JP2009059874A - Electronic component holder and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component holder which can suppress a printing defect due to adhesion of an adhesion layer and a mask and also prevent a decrease in yield of component mounting and damage to an electronic component, and a manufacturing method thereof. <P>SOLUTION: The adhesion layer 3 is stacked on a baseboard 1, and a surface of the adhesion layer 3 is sectioned into a plurality of adhesion areas 4 where a plurality of flexible printed boards 10 are detachably stuck and a non-adhesion area 5 other than the plurality of adhesion areas 4, no step being formed between the plurality of adhesion areas 4 and the non-adhesion area 5. The non-adhesion area 5 includes areas other than the external shape of the flexible printed boards 10, so when cream solder is printed on the flexible printed boards 10 using a metal mask, the metal mask is not stuck on the non-adhesion area 5 to cause no printing defect. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component holder used for fixing and transporting an electronic component made of a flexible printed circuit board and the like, and a method for manufacturing the same.

  In recent years, thin flexible printed boards (also referred to as FPC boards) having flexibility are frequently used in the fields of electronics and information communication. The flexible printed circuit board is formed, for example, by laminating circuit conductor patterns on an insulating polyimide film by a printing technique, and electronic components such as inductors, LSIs, capacitors, resistors, and filters are mounted thereon. The mounting of the electronic component is performed through cream solder printing using a metal mask, mounting of the electronic component, reflow soldering, and a cutting process.

By the way, the flexible printed circuit board with poor rigidity is flattened and mounted on an electronic component holder (not shown) in view of being transported and mounted (see Patent Document 1). In this type of electronic component holder, an adhesive layer made of silicone rubber or the like is laminated on a heat-resistant base board, and a necessary number of flexible printed circuit boards are detachably attached to a predetermined region on the surface of the adhesive layer.
JP 2006-80212 A

  Since the conventional electronic component holder is configured as described above, when cream solder is printed on a flexible printed circuit board using a metal mask for mounting electronic components, a region other than a predetermined region on the surface of the adhesive layer is used. If the region is exposed, there is a problem that the exposed region and the metal mask are adhered (adhered) to cause printing failure.

  As a method for solving such a problem, a method of dividing a predetermined region of the adhesive layer into a plurality of parts or a method of dividing and arranging them in an island shape is conceivable. Depending on the printed circuit board, it is necessary to design and manufacture the plate individually, and a big problem of incurring high costs arises. Further, with the island-shaped arrangement, a step is generated in the adhesive layer, which may reduce the yield of electronic component mounting.

  In addition, when adjusting the adhesive holding of the flexible printed circuit board with the adhesive area between the flexible printed circuit board and the adhesive layer, an area with a partially different thickness is formed on the flexible printed circuit board having poor rigidity, and the electronic component There is a possibility that the flexible printed circuit board may be broken or damaged during mounting.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an electronic component holder that suppresses printing defects associated with adhesion between an adhesive layer and a mask, and that can prevent a reduction in component mounting yield and damage to electronic components, and its manufacture. It aims to provide a method.

In the present invention, in order to solve the above problems, an adhesive layer is laminated on a base board, and an electronic component is detachably held on the surface of the adhesive layer,
The adhesive layer is characterized in that the surface of the adhesive layer is formed from an adhesive region that detachably attaches an electronic component and a non-adhesive region formed in at least a part other than the adhesive region.
In addition, it is preferable to perform dry etching by plasma discharge to the formation plan area | region of the non-adhesion area | region of an adhesion layer, and to form a non-adhesion area | region.

Moreover, in order to solve the said subject in this invention, it is a manufacturing method of the electronic component holder of Claim 1 or 2, Comprising:
An adhesive layer is laminated on the base board, and the surface of the adhesive layer is partially masked to expose a region where the non-adhesive region is to be formed, and dry etching by plasma discharge is applied to the region where the non-adhesive region is to be formed. It is characterized by forming an adhesive region.

  Here, the base board and the adhesive layer in the claims are appropriately formed in a rectangular shape, a square shape, a polygonal shape, a circular shape, an elliptical shape or the like in a plan view. The adhesive layer can be provided on any of the front surface, the back surface, and the front and back surfaces of the base board. This adhesive layer is preferably formed using various elastic elastomers.

  The electronic component includes at least one or more flexible printed boards, ceramic green sheets, glass, semiconductor wafers, dies, inductors, LSIs, capacitors, resistors, filters, and the like. The adhesive region and the non-adhesive region are not particularly limited to a plurality. Further, the non-adhesive region may be appropriately formed in a frame shape, a cross shape, a dot shape, a ring shape or the like so as to include a portion corresponding to a region other than the outer shape according to the shape of the electronic component.

  According to the present invention, an electronic component holder can be manufactured by forming a non-adhesive region by overlaying an adhesive layer on a base board and subjecting the non-adhesive region to a formation planned region by dry etching or ultraviolet irradiation treatment. it can. Since the surface of the adhesive layer is divided into an adhesive region and a non-adhesive region, and the non-adhesive region includes regions other than electronic components, when solder or the like is printed on the electronic component using a mask, The mask is less likely to stick and cause poor printing.

According to the present invention, there is an effect that it is possible to suppress printing defects accompanying adhesion between the adhesive layer and the mask, and to prevent a reduction in component mounting yield and damage to electronic components.
Further, if the non-adhesive region is formed by performing dry etching by plasma discharge on the region where the non-adhesive region of the adhesive layer is to be formed, the non-adhesive region can be formed in a relatively short time compared to other methods. Further, the non-adhesive region can be finely processed, the etching control can be facilitated, the etching rate can be increased, and the manufacturing cost can be reduced.

  Hereinafter, a preferred embodiment of an electronic component holder according to the present invention will be described with reference to the drawings. The electronic component holder in the present embodiment is mounted on a heat-resistant base board 1 as shown in FIGS. A plurality of adhesive regions 4 for laminating a plurality of flexible printed circuit boards 10 in a detachable manner on the surface which is the upper surface of the adhesive layer 3, and a plurality of adhesive regions 4. A non-adhesive region 5 that is formed in a region other than the adhesive region 4 and has no weak adhesive property is formed so that a step is not generated between the plurality of adhesive regions 4 and the non-adhesive region 5.

  The base board 1 is formed into a flat rectangular plate using a predetermined material such as metal, plastic, ceramic, etc., and has a size that does not hinder fixing and transport by an operator. In view of securing rigidity and preventing excessive weight increase, the thickness is set to 0.3 to 5.0 mm.

  Examples of the metal material of the base board 1 include flat SUS, aluminum, iron, copper, and the like, and examples of the plastic material include heat-resistant glass epoxy, polyether sulfone, polyether ketone, polyether imide, and polyether. Examples thereof include sulfide, polyarylate, and polyimide. Examples of the ceramic material for the base board 1 include alumina, sialon, zirconia, aluminum nitride, silicon nitride, silicon carbide, and titanium nitride.

  The pressure-sensitive adhesive layer 3 is molded into a substantially cross-sectional shape with a flat cross section using a predetermined elastic elastomer, and has a rubber hardness of 5 to 60 Hs (JIS A). Examples of the material of the elastic adhesive layer 3 include silicone rubber, fluorine rubber, urethane elastomer, natural rubber, and cyclopentadiene rubber. Since the adhesive layer 3 is required to be able to withstand the solder reflow temperature at the time of mounting an electronic component, when the material is a silicone rubber, a polyimide silicone rubber is preferable, and a fluorinated polyether skeleton having a curable functional group is used. A fluorine-based elastomer may be used.

  The rubber hardness of the pressure-sensitive adhesive layer 3 is in the range of 5 to 60 Hs because the mechanical strength of the pressure-sensitive adhesive layer 3 is insufficient and the durability is deteriorated when the rubber hardness is less than 5 Hs. Conversely, when the rubber hardness exceeds 60 Hs, the adhesive strength of the adhesive layer 3 is reduced and the flexible printed circuit board 10 cannot be sufficiently adhered and held.

  The pressure-sensitive adhesive layer 3 is laminated on the surface of the base board 1. As this lamination method, for example, a curable composition is applied to the base board 1 by a screen printing method, a dip method, a doctor blade method, a knife coating method, a bar coating method. A method of applying and curing by a coating method, a spin coating method or the like is employed.

  As shown in FIG. 1, the plurality of adhesive regions 4 are arranged side by side on the surface excluding the peripheral portion of the adhesive layer 3, and the adhesive regions 4 and the adhesive regions 4 are separated from each other at a predetermined interval. The adhesive region 4 corresponds to the size and shape of the flexible printed circuit board 10. It should be noted that the adhesive strength of each adhesive region 4 (which is also the adhesive strength of the adhesive layer 3) depends greatly on the surface state of the adhesive region 4. That is, the adhesive strength of the adhesive region 4 increases when the surface of the adhesive region 4 is smooth and glossy, and decreases when the surface is rough. Therefore, in order to ensure the uniformity of the adhesive force, it is important to keep the surface state of the adhesive region 4 uniform.

  As shown in FIG. 1, the non-adhesive region 5 is formed by applying a predetermined treatment to the region where the non-adhesive region 5 of the adhesive layer 3 is to be formed, and each flexible print is formed according to the shape of the flexible printed circuit board 10. While surrounding the board | substrate 10, the area | regions other than the external shape of this flexible printed circuit board 10 are included. Specifically, the non-adhesive region 5 is formed by performing dry etching or the like by plasma discharge between the peripheral edge portion of the adhesive layer 3 and the plurality of adhesive regions 4. The non-adhesive region 5 is formed with a depth in the range of 0.05 to 1 μm when dry etching is performed by plasma discharge.

In the above, when manufacturing an electronic component holder, first, a silicone rubber compound is dispensed to a predetermined thickness by a calender roll, and the silicone rubber compound is heated and cured to form the adhesive layer 3.
In addition to the operation of forming the pressure-sensitive adhesive layer 3, a liquid silicone rubber is screen-printed on the surface of the base board 1 having a predetermined thickness to form an uncured adhesive layer 2, and this uncured adhesive layer The adhesive layer 3 that has already been formed on the substrate 2 is attached (see FIG. 2) and heated and pressed to integrate the base board 1 and the adhesive layer 3 together.

  When the base board 1 and the adhesive layer 3 are thus integrated, the pattern mask 11 is overlaid on the adhesive region 4 of the adhesive layer 3 to expose the region where the non-adhesive region 5 of the adhesive layer 3 is to be formed (see FIG. 3). If the non-adhesive region 5 that does not have weak adhesiveness is formed by subjecting the region where the non-adhesive region 5 is to be formed to a dry etching process by plasma discharge, an electronic component holder can be manufactured. In the dry etching process by plasma discharge, for example, a plasma cleaning apparatus or a plasma etching apparatus that can be easily controlled and can be finely processed can be used.

  According to the above configuration, the surface of the adhesive layer 3 is partitioned into a plurality of adhesive regions 4 and non-adhesive regions 5, and the non-adhesive regions 5 include regions other than the outer shape of the flexible printed circuit board 10. When the cream solder is printed on the metal mask 10 using the metal mask, the metal mask does not adhere to the non-adhesive region 5 to cause printing failure. In addition, since it is not necessary to divide the predetermined region of the adhesive layer 3 into a plurality of parts or to divide and arrange them in an island shape, it is not necessary to design and produce a plate individually according to the flexible printed circuit board 10. The lead time can be shortened without incurring high.

  Moreover, since the adhesion area | region 4 and the non-adhesion area | region 5 of the adhesion layer 3 are substantially continuous, and there is almost no level | step difference between these, the yield fall of electronic component mounting can be suppressed and prevented. In addition, since there are almost no areas with partially different thicknesses relative to the flexible printed circuit board 10 having poor rigidity, there is no possibility that the flexible printed circuit board 10 will be broken or damaged when electronic components are mounted. Furthermore, since the non-adhesive region 5 is formed by dry etching treatment using plasma discharge, the non-adhesive region 5 can be formed in a short time and at a lower cost than in the case of using other processing methods. The prevention of deterioration is greatly expected.

  Next, FIG. 4 shows a second embodiment of the present invention. In this case, when the base board 1 and the adhesive layer 3 are integrated, the pattern mask 11 is overlaid on the adhesive region 4 of the adhesive layer 3. Then, the non-adhesive region 5 formation exposure region is exposed, and then the non-adhesion region 5 formation target region is irradiated with UV light 13 by the ultraviolet irradiation device 12 to be surface-modified, and the non-adhesion region having no weak adhesion By forming 5, an electronic component holder is manufactured. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the non-adhesive region 5 is formed by irradiating the UV light 13 to the region where the non-adhesive region 5 is to be formed to modify the surface. Obviously, the non-adhesive regions 5 having various shapes can be formed very easily.

  In the above-described embodiment, the flat base board 1 is simply shown. However, the present invention is not limited to this. For example, a plurality of alignment pins for the flexible printed circuit board 10 penetrating the adhesive layer 3 on the base board 1. Or an avoidance hole for the flexible printed circuit board 10 may be provided. In addition, as a method of laminating the adhesive layer 3 on the base board 1, a method is adopted in which a curable composition is formed into a film by a calendar device, an extrusion device, and a press device, and this is adhered to the surface of the base board 1. Also good. Furthermore, although the non-adhesion area | region 5 may be formed linearly in the formation plan area | region of the non-adhesion area | region 5, it can also be formed in a dot shape etc.

Hereinafter, although the Example of the manufacturing method of the electronic component holder which concerns on this invention is described, the manufacturing method of the electronic component holder which concerns on this invention is not limited to a following example at all.
First, a silicone rubber compound [manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1510U] is dispensed to a thickness of 0.2 mm by a calender roll, and the silicone rubber compound is heated and cured to have a thickness of 0.2 mm. A layer was formed.

  Separately from the above work, a liquid silicone rubber (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KE-1800) is screen-printed to a thickness of 0.02 mm on the surface of the base board to form an uncured adhesive layer, The pressure-sensitive adhesive layer was adhered onto the uncured adhesive layer and heated and pressed to integrate the base board and the pressure-sensitive adhesive layer. As the base board, an aluminum plate having a thickness of 0.8 mm was used.

  Next, a pattern mask is partially overlapped on the surface of the adhesive layer to expose a region where the non-adhesive region of the adhesive layer is to be formed, and a dry etching process using plasma discharge is applied to the region where the non-adhesive region is to be formed to form the non-adhesive region. By forming, an electronic component holder could be manufactured in a short time. In the dry etching process, a plasma cleaning apparatus using a reactive gas plasma under reduced pressure (manufactured by Hitachi High-Tech Co., Ltd .: trade name SPC-100) was used, and the RIE = Reactive long Etching method (ion) was adopted.

  Dry etching was performed under the conditions of a degree of vacuum of 20 Pa, an Ar amount of 5 cc / min, and a discharge output of RF 600 W. The etching grade was 0.25 μm / min, and a non-adhesive region was formed by etching about 0.5 μm by discharge for 2 minutes.

It is a perspective explanatory view showing typically an embodiment of an electronic component holder concerning the present invention. It is explanatory drawing which shows typically the state which adheres an adhesion layer to the contact bonding layer in embodiment of the manufacturing method of the electronic component holder which concerns on this invention. It is explanatory drawing which shows typically the state which accumulated the pattern mask on the adhesion area | region of the adhesion layer in embodiment of the manufacturing method of the electronic component holder which concerns on this invention. It is explanatory drawing which shows typically 2nd Embodiment of the electronic component holder which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base board 2 Adhesive layer 3 Adhesive layer 4 Adhesive area 5 Non-adhesive area 10 Flexible printed circuit board (electronic component)
11 Pattern mask 12 UV irradiation device 13 UV light

Claims (3)

An electronic component holder for laminating an adhesive layer on a base board and detachably holding an electronic component on the surface of the adhesive layer,
An electronic component holder characterized in that the surface of the adhesive layer is formed from an adhesive region to which an electronic component is detachably adhered and a non-adhesive region formed in at least a part other than the adhesive region.   The electronic component holder according to claim 1, wherein the non-adhesive region is formed by performing dry etching by plasma discharge on a region where the non-adhesive region of the adhesive layer is to be formed.   The method for manufacturing an electronic component holder according to claim 1 or 2, wherein an adhesive layer is laminated on the base board, and a surface of the adhesive layer is partially masked to expose a region where a non-adhesive region is to be formed, A method for manufacturing an electronic component holder, wherein the non-adhesive region is formed by performing dry etching by plasma discharge on a region where the non-adhesive region is to be formed.

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