CN114286515A

CN114286515A - Method for increasing power supply area of circuit board

Info

Publication number: CN114286515A
Application number: CN202111338621.7A
Authority: CN
Inventors: 乔·地克森
Original assignee: Wus Printed Circuit Co Ltd
Current assignee: Wus Printed Circuit Co Ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-04-05

Abstract

The invention discloses a method for increasing the power supply area of a circuit board, which comprises the following steps: drilling holes in the copper foil for the reverse welding disc, and simultaneously drilling positioning holes; sticking ABF glue on the rough surface of the copper foil; coating high-temperature-resistant adhesive liquid on four sides of the upper surface of the copper foil with the ABF adhesive, and covering an aluminum sheet on the surface of the copper foil after coating; pressing the copper foil and the prepreg into a copper-clad plate, and removing an aluminum sheet after pressing; the copper-clad plate is exposed, developed and etched according to the positioning hole, and other inner layer patterns are simultaneously manufactured; pressing the copper-clad plate after brown oxidation with a prepreg to form a circuit board; according to the invention, the anti-pad is drilled on the copper foil by adopting a drilling method, the side cutting surface of the drilled hole is vertical, the side corrosion problem can be avoided by adopting the drilling method, the power supply area is increased, and the single-layer current can be improved by 24%.

Description

Method for increasing power supply area of circuit board

Technical Field

The invention relates to a method for increasing the power supply area of a circuit board, and belongs to the technical field of PCB (printed circuit board) via holes.

Background

At present, the actual power supply area of a circuit board is reduced by about 1/3 compared with the designed power supply area due to the lateral erosion problem of the reverse pad of the power supply layer, the current difference between the actual power supply area and the designed power supply area occurs, the difference needs to be compensated by increasing the thickness of copper foil, and the increase of the thickness of the copper foil means the increase of the cost.

Disclosure of Invention

The invention aims to provide a method for increasing the power supply area of a circuit board, which aims to solve the defects that the actual power supply area of the circuit board is about 1/3 less than the designed power supply area and the current difference between the actual power supply area and the designed power supply area is caused by the lateral erosion problem in the prior art.

A method of increasing the power supply area of a wiring board, the method comprising the steps of:

drilling holes in the copper foil for the reverse welding disc, and simultaneously drilling positioning holes;

sticking ABF glue on the rough surface of the copper foil;

coating high-temperature-resistant adhesive liquid on four sides of the upper surface of the copper foil with the ABF adhesive, and covering an aluminum sheet on the surface of the copper foil after coating;

pressing the copper foil and the prepreg into a copper-clad plate, and removing an aluminum sheet after pressing;

the copper-clad plate is exposed, developed and etched according to the positioning hole, and other inner layer patterns are simultaneously manufactured;

and pressing the copper-clad plate after brown oxidation with a prepreg to form the circuit board.

Further, the method for pasting the ABF glue on the rough surface of the copper foil comprises the following steps: etching the copper foil, and then pasting ABF glue on the rough surface of the copper foil.

Further, the thickness of ABF glue is 2-5 um.

Further, the ABF rubberizing adopts the mode rubberizing of roll-to-roll.

Further, the drilling adopts a CCD mode.

Further, the coating thickness of the high-temperature glue liquid is 0.5 mm.

Compared with the prior art, the invention has the following beneficial effects: according to the invention, the anti-pad is drilled on the copper foil by adopting a drilling method, the side cutting surface of the drilled hole is vertical, the side corrosion problem can be avoided by adopting the drilling method, the power supply area is increased, and the single-layer current can be improved by 24%.

Drawings

FIG. 1 is a schematic view of the present invention drilling holes in a copper foil at a reverse pad location;

FIG. 2 is a schematic view of the ABF adhesive patch of the present invention;

FIG. 3 is a schematic view of the high temperature resistant glue coating of the present invention;

FIG. 4 is a schematic diagram of a copper-clad plate according to the present invention;

FIG. 5 is a schematic view showing the exposure, development and etching of the copper-clad plate of the present invention;

FIG. 6 is a schematic diagram illustrating the exposure, development and etching of the inner layer pattern according to the present invention;

FIG. 7 is a schematic view of a circuit board according to the present invention;

fig. 8 is a schematic view of anti pad of the present invention.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

Example 1

As shown in fig. 1-7, a method for increasing the power supply area of a circuit board is disclosed, which comprises the following steps:

step one, as shown in figure 1, drilling holes on the copper foil at the positions of the reversed welding discs in a mechanical drilling mode by using a CCD mode, and simultaneously drilling positioning holes;

step two, as shown in fig. 2, adhering ABF glue on the rough surface of the copper foil in a roll-to-roll mode after etching, and cutting the copper foil into pieces with designed sizes, wherein the thickness of the ABF glue is 2-5 um;

step three, as shown in fig. 3, coating high-temperature-resistant glue liquid on four sides of the upper surface of the copper foil pasted with the ABF glue, wherein the span is 0.5mm, and covering the aluminum sheet on the surface of the copper foil after coating;

step four, as shown in fig. 4, the copper foil in the step 3 and a prepreg required by design are pressed into a copper-clad plate, and an aluminum sheet is removed after pressing;

step five, developing and etching the copper-clad plate obtained in the step 4 according to the exposure of the positioning hole, but exposing all the anti-pad positions without etching;

sixthly, simultaneously manufacturing other inner layer patterns and the fifth step;

step seven, pressing the copper-clad plates obtained in the step 5 and the step 6 after browning with a prepreg to form a circuit board;

the other steps are consistent with the PCB processing flow. Drilling, PTH plating, outer layer patterning, printing of green oil, etc

Example 2

A method for increasing the power supply area of a circuit board is disclosed, which comprises the following steps:

step one, as shown in fig. 5, drilling holes on the copper foil at the positions of the reversed pads in a mechanical drilling mode by using a CCD mode, and simultaneously drilling positioning holes;

step two, as shown in fig. 6, after etching, adhering ABF glue on the rough surface of the copper foil in a roll-to-roll manner, and cutting the copper foil into a sheet body with a designed size;

step three, as shown in fig. 7, the copper foil in the step 2 is attached to a photomask of a copper-clad plate without the copper foil;

and step four, pasting a dry film on the copper-clad plate obtained in the step three according to the position of the positioning hole, exposing, developing and etching, but exposing all the positions of the reverse welding disc without etching.

Fifthly, other inner layer patterns are manufactured simultaneously with the fourth step;

and step six, pressing the copper-clad plates in the fourth step and the fifth step after browning with a prepreg to form the circuit board.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. A method for increasing the power supply area of a circuit board is characterized by comprising the following steps:

sticking ABF glue on the rough surface of the copper foil;

2. The method for increasing the power supply area of the circuit board according to claim 1, wherein the method for pasting the ABF glue on the rough surface of the copper foil comprises the following steps: etching the copper foil, and then pasting ABF glue on the rough surface of the copper foil.

3. The method for increasing the power supply area of the circuit board according to claim 2, wherein the thickness of the ABF glue is 2-5 um.

4. The method for increasing the power supply area of the circuit board according to claim 2, wherein the ABF tape is applied in a roll-to-roll manner.

5. The method for increasing the power supply area of the circuit board according to claim 4, wherein the drilling is carried out in a CCD mode.

6. The method for increasing the power supply area of the circuit board according to claim 1, wherein the high-temperature glue liquid is applied to a thickness of 0.5 mm.