CN105960093A - Circuit board splice board - Google Patents

Circuit board splice board Download PDF

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Publication number
CN105960093A
CN105960093A CN201610380470.4A CN201610380470A CN105960093A CN 105960093 A CN105960093 A CN 105960093A CN 201610380470 A CN201610380470 A CN 201610380470A CN 105960093 A CN105960093 A CN 105960093A
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CN
China
Prior art keywords
circuit board
width
circuit
length
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610380470.4A
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Chinese (zh)
Inventor
陈鑫锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201610380470.4A priority Critical patent/CN105960093A/en
Publication of CN105960093A publication Critical patent/CN105960093A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a circuit board splice board. The circuit board splice board includes at least one splice board unit, wherein the splice board unit includes two first circuit boards, two second circuit boards and two third circuit boards; first gaps are formed between every two of the first circuit boards, the two second circuit boards and the two third circuit boards, and all the first gaps form a rectangular outer contour together; and the first circuit boards, the second circuit boards and the third circuit boards are rectangular and are different in size. The circuit board splice board is high in the utilization rate of sheet material.

Description

Multiple-printed-panel for circuit board
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of multiple-printed-panel for circuit board.
Background technology
Renewal along with surface mounting technology (Surface Mounted Technology, SMT) technological level And improvement, printed circuit board (PCB) (Printed Circuit Board, PCB, also known as circuit board) designer is entering During the design of row multiple-printed-panel for circuit board, need to fully take into account the working condition of product, make the product designed full Can productivity requirement, thus quickly put on market, meet the needs of market and client.Meanwhile, designer Also needing to the utilization rate in view of sheet material when designing circuit board plate material, availability ratio of the armor plate is to affect circuit board One of this key factor.
When doing board design, some veneers of Chang Yinwei are too small, it has not been convenient to cross stove (crest or reflow ovens) Or cross surface mounting technology equipment, it is necessary to jigsaw solves process issues.The process of multiple-printed-panel for circuit board is By the veneer of some small sizes, assembled arrangement becomes the process of a big circuit board plate material.
Current cell phone mainboard is usually arranged as C-shaped, carries out center pair frequently with two pieces of cell phone mainboards during jigsaw Claim splicing.But this jigsaw mode, the vacant sheet material between two pieces of cell phone mainboards can not be fully used, Form substantial amounts of waste material, be unfavorable for cost-effective.
Summary of the invention
The technical problem to be solved is the multiple-printed-panel for circuit board providing a kind of availability ratio of the armor plate high.
To achieve these goals, embodiment of the present invention adopts the following technical scheme that
Thering is provided a kind of multiple-printed-panel for circuit board, including at least one jigsaw unit, described jigsaw unit includes two the One circuit board, two second circuit boards and two tertiary circuit plates, said two first circuit board, described Two second circuit boards and said two tertiary circuit plate are respectively formed the first gap between any two and collectively form One rectangular outline, described first circuit board, described second circuit board and described tertiary circuit plate The most rectangular and differ in size from one another.
Wherein, the long limit of described second circuit board is parallel with the long limit of described first circuit board, described 3rd electricity The long limit of road plate is vertical with the long limit of described first circuit board.
Wherein, described first gap has width T, and described first circuit board has the first length A1 and first Width B1, described second circuit board has the second length A2 and the second width B2, and described tertiary circuit plate has There is the 3rd length A3, meet: A1=A2, A3=B1+B2+T.
Wherein, described tertiary circuit plate has the 3rd width B3, and a length of 2 × A1+2 of described outline × B3+3 × T, a width of A3 of described outline.
Wherein, described tertiary circuit plate has the 3rd width B3, a length of 2 × A3+T of described outline, A width of A1+B3+T of described outline.
Wherein, described first gap has width T, and described first circuit board has the first length A1, described Second circuit board has the second length A2, and described tertiary circuit plate has the 3rd width B3, meets: A1= A2=2 × B3+T.
Wherein, described first circuit board has the first width B1, and described second circuit board has the second width B2, Described tertiary circuit plate has the 3rd length A3, a length of 2 × B1+2 × B2+A3+4 of described outline × T, a width of A1 of described outline.
Wherein, described first gap has width T, and described first circuit board has the first length A1 and first Width B1, described second circuit board has the second length A2 and the second width B2, and described tertiary circuit plate has There is the 3rd length A3, meet: A1=A2, A3=2 × B1+2 × B2+3 × T.
Wherein, described tertiary circuit plate has the 3rd width B3, a length of A3 of described outline, described foreign steamer Wide a width of 2 × B3+A1+2 × T.
Wherein, the width in described first gap is more than or equal to 1.5mm and less than or equal to 3mm.
Compared to prior art, the method have the advantages that
Multiple-printed-panel for circuit board described in the embodiment of the present invention, due to first circuit board two described, two described Two circuit boards and two described tertiary circuit plates are respectively formed the first gap arrangement between any two and collectively form one Individual rectangular outline, the most described jigsaw unit is rectangular.The characteristic easily spliced due to rectangle so that The availability ratio of the armor plate of described multiple-printed-panel for circuit board is high, waste material is few, and production cost is low.
Meanwhile, described first circuit board, described second circuit board and described tertiary circuit plate size each other are not With, can be used for carrying different devices and circuit, and be also a kind of fool-proof design so that concerned process steps letter Single, efficiently.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, below by use required in embodiment Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is only some enforcements of the present invention Mode, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to As these accompanying drawings obtain other accompanying drawing.
Fig. 1 is a kind of jointing-board structure of circuit board schematic diagram that the embodiment of the present invention provides.
Fig. 2 is the structural representation of a kind of jigsaw unit of a kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides.
Fig. 3 is that another structure of a kind of jigsaw unit of a kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides is shown It is intended to.
Fig. 4 is the structural representation of the another kind of jigsaw unit of a kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides Figure.
Fig. 5 is the structural representation of another jigsaw unit of a kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides Figure.
Fig. 6 is the structural representation of a kind of cell phone mainboard that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation The every other embodiment obtained under property work premise, broadly falls into the scope of protection of the invention.
Additionally, the explanation of following embodiment is with reference to additional diagram, may be used to reality in order to illustrate the present invention The specific embodiment executed.The direction term being previously mentioned in the present invention, such as, " on ", D score, "front", "rear", "left", "right", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings, therefore, use Direction term in order to more preferably, be illustrated more clearly that and understand the present invention rather than instruction or infer indication Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that Limitation of the present invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " peace Dress ", " being connected ", " connection ", " be arranged on ... on " should be interpreted broadly, for example, it may be fix connection, Can also be detachably connected, or be integrally connected;Can be to be mechanically connected;Can be to be joined directly together, Can also be indirectly connected to by intermediary, can be the connection of two element internals.General for this area For logical technical staff, above-mentioned term concrete meaning in the present invention can be understood with concrete condition.
Additionally, in describing the invention, except as otherwise noted, " multiple " are meant that two or more. If occurring the term of " operation " in this specification, it refers not only to independent operation, cannot be bright with other operation When really distinguishing, as long as the effect desired by this operation that can realize then is also included within this term.It addition, this theory In bright book with "~" numerical range that represents refer to using "~" before and after the numerical value recorded as minima and maximum The scope that value is included.In the accompanying drawings, the unit that structure is similar or identical is indicated by the same numeral.
Seeing also Fig. 1 to Fig. 5, the embodiment of the present invention provides a kind of multiple-printed-panel for circuit board 100, including at least One jigsaw unit 10, described jigsaw unit 10 includes 1, two second circuit boards 2 of two first circuit boards And two tertiary circuit plates 3, said two first circuit board 1, said two second circuit board 2 and institute State two tertiary circuit plates 3 be respectively formed the first gap 4 between any two and collectively form a rectangular foreign steamer Wide 5, described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3 the most rectangular and Differ in size from one another.
In the present embodiment, due to 1, two described second circuit boards 2 and two of two described first circuit boards Individual described tertiary circuit plate 3 be respectively formed between any two the first gap 4 arrange and collectively form one rectangular Outline 5, the most described jigsaw unit 10 is rectangular.The characteristic easily spliced due to rectangle so that described electricity The availability ratio of the armor plate of road plate jigsaw 100 is high, waste material is few, and production cost is low.
Meanwhile, described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3 are the biggest Little difference, can be used for carrying different devices and circuit, and is also a kind of fool-proof design so that relevant work Sequence is simple, efficiently.
Further, see also Fig. 1 to Fig. 5, as a kind of alternative embodiment, described second circuit board The long limit of 2 is parallel with the long limit of described first circuit board 1, the long limit of described tertiary circuit plate 3 and described first The long limit of circuit board 1 is vertical.In the present embodiment, the arrangement of described multiple-printed-panel for circuit board 100 is met Described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3, can assemble satisfied The cell phone mainboard of existing major part handset demand.Meanwhile, described arrangement can also improve jigsaw sheet material Utilization rate, and then reduce cost.
Long limit described in the present embodiment, refers to limit longer in the limit of rectangle as shown in the figure.
Further, see also Fig. 1 to Fig. 3, as a kind of preferred embodiment, described first gap 4 Having width T, described first circuit board 1 has the first length A1 and the first width B1, described second electricity Road plate 2 has the second length A2 and the second width B2, and described tertiary circuit plate 3 has the 3rd length A3 With the 3rd width B3.Described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3 Meet: A1=A2, A3=B1+B2+T.
Preferably, different arrangements makes described outline 5 have different length and width.As in figure 2 it is shown, A length of 2 × A1+2 × B3+3 × the T of described outline 5, a width of A3 of described outline 5.Or, As it is shown on figure 3, a length of 2 × A3+T of described outline 5, a width of A1+B3+T of described outline 5. The jigsaw availability ratio of the armor plate of multiple-printed-panel for circuit board 100 described in the present embodiment is high, and waste material area is little, low cost.
Further, see also Fig. 1 and Fig. 4, as another kind of preferred embodiment, described first gap 4 have width T, and described first circuit board 1 has the first length A1 and the first width B1, described second electricity Road plate 2 has the second length A2 and the second width B2, and described tertiary circuit plate 3 has the 3rd length A3 With the 3rd width B3, described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3 Meet: A1=A2=2 × B3+T.
Preferably, a length of 2 × B1+2 × B2+A3+4 × T of described outline 5, described outline 5 A width of A1.The jigsaw availability ratio of the armor plate of multiple-printed-panel for circuit board 100 described in the present embodiment is high, and waste material area is little, Low cost.
Further, see also Fig. 1 and Fig. 5, as still another preferable embodiment, described first gap 4 have width T, and described first circuit board 1 has the first length A1 and the first width B1, described second electricity Road plate 2 has the second length A2 and the second width B2, and described tertiary circuit plate 3 has the 3rd length A3 With the 3rd width B3, described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3 Meet: A1=A2, A3=2 × B1+2 × B2+3 × T.
Preferably, a length of A3 of described outline 5, a width of 2 × B3+A1+2 × T of described outline 5. The jigsaw availability ratio of the armor plate of multiple-printed-panel for circuit board 100 described in the present embodiment is high, and waste material area is little, low cost.
Further, see also Fig. 1 to Fig. 5, as a kind of alternative embodiment, in order to make described jigsaw Unit 10 is arranged compact, facilitates again the carrying out of subsequent technique, the described width T in described first gap 4 simultaneously Meet: 1.5mm≤T≤3mm.Preferably, the described width T in described first gap 4 meets: T=2mm.
Preferably, between the most adjacent described jigsaw unit 10, form the second gap, described second gap Width is identical with the width in described first gap 4, with brief operation, reduces the cost.
Referring to Fig. 1 to Fig. 6, the embodiment of the present invention also provides for a kind of cell phone mainboard 20.Described cell phone mainboard 20 include first circuit board, tertiary circuit plate and the second circuit board being connected.Described first circuit board, Described tertiary circuit plate and described second circuit board, use the first circuit board as above described in any embodiment 1, tertiary circuit plate 3 and second circuit board 2.
It should be understood that described first circuit board 1, described second circuit board 2 and described tertiary circuit plate 3 The described cell phone mainboard 20 of " C " shape can be collectively forming.In other words, described jigsaw unit 10 is permissible It is spliced by two described cell phone mainboards 20.
In the present embodiment, owing to two described cell phone mainboards 20 can carry out rational joint, it is spliced The availability ratio of the armor plate of described multiple-printed-panel for circuit board 100 is high, waste material is few, and then reduces described cell phone mainboard 20 Cost.
It should be appreciated that cell phone mainboard 20 described in the present embodiment can be " C " shape plate, Z-shaped plate, " work " Shape plate, inverted " C " shape plate or anti-Z-shaped plate.Preferably, described in the present embodiment, cell phone mainboard 20 is " C " Shape plate.For the integrated mobile phone mainboard 20 being difficult to rational joint in prior art, described in the present embodiment Cell phone mainboard 20 due to after can using fractionation splicing and two described cell phone mainboards 20 can be spliced into one The connecting method of complete rectangular, so cell phone mainboard 20 described in the present embodiment is high to the utilization rate of jigsaw sheet material, Low cost.
Further, referring to Fig. 6, described cell phone mainboard 20 also includes two flexible PCBs 6, in order to Be connected between described first circuit board 1 and described tertiary circuit plate 3 and described tertiary circuit plate 3 with Between described second circuit board 2.The present embodiment said two flexible PCB 6, not only can realize interconnection function, Simultaneously due also to it compares the characteristic that ordinary circuit board is relatively thin, SIM card holder, speaker etc. can be carried thereon The structural member that aspect ratio is higher, so that applying the mobile phone of described cell phone mainboard 20 the most frivolous.
Being described in detail the embodiment of the present invention above, specific case used herein is to the present invention's Principle and embodiment are set forth, and the explanation of above example is only intended to help to understand the side of the present invention Method and core concept thereof;Simultaneously for one of ordinary skill in the art, according to the thought of the present invention, All will change in detailed description of the invention and range of application, in sum, this specification content should not be managed Solve as limitation of the present invention.

Claims (10)

1. a multiple-printed-panel for circuit board, it is characterised in that include at least one jigsaw unit, described jigsaw unit Including two first circuit boards, two second circuit boards and two tertiary circuit plates, said two the first electricity Road plate, said two second circuit board and said two tertiary circuit plate are respectively formed the first gap between any two And collectively form a rectangular outline, described first circuit board, described second circuit board and described Tertiary circuit plate is the most rectangular and differs in size from one another.
2. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that the long limit of described second circuit board Parallel with the long limit of described first circuit board, the long limit of described tertiary circuit plate and the length of described first circuit board Limit is vertical.
3. multiple-printed-panel for circuit board as claimed in claim 2, it is characterised in that described first gap has width T, Described first circuit board has the first length A1 and the first width B1, and it is long that described second circuit board has second Degree A2 and the second width B2, described tertiary circuit plate has the 3rd length A3, meets: A1=A2, A3 =B1+B2+T.
4. multiple-printed-panel for circuit board as claimed in claim 3, it is characterised in that described tertiary circuit plate has the Three width B3, a length of 2 × A1+2 × B3+3 × T of described outline, a width of A3 of described outline.
5. multiple-printed-panel for circuit board as claimed in claim 3, it is characterised in that described tertiary circuit plate has the Three width B3, a length of 2 × A3+T of described outline, a width of A1+B3+T of described outline.
6. multiple-printed-panel for circuit board as claimed in claim 2, it is characterised in that described first gap has width T, Described first circuit board has the first length A1, and described second circuit board has the second length A2, and described Three-circuit plate has the 3rd width B3, meets: A1=A2=2 × B3+T.
7. multiple-printed-panel for circuit board as claimed in claim 6, it is characterised in that described first circuit board has the One width B1, described second circuit board has the second width B2, and described tertiary circuit plate has the 3rd length A3, a length of 2 × B1+2 × B2+A3+4 × T of described outline, a width of A1 of described outline.
8. multiple-printed-panel for circuit board as claimed in claim 2, it is characterised in that described first gap has width T, Described first circuit board has the first length A1 and the first width B1, and it is long that described second circuit board has second Degree A2 and the second width B2, described tertiary circuit plate has the 3rd length A3, meets: A1=A2, A3=2 ×B1+2×B2+3×T。
9. multiple-printed-panel for circuit board as claimed in claim 8, it is characterised in that described tertiary circuit plate has the Three width B3, a length of A3 of described outline, a width of 2 × B3+A1+2 × T of described outline.
10. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that the width in described first gap More than or equal to 1.5mm and less than or equal to 3mm.
CN201610380470.4A 2016-05-31 2016-05-31 Circuit board splice board Pending CN105960093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610380470.4A CN105960093A (en) 2016-05-31 2016-05-31 Circuit board splice board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610380470.4A CN105960093A (en) 2016-05-31 2016-05-31 Circuit board splice board

Publications (1)

Publication Number Publication Date
CN105960093A true CN105960093A (en) 2016-09-21

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ID=56908213

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610380470.4A Pending CN105960093A (en) 2016-05-31 2016-05-31 Circuit board splice board

Country Status (1)

Country Link
CN (1) CN105960093A (en)

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Application publication date: 20160921

RJ01 Rejection of invention patent application after publication