CN108925036A - Multiple-printed-panel for circuit board - Google Patents
Multiple-printed-panel for circuit board Download PDFInfo
- Publication number
- CN108925036A CN108925036A CN201810744167.7A CN201810744167A CN108925036A CN 108925036 A CN108925036 A CN 108925036A CN 201810744167 A CN201810744167 A CN 201810744167A CN 108925036 A CN108925036 A CN 108925036A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- section
- width
- segment
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention discloses a kind of multiple-printed-panel for circuit board, including at least one jigsaw unit, the jigsaw unit includes first circuit board, second circuit board, tertiary circuit plate and the 4th circuit board, the first circuit board is identical as the second circuit plate shape and is centrosymmetrically arranged, the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, the first circuit board and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate and the 4th circuit board are respectively formed the first gap between any two and collectively form an outer profile in rectangle.The availability ratio of the armor plate of multiple-printed-panel for circuit board of the present invention is high.
Description
Technical field
The present invention relates to circuit board technology field more particularly to a kind of multiple-printed-panel for circuit board.
Background technique
With the update and improvement of surface mounting technology (Surface Mounted Technology, SMT) technological level,
Printed circuit board (Printed Circuit Board, PCB, also known as circuit board) designer is carrying out multiple-printed-panel for circuit board design
When, it needs to fully take into account the working condition of product, so that the product designed is met productibility requirement, to quickly launch
Market meets market and the needs of client.Meanwhile designer also needs the utilization in view of plate when designing circuit board plate material
One of an important factor for rate, availability ratio of the armor plate is influence circuit board cost.
When doing board design, some veneers of Chang Yinwei are too small, it has not been convenient to cross furnace (wave crest or reflow ovens) or cross surface
Mounting technology equipment, it is necessary to which jigsaw solves process issues.The process of multiple-printed-panel for circuit board be by the veneer of some small sizes,
Assembled arrangement becomes the process of a big circuit board plate material.
Current cell phone mainboard is usually arranged as C-shaped, carries out central symmetry splicings frequently with two pieces of cell phone mainboards when jigsaw.
But this jigsaw mode, the vacant plate between two pieces of cell phone mainboards cannot be fully utilized, and form a large amount of waste material, no
Conducive to save the cost.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of multiple-printed-panel for circuit board that availability ratio of the armor plate is high.
To achieve the goals above, embodiment of the present invention adopts the following technical scheme that：
A kind of multiple-printed-panel for circuit board, including at least one jigsaw unit are provided, the jigsaw unit includes first circuit board,
Two circuit boards, tertiary circuit plate and the 4th circuit board, the first circuit board it is identical as the second circuit plate shape and in
The heart is arranged symmetrically, and the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, first circuit
Plate and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate and
4th circuit board is respectively formed the first gap between any two and collectively forms an outer profile in rectangle.
Wherein, the first circuit board includes the first segment and second segment being connected, and the tertiary circuit plate includes being connected
The third section connect and the 4th section, the first segment, the second segment, the third section and described 4th section are in rectangle, institute
Second segment is stated with the second width B2, the third section has third width B3, meets：B2=B3.
Wherein, the first segment is parallel to described 4th section and perpendicular to the third section, and the second segment is parallel to institute
State third section and perpendicular to described 4th section.
Wherein, first gap has width T, and the first segment has the first length A1 and the first width B1, described
Second segment has the second length A2, and the third section has third length A3, and described 4th section has the 4th length A4 and the 4th
Width B4 meets：A2=B1+T, A3=B4+T, A1=A4.
Wherein, a length of B1+A2+A3+B4+T of the outer profile, the width of the outer profile are A1+T+B2.
Wherein, the first segment perpendicular to described 4th section and is parallel to the third section, and the second segment is perpendicular to institute
It states third section and is parallel to described 4th section.
Wherein, first gap has width T, and the first segment has the first length A1 and the first width B1, described
Second segment has the second length A2, and the third section has third length A3, and described 4th section has the 4th length A4 and the 4th
Width B4 meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+B2, A1 ≠ A4.
Wherein, a length of B1+A2+A4+T of the outer profile, the width of the outer profile are A1+T+B2.
Wherein, the first width B1 and the 4th width B4 meets：B1 > B4.
Wherein, the quantity of the jigsaw unit is multiple, forms second between the adjacent jigsaw unit of any two
Gap, the width in second gap are equal with the width in first gap.
Compared to the prior art, the invention has the advantages that：
Multiple-printed-panel for circuit board described in the embodiment of the present invention, due to first circuit board described in its, the second circuit board, described
Three-circuit plate and the 4th circuit board collectively form an outer profile in rectangle, therefore the jigsaw unit is in rectangle.
Due to the characteristic that rectangle easily splices, so that the availability ratio of the armor plate of the multiple-printed-panel for circuit board is high, waste material is few, production cost is low.Meanwhile
Since the first circuit board is different from the tertiary circuit plate shape, foolproof function is also played, so that concerned process steps are simple, high
Effect.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is a kind of jointing-board structure of circuit board schematic diagram provided in an embodiment of the present invention.
Fig. 2 is a kind of a kind of structural schematic diagram of jigsaw unit of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 3 is a kind of structural schematic diagram of another jigsaw unit of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 4 is a kind of structural schematic diagram of cell phone mainboard provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In addition, the explanation of following embodiment is referred to the additional illustration, the spy that can be used to implement to illustrate the present invention
Determine embodiment.Direction terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner",
"outside", " side " etc. are only the directions with reference to annexed drawings, and therefore, the direction term used is to more preferably, more clearly say
The bright and understanding present invention, rather than indicate or imply signified device or element and must have a particular orientation, with specific square
Position construction and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection ", " be arranged exist ... on " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to removably connect
It connects, or is integrally connected；It can be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.If this
Occur the term of " process " in specification, refers not only to independent process, when can not clearly be distinguished with other process, as long as
Effect desired by the process is able to achieve then to be also included in this term.In addition, the numerical value model indicated in this specification with "~"
Enclose the range for referring to that the numerical value for recording "~" front and back is included as minimum value and maximum value.In the accompanying drawings, structure
Similar or identical unit is indicated by the same numeral.
Also referring to Fig. 1 to Fig. 3, the embodiment of the present invention provides a kind of multiple-printed-panel for circuit board 100, including at least one jigsaw
Unit 2, the jigsaw unit 2 include first circuit board 11, second circuit board 15, tertiary circuit plate 12 and the 4th circuit board
16, the first circuit board 11 is identical as 15 shape of second circuit board and is centrosymmetrically arranged, the tertiary circuit plate 12
Identical as 16 shape of the 4th circuit board and be centrosymmetrically arranged, the first circuit board 11 and the tertiary circuit plate 12 are equal
It is L-shaped, the first circuit board 11, the second circuit board 15, the tertiary circuit plate 12 and the 4th circuit board
16 are respectively formed the first gap 17 between any two and collectively form an outer profile 14 in rectangle.
In the present embodiment, due to the first circuit board 11, the second circuit board 15, the tertiary circuit plate 12 with
And the 4th circuit board 16 collectively forms an outer profile 14 in rectangle, therefore the jigsaw unit 2 is in rectangle.Due to square
The characteristic that shape is easily spliced, so that the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high, waste material is few, production cost is low.Meanwhile by
It is different from 12 shape of tertiary circuit plate in the first circuit board 11, also play foolproof function so that concerned process steps it is simple,
Efficiently.
It should be appreciated that first circuit board 11 described in the present embodiment and the tertiary circuit plate 12 are L-shaped, " L "
Two sides of shape are generally perpendicular to each other, and allow to have a small amount of offset.
Further, referring to Figure 2 together and Fig. 3, as a kind of alternative embodiment, the first circuit board 11 includes phase
The first segment 111 and second segment 112 of connection, the tertiary circuit plate 12 include the third section 121 being connected and the 4th section 122,
The first segment 111, the second segment 112, the third section 121 and described 4th section 122 are in rectangle, the second segment
112 have the second width B2, and the third section 121 has third width B3, meet：B2=B3.At this point, due to the second segment
112 is equal with the width of the third section 121, so connection difficulty is small when needing to connect.
Also referring to Fig. 1 and Fig. 2, as a kind of preferred embodiment, the first segment 111 is parallel to described 4th section
122 and perpendicular to the third section 121, the second segment 112 is parallel to the third section 121 and perpendicular to described 4th section
122。
Preferably, first gap 17 has width T, and the first segment 111 has the first length A1 and the first width
B1, the second segment 112 have the second length A2, and the third section 121 has third length A3, and described 4th section 122 has
4th length A4 and the 4th width B4 meets：A2=B1+T, A3=B4+T, A1=A4.At this point, the first circuit board 11, institute
One can be collectively formed in the outer of rectangle by stating second circuit board 15, the tertiary circuit plate 12 and the 4th circuit board 16
Profile 14.That is, jigsaw unit 2 described in the present embodiment is in rectangle, the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high, waste material
Area is small, at low cost.
In the present embodiment, a length of B1+A2+A3+B4+T of the outer profile 14, the width of the outer profile 14 are A1+T+
B2。
Also referring to Fig. 1 and Fig. 3, as another preferred embodiment, the first segment 111 is perpendicular to described 4th section
122 and it is parallel to the third section 121, the second segment 112 is perpendicular to the third section 121 and is parallel to described 4th section
122。
Preferably, first gap 17 has width T, and the first segment 111 has the first length A1 and the first width
B1, the second segment 112 have the second length A2, and the third section 121 has third length A3, and described 4th section 122 has
4th length A4 and the 4th width B4 meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+B2, A1 ≠ A4.At this point,
The first circuit board 11, the second circuit board 15, the tertiary circuit plate 12 and the 4th circuit board 16 can be total to
It is in the outer profile 14 of rectangle with composition one.That is, jigsaw unit 2 described in the present embodiment is in rectangle, the multiple-printed-panel for circuit board 100
Availability ratio of the armor plate it is high, waste material area is small, at low cost.
In the present embodiment, a length of B1+A2+A4+T of the outer profile 14, the width of the outer profile 14 are A1+T+B2.
Further, referring to Figure 2 together and Fig. 3, as a kind of alternative embodiment, the first width B1 and described
Four width B4 meet：B1 > B4.So that the first segment 111 and described 4th section 122 can be used for carrying different device and line
Road, application are more diversified.Meanwhile foolproof function is also functioned to, so that concerned process steps are simple, efficient.
Further, please refer to Fig.1 to Fig.3, as a kind of alternative embodiment, the quantity of the jigsaw unit 2 be it is multiple,
The second gap 18, the width in second gap 18 and described first are formed between the adjacent jigsaw unit 2 of any two
Gap 17 it is of same size, with brief process, reduce the cost.
Preferably, the jigsaw unit 2 is arranged in array, to improve the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100.
Further, also referring to Fig. 1 to Fig. 3, as a kind of alternative embodiment, the width in first gap 17
T is spent to meet：1.5mm≤T≤3mm, so that the first circuit board 11, the second circuit board 15, the tertiary circuit plate 12
And the 4th circuit board 16 is arranged progress that is compact, while facilitating subsequent technique again.
Preferably, the width T in first gap 17 meets：T=2mm.
The embodiment of the present invention also provides a kind of cell phone mainboard 1 referring to FIG. 1 to FIG. 4,.The cell phone mainboard 1 includes being connected
The first circuit board and tertiary circuit plate connect.The first circuit board uses the first circuit board as described in above-mentioned any embodiment
11, the tertiary circuit plate uses the tertiary circuit plate 12 as described in above-mentioned any embodiment.
It should be understood that the first circuit board 11 (or described second circuit board 15) and institute as shown in Figures 2 and 3
1 (such as Fig. 4 of the cell phone mainboard of " C " shape can be collectively formed by stating tertiary circuit plate 12 (or described 4th circuit board 16)
It is shown).In other words, the jigsaw unit 2 can be spliced by two cell phone mainboards 1.
In the present embodiment, since two cell phone mainboards 1 are able to carry out rational joint, the circuit being spliced
The availability ratio of the armor plate of plate jigsaw 100 is high, waste material is few, thereby reduces the cost of the cell phone mainboard 1.
It should be appreciated that cell phone mainboard 1 described in the present embodiment can be " C " shape plate, Z-shaped plate, inverted " C " shape plate or anti-
Z-shaped plate.Preferably, cell phone mainboard 11 described in the present embodiment is " C " shape plate.Rational joint is difficult in compared with the existing technology
For integrated mobile phone mainboard 1, cell phone mainboard 1 described in the present embodiment due to can use split after splice and two mobile phones
Mainboard 1 can be spliced into the connecting method of a complete rectangular, so utilization of the cell phone mainboard 1 to jigsaw plate described in the present embodiment
Rate is high, at low cost.
Further, referring to Fig. 4, the cell phone mainboard 1 further includes flexible circuit board 13, it is connected to first circuit
Between plate 11 and the tertiary circuit plate 12.Flexible circuit board 13 described in the present embodiment can not only realize connection function, simultaneously also
Since it compares the relatively thin characteristic of ordinary circuit board, the relatively high structure of the height such as SIM card holder, loudspeaker can be carried on it
Part, so that more frivolous using the mobile phone of the cell phone mainboard 1.
The embodiment of the present invention has been described in detail above, specific case used herein to the principle of the present invention and
Embodiment is expounded, and the above description of the embodiment is only used to help understand the method for the present invention and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the present invention
There is change place, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (10)
1. a kind of multiple-printed-panel for circuit board, which is characterized in that including at least one jigsaw unit, the jigsaw unit includes the first circuit
Plate, second circuit board, tertiary circuit plate and the 4th circuit board, the first circuit board are identical as the second circuit plate shape
And be centrosymmetrically arranged, the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, and described first
Circuit board and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate
And the 4th circuit board is respectively formed the first gap between any two and collectively forms an outer profile in rectangle.
2. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that the first circuit board includes the first segment being connected
And second segment, the tertiary circuit plate include the third section being connected and the 4th section, it is the first segment, the second segment, described
Third section and it is described 4th section be in rectangle, the second segment have the second width B2, the third section have third width
B3 meets：B2=B3.
3. multiple-printed-panel for circuit board as claimed in claim 2, which is characterized in that the first segment is parallel to described 4th section and vertical
In the third section, the second segment is parallel to the third section and perpendicular to described 4th section.
4. multiple-printed-panel for circuit board as claimed in claim 3, which is characterized in that first gap has width T, the first segment
With the first length A1 and the first width B1, the second segment has the second length A2, and the third section has third length A3,
Described 4th section has the 4th length A4 and the 4th width B4, meets：A2=B1+T, A3=B4+T, A1=A4.
5. multiple-printed-panel for circuit board as claimed in claim 4, which is characterized in that a length of B1+A2+A3+B4+T of the outer profile, institute
The width for stating outer profile is A1+T+B2.
6. multiple-printed-panel for circuit board as claimed in claim 2, which is characterized in that the first segment is perpendicular to described 4th section and parallel
In the third section, the second segment is perpendicular to the third section and is parallel to described 4th section.
7. multiple-printed-panel for circuit board as claimed in claim 6, which is characterized in that first gap has width T, the first segment
With the first length A1 and the first width B1, the second segment has the second length A2, and the third section has third length A3,
Described 4th section has the 4th length A4 and the 4th width B4, meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+
B2, A1 ≠ A4.
8. multiple-printed-panel for circuit board as claimed in claim 7, which is characterized in that a length of B1+A2+A4+T of the outer profile, it is described
The width of outer profile is A1+T+B2.
9. the multiple-printed-panel for circuit board as described in claim 4 or 7, which is characterized in that the first width B1 and the 4th width
B4 meets：B1 > B4.
10. multiple-printed-panel for circuit board as claimed in any one of claims 1 to 9, which is characterized in that the quantity of the jigsaw unit is
It is multiple, the second gap, the width in second gap and described first are formed between the adjacent jigsaw unit of any two
The width in gap is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744167.7A CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380394.7A CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
| CN201810744167.7A CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610380394.7A Division CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108925036A true CN108925036A (en) | 2018-11-30 |
| CN108925036B CN108925036B (en) | 2020-03-17 |
Family
ID=56832136
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744167.7A Active CN108925036B (en) | 2016-05-31 | 2016-05-31 | Circuit board splicing board |
| CN201610380394.7A Expired - Fee Related CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610380394.7A Expired - Fee Related CN105934087B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108925036B (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2343059A (en) * | 1998-10-21 | 2000-04-26 | Jerseyfield Limited | A method for tracking printed circuit boards on multi-board panels through a production process |
| CN201204743Y (en) * | 2008-06-11 | 2009-03-04 | 苏州大展电路工业有限公司 | Typesetting structure for printed circuit board |
| CN202444694U (en) * | 2011-12-21 | 2012-09-19 | 青岛海信电器股份有限公司 | Pcb |
| CN202551496U (en) * | 2012-03-13 | 2012-11-21 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with micro connection structure |
| CN103635023B (en) * | 2012-08-27 | 2016-08-24 | 富葵精密组件(深圳)有限公司 | The manufacture method of circuit board |
| CN203340425U (en) * | 2013-07-04 | 2013-12-11 | 上海市共进通信技术有限公司 | Material-saving PCB splicing structure |
| CN103997859B (en) * | 2014-06-03 | 2017-02-15 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
| CN204498464U (en) * | 2015-03-31 | 2015-07-22 | 广州兴森快捷电路科技有限公司 | A kind of split structure of PCB substrate |
| CN205051977U (en) * | 2015-10-16 | 2016-02-24 | 上海斐讯数据通信技术有限公司 | Prevent PCB makeup that board bent plate sticks up |
-
2016
- 2016-05-31 CN CN201810744167.7A patent/CN108925036B/en active Active
- 2016-05-31 CN CN201610380394.7A patent/CN105934087B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105934087B (en) | 2018-09-04 |
| CN108925036B (en) | 2020-03-17 |
| CN105934087A (en) | 2016-09-07 |
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |
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