CN108925036A - Circuit board puzzle - Google Patents

Abstract

The invention discloses a circuit board jointed board, which comprises at least one jointed board unit, wherein the jointed board unit comprises a first circuit board, a second circuit board, a third circuit board and a fourth circuit board, the first circuit board and the second circuit board are identical in shape and are arranged in a central symmetry manner, the third circuit board and the fourth circuit board are identical in shape and are arranged in a central symmetry manner, the first circuit board and the third circuit board are both in an L shape, and first gaps are formed between every two of the first circuit board, the second circuit board, the third circuit board and the fourth circuit board and jointly form a rectangular outer contour.

Description

Circuit board puzzle

technical field

The invention relates to the technical field of circuit boards, in particular to a circuit board assembly.

Background technique

With the update and improvement of Surface Mounted Technology (SMT) process level, printed circuit board (Printed Circuit Board, PCB, also known as circuit board) designers need to fully consider when designing circuit boards. The production conditions of the products enable the designed products to meet the manufacturability requirements, so that they can be put on the market quickly to meet the needs of the market and customers. At the same time, designers also need to consider the utilization rate of the board when designing the board material. The board utilization rate is one of the important factors affecting the cost of the circuit board.

When doing circuit board design, often because some single boards are too small, it is not convenient to pass through the furnace (wave or reflow furnace) or surface mount technology equipment, so it is necessary to solve the processing technology problem by combining boards. The process of circuit board assembly is the process of combining and arranging some small-volume veneers into a large circuit board.

The current mobile phone motherboard is usually set in a C shape, and two mobile phone motherboards are often used for center-symmetrical splicing of the panel. However, in this jigsaw method, the vacant plates between the two mobile phone motherboards cannot be fully utilized, resulting in a large amount of waste, which is not conducive to cost saving.

Contents of the invention

The technical problem to be solved by the present invention is to provide a circuit board splicing board with high plate utilization rate.

In order to achieve the above object, the embodiment of the present invention adopts the following technical solutions:

Provide a circuit board puzzle, including at least one puzzle unit, the puzzle unit includes a first circuit board, a second circuit board, a third circuit board and a fourth circuit board, the first circuit board and the The second circuit board has the same shape and is arranged symmetrically to the center, the third circuit board is the same as the fourth circuit board and is arranged symmetrically to the center, and both the first circuit board and the third circuit board are in an "L" shape A first gap is formed between the first circuit board, the second circuit board, the third circuit board and the fourth circuit board and together form a rectangular outer contour.

Wherein, the first circuit board includes a connected first section and a second section, the third circuit board includes a connected third section and a fourth section, the first section, the second section, Both the third section and the fourth section are rectangular, the second section has a second width B2, and the third section has a third width B3, satisfying: B2=B3.

Wherein, the first segment is parallel to the fourth segment and perpendicular to the third segment, and the second segment is parallel to the third segment and perpendicular to the fourth segment.

Wherein, the first gap has a width T, the first section has a first length A1 and a first width B1, the second section has a second length A2, and the third section has a third length A3, so The fourth segment has a fourth length A4 and a fourth width B4, satisfying: A2=B1+T, A3=B4+T, A1=A4.

Wherein, the length of the outer contour is B1+A2+A3+B4+T, and the width of the outer contour is A1+T+B2.

Wherein, the first segment is perpendicular to the fourth segment and parallel to the third segment, and the second segment is perpendicular to the third segment and parallel to the fourth segment.

Wherein, the first gap has a width T, the first section has a first length A1 and a first width B1, the second section has a second length A2, and the third section has a third length A3, so The fourth segment has a fourth length A4 and a fourth width B4, satisfying: A2=B1+T, A4=2×B3+T, A3+2×B4=A1+B2, A1≠A4.

Wherein, the length of the outer contour is B1+A2+A4+T, and the width of the outer contour is A1+T+B2.

Wherein, the first width B1 and the fourth width B4 satisfy: B1>B4.

Wherein, the number of said jigsaw units is multiple, and a second gap is formed between any two adjacent said jigsaw units, and the width of said second gap is equal to the width of said first gap.

Compared with the prior art, the present invention has the following beneficial effects:

According to the circuit board assembly in the embodiment of the present invention, since the first circuit board, the second circuit board, the third circuit board and the fourth circuit board jointly form a rectangular outer contour, therefore The jigsaw unit is rectangular. Due to the feature of easy splicing of rectangles, the plate utilization rate of the circuit board assembly is high, waste is less, and the production cost is low. At the same time, because the shape of the first circuit board is different from that of the third circuit board, it also acts as a fool-proof function, making the related process simple and efficient.

Description of drawings

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings used in the implementation will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the present invention. As far as technical personnel are concerned, other drawings can also be obtained like these drawings without paying creative work.

FIG. 1 is a schematic diagram of a circuit board assembly structure provided by an embodiment of the present invention.

FIG. 2 is a schematic structural diagram of a panel unit of a circuit board panel provided by an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of another panel unit of a circuit board panel provided by an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a mobile phone motherboard provided by an embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for better and more clearly explaining and understanding the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, use a specific orientation construction and operation, therefore, should not be construed as limiting the invention.

In the description of the present invention, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", "connection", and "set on..." should be understood in a broad sense, for example, it can be A fixed connection can also be a detachable connection or an integral connection; it can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more. If the term "process" appears in this specification, it not only refers to an independent process, but also includes in this term as long as it can realize the expected function of the process when it cannot be clearly distinguished from other processes. In addition, the numerical range represented by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the drawings, units with similar or identical structures are denoted by the same reference numerals.

Please refer to FIG. 1 to FIG. 3 together. The embodiment of the present invention provides a circuit board assembly 100, which includes at least one assembly unit 2, and the assembly unit 2 includes a first circuit board 11, a second circuit board 15, The third circuit board 12 and the fourth circuit board 16, the first circuit board 11 and the second circuit board 15 have the same shape and are symmetrically arranged in the center, and the third circuit board 12 and the fourth circuit board 16 have the same shape. The same and centrally symmetrical arrangement, the first circuit board 11 and the third circuit board 12 are in the shape of "L", the first circuit board 11, the second circuit board 15, the third circuit board 12 and the fourth circuit board 16 form a first gap 17 between them and together form a rectangular outer contour 14 .

In this embodiment, since the first circuit board 11, the second circuit board 15, the third circuit board 12 and the fourth circuit board 16 jointly form a rectangular outer contour 14, the Described jigsaw unit 2 is rectangular. Due to the feature of easy splicing of rectangles, the circuit board assembly 100 has high plate utilization rate, less waste material and low production cost. At the same time, because the shapes of the first circuit board 11 and the third circuit board 12 are different, they also play a fool-proof role, making the related process simple and efficient.

It should be understood that, in this embodiment, both the first circuit board 11 and the third circuit board 12 are in an "L" shape, and the two sides of the "L" shape are approximately perpendicular to each other, allowing a small amount of offset.

Further, please refer to FIG. 2 and FIG. 3 together. As an optional embodiment, the first circuit board 11 includes a connected first section 111 and a second section 112, and the third circuit board 12 includes The connected third section 121 and fourth section 122, the first section 111, the second section 112, the third section 121 and the fourth section 122 are all rectangular, and the second section 112 Having a second width B2, the third section 121 has a third width B3, satisfying: B2=B3. At this time, since the width of the second section 112 and the third section 121 are equal, the connection is less difficult when it needs to be connected.

Please refer to FIG. 1 and FIG. 2 together. As a preferred embodiment, the first segment 111 is parallel to the fourth segment 122 and perpendicular to the third segment 121, and the second segment 112 is parallel to the The third segment 121 is perpendicular to the fourth segment 122 .

Preferably, the first gap 17 has a width T, the first segment 111 has a first length A1 and a first width B1, the second segment 112 has a second length A2, and the third segment 121 has a first Three lengths A3, the fourth section 122 has a fourth length A4 and a fourth width B4, satisfying: A2=B1+T, A3=B4+T, A1=A4. At this time, the first circuit board 11 , the second circuit board 15 , the third circuit board 12 and the fourth circuit board 16 can jointly form a rectangular outer contour 14 . That is to say, the panel unit 2 in this embodiment is rectangular, and the circuit board panel 100 has a high board utilization rate, a small waste area, and low cost.

In this embodiment, the length of the outer contour 14 is B1+A2+A3+B4+T, and the width of the outer contour 14 is A1+T+B2.

Please refer to FIG. 1 and FIG. 3 together. As another preferred embodiment, the first section 111 is perpendicular to the fourth section 122 and parallel to the third section 121, and the second section 112 is perpendicular to The third segment 121 is parallel to the fourth segment 122 .

Preferably, the first gap 17 has a width T, the first segment 111 has a first length A1 and a first width B1, the second segment 112 has a second length A2, and the third segment 121 has a first Three lengths A3, the fourth section 122 has a fourth length A4 and a fourth width B4, satisfying: A2=B1+T, A4=2×B3+T, A3+2×B4=A1+B2, A1≠A4 . At this time, the first circuit board 11 , the second circuit board 15 , the third circuit board 12 and the fourth circuit board 16 can jointly form a rectangular outer contour 14 . That is to say, the panel unit 2 in this embodiment is rectangular, and the circuit board panel 100 has a high board utilization rate, a small waste area, and low cost.

In this embodiment, the length of the outer contour 14 is B1+A2+A4+T, and the width of the outer contour 14 is A1+T+B2.

Further, please refer to FIG. 2 and FIG. 3 together. As an optional embodiment, the first width B1 and the fourth width B4 satisfy: B1>B4. The first segment 111 and the fourth segment 122 can be used to carry different devices and circuits, and the applications are more diverse. At the same time, it also plays a fool-proof role, making the related processes simple and efficient.

Further, referring to Fig. 1 to Fig. 3, as an optional embodiment, the number of said puzzle units 2 is multiple, and a second gap 18 is formed between any two adjacent said puzzle units 2 , the width of the second gap 18 is the same as the width of the first gap 17, so as to simplify the process and reduce the cost.

Preferably, the panel units 2 are arranged in an array, so as to improve the board utilization rate of the circuit board panel 100 .

Further, please refer to FIGS. 1 to 3 together. As an optional embodiment, the width T of the first gap 17 satisfies: 1.5mm≤T≤3mm, so that the first circuit board 11 , the second circuit board 15 , the third circuit board 12 and the fourth circuit board 16 are arranged compactly, and at the same time, it is convenient for subsequent processes.

Preferably, the width T of the first gap 17 satisfies: T=2mm.

Please refer to FIG. 1 to FIG. 4 , the embodiment of the present invention also provides a mobile phone motherboard 1 . The main board 1 of the mobile phone includes a first circuit board and a third circuit board which are connected. The first circuit board adopts the first circuit board 11 as described in any of the above embodiments, and the third circuit board adopts the third circuit board 12 as described in any of the above embodiments.

It can be understood that the first circuit board 11 (or the second circuit board 15) and the third circuit board 12 (or the fourth circuit board 16) shown in FIGS. 2 and 3 can be Together form a "C" shaped mobile phone motherboard 1 (as shown in Figure 4). In other words, the splicing unit 2 can be formed by splicing two mainboards 1 of the mobile phone.

In this embodiment, since the two mobile phone main boards 1 can be spliced reasonably, the spliced circuit board panel 100 has a high board utilization rate and less waste, thereby reducing the cost of the mobile phone main board 1 .

It should be understood that the main board 1 of the mobile phone in this embodiment can be a "C"-shaped board, a "Z"-shaped board, a reverse "C"-shaped board or a reversed "Z"-shaped board. Preferably, the main board 11 of the mobile phone in this embodiment is a "C" shaped board. Compared with the integrated mobile phone main board 1 that is difficult to splice reasonably in the prior art, the mobile phone main board 1 described in this embodiment can be spliced after splitting, and the two mobile phone main boards 1 can be spliced into a complete rectangular splicing method , so the mobile phone motherboard 1 described in this embodiment has a high utilization rate of the jigsaw panels and low cost.

Further, please refer to FIG. 4 , the mobile phone motherboard 1 further includes a flexible circuit board 13 connected between the first circuit board 11 and the third circuit board 12 . The flexible circuit board 13 described in this embodiment can not only realize the connection function, but also because of its thinner characteristics than ordinary circuit boards, it can be equipped with relatively high structural parts such as SIM card holders and speakers, so that The mobile phone using the mobile phone motherboard 1 is lighter and thinner.

The embodiments of the present invention have been described in detail above, and specific examples have been used in this paper to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only used to help understand the method and core idea of the present invention; at the same time, for Those skilled in the art will have changes in the specific implementation and scope of application according to the idea of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims (10)

1. a kind of multiple-printed-panel for circuit board, which is characterized in that including at least one jigsaw unit, the jigsaw unit includes the first circuit Plate, second circuit board, tertiary circuit plate and the 4th circuit board, the first circuit board are identical as the second circuit plate shape And be centrosymmetrically arranged, the tertiary circuit plate is identical as the 4th circuit board shape and is centrosymmetrically arranged, and described first Circuit board and the tertiary circuit plate are L-shaped, the first circuit board, the second circuit board, the tertiary circuit plate And the 4th circuit board is respectively formed the first gap between any two and collectively forms an outer profile in rectangle.

2. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that the first circuit board includes the first segment being connected And second segment, the tertiary circuit plate include the third section being connected and the 4th section, it is the first segment, the second segment, described Third section and it is described 4th section be in rectangle, the second segment have the second width B2, the third section have third width B3 meets：B2=B3.

3. multiple-printed-panel for circuit board as claimed in claim 2, which is characterized in that the first segment is parallel to described 4th section and vertical In the third section, the second segment is parallel to the third section and perpendicular to described 4th section.

4. multiple-printed-panel for circuit board as claimed in claim 3, which is characterized in that first gap has width T, the first segment With the first length A1 and the first width B1, the second segment has the second length A2, and the third section has third length A3, Described 4th section has the 4th length A4 and the 4th width B4, meets：A2=B1+T, A3=B4+T, A1=A4.

5. multiple-printed-panel for circuit board as claimed in claim 4, which is characterized in that a length of B1+A2+A3+B4+T of the outer profile, institute The width for stating outer profile is A1+T+B2.

6. multiple-printed-panel for circuit board as claimed in claim 2, which is characterized in that the first segment is perpendicular to described 4th section and parallel In the third section, the second segment is perpendicular to the third section and is parallel to described 4th section.

7. multiple-printed-panel for circuit board as claimed in claim 6, which is characterized in that first gap has width T, the first segment With the first length A1 and the first width B1, the second segment has the second length A2, and the third section has third length A3, Described 4th section has the 4th length A4 and the 4th width B4, meets：A2=B1+T, A4=2 × B3+T, A3+2 × B4=A1+ B2, A1 ≠ A4.

8. multiple-printed-panel for circuit board as claimed in claim 7, which is characterized in that a length of B1+A2+A4+T of the outer profile, it is described The width of outer profile is A1+T+B2.

9. the multiple-printed-panel for circuit board as described in claim 4 or 7, which is characterized in that the first width B1 and the 4th width B4 meets：B1 > B4.

10. multiple-printed-panel for circuit board as claimed in any one of claims 1 to 9, which is characterized in that the quantity of the jigsaw unit is It is multiple, the second gap, the width in second gap and described first are formed between the adjacent jigsaw unit of any two The width in gap is equal.