CN109587953A - Thick copper copper base borrosion hole technique - Google Patents
Thick copper copper base borrosion hole technique Download PDFInfo
- Publication number
- CN109587953A CN109587953A CN201811515477.8A CN201811515477A CN109587953A CN 109587953 A CN109587953 A CN 109587953A CN 201811515477 A CN201811515477 A CN 201811515477A CN 109587953 A CN109587953 A CN 109587953A
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- CN
- China
- Prior art keywords
- copper
- thick
- copper base
- thick copper
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention discloses a kind of thick copper copper base borrosion hole technique, includes following steps: (1) sawing sheet；(2) nog plate: nog plate is carried out to thick copper copper base, to properly increase the roughness of the plate face of thick copper copper base, while cleaning plate face；(3) etching resisting ink or dry film pad pasting: are attached in the plate face of thick copper copper base；(4) it exposes；(5) develop；(6) it etches: using acid etching liquid medicine and exposed thick copper copper base redox reaction, the thick copper copper base corruption of through hole being etched away, to obtain the through-hole of accurate various shape；(7) film is taken off.By attaching etching resisting ink or dry film on thick copper copper base, various required via hole images are preset on etching resisting ink or dry film, and in such a way that copper is removed in etching, reach the through-hole for processing various shape, instead of the machining mode of tradition drilled out using drilling machine+brill nozzle, processing cost is greatly reduced, and improves production efficiency and the quality of production.
Description
Technical field
The present invention relates to PCB to manufacture field technology, refers in particular to a kind of thick copper copper base borrosion hole technique.
Background technique
In pcb board during manufacturing, it is often necessary to carry out aperture to thick copper copper base.At present in thick copper copper base
Upper processing circular through hole, used mode are to be drilled out using drilling machine+brill nozzle, and such process costs are too high, and cause resource
Waste.Copper base is thicker simultaneously, and precision is poorer.If to use drilling machine+brill in processing profiled through-hole on thick copper copper base
The mode of nozzle is also more difficult to realize, and not can guarantee pass and hole position accuracy.On therefore, it is necessary to study a kind of schemes to solve
State problem.
Summary of the invention
In view of this, in view of the deficiencies of the prior art, the present invention aims to provide a kind of thick copper copper bases
Borrosion hole technique can effectively solve high existing thickness copper copper base aperture processing cost, low precision and processing profiled can not lead to
The problem of hole.
To achieve the above object, the present invention is using following technical solution:
A kind of thickness copper copper base borrosion hole technique, includes following steps:
(1) sawing sheet: the copper-based board size of thick copper is cut by product demand；
(2) nog plate: nog plate is carried out to thick copper copper base and is cleaned simultaneously with properly increasing the roughness of the plate face of thick copper copper base
Plate face；
(3) etching resisting ink or dry film pad pasting: are attached in the plate face of thick copper copper base；
(4) it exposes: using through-hole image egative film by Exposure mode, image being transferred on etching resisting ink or dry film；
(5) develop: by utilizing Na2CO3Alkalescent liquid medicine is reacted with unexposed etching resisting ink or dry film, against corrosion by what is be not required to
Layer dissolution removal exposes thick copper copper base to be etched；
(6) it etches: using acid etching liquid medicine and exposed thick copper copper base redox reaction, the thick copper of through hole is copper-based
Plate corruption etches away, to obtain the through-hole of accurate various shape；
(7) take off film: using NaOH strong basicity liquid medicine by etching resisting ink or dry film dissolution strip, thus obtain processed it is various
The thick copper copper base of shape.
As a preferred embodiment, it is etched several times in the step (6) according to the copper-based plate thickness of thick copper, thick copper copper base
Thicker, etching number is more, until reaching aperture requirement.
As a preferred embodiment, in the step (4), aperture suitably reduces 2-3mil when the engineering film makes, to
Compensation etching lateral erosion.
The present invention has obvious advantages and beneficial effects compared with the existing technology, specifically, by above-mentioned technical proposal
Known to:
By attaching etching resisting ink or dry film on thick copper copper base, preset on etching resisting ink or dry film various required logical
Hole pattern, and in such a way that copper is removed in etching, reach the through-hole for processing various shape, uses drilling machine+brill instead of tradition
The machining mode that nozzle drills out, greatly reduces processing cost, and improve production efficiency and the quality of production.
Detailed description of the invention
Fig. 1 is the process flow diagram of the preferred embodiments of the invention；
Fig. 2 is the main view of the preferred embodiments of the invention product processing；
Fig. 3 is the sectional view of the preferred embodiments of the invention product processing.
Description of drawing identification:
10, thick copper copper base 11, through-hole
20, etching resisting ink or dry film 21, through-hole
30, through-hole image egative film.
Specific embodiment
Present invention discloses a kind of thick copper copper base borrosion hole techniques, include following steps:
(1) sawing sheet: thick 10 size of copper copper base is cut by product demand.
(2) nog plate: carrying out nog plate to thick copper copper base 10, to properly increase the roughness of the plate face of thick copper copper base 10,
Plate face is cleaned simultaneously.In the present embodiment, during nog plate, control polishing scratch size is 12-16mm, and the volcanic ash quality of use is dense
Degree is 15-25%, and temperature is controlled at 80-90 DEG C, and speed control is in 2.0-2.5m/min.
(3) etching resisting ink or dry film 20 pad pasting: are attached in the plate face of thick copper copper base 10.In the present embodiment, pad pasting
It is carried out in the case where temperature is 110-130 DEG C of environment, speed control is in 1.2-1.4m/min.
(4) it exposes: using through-hole image egative film 30 by Exposure mode, image being transferred on etching resisting ink or dry film.
Aperture suitably reduces 2-3mil when the engineering film production that exposure uses, and to compensate etching lateral erosion, and exposure energy controls
At 7-9 grades.
(5) develop: by utilizing Na2CO3Alkalescent liquid medicine is reacted with unexposed etching resisting ink or dry film 20, will be not required to
Resist layer dissolve removal, expose thick copper copper base 10 to be etched.In the present embodiment, be developed under 28-32 DEG C of environment into
Capable, speed control is in 2.7-2.9m/min, or is subject to develop and put, the Na of use2CO3Mass concentration is 0.8-1.2%.
(6) it etches: using acid etching liquid medicine and exposed thick 10 redox reaction of copper copper base, at through-hole 21
Thick 10 corruption of copper copper base etches away, to obtain the through-hole 11 of accurate various shape.It is more according to thick 10 thickness of copper copper base point
Secondary etching, thick copper copper base 10 is thicker, and etching number is more, until reaching aperture requirement.In the present embodiment, it is etched in 45-
It is carried out under 55 DEG C of environment, etching speed control is 1.29-1.31, copper ion (Cu in 0.9-1.1m/min, the specific gravity of etching2+) be
110-170g/l, hydrochloric acid acid equivalent are 2.0-3.0N, the oxidant (Na of use2O2) mass content be 20-30 parts.
(7) it takes off film: being stripped etching resisting ink or dry film dissolution using NaOH strong basicity liquid medicine, to processed
Thickness copper copper base 10 of various shapes.In the present embodiment, the mass concentration of NaOH is 8-12%, the temperature of NaOH strong basicity liquid medicine
Degree is 45-55 DEG C.
Design focal point of the invention is: by attaching etching resisting ink or dry film on thick copper copper base, in etching resisting ink
Or preset on dry film it is various required for via hole images, and using etching remove copper by the way of, reach process various shape it is lead to
Hole greatly reduces processing cost, and improve production instead of the machining mode of tradition drilled out using drilling machine+brill nozzle
Efficiency and the quality of production.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore any subtle modifications, equivalent variations and modifications to the above embodiments according to the technical essence of the invention, still
Belong in the range of technical solution of the present invention.
Claims (3)
1. a kind of thickness copper copper base borrosion hole technique, it is characterised in that: include following steps:
(1) sawing sheet: the copper-based board size of thick copper is cut by product demand；
(2) nog plate: nog plate is carried out to thick copper copper base and is cleaned simultaneously with properly increasing the roughness of the plate face of thick copper copper base
Plate face；
(3) etching resisting ink or dry film pad pasting: are attached in the plate face of thick copper copper base；
(4) it exposes: using through-hole image egative film by Exposure mode, image being transferred on etching resisting ink or dry film；
(5) develop: by utilizing Na2CO3Alkalescent liquid medicine is reacted with unexposed etching resisting ink or dry film, against corrosion by what is be not required to
Layer dissolution removal exposes thick copper copper base to be etched；
(6) it etches: using acid etching liquid medicine and exposed thick copper copper base redox reaction, the thick copper of through hole is copper-based
Plate corruption etches away, to obtain the through-hole of accurate various shape；
(7) take off film: using NaOH strong basicity liquid medicine by etching resisting ink or dry film dissolution strip, thus obtain processed it is various
The thick copper copper base of shape.
2. thickness copper copper base borrosion hole technique according to claim 1, it is characterised in that: according to thick copper in the step (6)
Copper-based plate thickness etches several times, and thick copper copper base is thicker, and etching number is more, until reaching aperture requirement.
3. thickness copper copper base borrosion hole technique according to claim 1, it is characterised in that: in the step (4), the engineering film
Aperture suitably reduces 2-3mil when production, to compensate etching lateral erosion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811515477.8A CN109587953A (en) | 2018-12-12 | 2018-12-12 | Thick copper copper base borrosion hole technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811515477.8A CN109587953A (en) | 2018-12-12 | 2018-12-12 | Thick copper copper base borrosion hole technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109587953A true CN109587953A (en) | 2019-04-05 |
Family
ID=65929117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811515477.8A Pending CN109587953A (en) | 2018-12-12 | 2018-12-12 | Thick copper copper base borrosion hole technique |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856356A (en) * | 2019-11-15 | 2020-02-28 | 莆田市涵江区依吨多层电路有限公司 | Method for producing copper substrate based on resistance module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1159133A (en) * | 1996-01-18 | 1997-09-10 | 三星航空产业株式会社 | Manufacturing method of metal substrate for PCB (printed circuit board) |
| JP2005050980A (en) * | 2003-07-31 | 2005-02-24 | Ngk Spark Plug Co Ltd | Wiring board and its producing process |
| JP2005264283A (en) * | 2004-03-22 | 2005-09-29 | Toppan Printing Co Ltd | Metal etching product and its production method |
| CN1763943A (en) * | 2004-09-30 | 2006-04-26 | Tdk株式会社 | Wiring board and wiring board manufacturing method |
| CN106455345A (en) * | 2016-08-26 | 2017-02-22 | 遂宁市英创力电子科技有限公司 | Method of machining burr-free hole of PCB copper-based core board |
-
2018
- 2018-12-12 CN CN201811515477.8A patent/CN109587953A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1159133A (en) * | 1996-01-18 | 1997-09-10 | 三星航空产业株式会社 | Manufacturing method of metal substrate for PCB (printed circuit board) |
| JP2005050980A (en) * | 2003-07-31 | 2005-02-24 | Ngk Spark Plug Co Ltd | Wiring board and its producing process |
| JP2005264283A (en) * | 2004-03-22 | 2005-09-29 | Toppan Printing Co Ltd | Metal etching product and its production method |
| CN1763943A (en) * | 2004-09-30 | 2006-04-26 | Tdk株式会社 | Wiring board and wiring board manufacturing method |
| CN106455345A (en) * | 2016-08-26 | 2017-02-22 | 遂宁市英创力电子科技有限公司 | Method of machining burr-free hole of PCB copper-based core board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856356A (en) * | 2019-11-15 | 2020-02-28 | 莆田市涵江区依吨多层电路有限公司 | Method for producing copper substrate based on resistance module |
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Application publication date: 20190405 |