CN102946690A - Method for manufacturing circuit board - Google Patents
Method for manufacturing circuit board Download PDFInfo
- Publication number
- CN102946690A CN102946690A CN2012104317524A CN201210431752A CN102946690A CN 102946690 A CN102946690 A CN 102946690A CN 2012104317524 A CN2012104317524 A CN 2012104317524A CN 201210431752 A CN201210431752 A CN 201210431752A CN 102946690 A CN102946690 A CN 102946690A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- flexible
- sheet material
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a method for preparing a circuit board. The method comprises the following steps: S1: partitioning a flexible circuit board material (101) into a plurality of strip-shaped typesetting units (102) in array arrangement; S2: at least setting one bending area (103) in each strip-shaped typesetting unit (102), and arranging an electronic component (s) (104) on one side or two sides of the bending area (103); S3: blanking the flexible circuit board material (101) on which the electronic components (104) are arranged into a plurality of flexible circuit boards (105) one by one in an array manner; and S4: bending the blanked flexible circuit boards (105) at the bending areas (103) one by one. The method for manufacturing the circuit board has the benefits that as the strip-shaped flexible circuit boards are typeset in the flexible circuit board material in a strip-shaped manner, the flexible circuit board material is high in utilization ratio and small in loss and the cost in preparing a single flexible circuit board is low.
Description
Technical field
The present invention relates to field of circuit boards, more particularly, relate to a kind of method for preparing circuit board.
Background technology
Flexible PCB is called for short soft board or FPC, is that make take polyimides or polyester film as base material a kind of has height reliability, and excellent flexible printed circuit has the advantages such as distribution density is high, lightweight, thin thickness.
, a collection of flexible PCB need to be produced on the flexible PCB sheet material of a monoblock together during flexible PCB in preparation, and then with the single flexible circuit board one by one stamping-out get off.The type-setting mode of single flexible circuit board can affect utilance and the production efficiency of flexible circuit sheet material, at the flexible circuit sheet material of same area more multiunit flexible PCB of arranging, is the key factor that the designer considers how.Existing flexible PCB (FPC) cost calculation is to decide price according to area, flexible PCB on the backlight product (FPC) mostly is L shaped flexible PCB, its type-setting mode as shown in Figure 1, in flexible circuit sheet material 101, there is vacant part, this part needs as waste disposal, waste most of raw material, thereby increased the cost of single flexible circuit board (FPC).
Summary of the invention
The technical problem to be solved in the present invention is that the low defective of above-mentioned flexible circuit sheet material utilance for prior art provides a kind of flexible circuit sheet material utilance the high method for preparing circuit board.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of method for preparing circuit board, may further comprise the steps:
S1: the composing unit that flexible circuit sheet material is divided into the strip that a plurality of array way arrange;
S2: in the described composing unit of the strip of dividing, a bent area is set at least, at the one or both sides of described bent area layout electronic devices and components;
S3: with layout the described flexible circuit sheet material behind the electronic devices and components by array way one by one stamping-out become a plurality of flexible PCBs;
S4: the described flexible PCB behind the stamping-out is bent one by one at its bent area.
In the method for preparing circuit board of the present invention, in described step S4, L shaped, the door shape or Z-shaped of being shaped as after the described flexible PCB bending.
In the method for preparing circuit board of the present invention, described flexible circuit sheet material be shaped as rectangle.
In the method for preparing circuit board of the present invention, before described step S1, also comprise step: the size of setting according to demand the composing unit of described strip.
In the method for preparing circuit board of the present invention, described strip refers to that width dimensions is below 1/3rd of length dimension.
In the method for preparing circuit board of the present invention, the flexible PCB that each stamping-out goes out to have same widths or length among the described step S3.
In the method for preparing circuit board of the present invention, the layout electronic devices and components refer to by paster or wave-soldering mode electronic devices and components are fixed on the described composing unit among the described step S2.
In the method for preparing circuit board of the present invention, among the described step S1, be provided with art border around the described flexible circuit sheet material; Be provided with MARK point, location hole and fool proof point in the described art border.
In the method for preparing circuit board of the present invention, described MARK point is arranged on the position at described art border diagonal angle.
Implement the method for preparing circuit board of the present invention, have following beneficial effect: adopt the flexible PCB of strip to carry out the bar shaped composing in flexible circuit sheet material, flexible circuit sheet material utilance is high, and loss is little, and preparation single flexible circuit board cost is low.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is flexible circuit sheet material composing schematic diagram of the prior art;
Fig. 2 is the method flow diagram that the present invention prepares circuit board;
Fig. 3 is that the present invention prepares flexible circuit sheet material composing schematic diagram in the method for circuit board;
Fig. 4 is that the present invention prepares layout electronic devices and components schematic diagram in the method for circuit board;
Fig. 5 is that the present invention prepares flexible PCB bending sketch map in the method for circuit board.
Embodiment
Understand for technical characterictic of the present invention, purpose and effect being had more clearly, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
As shown in Figure 2, the present invention's method of preparing circuit board may further comprise the steps:
S1: the composing unit 102 that flexible circuit sheet material 101 is divided into the strip that a plurality of array way arrange;
S2: in the described composing unit 102 of the strip of dividing, a bent area 103 is set at least, at the one or both sides of described bent area 103 layout electronic devices and components 104;
S3: with layout the described flexible circuit sheet material 101 behind the electronic devices and components 104 by array way one by one stamping-out become a plurality of flexible PCBs 105;
S4: the described flexible PCB 105 behind the stamping-out is bent one by one at its bent area 103.
In the method step S4 of above-mentioned preparation circuit board, being shaped as after flexible PCB 105 bends one by one is L shaped, door shape or Z-shaped.Before the above-mentioned method for preparing circuit board, also comprise step: the size of setting according to demand the composing unit 102 of strip.
At first, the area of user's flexible PCB 105 according to demand, the size of the composing unit 102 of design strip makes both areas equate that strip refers to that width dimensions is below 1/3rd of length dimension.Select the rectangle flexible circuit sheet material 101 corresponding with the size of flexible PCB 105, flexible circuit sheet material 101 is divided into the composing unit 102 of a plurality of strips of arranging with array way, be provided with art border around the flexible circuit sheet material 101, the conveyer belt of leaving patch device for uses.In order to guarantee that flexible circuit sheet material 101 can be placed on the anchor clamps of printing equipment accurately, securely, need to arrange a pair of or two pairs of non-metallic location holes, location hole is designed to circle.When adopting different chip mounters, the position of location hole, quantity and size all can be different, should set according to chip mounter.In order accurately to mount components and parts, at the art border of flexible circuit sheet material 101 location MARK point and fool proof point are set.The MARK point is arranged on the position at art border diagonal angle, and the MARK point adopts filled circles, can be naked copper, by naked copper, nickel plating or the zinc-plated or scolding tin coating of limpid inoxidzable coating protection.Secondly, in each composing unit 102 of dividing, a bent area 103 is set at least, at the one or both sides of bent area layout electronic devices and components 104, see also shown in Figure 4ly, can electronic devices and components 104 be fixed on the composing unit 102 by paster or wave-soldering mode.Then, with layout the described flexible circuit sheet material 101 behind the electronic devices and components 104 by array way one by one stamping-out become a plurality of flexible PCBs 105, flexible PCB 105 width or length that each stamping-out goes out are identical.Because flexible PCB 105 has bent characteristic, at last, the flexible PCB 105 behind the stamping-out is bent one by one at bent area 103, can form L shaped when a bent area 103 is set, can form a shape or Z-shaped when two bent areas 103 are set, see also shown in Figure 5.The angle of flexible PCB 105 bending, shape need guarantee in the bending place components and parts to be set according to user's requirements set.Can adopt manual bending during bending flexible circuit board 105, when producing in enormous quantities for the flexible PCB 105 of same shape, also can adopt mechanical deflection, the angle of bending and shape consistency are high, also can reduce cost of labor simultaneously.
The method for preparing circuit board according to the present invention, in the embodiment of a L shaped flexible PCB of preparation, such as Fig. 1, shown in Figure 3, specific operation process is as follows: (1) is according to the area of L shaped flexible PCB, set the size of the composing unit 102 of strip, then according to the rectangle flexible circuit sheet material 101 of the corresponding size of size Selection of the composing unit 102 of strip.(2) flexible circuit sheet material 101 is divided into the composing unit 102 of a plurality of strips of arranging with array way, then design technology frame around rectangle flexible circuit sheet material 101 arranges MARK point, location hole and fool proof point at art border again.(3) bent area 103 is set in the composing of each after the division unit 102, at the both sides of bent area 103 layout electronic devices and components 104.(4) with layout the flexible circuit sheet material 101 behind the electronic devices and components 104 by array way one by one stamping-out become a plurality of flexible PCBs 105; (5) one by one be bent into L shaped at bent area 103 flexible PCB 105 behind the stamping-out.
In above-mentioned specific embodiment, the flexible PCB 105 of 11 strips of in flexible circuit sheet material 101, having set type, generate 11 L shaped flexible PCBs by bending again, and 8 the L shaped flexible PCBs of only having set type in the flexible circuit sheet material 101 of the same area in the prior art.When utilizing the flexible PCB of flexible circuit sheet material 101 other shapes of preparation of the same area, such as door shape or Z-shaped, the flexible PCB number that adopts this method to prepare all can be more than the flexible PCB number of prior art preparation.This shows, adopt the method for preparing circuit board of the present invention, the utilance of flexible circuit sheet material 101 is high, and the single flexible circuit board cost of preparation is low, has improved industrial economic benefit.
The above is described embodiments of the invention by reference to the accompanying drawings; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away from the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (9)
1. a method for preparing circuit board is characterized in that, may further comprise the steps:
S1: the composing unit (102) that flexible circuit sheet material (101) is divided into the strip that a plurality of array way arrange;
S2: in the described composing unit (102) of the strip of dividing, a bent area (103) is set at least, at the one or both sides of described bent area (103) layout electronic devices and components (104);
S3: with layout the described flexible circuit sheet material (101) behind the electronic devices and components (104) by array way one by one stamping-out become a plurality of flexible PCBs (105);
S4: the described flexible PCB (105) behind the stamping-out is bent one by one at its bent area (103).
2. the method for preparing circuit board according to claim 1 is characterized in that, in described step S4, being shaped as after described flexible PCB (105) bending is L shaped, door shape or Z-shaped.
3. the method for preparing circuit board according to claim 2 is characterized in that, described flexible circuit sheet material (101) be shaped as rectangle.
4. the method for preparing circuit board according to claim 3 is characterized in that, also comprises step before described step S1: the size of setting according to demand the composing unit (102) of described strip.
5. the method for preparing circuit board according to claim 3 is characterized in that, described strip refers to that width dimensions is below 1/3rd of length dimension.
6. the method for preparing circuit board according to claim 3 is characterized in that, the flexible PCB (105) that each stamping-out goes out to have same widths or length among the described step S3.
7. the method for preparing circuit board according to claim 3 is characterized in that, layout electronic devices and components (104) refer to by paster or wave-soldering mode electronic devices and components (104) are fixed on the described composing unit (102) among the described step S2.
8. each described method for preparing circuit board is characterized in that according to claim 1-7, in described step S1, is provided with art border around the described flexible circuit sheet material (101); Be provided with MARK point, location hole and fool proof point in the described art border.
9. the method for preparing circuit board according to claim 1 is characterized in that, described MARK point is arranged on the position at described art border diagonal angle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104317524A CN102946690A (en) | 2012-11-01 | 2012-11-01 | Method for manufacturing circuit board |
| PCT/CN2013/075223 WO2014067275A1 (en) | 2012-11-01 | 2013-05-06 | Method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104317524A CN102946690A (en) | 2012-11-01 | 2012-11-01 | Method for manufacturing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102946690A true CN102946690A (en) | 2013-02-27 |
Family
ID=47729579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104317524A Pending CN102946690A (en) | 2012-11-01 | 2012-11-01 | Method for manufacturing circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102946690A (en) |
| WO (1) | WO2014067275A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014067275A1 (en) * | 2012-11-01 | 2014-05-08 | 广东欧珀移动通信有限公司 | Method for manufacturing circuit board |
| CN104992629A (en) * | 2015-05-29 | 2015-10-21 | 深圳市奥拓电子股份有限公司 | Display screen lamp panel and splicing method thereof |
| CN105208803A (en) * | 2015-09-24 | 2015-12-30 | 高德（无锡）电子有限公司 | Fool-proof method for multi-layer plate misplacing |
| CN105934090A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Assembled circuit board |
| EP3089000A4 (en) * | 2013-12-24 | 2016-12-14 | Kunshan Visionox Display Co Ltd | Fpc of capacitive touch screen and method for mounting fpc |
| CN105960094B (en) * | 2016-05-31 | 2019-02-01 | Oppo广东移动通信有限公司 | Multiple-printed-panel for circuit board and its processing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109537015B (en) * | 2019-01-09 | 2023-04-25 | 零壹电子(珠海)有限公司 | Device and method applied to micro-miniature multilayer circuit board electroplating |
| CN111741598A (en) * | 2020-07-01 | 2020-10-02 | 苏州市华扬电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101366324A (en) * | 2006-08-29 | 2009-02-11 | 日本梅克特隆株式会社 | Flexible wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2800697Y (en) * | 2005-06-03 | 2006-07-26 | 上海华仕德电路技术有限公司 | Typesetting structure of non-distance flexible circuit board |
| CN102946690A (en) * | 2012-11-01 | 2013-02-27 | 广东欧珀移动通信有限公司 | Method for manufacturing circuit board |
-
2012
- 2012-11-01 CN CN2012104317524A patent/CN102946690A/en active Pending
-
2013
- 2013-05-06 WO PCT/CN2013/075223 patent/WO2014067275A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101366324A (en) * | 2006-08-29 | 2009-02-11 | 日本梅克特隆株式会社 | Flexible wiring board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014067275A1 (en) * | 2012-11-01 | 2014-05-08 | 广东欧珀移动通信有限公司 | Method for manufacturing circuit board |
| EP3089000A4 (en) * | 2013-12-24 | 2016-12-14 | Kunshan Visionox Display Co Ltd | Fpc of capacitive touch screen and method for mounting fpc |
| US10162455B2 (en) | 2013-12-24 | 2018-12-25 | Kunshan Visionox Display Co., Ltd. | FPC of a capacitive touchscreen and a method for mounting the FPC |
| CN104992629A (en) * | 2015-05-29 | 2015-10-21 | 深圳市奥拓电子股份有限公司 | Display screen lamp panel and splicing method thereof |
| CN104992629B (en) * | 2015-05-29 | 2020-09-04 | 深圳市奥拓电子股份有限公司 | Display screen lamp panel and splicing method thereof |
| CN105208803A (en) * | 2015-09-24 | 2015-12-30 | 高德（无锡）电子有限公司 | Fool-proof method for multi-layer plate misplacing |
| CN105934090A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Assembled circuit board |
| CN105934090B (en) * | 2016-05-31 | 2019-02-01 | Oppo广东移动通信有限公司 | Multiple-printed-panel for circuit board |
| CN105960094B (en) * | 2016-05-31 | 2019-02-01 | Oppo广东移动通信有限公司 | Multiple-printed-panel for circuit board and its processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014067275A1 (en) | 2014-05-08 |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130227 |