CN105960092A - Circuit board splice board - Google Patents
Circuit board splice board Download PDFInfo
- Publication number
- CN105960092A CN105960092A CN201610380362.7A CN201610380362A CN105960092A CN 105960092 A CN105960092 A CN 105960092A CN 201610380362 A CN201610380362 A CN 201610380362A CN 105960092 A CN105960092 A CN 105960092A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- framework
- dowel
- printed
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board splice board. The circuit board splice board includes a framework, a board body with two circuit boards, a first splice bar and a second splice bar, wherein the plate body is arranged in the framework; the first splice bar is arranged on the side edge of the board body and the framework; the second splice bar includes a first connection segment and a second connection segment which are connected in an integrated way; the first connection segment is arranged between the two adjacent circuit boards, and is close to the framework; and the end part of the second connection segment is fixed on the framework which is closed to the two adjacent circuit boards. For the circuit board splice board, as the first splice bar is arranged on the framework and the side edge of the board body to fix the board body on the frame work and the second splice bar is arranged between the two circuit boards which are adjacent to the frame work at the same time, and as the second splice bar is provided with the first connection segment which can connect the two circuit boards and the second connection segment stretches out from the second splice bar and is fixed on the framework, the connection intensity between the board body and the framework can be improved and the circuit board splice board with higher connection intensity can be provided.
Description
Technical field
The present invention relates to circuit board design techniques field, particularly relate to a kind of multiple-printed-panel for circuit board.
Background technology
Circuit board size within electronic product is less, general employing split type circuit board, it is easy to processing and fabricating, and along with the fast development of electronic product, the fuselage of product is more and more thinner, causes circuit board more and more thinner and more and more less so that the circuit board number that multiple-printed-panel for circuit board is comprised is increasing, and increasing of circuit board number, the most easily make the intensity entirety of multiple-printed-panel for circuit board weaken.Circuit board of the prior art would generally be fixed on technique edges; wherein circuit board is typically to arrange the dowel realization of I type with the splicing of technique edges; if inventor finds that the sheet frame of circuit board is shorter when stating mode on the implementation; then the dowel quantity between circuit board to technique edges is the most corresponding less; now can reduce the intensity of split type circuit board, affect the paster effect in split type circuit later stage.
Summary of the invention
It is an object of the invention to provide a kind of bonding strength split type circuit board that can improve between circuit board and framework.
In order to solve above-mentioned technical problem, the invention provides a kind of multiple-printed-panel for circuit board, including framework, having the plate body of two circuit boards, the first dowel and the second dowel, described plate body is placed in the inside of described framework, and described first dowel is arranged on side and the described framework of described plate body；Described second dowel includes the first linkage section and the second linkage section integrally connected, described first linkage section is arranged between adjacent two circuit board, and described first linkage section is near described framework, the end of described second linkage section is fixed on the described framework closed on described two adjacent circuit boards.
Wherein, the distance being provided with between described adjacent two circuit board of described first linkage section is more than or equal to 3mm.
Wherein, described first linkage section is vertically connected at described second linkage section.
Wherein, described first linkage section and described second linkage section are all straightway.
Wherein, described framework also includes that the 3rd dowel, described 3rd dowel are arranged between described two adjacent circuit boards, and the distance being provided with between described adjacent two circuit board of described 3rd dowel is less than 3mm.
Wherein, described framework includes two technique edges being oppositely arranged.
Wherein, described framework includes that four technique edges, described four technique skirt connect formation and close framework.
Wherein, described first dowel is rectangle, annular or ellipse.
Wherein, described 3rd dowel is rectangle, annular or ellipse.
Wherein, the structure of each described circuit board is identical.
Plate body is fixed on framework by the multiple-printed-panel for circuit board that the present invention provides by arranging the first dowel at the side of framework and plate body, arranging the second dowel between two circuit boards adjacent with framework strengthens the bonding strength between plate body and framework further simultaneously, this second dowel not only has the first linkage section can connect two circuit boards, but also stretch out the second linkage section and be fixed on framework, strengthen the bonding strength between plate body and framework with this, thus a kind of bonding strength preferably multiple-printed-panel for circuit board is provided.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic diagram of the multiple-printed-panel for circuit board that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1, a kind of multiple-printed-panel for circuit board 100 provided for the present invention, this multiple-printed-panel for circuit board 100 includes framework 1, plate body 2, first dowel 3 with at least two circuit board 21 and the second dowel 4, wherein plate body 2 is connected on framework 1 by the first dowel 3, connected by the first linkage section 41 of the second dowel 4 between two circuit boards 21, and second dowel 4 also stretch out the second linkage section 42 and be fixed on framework 1, strengthen the bonding strength between plate body 2 and framework 1 with this, thus a kind of bonding strength preferably multiple-printed-panel for circuit board 100 is provided.
In the present embodiment, framework 1 includes two technique edges being oppositely arranged 11.Certainly, in other embodiments, framework 1 includes that four technique edges 11, four technique edges 11 enclose and connect formation closing framework.
In the present embodiment, between plate body 2 and the close side of technique edges 11, first dowel 3 is set, to be fixed on framework 1 by plate body 2, improves the bulk strength of multiple-printed-panel for circuit board 100.The generally rectangular shaped shape of plate body 2, has two the first long limit L1 being oppositely arranged and the first minor face S1 being oppositely arranged, two the first minor face S1 are connected between two the first long limit L1.Article two, it is respectively provided with the first dowel 3 between the first long limit L1 and two technique edges 11.
In the present embodiment, circuit board 21 according to the different definition of position is: the external circuit board 21, is positioned at the marginal area of plate body 2, i.e. near the circuit board 21 of framework 1；Internal circuit board, is positioned at the zone line of plate body 2.It should be understood that in this embodiment, the quantity of the external circuit board 21 is six, and the quantity of internal circuit board is zero.Owing to the quantity of internal circuit board is zero, therefore the circuit board 21 mentioned in this embodiment is also for the external circuit board 21.It should be understood that the structure of each circuit board 21 is identical.Certainly, in other embodiments, the quantity of internal circuit board 21 sets according to the actual requirements.Accordingly, if the quantity of internal circuit board 21 is not zero, then circuit board 21 includes the external circuit board 21 and internal circuit board.
In the present embodiment, circuit board 21 has second be oppositely arranged long limit L2 and the 3rd long limit L3 and the second minor face S2 being oppositely arranged and the 3rd minor face S3.Wherein, two the second long limit L2 are spliced to form the first minor face S1, two article of the 3rd long limit L3 and are spliced to form another article the first minor face S1.
In this embodiment, the structure of circuit board 21 is: the intersection of the second long limit L2 and the second minor face S2 offers the first breach 21a, the intersection of the 3rd long limit L3 and the second minor face S2 offers the second breach 21b, first breach 21a and the second breach 21b offers so that the size of the second minor face S2 is shorter, when the second minor face S2 making circuit board 21 is arranged on framework 1 by the first dowel 3, the position that first dowel 3 can be arranged is less, therefore the negligible amounts of the first dowel 3 between the first framework 1 and the second minor face S2.Certainly, in other embodiments, the structure of circuit board 21 can also according to actually required and relative set, such as, circuit board 21 can be with rectangular shape.
In the present embodiment, first dowel 3 is arranged between technique edges 11 with the side of corresponding plate body 2, may be appreciated, owing to the technique edges 11 in this embodiment is two, therefore the first dowel 3 is arranged between a technique edges 11 and the first minor face S1, first dowel 3 is arranged between another technique edges 11 and the second minor face S2, and the first dowel 3 is respectively perpendicular to technique edges 11 and the first minor face S1.By arranging the first dowel 3 at the side of framework 1 and plate body 2, plate body 2 is fixed on framework 1.It should be understood that for the ease of the processing of multiple-printed-panel for circuit board 100, the first dowel 3 can be rectangle, annular or ellipse.In this embodiment, the first dowel 3 is rectangle.
In the present embodiment, second dowel 4 includes the first linkage section 41 and the second linkage section 42 integrally connected, first linkage section 41 is arranged between adjacent two circuit board 21, and first linkage section 41 near framework 1, the end of the second linkage section 42 be fixed on on adjacent two frameworks that circuit board 21 closes on 1.Concrete, the first linkage section 41 is set between two circuit boards 21 adjacent with technique edges 11, and on the first linkage section 41, stretches out the second linkage section 42 be fixed on neighbouring technique edges 11.May be appreciated, owing to the second minor face S2 is the longest along the bearing of trend length of the first long limit L1, it can arrange multiple first dowel 3 with the corresponding technique edges 11 i.e. technique edges 11 on right side, i.e. the second minor face S2 of circuit board 21 can preferably be fixed on technique edges 11, therefore the second minor face S2 there is no and arranges the second dowel 4；And owing to the length of the first minor face S1 is shorter, its position that can arrange the first dowel 3 with the technique edges 11 in left side is less, in order to improve the bulk strength of multiple-printed-panel for circuit board 100 further, while two circuit boards 21 being positioned at left side are connected by the first linkage section 41, stretch out the second linkage section 42 connect neighbouring framework 1, i.e. add the bonding strength of left side circuit board 21 and technique edges 11, thus further increase the bulk strength of multiple-printed-panel for circuit board 100, and, when 100 points of plates of later stage multiple-printed-panel for circuit board, gong cutter has only to separate the two ends arranging the first linkage section 41 with two circuit boards 21, do not affect the efficiency of point plate.Certainly, in other embodiments, arranging of the second dowel 4 can also relative set according to actual needs.
Further, the first linkage section 41 is vertically connected at the second linkage section 42.Concrete, the first linkage section 41 forms similar T-shaped structure with the second linkage section 42, by the second dowel 4 is arranged to T-type structure, both ensure that the bonding strength of the second dowel 4, is easy to again the processing of multiple-printed-panel for circuit board 100 and follow-up point plate.First linkage section 41 is identical with the structure of the fixing end of technique edges 11 with the fixing end of adjacent two circuit boards 21 and the second linkage section 42 respectively.It should be understood that the first linkage section 41 and the second linkage section 42 are all straightway, it is simple to the early stage cutting of multiple-printed-panel for circuit board 100.Certainly, in other embodiments, the second dowel 4 can be with structure triangular in shape, or each linkage section of the second dowel 4 can be curved section.
In order to further improve, the distance being provided with between adjacent two circuit board 21 of the first linkage section 41 is more than or equal to 3mm.In the present embodiment, owing to the split type circuit board later stage can relate to a point plate, the meat thickness of its gong cutter is generally higher than 2mm, passes through when dividing plate for the ease of gong cutter, first breach 21a and the second breach 21b is 3mm along the distance in the direction of the first minor face S1, it is simple to gong cutter divides plate.Certainly, in other embodiments, the distance being provided with between adjacent two circuit board 21 of the first linkage section 41 is also less than 3mm.
In order to further improve, framework 1 also includes that the 3rd dowel 5, the 3rd dowel 5 are arranged between adjacent two circuit board 21, and the distance being provided with between adjacent two circuit board 21 of the 3rd dowel 5 is less than 3mm.
In the present embodiment, for the ease of the processing of multiple-printed-panel for circuit board 100, the 3rd dowel 5 can be rectangle, annular or ellipse.It should be understood that the 3rd dowel 5 is identical with the structure of the first dowel 3.3rd dowel 5 is primarily adapted for use in the splicing between adjacent two circuit boards 21, it is distinguished as with the second dowel 4, second dowel 4 is simultaneously connected to technique edges 11, and the 3rd dowel 5 is only arranged between two circuit boards 21, splicing by the different position of the 3rd dowel 5 and the second dowel 4 the most adjacent corresponding two circuit boards 21, while the bonding strength enhanced between each circuit board 21, also due to the introducing of the 3rd dowel 5, the easy making process of split type circuit board 21 is further increased.Certainly, in other embodiments, multiple-printed-panel for circuit board 100 can also be without arranging the 3rd dowel 5.
Plate body 2 is fixed on framework 1 by the multiple-printed-panel for circuit board 100 that the present invention provides by arranging the first dowel 3 at the side of framework 1 and plate body 2, arranging the second dowel 4 between two circuit boards 21 adjacent with framework 1 strengthens the bonding strength between plate body 2 and framework 1 further simultaneously, this second dowel 4 not only has the first linkage section 41 can connect two circuit boards 21, but also stretch out the second linkage section 42 and be fixed on framework 1, strengthen the bonding strength between plate body 2 and framework 1 with this, thus a kind of bonding strength preferably multiple-printed-panel for circuit board 100 is provided.
It should be understood that in multiple-printed-panel for circuit board 100 after undue plate, the circuit board of monolithic can be applied to mobile terminal.May be appreciated, mobile terminal can be any possess communication and the equipment of storage function, such as: panel computer, mobile phone, electronic reader, remote controller, personal computer (Personal Computer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have the smart machine of network function.
Being above the preferred embodiment of the present invention, it is noted that for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a multiple-printed-panel for circuit board, it is characterised in that include framework, have the plate body of two circuit boards,
One dowel and the second dowel, described plate body is placed in the inside of described framework, and described first dowel is arranged
On the side and described framework of described plate body；Described second dowel includes the first linkage section integrally connected
With the second linkage section, described first linkage section is arranged between adjacent two circuit board, and described first connects
The section of connecing is near described framework, and the end of described second linkage section is fixed on and is faced with described two adjacent circuit boards
On near described framework.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that be provided with described first and connect
Distance between described adjacent two circuit board of section is more than or equal to 3mm.
Multiple-printed-panel for circuit board the most according to claim 1 and 2, it is characterised in that described first linkage section
It is vertically connected at described second linkage section.
Multiple-printed-panel for circuit board the most according to claim 3, it is characterised in that described first linkage section and institute
State the second linkage section and be all straightway.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described framework also includes the 3rd
Dowel, described 3rd dowel is arranged between described two adjacent circuit boards, and is provided with described
Distance between described adjacent two circuit board of three dowels is less than 3mm.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described framework includes two phases
To the technique edges arranged.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described framework includes four works
Skill limit, described four technique skirt connect formation and close framework.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that described first dowel is square
Shape, annular or ellipse.
Multiple-printed-panel for circuit board the most according to claim 5, it is characterised in that described 3rd dowel is square
Shape, annular or ellipse.
Multiple-printed-panel for circuit board the most according to claim 1, it is characterised in that each described circuit board
Structure is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380362.7A CN105960092B (en) | 2016-05-31 | 2016-05-31 | A kind of multiple-printed-panel for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380362.7A CN105960092B (en) | 2016-05-31 | 2016-05-31 | A kind of multiple-printed-panel for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105960092A true CN105960092A (en) | 2016-09-21 |
| CN105960092B CN105960092B (en) | 2019-04-02 |
Family
ID=56907801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610380362.7A Active CN105960092B (en) | 2016-05-31 | 2016-05-31 | A kind of multiple-printed-panel for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105960092B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484340A (en) * | 2017-08-04 | 2017-12-15 | 郑州云海信息技术有限公司 | A kind of anti-flash pcb board and processing method |
| CN114745868A (en) * | 2021-12-29 | 2022-07-12 | 龙南骏亚电子科技有限公司 | Board splicing process and device for circuit board production |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004295498A (en) * | 2003-03-27 | 2004-10-21 | Denso Corp | Ic card |
| CN103025056A (en) * | 2011-09-21 | 2013-04-03 | 揖斐电电子（北京）有限公司 | Multichip typesetting substrate and manufacturing method thereof |
| CN103068160A (en) * | 2012-12-25 | 2013-04-24 | 广东欧珀移动通信有限公司 | Split type circuit board |
| CN203435232U (en) * | 2013-08-29 | 2014-02-12 | 深圳天珑无线科技有限公司 | Printed circuit board (PCB) used for mobile terminal |
| CN205179527U (en) * | 2015-12-02 | 2016-04-20 | 重庆蓝岸通讯技术有限公司 | PCB spliced board |
| CN105578756A (en) * | 2016-02-26 | 2016-05-11 | 广东欧珀移动通信有限公司 | Printed board |
-
2016
- 2016-05-31 CN CN201610380362.7A patent/CN105960092B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004295498A (en) * | 2003-03-27 | 2004-10-21 | Denso Corp | Ic card |
| CN103025056A (en) * | 2011-09-21 | 2013-04-03 | 揖斐电电子（北京）有限公司 | Multichip typesetting substrate and manufacturing method thereof |
| CN103068160A (en) * | 2012-12-25 | 2013-04-24 | 广东欧珀移动通信有限公司 | Split type circuit board |
| CN203435232U (en) * | 2013-08-29 | 2014-02-12 | 深圳天珑无线科技有限公司 | Printed circuit board (PCB) used for mobile terminal |
| CN205179527U (en) * | 2015-12-02 | 2016-04-20 | 重庆蓝岸通讯技术有限公司 | PCB spliced board |
| CN105578756A (en) * | 2016-02-26 | 2016-05-11 | 广东欧珀移动通信有限公司 | Printed board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484340A (en) * | 2017-08-04 | 2017-12-15 | 郑州云海信息技术有限公司 | A kind of anti-flash pcb board and processing method |
| CN114745868A (en) * | 2021-12-29 | 2022-07-12 | 龙南骏亚电子科技有限公司 | Board splicing process and device for circuit board production |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105960092B (en) | 2019-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105828528B (en) | Circuit board and mobile terminal | |
| US10198028B2 (en) | Display panel, display panel assembly and method of manufacturing the same, and display device | |
| US20180108604A1 (en) | Chip on film and display device | |
| CN104990001B (en) | Backlight module and preparation method thereof, double-side display device | |
| CN105828525A (en) | Jointed board for circuit boards | |
| CN105960092A (en) | Circuit board splice board | |
| CN105934086B (en) | A kind of multiple-printed-panel for circuit board | |
| CN105934092A (en) | Assembled flexible circuit board | |
| US11232723B2 (en) | Folding display panel and display device | |
| KR20160100431A (en) | Portable multi-slide type display apparatus | |
| CN105960095A (en) | Circuit board splice board | |
| CN205302092U (en) | Laptop | |
| CN205371192U (en) | A frame mosaic structure for educating all -in -one | |
| CN105842892A (en) | Front frame, display module and display equipment | |
| CN202735627U (en) | Display device | |
| CN105682355B (en) | A kind of FPC jigsaw structures of L-type | |
| US20140290742A1 (en) | Frame structure and solar module having the same | |
| CN105848414A (en) | Circuit board panel | |
| CN205812096U (en) | A kind of display screen component and electronic equipment | |
| CN207191444U (en) | A kind of oxygen cylinder separation | |
| CN105934090A (en) | Assembled circuit board | |
| CN203883889U (en) | Mobile phone main board jointed plate | |
| CN204595378U (en) | LCD assembly and display module | |
| CN105934087A (en) | Circuit board jointed board | |
| CN105934088A (en) | Circuit board jointed board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |