CN105934090B - Multiple-printed-panel for circuit board - Google Patents

Multiple-printed-panel for circuit board Download PDF

Info

Publication number
CN105934090B
CN105934090B CN201610380571.1A CN201610380571A CN105934090B CN 105934090 B CN105934090 B CN 105934090B CN 201610380571 A CN201610380571 A CN 201610380571A CN 105934090 B CN105934090 B CN 105934090B
Authority
CN
China
Prior art keywords
segment
circuit board
long side
printed
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610380571.1A
Other languages
Chinese (zh)
Other versions
CN105934090A (en
Inventor
陈鑫锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201610380571.1A priority Critical patent/CN105934090B/en
Publication of CN105934090A publication Critical patent/CN105934090A/en
Application granted granted Critical
Publication of CN105934090B publication Critical patent/CN105934090B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09081Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention discloses a kind of multiple-printed-panel for circuit board, jigsaw main body including being in rectangle, the jigsaw main body includes the first long side and multiple circuit boards, the multiple circuit board is equidistantly arranged along the extending direction of first long side, each circuit board includes the first segment and second segment being connected, the first segment and the second segment are elongated, first jiao of α is formed between the first segment and first long side, the second angle beta is formed between the second segment and the first segment, meet: 0 ° of 90 ° of < α <, α≤β≤+ 90 ° of α.The availability ratio of the armor plate of multiple-printed-panel for circuit board of the present invention is high.

Description

Multiple-printed-panel for circuit board
Technical field
The present invention relates to circuit board technology field more particularly to a kind of multiple-printed-panel for circuit board.
Background technique
With the update and improvement of surface mounting technology (Surface Mounted Technology, SMT) technological level, Printed circuit board (Printed Circuit Board, PCB, also known as circuit board) designer is carrying out multiple-printed-panel for circuit board design When, it needs to fully take into account the working condition of product, so that the product designed is met productibility requirement, to quickly launch Market meets market and the needs of client.Meanwhile designer also needs the utilization in view of plate when designing circuit board plate material One of an important factor for rate, availability ratio of the armor plate is influence circuit board cost.
When doing board design, some veneers of Chang Yinwei are too small, it has not been convenient to cross furnace (wave crest or reflow ovens) or cross surface Mounting technology equipment, it is necessary to which jigsaw solves process issues.The process of multiple-printed-panel for circuit board be by the veneer of some small sizes, Assembled arrangement becomes the process of a big circuit board plate material.In the prior art, often occur since veneer shape is non-rectangle, And cause the utilization rate to circuit board plate material low, cause plate to waste, cost waste when high-volume making sheet is very high.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of multiple-printed-panel for circuit board that availability ratio of the armor plate is high.
To achieve the goals above, embodiment of the present invention adopts the following technical scheme that
On the one hand, a kind of multiple-printed-panel for circuit board is provided, the jigsaw main body including being in rectangle, the jigsaw main body includes first long Side and multiple circuit boards, the multiple circuit board are equidistantly arranged along the extending direction of first long side, each circuit Plate includes the first segment and second segment being connected, and the first segment and the second segment are elongated, the first segment with First jiao of α is formed between first long side, forms the second angle beta between the second segment and the first segment, is met: 0 ° of < α 90 ° of <, α≤β≤+ 90 ° of α.
Wherein, first jiao of α meets: 25 °≤α≤65 °.
Wherein, each circuit board further includes third section, and the third section is connected to the separate institute of the second segment One end of first segment is stated, and forms gap between the third section and the adjacent second segment.
Wherein, the jigsaw main body further includes multiple T-shape plates, and the multiple T-shape plate is connected to institute correspondingly Multiple circuit boards are stated, each T-shape plate includes the riser and transverse slat being connected, and one end of the riser is connected to described The middle part of transverse slat, the other end of the riser are connected to the long side far from the first segment of the second segment, and each institute It states and is respectively formed gap between T-shape plate and the adjacent second segment.
Wherein, the first spacing T is formed between the adjacent circuit board of any two, second angle beta is equal to 90 °, institute First segment is stated with the first width T1, the second segment has the second width T2, and the riser is elongated and perpendicular to described Second segment, the riser have the 4th width T4 and the 4th length L4, and the riser is with the second segment far from described first The second interval S is formed between the short side of section, is met: S≤T1-T4, T4 >=T2+2 × T.
Wherein, the transverse slat is elongated, and the transverse slat is perpendicular to the riser and symmetrical relative to the riser, described Transverse slat has the 5th width T5 and the 5th length L5, meets: L5≤2 × S, T5≤T2.
Wherein, the jigsaw main body further includes the second long side being oppositely arranged with first long side, each circuit Plate is all connected with the first long side setting, and each T-shape plate is all connected with the second long side setting.
Wherein, the jigsaw main body further includes two be relatively connected between first long side and second long side Short side, two circuit boards for being arranged in the multiple circuit board ends are respectively connected to two short sides.
Wherein, the first spacing T is formed between the adjacent circuit board of any two, second angle beta is equal to 90 °, institute First segment is stated with the first width T1, the second segment has the second width T2, first jiao of α satisfaction:
Wherein, the first spacing T is formed between the adjacent circuit board of any two, met: 1.5mm≤T≤3mm.
Compared to the prior art, the invention has the following advantages:
Multiple-printed-panel for circuit board described in the embodiment of the present invention, since the multiple circuit board is along described the first of the jigsaw main body The extending direction of long side equidistantly arranges, and first jiao of α is formed between the first segment and first long side, and described second The second angle beta is formed between section and the first segment, is met: 0 ° of 90 ° of < α <, α≤β≤+ 90 ° of α, so as to reduce the spelling The area of plate main body effectively improves the multiple circuit board to the utilization rate of the jigsaw main body, reduces production cost.Change speech It, the availability ratio of the armor plate of the multiple-printed-panel for circuit board is high.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is a kind of structural schematic diagram of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 2 is a kind of structural schematic diagram of the circuit board of multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 3 is the structural schematic diagram of another multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 4 is the structural schematic diagram of another multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Fig. 5 is the structural schematic diagram of the circuit board of another multiple-printed-panel for circuit board provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
In addition, the explanation of following embodiment is referred to the additional illustration, the spy that can be used to implement to illustrate the present invention Determine embodiment.Direction terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side " etc. are only the directions with reference to annexed drawings, and therefore, the direction term used is to more preferably, more clearly say The bright and understanding present invention, rather than indicate or imply signified device or element and must have a particular orientation, with specific square Position construction and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection ", " be arranged exist ... on " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to removably connect It connects, or is integrally connected;It can be mechanical connection;It can be directly connected, can also indirectly connected through an intermediary, it can To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition Concrete meaning in the present invention.
In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.If this Occur the term of " process " in specification, refers not only to independent process, when can not clearly be distinguished with other process, as long as Effect desired by the process is able to achieve then to be also included in this term.In addition, the numerical value model indicated in this specification with "~" Enclose the range for referring to that the numerical value for recording "~" front and back is included as minimum value and maximum value.In the accompanying drawings, structure Similar or identical unit is indicated by the same numeral.
Also referring to Fig. 1 and Fig. 2, the embodiment of the present invention provides a kind of multiple-printed-panel for circuit board 100, the jigsaw including being in rectangle Main body 10, the jigsaw main body 10 include the first long side 101 and multiple circuit boards 1, and the multiple circuit board 1 is long along described first The extending direction on side 101 equidistantly arranges, and each circuit board 1 includes the first segment 11 and second segment 12 being connected, institute It states first segment 11 and the second segment 12 is elongated, form first between the first segment 11 and first long side 101 Angle α forms the second angle beta between the second segment 12 and the first segment 11, meet: 0 ° of 90 ° of < α <, α≤β≤+ 90 ° of α.
In the present embodiment, first long side 101 due to the multiple circuit board 1 along the jigsaw main body 10 is prolonged It stretches direction equidistantly to arrange, and forms first jiao of α, the second segment between the first segment 11 and first long side 101 The second angle beta is formed between 12 and the first segment 11, is met: 0 ° of 90 ° of < α <, α≤β≤+ 90 ° of α, it is described so as to reduce The area of jigsaw main body 10 effectively improves the multiple circuit board 1 to the utilization rate of the jigsaw main body 10, and reduction is produced into This.In other words, the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high.
It should be appreciated that in the present embodiment, the multiple equidistantly arrangement of circuit board 1, therefore the two of arbitrary neighborhood institutes State the spacing between two second segments 12 of the spacing and arbitrary neighborhood between first segment 11 be it is identical always, with convenient Subsequent process is gone on smoothly.
Further, as a kind of alternative embodiment, first jiao of α meets: 25 °≤α≤65 °.At this point, the circuit The area of the waste material (namely plate in addition to the multiple circuit board 1 of the jigsaw main body 10) of plate jigsaw 100 is small, described Multiple-printed-panel for circuit board 100 has higher availability ratio of the armor plate.
Also referring to Fig. 1 and Fig. 2, as a kind of preferred embodiment, any two of the multiple-printed-panel for circuit board 100 are adjacent The circuit board 1 between form the first spacing T, second angle beta is equal to 90 °, and the first segment 11 has the first width T1, The second segment 12 has the second width T2, first jiao of α satisfaction:
It should be understood that the first width T1 refers to that the first segment 11 is big in the size perpendicular to its extending direction Small, the second width T2 refers to the second segment 12 in the size perpendicular to its extending direction.The first segment 11 is also Refer to the size of size of the first segment 11 in its extending direction with the first length L1, the first length L1.Preferably, The multiple circuit board 1 of the present embodiment meets: L1 >=2 × T2+T.
For example, first jiao of α is 45 ° when the first width T1 is equal to the second width T2;When described first When width T1 is greater than the second width T2, first jiao of α meets: 45 °≤α≤65 °;When the first width T1 is less than institute When stating the second width T2, first jiao of α meets: 25 °≤α≤45 °.
Further, referring to Fig. 1, as a kind of alternative embodiment, the jigsaw main body 10 further includes and described first The second long side 102 that long side 101 is oppositely arranged, each circuit board 1 connect first long side 101 and described the simultaneously Two long sides 102.Preferably, the jigsaw main body 10 further includes relatively being connected to first long side 101 and second length Two short sides 103 between side 102 are arranged in two 1 (such as first, figures of circuit board at the multiple 1 both ends of circuit board The circuit board 1 and the last one described circuit board 1) it is respectively connected to two short sides 103.At this point, the jigsaw main body 10 area is minimum, further reduces waste material area, and the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high.
Further, referring to Fig. 3, as a kind of alternative embodiment, each circuit board 1 further includes third section 13, the third section 13 be connected to the second segment 12 far from the first segment 11 one end, and the third section 13 with Gap namely the third section 13 are formed between the adjacent second segment 12 weight does not occur with the adjacent second segment 12 It is folded.Even, one end far from the second segment 12 of the third section 13 can also continue to the 4th section, the 5th section of connection etc., make It is substantially wavy to obtain each circuit board 1.
It should be appreciated that the third section 13 can connect to the short side far from the first segment 11 of the second segment 12 On, it also can connect to the end position of the long side far from the first segment 11 of the second segment 12.
Further, referring to Figure 4 together and Fig. 5, as a kind of alternative embodiment, the jigsaw main body 10 further includes more A T-shape plate 2, the multiple T-shape plate 2 are connected to the multiple circuit board 1 correspondingly, and each T-shape plate 2 is Including the riser 14 and transverse slat 15 being connected, one end of the riser 14 is connected to the middle part of the transverse slat 15, the riser 14 The other end be connected to the second segment 12 far from the first segment 11 long side 121, and each T-shape plate 2 with Gap namely each T-shape plate 2 are respectively formed between the adjacent second segment 12 will not be with the adjacent second segment 12 overlap.
In the present embodiment, the setting of the multiple T-shape plate 2 is so that the application of the circuit board 1 is more diversified.Example Such as, when the circuit board 1 is applied to Mobile terminal main board, the riser 14 is formed by the T-shape with the transverse slat 15 Plate 2 can be used for connecting side key.
For example, referring to Figure 4 together and Fig. 5, the first spacing is formed between the adjacent circuit board 1 of any two T, second angle beta are equal to 90 °, and the first segment 11 has the first width T1, and the second segment 12 has the second width T2, institute It is elongated and perpendicular to the second segment 12 to state riser 14, the riser 14 has the 4th width T4 and the 4th length L4, institute It states and forms the second interval S between riser 14 and the short side 122 far from the first segment 11 of the second segment 12, meet: S≤ T1-T4, T4 >=T2+2 × T.
In the present embodiment, the setting of the interval S and the 4th length L4, so that the institute of each T-shape plate 2 Stating riser 14 will not be Chong Die with the multiple circuit board 1, and the arrangement of the multiple circuit board 1 and multiple risers 14 is compact And rationally, the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high.
Further, the transverse slat 15 is elongated, and the transverse slat 15 is perpendicular to the riser 14 and relative to described perpendicular Plate 14 is symmetrical, and the transverse slat 15 has the 5th width T5 and the 5th length L5, meets: L5≤2 × S, T5≤T2.
In the present embodiment, the setting of the 5th width T5 and the 5th length L5, so that each T-shape plate 2 is described Transverse slat 15 will not be Chong Die with the multiple circuit board 1, and the arrangement of the multiple circuit board 1 and the multiple T-shape plate 2 is compact And rationally, the availability ratio of the armor plate of the multiple-printed-panel for circuit board 100 is high.
Further, referring to Fig. 4, as a kind of alternative embodiment, the jigsaw main body 10 further includes and described first The second long side 102 that long side 101 is oppositely arranged, each circuit board 1 are all connected with first long side 101 and are arranged, Mei Gesuo It states T-shape plate 2 and is all connected with the setting of the second long side 102.Meanwhile the jigsaw main body 10 further include relatively be connected to it is described Two short sides 103 between first long side 101 and second long side 102 are arranged in two of the multiple 1 both ends of circuit board The circuit board 1 is respectively connected to two short sides 103.At this point, the area of the jigsaw main body 10 is minimum, further decrease The availability ratio of the armor plate of waste material area, the multiple-printed-panel for circuit board 100 is high.
Further, Fig. 1, Fig. 3 and Fig. 4 are please referred to, as a kind of alternative embodiment, in order to make the multiple circuit board 1 arrangement is compact, while facilitating the progress of subsequent technique again, and the first spacing T meets: 1.5mm≤T≤3mm.Preferably, T =2mm.
Further, referring to Fig. 1, as a kind of alternative embodiment, the multiple-printed-panel for circuit board 100 further includes two techniques Side 4, described two technique edges 4 are respectively connected to first long side 101 and second long side 102.The technique edges 4 to It is passed in surface mounting technology (Surface Mounted Technology, SMT) equipment for the multiple-printed-panel for circuit board 100 Send use.
Further, referring to Fig. 1, as a kind of alternative embodiment, the multiple-printed-panel for circuit board 100 is also provided at least four A location hole 5, at least four location hole 5 are dispersed in the surrounding of the multiple circuit board 1.When carrying out surface mount, table Face paste dress technical equipment completes the patch of element on the multiple-printed-panel for circuit board 100 by identifying that the location hole 5 is aligned Dress.
The embodiment of the present invention has been described in detail above, specific case used herein to the principle of the present invention and Embodiment is expounded, and the above description of the embodiment is only used to help understand the method for the present invention and its core ideas; At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the present invention There is change place, in conclusion the contents of this specification are not to be construed as limiting the invention.

Claims (8)

1. a kind of multiple-printed-panel for circuit board, which is characterized in that the jigsaw main body including being in rectangle, the jigsaw main body include the first long side With multiple circuit boards, the multiple circuit board is equidistantly arranged along the extending direction of first long side, each circuit board It include the first segment and second segment being connected, the first segment and the second segment are elongated, the first segment and institute It states and forms first jiao of α between the first long side, form the second angle beta between the second segment and the first segment, meet: 0 ° of < α < 90 °, α≤β≤+ 90 ° of α;
Wherein, the jigsaw main body further includes multiple T-shape plates, and the multiple T-shape plate is connected to described more correspondingly A circuit board, each T-shape plate includes the riser and transverse slat being connected, and one end of the riser is connected to the transverse slat Middle part, the other end of the riser is connected to the long side far from the first segment of the second segment, and " T " Gap is respectively formed between template and the adjacent second segment.
2. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that first jiao of α meets: 25 °≤α≤65 °.
3. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that formed between the adjacent circuit board of any two First spacing T, second angle beta are equal to 90 °, and the first segment has the first width T1, and the second segment has the second width T2, the riser is elongated and perpendicular to the second segment, and the riser has the 4th width T4 and the 4th length L4, described The second interval S is formed between riser and the short side far from the first segment of the second segment, is met: S≤T1-T4, T4 >=T2 +2×T。
4. multiple-printed-panel for circuit board as claimed in claim 3, which is characterized in that the transverse slat is elongated, the transverse slat perpendicular to The riser and symmetrical relative to the riser, the transverse slat have the 5th width T5 and the 5th length L5, meet: L5≤2 × S, T5≤T2.
5. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that the jigsaw main body further includes and first long side The second long side being oppositely arranged, each circuit board are all connected with the first long side setting, and each T-shape plate is all connected with The second long side setting.
6. multiple-printed-panel for circuit board as claimed in claim 5, which is characterized in that the jigsaw main body further includes relatively being connected to institute Two short sides between the first long side and second long side are stated, two circuits of the multiple circuit board ends are arranged in Plate is respectively connected to two short sides.
7. such as the described in any item multiple-printed-panel for circuit board of claim 1 to 2, which is characterized in that the adjacent circuit of any two The first spacing T is formed between plate, second angle beta is equal to 90 °, and the first segment has the first width T1, the second segment tool There is the second width T2, first jiao of α satisfaction:
8. multiple-printed-panel for circuit board as described in claim 1, which is characterized in that formed between the adjacent circuit board of any two First spacing T meets: 1.5mm≤T≤3mm.
CN201610380571.1A 2016-05-31 2016-05-31 Multiple-printed-panel for circuit board Expired - Fee Related CN105934090B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610380571.1A CN105934090B (en) 2016-05-31 2016-05-31 Multiple-printed-panel for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610380571.1A CN105934090B (en) 2016-05-31 2016-05-31 Multiple-printed-panel for circuit board

Publications (2)

Publication Number Publication Date
CN105934090A CN105934090A (en) 2016-09-07
CN105934090B true CN105934090B (en) 2019-02-01

Family

ID=56832144

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610380571.1A Expired - Fee Related CN105934090B (en) 2016-05-31 2016-05-31 Multiple-printed-panel for circuit board

Country Status (1)

Country Link
CN (1) CN105934090B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108200718A (en) * 2018-02-22 2018-06-22 广东欧珀移动通信有限公司 Circuit board

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2343059A (en) * 1998-10-21 2000-04-26 Jerseyfield Limited A method for tracking printed circuit boards on multi-board panels through a production process
CN2800697Y (en) * 2005-06-03 2006-07-26 上海华仕德电路技术有限公司 Typesetting structure of non-distance flexible circuit board
CN2802902Y (en) * 2005-06-24 2006-08-02 上海华仕德电路技术有限公司 Obverse and reverse arrangement structure of flexible circuit board
CN201491384U (en) * 2009-08-19 2010-05-26 广东依顿电子科技股份有限公司 Jointing-board structure of circuit board
CN202197453U (en) * 2011-09-22 2012-04-18 卧龙电气集团股份有限公司 Jointed circuit board used for Hall electric machine
CN102946690A (en) * 2012-11-01 2013-02-27 广东欧珀移动通信有限公司 Method for manufacturing circuit board
CN103997859A (en) * 2014-06-03 2014-08-20 深圳市华大电路科技有限公司 Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2343059A (en) * 1998-10-21 2000-04-26 Jerseyfield Limited A method for tracking printed circuit boards on multi-board panels through a production process
CN2800697Y (en) * 2005-06-03 2006-07-26 上海华仕德电路技术有限公司 Typesetting structure of non-distance flexible circuit board
CN2802902Y (en) * 2005-06-24 2006-08-02 上海华仕德电路技术有限公司 Obverse and reverse arrangement structure of flexible circuit board
CN201491384U (en) * 2009-08-19 2010-05-26 广东依顿电子科技股份有限公司 Jointing-board structure of circuit board
CN202197453U (en) * 2011-09-22 2012-04-18 卧龙电气集团股份有限公司 Jointed circuit board used for Hall electric machine
CN102946690A (en) * 2012-11-01 2013-02-27 广东欧珀移动通信有限公司 Method for manufacturing circuit board
CN103997859A (en) * 2014-06-03 2014-08-20 深圳市华大电路科技有限公司 Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof

Also Published As

Publication number Publication date
CN105934090A (en) 2016-09-07

Similar Documents

Publication Publication Date Title
CN104777939A (en) Touch panel
CN103079353A (en) Method for improving overlength high frequency circuit board hole site working accuracy
CN105934090B (en) Multiple-printed-panel for circuit board
CN203840633U (en) Flexible circuit board and signal transmission device
CN205071464U (en) Pad
CN102686027A (en) Flexible circuit board and manufacturing method thereof
CN203674376U (en) Broadband omnidirectional antenna
CN105848414B (en) Multiple-printed-panel for circuit board
CN204069487U (en) A kind of printed circuit board (PCB)
JP2006196748A (en) Printed circuit board, substrate base material and electronic apparatus
CN205902199U (en) FPC gold finger structure
CN105934087B (en) Multiple-printed-panel for circuit board
CN204577793U (en) Multiplexer
CN103746177B (en) A kind of wideband omnidirectional antenna
CN103917041A (en) Flexible circuit board and manufacturing method thereof
CN206350239U (en) A kind of modern electronic component structure
CN203884065U (en) Flexible circuit board and electronic device including the same
CN102291974B (en) Cutting side positioning type welding structure and method for preventing pins from shifting
CN102691707A (en) Base connector applicable to display
CN204818357U (en) Wave -soldering supports tray
CN104411102A (en) PCB splitting jig
TWM461284U (en) The jumper for printed wiring board and printed wiring board
CN102955527B (en) A kind of bracket and the welding method to the bracket
CN206712083U (en) A kind of clathrate connector
CN203788553U (en) Printed circuit board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190201

CF01 Termination of patent right due to non-payment of annual fee