CN105934087B - Multiple-printed-panel for circuit board - Google Patents
Multiple-printed-panel for circuit board Download PDFInfo
- Publication number
- CN105934087B CN105934087B CN201610380394.7A CN201610380394A CN105934087B CN 105934087 B CN105934087 B CN 105934087B CN 201610380394 A CN201610380394 A CN 201610380394A CN 105934087 B CN105934087 B CN 105934087B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- section
- width
- segment
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention discloses a kind of multiple-printed-panel for circuit board, including at least one jigsaw unit, the jigsaw unit includes first circuit board, second circuit board, tertiary circuit plate and the 4th circuit board, the first circuit board is identical as the second circuit plate shape and is centrosymmetrically arranged, the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, the first circuit board and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate and the 4th circuit board are respectively formed the first gap and collectively form a rectangular outer profile between any two.The availability ratio of the armor plate of multiple-printed-panel for circuit board of the present invention is high.
Description
Technical field
The present invention relates to circuit board technology field more particularly to a kind of multiple-printed-panel for circuit board.
Background technology
With the update and improvement of surface mounting technology (Surface Mounted Technology, SMT) technological level,
Printed circuit board (Printed Circuit Board, PCB, also known as circuit board) designer is carrying out multiple-printed-panel for circuit board design
When, the working condition for fully taking into account product is needed, so that the product designed is met productibility requirement, to quickly launch
Market meets market and the needs of client.Meanwhile designer also needs to the utilization in view of plank when designing circuit board plate material
One of an important factor for rate, availability ratio of the armor plate is influence circuit board cost.
When doing board design, some veneers of Chang Yinwei are too small, it has not been convenient to cross stove (wave crest or reflow ovens) or cross surface
Mounting technology equipment, it is necessary to which jigsaw solves process issues.The process of multiple-printed-panel for circuit board be by the veneer of some small sizes,
Assembled arrangement becomes the process of a big circuit board plate material.
Current cell phone mainboard is usually arranged as C-shaped, carries out central symmetry splicings frequently with two pieces of cell phone mainboards when jigsaw.
But this jigsaw mode, the vacant plank between two pieces of cell phone mainboards cannot be fully used, and form a large amount of waste material, no
Conducive to cost-effective.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of multiple-printed-panel for circuit board that availability ratio of the armor plate is high.
To achieve the goals above, embodiment of the present invention adopts the following technical scheme that：
A kind of multiple-printed-panel for circuit board, including at least one jigsaw unit are provided, the jigsaw unit includes first circuit board,
Two circuit boards, tertiary circuit plate and the 4th circuit board, the first circuit board it is identical as the second circuit plate shape and in
The heart is arranged symmetrically, and the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, first circuit
Plate and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate and
4th circuit board is respectively formed the first gap and collectively forms a rectangular outer profile between any two.
Wherein, the first circuit board includes the first segment and second segment being connected, and the tertiary circuit plate includes being connected
The third section connect and the 4th section, the first segment, the second segment, the third section and the 4th section of rectangular, the institute
Stating second segment, there is the second width B2, the third section to have third width B3, meet：B2=B3.
Wherein, the first segment is parallel to described 4th section and perpendicular to the third section, and the second segment is parallel to institute
State third section and perpendicular to described 4th section.
Wherein, first gap has width T, and the first segment has the first length A1 and the first width B1, described
There is second segment the second length A2, the third section to have third length A3, and described 4th section has the 4th length A4 and the 4th
Width B4 meets：A2=B1+T, A3=B4+T, A1=A4.
Wherein, the width of a length of B1+A2+A3+B4+T of the outer profile, the outer profile are A1+T+B2.
Wherein, the first segment perpendicular to described 4th section and is parallel to the third section, and the second segment is perpendicular to institute
It states third section and is parallel to described 4th section.
Wherein, first gap has width T, and the first segment has the first length A1 and the first width B1, described
There is second segment the second length A2, the third section to have third length A3, and described 4th section has the 4th length A4 and the 4th
Width B4 meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+B2, A1 ≠ A4.
Wherein, the width of a length of B1+A2+A4+T of the outer profile, the outer profile are A1+T+B2.
Wherein, the first width B1 and the 4th width B4 meets：B1 ＞ B4.
Wherein, the quantity of the jigsaw unit is multiple, and second is formed between the adjacent jigsaw unit of any two
Gap, the width in second gap are equal with the width in the first gap.
Compared to the prior art, the invention has the advantages that：
Multiple-printed-panel for circuit board described in the embodiment of the present invention, due to first circuit board described in its, the second circuit board, described
Three-circuit plate and the 4th circuit board collectively form a rectangular outer profile, therefore the jigsaw unit is rectangular.
The characteristic easily spliced due to rectangle so that the availability ratio of the armor plate of the multiple-printed-panel for circuit board is high, waste material is few, and production cost is low.Meanwhile
Since the first circuit board is different from the tertiary circuit plate shape, foolproof function is also played so that concerned process steps are simple, high
Effect.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is a kind of jointing-board structure of circuit board schematic diagram provided in an embodiment of the present invention.
Fig. 2 is a kind of a kind of structural schematic diagram of jigsaw unit of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 3 is a kind of structural schematic diagram of another jigsaw unit of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 4 is a kind of structural schematic diagram of cell phone mainboard provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
In addition, the explanation of following embodiment is referred to the additional illustration, to illustrate the spy that the present invention can be used to implement
Determine embodiment.Direction terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner",
"outside", " side " etc. are only the directions with reference to annexed drawings, and therefore, the direction term used is to more preferably, more clearly say
It is bright and understand the present invention, rather than indicate or imply signified device or element must have a particular orientation, with specific side
Position construction and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Company ", shall be understood in a broad sense " connection " " on setting exists ... ", can also be removably to connect for example, it may be being fixedly connected
It connects, or is integrally connected；It can be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, it can understand above-mentioned term with concrete condition
Concrete meaning in the present invention.
In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.If this
The term for occurring " process " in specification, refers not only to independent process, when can not clearly be distinguished with other process, as long as
It can realize that the effect desired by the process is then also included in this term.In addition, the numerical value model indicated with "~" in this specification
It refers to the range that "~" front and back numerical value recorded is included as minimum value and maximum value to enclose.In the accompanying drawings, structure
Similar or identical unit is indicated by the same numeral.
Also referring to Fig. 1 to Fig. 3, the embodiment of the present invention provides a kind of multiple-printed-panel for circuit board 100, including at least one jigsaw
Unit 2, the jigsaw unit 2 include first circuit board 11, second circuit board 15, tertiary circuit plate 12 and the 4th circuit board
16, the first circuit board 11 is identical as 15 shape of the second circuit board and is centrosymmetrically arranged, the tertiary circuit plate 12
Identical as 16 shape of the 4th circuit board and be centrosymmetrically arranged, the first circuit board 11 and the tertiary circuit plate 12 are equal
It is L-shaped, the first circuit board 11, the second circuit board 15, the tertiary circuit plate 12 and the 4th circuit board
16 are respectively formed the first gap 17 and collectively form a rectangular outer profile 14 between any two.
In the present embodiment, due to the first circuit board 11, the second circuit board 15, the tertiary circuit plate 12 with
And the 4th circuit board 16 collectively forms a rectangular outer profile 14, therefore the jigsaw unit 2 is rectangular.Due to square
The characteristic that shape is easily spliced so that the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high, waste material is few, and production cost is low.Meanwhile by
It is different from 12 shape of tertiary circuit plate in the first circuit board 11, also play foolproof function so that concerned process steps are simple,
Efficiently.
It should be appreciated that first circuit board 11 described in the present embodiment and the tertiary circuit plate 12 are L-shaped, " L "
Two sides of shape are generally perpendicular to each other, and allow have a small amount of offset.
Further, also referring to Fig. 2 and Fig. 3, as a kind of alternative embodiment, the first circuit board 11 includes phase
The first segment 111 and second segment 112 of connection, the tertiary circuit plate 12 include the third section 121 being connected and the 4th section 122,
The first segment 111, the second segment 112, the third section 121 and the 4th section of 122 rectangular, the second segment
112 there is the second width B2, the third section 121 to have third width B3, meet：B2=B3.At this point, due to the second segment
112 is equal with the width of the third section 121, so when needing connection, connection difficulty is small.
Also referring to Fig. 1 and Fig. 2, as a kind of preferred embodiment, the first segment 111 is parallel to described 4th section
122 and perpendicular to the third section 121, the second segment 112 is parallel to the third section 121 and perpendicular to described 4th section
122。
Preferably, there is width T, the first segment 111 to have the first length A1 and the first width in first gap 17
There is the second length A2, the third section 121 to have third length A3 for B1, the second segment 112, and described 4th section 122 has
4th length A4 and the 4th width B4 meets：A2=B1+T, A3=B4+T, A1=A4.At this point, the first circuit board 11, institute
State second circuit board 15, the tertiary circuit plate 12 and the 4th circuit board 16 can collectively form one it is rectangular outer
Profile 14.That is, jigsaw unit 2 described in the present embodiment is rectangular, the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high, waste material
Area is small, at low cost.
In the present embodiment, the width of a length of B1+A2+A3+B4+T of the outer profile 14, the outer profile 14 are A1+T+
B2。
Also referring to Fig. 1 and Fig. 3, as another preferred embodiment, the first segment 111 is perpendicular to described 4th section
122 and it is parallel to the third section 121, the second segment 112 is perpendicular to the third section 121 and is parallel to described 4th section
122。
Preferably, there is width T, the first segment 111 to have the first length A1 and the first width in first gap 17
There is the second length A2, the third section 121 to have third length A3 for B1, the second segment 112, and described 4th section 122 has
4th length A4 and the 4th width B4 meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+B2, A1 ≠ A4.At this point,
The first circuit board 11, the second circuit board 15, the tertiary circuit plate 12 and the 4th circuit board 16 can be total to
With one rectangular outer profile 14 of composition.That is, jigsaw unit 2 described in the present embodiment is rectangular, the multiple-printed-panel for circuit board 100
Availability ratio of the armor plate it is high, waste material area is small, at low cost.
In the present embodiment, the width of a length of B1+A2+A4+T of the outer profile 14, the outer profile 14 are A1+T+B2.
Further, also referring to Fig. 2 and Fig. 3, as a kind of alternative embodiment, the first width B1 and described
Four width B4 meet：B1 ＞ B4.So that the first segment 111 and described 4th section 122 can be used for carrying different device and line
Road, application are more diversified.Meanwhile also functioning to foolproof function so that concerned process steps are simple, efficient.
Further, please refer to Fig.1 to Fig.3, as a kind of alternative embodiment, the quantity of the jigsaw unit 2 be it is multiple,
The second gap 18, the width in second gap 18 and described first are formed between the adjacent jigsaw unit 2 of any two
Gap 17 it is of same size, with brief process, reduce the cost.
Preferably, the jigsaw unit 2 is arranged in array, to improve the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100.
Further, also referring to Fig. 1 to Fig. 3, as a kind of alternative embodiment, the width in first gap 17
T is spent to meet：1.5mm≤T≤3mm, so that the first circuit board 11, the second circuit board 15, the tertiary circuit plate 12
And the 4th circuit board 16 is arranged progress that is compact, while facilitating subsequent technique again.
Preferably, the width T in first gap 17 meets：T=2mm.
It please refers to Fig.1 to Fig.4, the embodiment of the present invention also provides a kind of cell phone mainboard 1.The cell phone mainboard 1 includes being connected
The first circuit board and tertiary circuit plate connect.The first circuit board uses the first circuit board as described in above-mentioned any embodiment
11, the tertiary circuit plate uses the tertiary circuit plate 12 as described in above-mentioned any embodiment.
It should be understood that the first circuit board 11 (or described second circuit board 15) and institute as shown in Figures 2 and 3
1 (such as Fig. 4 of the cell phone mainboard of " C " shape can be collectively formed by stating tertiary circuit plate 12 (or described 4th circuit board 16)
It is shown).In other words, the jigsaw unit 2 can be spliced by two cell phone mainboards 1.
In the present embodiment, since two cell phone mainboards 1 can carry out rational joint, the circuit being spliced
The availability ratio of the armor plate of plate jigsaw 100 is high, waste material is few, thereby reduces the cost of the cell phone mainboard 1.
It should be appreciated that cell phone mainboard 1 described in the present embodiment can be " C " shape plate, Z-shaped plate, inverted " C " shape plate or anti-
Z-shaped plate.Preferably, cell phone mainboard 11 described in the present embodiment is " C " shape plate.Rational joint is difficult in compared with the existing technology
For integrated mobile phone mainboard 1, cell phone mainboard 1 described in the present embodiment due to may be used split after splice and two mobile phones
Mainboard 1 can be spliced into the connecting method of a complete rectangular, so utilization of the cell phone mainboard 1 to jigsaw plank described in the present embodiment
Rate is high, at low cost.
Further, referring to Fig. 4, the cell phone mainboard 1 further includes flexible PCB 13, it is connected to first circuit
Between plate 11 and the tertiary circuit plate 12.Flexible PCB 13 described in the present embodiment can not only realize connection function, simultaneously also
Since it compares the relatively thin characteristic of ordinary circuit board, the relatively high structure of the height such as SIM card holder, loud speaker can be carried on it
Part, so that more frivolous using the mobile phone of the cell phone mainboard 1.
The embodiment of the present invention is described in detail above, specific case used herein to the principle of the present invention and
Embodiment is expounded, and the explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention；
Meanwhile for those of ordinary skill in the art, according to the thought of the present invention, can in specific embodiments and applications
There is change place, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (4)
1. a kind of multiple-printed-panel for circuit board, which is characterized in that including at least one jigsaw unit, the jigsaw unit includes the first circuit
Plate, second circuit board, tertiary circuit plate and the 4th circuit board, the first circuit board are identical as the second circuit plate shape
And be centrosymmetrically arranged, the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, and described first
Circuit board and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate
And the 4th circuit board is respectively formed the first gap and collectively forms a rectangular outer profile between any two；
Wherein, the first circuit board includes the first segment and second segment being connected, and the tertiary circuit plate includes being connected
Third section and the 4th section, the first segment, the second segment, the third section and it is described 4th section it is rectangular, described
Two sections there is the second width B2, the third section to have third width B3, meet：B2=B3；Wherein, the first segment perpendicular to
Described 4th section and it is parallel to the third section, the second segment is perpendicular to the third section and is parallel to described 4th section；
Wherein, first gap has a width T, and the first segment has a first length A1 and the first width B1, and described second
There is section the second length A2, the third section to have third length A3, and described 4th section has the 4th length A4 and the 4th width
B4 meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+B2, A1 ≠ A4.
2. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that a length of B1+A2+A4+T of the outer profile, it is described
The width of outer profile is A1+T+B2.
3. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that the first width B1 and the 4th width B4 is full
Foot：B1 ＞ B4.
4. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that the quantity of the jigsaw unit be it is multiple, arbitrary two
The second gap, the width phase of the width in second gap and first gap are formed between a adjacent jigsaw unit
Deng.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744167.7A CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
| CN201610380394.7A CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380394.7A CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744167.7A Division CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105934087A CN105934087A (en) | 2016-09-07 |
| CN105934087B true CN105934087B (en) | 2018-09-04 |
Family
ID=56832136
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744167.7A Active CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
| CN201610380394.7A Expired - Fee Related CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744167.7A Active CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108925036B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2343059A (en) * | 1998-10-21 | 2000-04-26 | Jerseyfield Limited | A method for tracking printed circuit boards on multi-board panels through a production process |
| CN201204743Y (en) * | 2008-06-11 | 2009-03-04 | 苏州大展电路工业有限公司 | Typesetting structure for printed circuit board |
| TWM437023U (en) * | 2012-03-13 | 2012-09-01 | Zhen Ding Technology Co Ltd | Printed circuit board assembly having micro-interconnecting areas |
| CN202444694U (en) * | 2011-12-21 | 2012-09-19 | 青岛海信电器股份有限公司 | Pcb |
| CN203340425U (en) * | 2013-07-04 | 2013-12-11 | 上海市共进通信技术有限公司 | Material-saving PCB splicing structure |
| CN103997859A (en) * | 2014-06-03 | 2014-08-20 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
| CN204498464U (en) * | 2015-03-31 | 2015-07-22 | 广州兴森快捷电路科技有限公司 | A kind of split structure of PCB substrate |
| CN205051977U (en) * | 2015-10-16 | 2016-02-24 | 上海斐讯数据通信技术有限公司 | Prevent PCB makeup that board bent plate sticks up |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635023B (en) * | 2012-08-27 | 2016-08-24 | 富葵精密组件(深圳)有限公司 | The manufacture method of circuit board |
-
2016
- 2016-05-31 CN CN201810744167.7A patent/CN108925036B/en active Active
- 2016-05-31 CN CN201610380394.7A patent/CN105934087B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2343059A (en) * | 1998-10-21 | 2000-04-26 | Jerseyfield Limited | A method for tracking printed circuit boards on multi-board panels through a production process |
| CN201204743Y (en) * | 2008-06-11 | 2009-03-04 | 苏州大展电路工业有限公司 | Typesetting structure for printed circuit board |
| CN202444694U (en) * | 2011-12-21 | 2012-09-19 | 青岛海信电器股份有限公司 | Pcb |
| TWM437023U (en) * | 2012-03-13 | 2012-09-01 | Zhen Ding Technology Co Ltd | Printed circuit board assembly having micro-interconnecting areas |
| CN203340425U (en) * | 2013-07-04 | 2013-12-11 | 上海市共进通信技术有限公司 | Material-saving PCB splicing structure |
| CN103997859A (en) * | 2014-06-03 | 2014-08-20 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
| CN204498464U (en) * | 2015-03-31 | 2015-07-22 | 广州兴森快捷电路科技有限公司 | A kind of split structure of PCB substrate |
| CN205051977U (en) * | 2015-10-16 | 2016-02-24 | 上海斐讯数据通信技术有限公司 | Prevent PCB makeup that board bent plate sticks up |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105934087A (en) | 2016-09-07 |
| CN108925036A (en) | 2018-11-30 |
| CN108925036B (en) | 2020-03-17 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180904 |