability of 100 mW / cm ² . The irradiation of ultraviolet rays was set to 3,000 mJ / mm ² for 10 minutes (see FIG. 3), and the irradiation amount of ultraviolet rays was set to 4,500 mJ / mm ² .

It is sectional explanatory drawing which shows the electronic component holder before non-adhesion area | region formation in embodiment of the electronic component holder which concerns on this invention, and its manufacturing method. It is sectional explanatory drawing which shows the electronic component holder provided with the non-adhesion area | region in embodiment of the electronic component holder which concerns on this invention, and its manufacturing method. It is a graph which shows the characteristic change of the adhesive force by ultraviolet irradiation in the Example of the electronic component holder which concerns on this invention, and its manufacturing method.

Explanation of symbols

1 Baseboard 2 Adhesive layer 3 Non-adhesive area

Claims (5)

  An electronic component holder for mounting an electronic component, wherein an adhesive layer for detachably mounting an electronic component is provided on a base board, and a part thereof is a non-adhesive region.   The electronic component holder according to claim 1, wherein the non-adhesive region includes at least a portion corresponding to an area other than the outer shape of the electronic component to be mounted.   A method for manufacturing an electronic component holder, comprising: providing an adhesive layer for detachably mounting an electronic component on a base board, and forming a part thereof in a non-adhesive region.   The manufacturing method of the electronic component holder of Claim 3 which forms a part of adhesion layer in a non-adhesion area | region by roughening based on a blast process.   The manufacturing method of the electronic component holder of Claim 3 which forms a part of adhesion layer in a non-adhesion area | region by the surface modification based on ultraviolet irradiation.

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