CN204576463U - Flexible PCB and apply the electronic equipment of this flexible PCB - Google Patents
Flexible PCB and apply the electronic equipment of this flexible PCB Download PDFInfo
- Publication number
- CN204576463U CN204576463U CN201520265634.XU CN201520265634U CN204576463U CN 204576463 U CN204576463 U CN 204576463U CN 201520265634 U CN201520265634 U CN 201520265634U CN 204576463 U CN204576463 U CN 204576463U
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- subregion
- haptic element
- link
- flexible pcb
- matrix
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Links
- 239000011159 matrix material Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims description 20
- 230000006698 induction Effects 0.000 claims description 12
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 13
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
Abstract
The utility model relates to a kind of flexible PCB and applies the electronic equipment of this flexible PCB.This flexible PCB comprises matrix, be formed in the conductive circuit layer on matrix, multiple first haptic element and multiple second haptic element, matrix comprises the first link and the second link, first haptic element is positioned at the first link of matrix, second haptic element is positioned at the second link of matrix, conductive circuit layer comprises multiple conducting wire, each conducting wire is electrically connected between corresponding first haptic element and second haptic element, first haptic element comprises near the first end of the second haptic element and the second end away from the second haptic element, wherein at least one conducting wire to be arranged between two adjacent the first haptic elements and to be connected with the second end of corresponding first haptic element.The conducting wire of setting like this can take less area, and the part that flexible PCB is exposed to the touch-control sensing layer of touch-screen is less, is thus more adapted to account for screen than large electronic equipment.
Description
Technical field
The utility model relates to touch-control electric equipment field, particularly relates to a kind of flexible PCB and applies the electronic equipment of this flexible PCB.
Background technology
Touch type electronic product such as mobile phone, panel computer etc. are used widely due to the convenience of operation.In touch type electronic product, flexible PCB (FPC) is absolutely necessary one of element.According to the kind difference of the electronic product that flexible PCB is applied, and the difference of installation site, the physical dimension of these flexible PCBs is also not quite similar, but the electrical property design of these flexible PCBs requires similar.Along with the demand of consumer to the giant-screen of the electronic products such as smart mobile phone and narrow frame is more and more higher, and the driver circuit of touch-screen and the number of channels of induction line get more and more, and placement space electronic product being left flexible PCB for is more and more less.Therefore, increasing electronic product requires further harsh to the physical dimension of flexible PCB.Traditional flexible PCB cabling design more can not meet this demand.
Utility model content
Based on this, be necessary that the cabling design for flexible PCB can not meet the problem of electronic equipment giant-screen and narrow frame demand, a kind of flexible PCB be provided and apply the electronic equipment of this flexible PCB.
A kind of flexible PCB, comprise matrix, be formed in the conductive circuit layer on matrix, multiple first haptic element and multiple second haptic element, described matrix comprises the first link and the second link, described first haptic element is positioned at the first link of matrix, described second haptic element is positioned at the second link of matrix, described conductive circuit layer comprises multiple conducting wire, each conducting wire is electrically connected between corresponding first haptic element and second haptic element, described first haptic element comprises near the first end of the second haptic element and the second end away from the second haptic element, wherein at least one conducting wire to be arranged between two adjacent the first haptic elements and to be connected with the second end of corresponding first haptic element.
Wherein in an embodiment, described first link comprises the first subregion, the second subregion and the 3rd subregion, second subregion is between the first subregion and the 3rd subregion, first subregion is connected with corresponding conducting wire with the second end of the first haptic element in the 3rd subregion, and the first end of the first haptic element in the second subregion is connected with corresponding conducting wire.
Wherein in an embodiment, also there is at least one in following two features:
Between two nearest the first haptic elements, form the first gap in first subregion and the second subregion, the conducting wire be connected with the first haptic element in the first subregion is all through described first gap; And
Between two nearest the first haptic elements, form the second gap in 3rd subregion and the second subregion, the conducting wire be connected with the first haptic element in the 3rd subregion is all through described second gap.
Wherein in an embodiment, at least one in the gap in the gap in the gap in the first subregion between arbitrary neighborhood two the first haptic elements, the second subregion between arbitrary neighborhood two the first haptic elements and the 3rd subregion between arbitrary neighborhood two the first haptic elements is less than described first gap or the second gap.
Wherein in an embodiment, first end of the first haptic element the first, in the 3rd subregion than the first end of the first haptic element in the second subregion closer to the second link of described matrix, the second end of the first haptic element in the first, the 3rd subregion than the second end of the first haptic element in the second subregion closer to the second link of described matrix.
Wherein in an embodiment, the first end of the first haptic element in the first, the 3rd subregion is concordant with a side of the first link, and the second end of the first haptic element in the second subregion is concordant with another side relative of the first link.
Wherein in an embodiment, described matrix also comprises the connecting portion between first, second link, the width of one end that described connecting portion is connected with the first link is greater than the spacing between any two the first haptic elements in the second subregion, is less than the spacing between the first subregion and the 3rd subregion.
A kind of electronic equipment, the flexible PCB comprising touch-screen and be electrically connected with touch-screen, described touch-screen comprises substrate and is formed in the touch-control sensing layer on substrate, described flexible PCB is any one flexible PCB above-mentioned, and described touch-control sensing layer is electrically connected with the first haptic element of flexible PCB.
Wherein in an embodiment, the side of the first link of the matrix of described flexible PCB is concordant with a side of touch-control sensing layer.
Wherein in an embodiment, the matrix of described flexible PCB also comprises the connecting portion between first, second link, the substrate of described touch-screen has a side parallel with the side of the first link of the matrix of described flexible PCB, reserved shooting head bore and infrared induction hole on described substrate, described shooting head bore and infrared induction hole are between the side and the side of substrate of the first link, and described shooting head bore and infrared induction hole lay respectively at the both sides of connecting portion.
Above-mentioned flexible PCB is by be arranged in wherein at least one conducting wire between two adjacent the first haptic elements and to be connected with the second end of corresponding first haptic element, setting like this can make the arrangement of conducting wire on matrix more reasonable, under the prerequisite that the quantity of conducting wire is identical, all be connected with the first end of the first haptic element compared to conducting wire, more matrix area can not be taken, thus can reduce the footprint area of flexible PCB, the design requirement of the increasingly strong giant-screen of electronic equipment and narrow frame can be adapted to.
Accompanying drawing explanation
The structural representation of the flexible PCB that Fig. 1 provides for the utility model one embodiment;
The part-structure schematic diagram of the electronic equipment that Fig. 2 provides for the utility model one embodiment.
Embodiment
As shown in Figure 1, the flexible PCB 100 that the utility model one embodiment provides, comprises matrix 10, is formed in the conductive circuit layer 20 on matrix 10, multiple first haptic element 30 and multiple second haptic element 40.
Matrix 10 is made by the material with soft character.Matrix 10 has bendable folding endurance because of soft, and when bending, the conductive circuit layer 20 be formed on matrix 10 can not be ruptured, thus is convenient to the configuration that flexible PCB 100 adapts to various electronic equipment.In certain embodiments, matrix 10 can be multi-layer compound structure.
Described matrix 10 comprises the first link 11, second link 13 and the connecting portion 12 between the first link 11 and the second link 13.Described first haptic element 30 is positioned at the first link 11 of matrix 10, and described second haptic element 40 is positioned at the second link 13 of matrix 10.In one embodiment, described first link 11 is for being electrically connected with the touch-control sensing layer of touch-screen, and described second link 13 is for being connected with control module.Because touch-control sensing layer has more number of channels, such as driver circuit and induction line, and for realizing inducing function, need to possess certain spacing distance between each circuit, thus the first link 11 be electrically connected with touch-control sensing layer, has larger width compared to the second link 13.
Described conductive circuit layer 20 is formed in one of matrix 10 on the surface.Suitable technique such as metal-coated membrane can be adopted to be patterned on matrix 10 again and form described conductive circuit layer 20, the technique of existing making conductive circuit layer 20 all can be applied to the utility model.Described conductive circuit layer 20 comprises multiple conducting wire 21, spaced between conducting wire 21.Each conducting wire 21 is electrically connected between corresponding first haptic element 30 and second haptic element 40.
Described first haptic element 30 is arranged on the first link 11, and described second haptic element 40 is arranged on the second link 13.First haptic element 30 and the second haptic element 40 are as the electrode of electrically conduct touch-screen and control module, and the first haptic element 30 and the second haptic element 40 have larger wire diameter compared to conducting wire 21.Shown in Fig. 1, the second haptic element 40 only uses the displaying of a block schematic, be appreciated that each second haptic element 40 also apart from one another by and be electrically insulated.
Described first haptic element 30 comprises near the first end 31 of the second haptic element 40 and the second end 33 away from the second haptic element 40.First haptic element 30 is towards identical, and in one embodiment, the first haptic element 30 is rectangular.The wire diameter of each the first haptic element 30 is identical, and setting parallel to each other.
In the utility model, at least one conducting wire 21 to be arranged between two adjacent the first haptic elements 30 and to be connected with the second end 33 of corresponding first haptic element 30.Setting like this can make the arrangement of conducting wire 21 on matrix 10 more reasonable, under the prerequisite that the quantity of conducting wire 21 is identical, all be connected with the first end 31 of the first haptic element 30 compared to conducting wire 21, more matrix 10 area can not be taken, thus can reduce the footprint area of flexible PCB 100, the design requirement of the increasingly strong giant-screen of electronic equipment and narrow frame can be adapted to.
Further, in certain embodiments, described first link 11 comprises the first subregion 111, second subregion 112 and the 3rd subregion 113, second subregion 112 between the first subregion 111 and the 3rd subregion 113.The connecting portion 12 of matrix 10 docks with the second subregion 112 of the first link 11 substantially.First subregion 111 is connected with corresponding conducting wire 21 with the second end 33 of the first haptic element 30 in the 3rd subregion 113, and the first end 31 of the first haptic element 30 in the second subregion 112 is connected with corresponding conducting wire 21.
In order to further improve the degree of integration of conducting wire 21, reduce the footprint area of matrix 10, between two nearest the first haptic elements 30, the first gap 50 is formed in the first subregion 111 and the second subregion 112, specifically as shown in fig. 1, namely described first gap 50 is formed between the first haptic element 30a in the first subregion 111 and the first haptic element 30b in the second subregion 112.The conducting wire 21 be connected with all first haptic elements 30 in the first subregion 111, all through described first gap 50, is connected with the second end 33 of the first corresponding haptic element 30 through these conducting wires 21 behind the first gap 50 again.
Similar, between two nearest the first haptic elements 30, the second gap 52 is formed in 3rd subregion 113 and the second subregion 112, namely as shown in fig. 1, described second gap 52 is formed between the first haptic element 30c in the 3rd subregion 113 and the first haptic element 30d in the second subregion 112.The conducting wire 21 be connected with all first haptic elements 30 in the 3rd subregion 113, all through described second gap 52, is connected with the second end 33 of the first corresponding haptic element 30 through these conducting wires 21 behind the second gap 52 again.
Further, gap 301 is formed between arbitrary neighborhood two the first haptic elements 30 in the first subregion 111.Each gap 301 is all wide.Form gap 302 between arbitrary neighborhood two the first haptic elements 30 in second subregion 112, each gap 302 is all wide.Form gap 303 between arbitrary neighborhood two the first haptic elements 30 in 3rd subregion 113, each gap 303 is all wide.
At least one in gap 303 in gap 302 in gap 301, second subregion 112 in first subregion 111 between arbitrary neighborhood two the first haptic elements 30 between arbitrary neighborhood two the first haptic elements 30 and the 3rd subregion 113 between arbitrary neighborhood two the first haptic elements 30 is less than described first gap 51 or the second gap 52.
In one embodiment, gap 301,302,303 wide, the first gap 51 and the second gap 52 wide.
First end 31 of the first haptic element 30 in the first end 31 to the second subregion 112 of the first haptic element 30 in the first subregion 111, the 3rd subregion 113 closer to the second end 33 of the first haptic element 30 in the second end 33 to the second subregion 112 of the first haptic element 30 in the second link 13, first subregion 111 of described matrix 10, the 3rd subregion 113 closer to the second link 13 of described matrix 10.Setting like this, can make conducting wire 21 more successfully be connected with the second end 33 of the first haptic element 30 in the first subregion 111, the 3rd subregion 113, for the arrangement of conducting wire 21 provides proportional space.
Further, first end 31 of the first haptic element 30 in the first subregion 111, the 3rd subregion 113 is concordant with a side 114 of the first link 11, and the second end 33 of the first haptic element 30 in the second subregion 112 is concordant with another side 115 relative of the first link 11.Because the second end 33 of the first haptic element 30 in the first subregion 111, the 3rd subregion 113 is for being connected with conducting wire 21, therefore the first end 31 place then without the need to being preserved for the space of arrangement conducting wire 21, thus can reduce the footprint area of matrix 10 as far as possible.
Arranged by above-mentioned winding displacement, the width of one end that connecting portion 12 is connected with the first link 11 is without the need to arranging wider size.In one embodiment, the width of one end that described connecting portion 12 is connected with the first link 11 is greater than the spacing between any two the first haptic elements 30 in the second subregion 112, is less than the spacing between the first subregion 111 and the 3rd subregion 113.
The width of one end that described connecting portion 12 is connected with the second link 13, roughly the same with the width of the second link 13.
With reference to figure 2, the utility model also provides a kind of electronic equipment applying above-mentioned flexible PCB 100.This electronic equipment can be mobile phone, panel computer, display terminal etc.The flexible PCB 100 that this electronic equipment comprises touch-screen 200 and is electrically connected with touch-screen 200.
Described touch-screen 200 comprises substrate 60 and is formed in the touch-control sensing layer 70 on substrate 60.Substrate 60 can be glass substrate, also can be the substrate of other materials such as PMMA.Touch-control sensing layer 70 can be formed directly into the conductive pattern layer on substrate 60, also can be first conductive pattern layer to be formed in independently on carrier, and then is combined by substrate 60 again, and in such cases, substrate 60 can as the cover sheet of electronic equipment.
Touch-control sensing layer 70 comprises the touch control electrode 71 for realizing touch controllable function, and for forming with the first haptic element 30 of flexible PCB 100 the conductive electrode (not shown) be electrically connected.Touch control electrode 71 is only shown with the form of square frame in fig. 2, is appreciated that in actual product, and touch control electrode 71 has multiple, and arranges with certain figure.
Adopt the flexible PCB 100 with the design of above-mentioned winding displacement, the side 114 of the first link 11 of the matrix 10 of flexible PCB 100 can be made concordant with a side 701 of touch-control sensing layer 70.In other words, within the first link 11 of flexible PCB 100 is positioned at the edge of touch-control sensing layer 70, connecting portion 12 and the second link 13 are positioned at beyond the edge of touch-control sensing layer 70.Because second end 33 of conducting wire 21 with the first haptic element 30 in the first subregion 111, the 3rd subregion 113 is connected, make this part conducting wire 21 can not expose to the edge of touch-control sensing layer 70, and then the area that flexible PCB 100 exposes to the edge of touch-control sensing layer 70 is reduced, thus this flexible PCB 100 is adapted to account for the electronic equipment of screen than larger (being also narrow frame) more.
Further, this substrate 60 has a side 601, and this side 601 is parallel with the side 701 of touch-control sensing layer 70.This substrate 60 also reserves shooting head bore 80 and infrared induction hole 81, and described shooting head bore 80 and infrared induction hole 81 lay respectively at the both sides of the connecting portion 12 of the matrix 10 of flexible PCB 100.Owing to adopting above-mentioned flexible PCB 100, the footprint area of matrix 10 is reduced, thus also can make more flexible with coordinating of the shooting head bore 80 on this electronic equipment and infrared induction hole 81, stop can not be caused because footprint area is excessive to shooting head bore 80 and infrared induction hole 81.
Understandably, above-mentioned electronic equipment also comprises other components such as the display module be combined with touch-screen 200, and this does not repeat.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this instructions is recorded.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. a flexible PCB, comprise matrix, be formed in the conductive circuit layer on matrix, multiple first haptic element and multiple second haptic element, described matrix comprises the first link and the second link, described first haptic element is positioned at the first link of matrix, described second haptic element is positioned at the second link of matrix, described conductive circuit layer comprises multiple conducting wire, each conducting wire is electrically connected between corresponding first haptic element and second haptic element, it is characterized in that, described first haptic element comprises near the first end of the second haptic element and the second end away from the second haptic element, wherein at least one conducting wire to be arranged between two adjacent the first haptic elements and to be connected with the second end of corresponding first haptic element.
2. flexible PCB according to claim 1, it is characterized in that, described first link comprises the first subregion, the second subregion and the 3rd subregion, second subregion is between the first subregion and the 3rd subregion, first subregion is connected with corresponding conducting wire with the second end of the first haptic element in the 3rd subregion, and the first end of the first haptic element in the second subregion is connected with corresponding conducting wire.
3. flexible PCB according to claim 2, is characterized in that, also has at least one in following two features:
Between two nearest the first haptic elements, form the first gap in first subregion and the second subregion, the conducting wire be connected with the first haptic element in the first subregion is all through described first gap; And
Between two nearest the first haptic elements, form the second gap in 3rd subregion and the second subregion, the conducting wire be connected with the first haptic element in the 3rd subregion is all through described second gap.
4. flexible PCB according to claim 3, it is characterized in that, at least one in the gap in the gap in the gap in the first subregion between arbitrary neighborhood two the first haptic elements, the second subregion between arbitrary neighborhood two the first haptic elements and the 3rd subregion between arbitrary neighborhood two the first haptic elements is less than described first gap or the second gap.
5. flexible PCB according to claim 2, it is characterized in that, first end of the first haptic element the first, in the 3rd subregion than the first end of the first haptic element in the second subregion closer to the second link of described matrix, the second end of the first haptic element in the first, the 3rd subregion than the second end of the first haptic element in the second subregion closer to the second link of described matrix.
6. flexible PCB according to claim 5, it is characterized in that, first end of the first haptic element the first, in the 3rd subregion is concordant with a side of the first link, and the second end of the first haptic element in the second subregion is concordant with another side relative of the first link.
7. flexible PCB according to claim 2, it is characterized in that, described matrix also comprises the connecting portion between first, second link, the width of one end that described connecting portion is connected with the first link is greater than the spacing between any two the first haptic elements in the second subregion, is less than the spacing between the first subregion and the 3rd subregion.
8. an electronic equipment, the flexible PCB comprising touch-screen and be electrically connected with touch-screen, described touch-screen comprises substrate and is formed in the touch-control sensing layer on substrate, described flexible PCB is the flexible PCB in claim 1-7 item described in any one, and described touch-control sensing layer is electrically connected with the first haptic element of flexible PCB.
9. electronic equipment as claimed in claim 8, it is characterized in that, the side of the first link of the matrix of described flexible PCB is concordant with a side of touch-control sensing layer.
10. electronic equipment as claimed in claim 8, it is characterized in that, the matrix of described flexible PCB also comprises the connecting portion between first, second link, the substrate of described touch-screen has a side parallel with the side of the first link of the matrix of described flexible PCB, reserved shooting head bore and infrared induction hole on described substrate, described shooting head bore and infrared induction hole are between the side and the side of substrate of the first link, and described shooting head bore and infrared induction hole lay respectively at the both sides of connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520265634.XU CN204576463U (en) | 2015-04-28 | 2015-04-28 | Flexible PCB and apply the electronic equipment of this flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520265634.XU CN204576463U (en) | 2015-04-28 | 2015-04-28 | Flexible PCB and apply the electronic equipment of this flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204576463U true CN204576463U (en) | 2015-08-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520265634.XU Withdrawn - After Issue CN204576463U (en) | 2015-04-28 | 2015-04-28 | Flexible PCB and apply the electronic equipment of this flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204576463U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106155405A (en) * | 2015-04-28 | 2016-11-23 | 深圳欧菲光科技股份有限公司 | Flexible PCB and apply the electronic equipment of this flexible PCB |
| CN111880684A (en) * | 2020-07-29 | 2020-11-03 | 深圳市康冠商用科技有限公司 | Infrared touch screen frame for installing functional components and display terminal thereof |
| CN106155405B (en) * | 2015-04-28 | 2024-04-26 | 安徽精卓光显技术有限责任公司 | Flexible circuit board and electronic equipment using same |
-
2015
- 2015-04-28 CN CN201520265634.XU patent/CN204576463U/en not_active Withdrawn - After Issue
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106155405A (en) * | 2015-04-28 | 2016-11-23 | 深圳欧菲光科技股份有限公司 | Flexible PCB and apply the electronic equipment of this flexible PCB |
| CN106155405B (en) * | 2015-04-28 | 2024-04-26 | 安徽精卓光显技术有限责任公司 | Flexible circuit board and electronic equipment using same |
| CN111880684A (en) * | 2020-07-29 | 2020-11-03 | 深圳市康冠商用科技有限公司 | Infrared touch screen frame for installing functional components and display terminal thereof |
| CN111880684B (en) * | 2020-07-29 | 2021-05-04 | 深圳市康冠商用科技有限公司 | Infrared touch screen frame for installing functional components and display terminal thereof |
| WO2022021481A1 (en) * | 2020-07-29 | 2022-02-03 | 深圳市康冠商用科技有限公司 | Infrared touch screen bezel for mounting functional assembly, and display terminal comprising same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Guangming New District Gongming street Shenzhen city Guangdong province 518106 white pine road o-film Technology Park HUAFA Road Patentee after: Ophiguang Group Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: Guangming New District Gongming street Shenzhen city Guangdong province 518106 white pine road o-film Technology Park HUAFA Road Patentee before: OFilm Tech Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: Guangming New District Gongming street Shenzhen city Guangdong province 518106 white pine road o-film Technology Park HUAFA Road Patentee after: OFilm Tech Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 518106 Guangdong province Shenzhen Guangming New Town of Gongming White Pine Road HUAFA Road Light Technology Park Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210423 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: Guangming New District Gongming street Shenzhen city Guangdong province 518106 white pine road o-film Technology Park HUAFA Road Patentee before: Ophiguang Group Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150819 Effective date of abandoning: 20240426 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20150819 Effective date of abandoning: 20240426 |