CN107241011A - A kind of power module and electronic product - Google Patents
A kind of power module and electronic product Download PDFInfo
- Publication number
- CN107241011A CN107241011A CN201710480718.9A CN201710480718A CN107241011A CN 107241011 A CN107241011 A CN 107241011A CN 201710480718 A CN201710480718 A CN 201710480718A CN 107241011 A CN107241011 A CN 107241011A
- Authority
- CN
- China
- Prior art keywords
- power module
- electric capacity
- inductance
- circuit board
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of power module, including control chip and circuit board, in addition to electric capacity and the inductance with pin, inductance is connected by pin with circuit board, and is placed in bridge like on circuit board；Electric capacity is placed in the space between circuit board and inductance, and is connected with circuit board.As can be seen here, under such space layout mode, it is believed that inductance uses shared space in overlapping form in the plane with electric capacity, therefore the space for needing to take in the plane is saved.On the other hand, due to without reducing the inductance area and electric capacity quantity in power module for the space shared by saving power module and then being forced to improve working frequency, so also further reducing the use cost of power module.In addition, including above-mentioned power module the invention also discloses a kind of electronic product, equally with the effect above.
Description
Technical field
The present invention relates to Power Management Design field, more particularly to a kind of power module and electronic product.
Background technology
In current design of circuit system, because number of elements is more and more and design of product becomes increasingly complex,
Cause the global density of element in circuit very high, and power module is as element larger with respect to space-consuming on circuit board,
Certain influence is existed to space wiring on circuit board.
In the prior art, in order to reduce the space that power module takes circuit board, often take reduction inductor size and subtract
The method of the quantity of few output capacitance.But in order to be able to reach the original working effect of power module, must just improve power supply mould
The working frequency of the control chip of block.Although this reduces the area occupied of electric power source pair of module circuit board, power module
Control chip, which is chronically under high-frequency working condition, significantly to reduce the service life of power module, and then adds power supply
The use cost of module.
As can be seen here there is provided a kind of use cost is relatively low and to the less power module of circuit board plane space hold,
It is those skilled in the art's urgent problem to be solved.
The content of the invention
It is an object of the invention to provide a kind of power module and electronic product, to reduce use cost and reduce to circuit
The occupancy of plate plane space.
In order to solve the above technical problems, the present invention provides a kind of power module, including control chip and circuit board, in addition to
Electric capacity and the inductance with pin, inductance are connected by pin with circuit board, and are placed in bridge like on circuit board；Electric capacity is placed in electricity
In space between road plate and inductance, and it is connected with circuit board.
It is preferred that, the L-shaped bending in end of pin.
It is preferred that, the direction of L-type bending is towards the direction of electric capacity.
It is preferred that, the width of pin is the 2/3 of the width of inductance.
It is preferred that, the output capacitance in input capacitance and electric capacity in electric capacity is located at inductance without pin parallel to pin
Both sides be in symmetry arrangement.
It is preferred that, electric capacity fits in inductance placement.
It is preferred that, electric capacity fits in circuit board placement.
It is preferred that, electric capacity is specially 0805 electric capacity.
In addition, the present invention also provides a kind of electronic product, including above-mentioned power module.
Power module provided by the present invention, is spatially optimized, and inductance is connected into circuit board in bridge like, and
Frame is in the top of electric capacity.Under such space layout mode, it is believed that inductance and electric capacity in overlapping form in the plane
Shared space is used, therefore saves the space for needing to take in the plane.It can be seen that, above-mentioned space layout mode is effective
Reduce the plane space of circuit board shared by power module.On the other hand, due to that need not be the sky shared by saving power module
Between and reduce the inductance area in power module and electric capacity quantity so be forced improve working frequency, so also further reducing
The use cost of power module.In addition, the present invention also provides a kind of electronic product, including described power module, beneficial effect
As above.
Brief description of the drawings
In order to illustrate the embodiments of the present invention more clearly, the required accompanying drawing used in embodiment will be done simply below
Introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ordinary skill people
For member, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of front view of the part-structure of power module provided in an embodiment of the present invention；
Fig. 2 is the front view of the part-structure of another power module provided in an embodiment of the present invention；
Fig. 3 is one kind provided in an embodiment of the present invention top view corresponding with Fig. 2.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on this
Embodiment in invention, those of ordinary skill in the art are not under the premise of creative work is made, and what is obtained is every other
Embodiment, belongs to the scope of the present invention.
The core of the present invention is to provide a kind of power module and electronic product, to reduce use cost and reduce to circuit
The occupancy of plate plane space.
In order that those skilled in the art more fully understand the present invention program, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.
Embodiment one
Fig. 1 is a kind of front view of the part-structure of power module provided in an embodiment of the present invention.The embodiment of the present invention is carried
A kind of power module supplied, including control chip and circuit board 13, in addition to electric capacity 12 and the inductance 10 with pin 11, inductance
10 are connected by pin 11 with circuit board 13, and are placed in bridge like on circuit board 13；Electric capacity 12 is placed in circuit board 13 and inductance 10
Between space in, and be connected with circuit board 13.
Wherein, pin 11 should carry out corresponding lengthening processing according to actual conditions, to realize that pin 11 connects with circuit board 13
The effect that rear inductance 10 can be erected by pin 11 is connect, and inductance 10 is used for basis by the space erected afterwards between circuit board 13
The quantity and arrangement mode of electric capacity 12 are placed in the operating power selection of specific power supply.As shown in figure 1, electric capacity 12 is placed on inductance 10
Between circuit board 13 spatially, it is superimposed equivalent to electric capacity 12 and inductance 10, so as to save the area of circuit board.
In addition, it is necessary to explanation, to ensure the versatility of inductance, the pin length of inductance should be in more than 1.5mm, herein
Signified pin length be specially the lower flat of inductance to the length of pin between circuit board surface, can be with this length
The space between inductance and circuit board is set to place the electric capacity of various main flows.Certainly, if being simply a certain electric capacity matching
Inductance, the pin of inductance specifically accordingly can be lengthened or be shortened processing according to the height of the electric capacity.
The power module that the present embodiment is provided, is spatially optimized, inductance is connected into circuit board in bridge like, and
Frame is in the top of electric capacity.Under such space layout mode, it is believed that inductance and electric capacity in overlapping form in the plane
Shared space is used, therefore saves the space for needing to take in the plane.It can be seen that, above-mentioned space layout mode is effective
Reduce the plane space of circuit board shared by power module.On the other hand, due to that need not be the sky shared by saving power module
Between and reduce the inductance area in power module and electric capacity quantity so be forced improve working frequency, so also further reducing
The use cost of power module.
Embodiment two
Fig. 2 is the front view of the part-structure of another power module provided in an embodiment of the present invention.
On the basis of above-described embodiment, also following preferred embodiment.
As shown in Figure 2, it is contemplated that be connected to by what the high inductance 10 of frame should more be stablized on circuit board 13, therefore be used as one
Plant preferred embodiment, by the L-shaped bending in the end of pin 11.
It is understood that the end of pin 11 and the contact area of circuit board 13 are bigger, it is possible to make pin 11 more
It is stably fixed on circuit board 13, and then inductance 10 can be erected by more stable.
Using the power module of such design in actual use, the vibrations or other that inductance will not be caused due to external force
Extraneous objective factor and come off from circuit board, cause power module to damage, so more can guarantee that power module in actual use
In the case of normal work.It should be noted that the purpose to bending pins is only to make the placement of inductance more stable, so
In the case where this purpose can be reached, specific restriction is not made to the overbending direction of pin end.In specific implementation, pin
End and circuit board can be connected by the way of welding.
It is above-mentioned preferred embodiment on the basis of, as shown in Fig. 2 as a preferred embodiment, L-type bend
Direction be towards the direction of electric capacity 12.
Because the direction that L-type is bent is towards the direction of electric capacity 12, i.e., towards the space between inductance 10 and circuit board 13
In-plane bending, therefore more space-consuming external circuit plates can be reduced while the stability of inductance 10 is taken into account
Plane space, and then reduce power module shared by circuit board plane space.
As shown in Fig. 2 as a preferred embodiment, electric capacity 12 fits in inductance 10 places.
It is understood that electric capacity 12 and inductance 10 are fitted placement, power module can be avoided as far as possible in space
More spaces are taken in height.
As shown in Fig. 2 on the basis of above-mentioned embodiment, as a preferred embodiment, electric capacity 12 is fitted in
Circuit board 13 is placed.
It is identical with the effect that above-mentioned embodiment is reached, be further ensured that inductance 10, electric capacity 12 and circuit board 13 this
Fitted two-by-two between three, have compressed power module space shared on spatial altitude.
Fig. 3 is one kind provided in an embodiment of the present invention top view corresponding with Fig. 2.
As shown in figure 3, as a preferred embodiment, the width of pin 11 is the 2/3 of the width of inductance 10.
The width of pin 11 shown in the figure is L1, and the width of inductance 10 is L2.It is understood that the width of pin 11
Spending L1 can be possibly even identical with the width L2 of inductance 10 more than the 2/3 of the width L2 of inductance 10.Similarly, pin 11
Width L1 can be less than inductance 10 width L2 2/3, this in theory all without influence power module normal work.But be
It is more suitable in actual life and uses, so cost-effective while to take into account the stability of inductance 10, and in pin
When 11 width L1 is the 2/3 of the width L2 of inductance 10, whole structure is best.
As shown in figure 3, as a preferred embodiment, output electricity in input capacitance and electric capacity 12 in electric capacity 12
Hold parallel to pin 11, and be in symmetry arrangement positioned at both sides of the inductance 10 without pin.
Because the usable area of the circuit board 13 of the lower section of inductance 10 is limited, so more rational layout type should be used
Electric capacity 12 is carried out to set public in the position between two row's electric capacity 12 under the arrangement mode of electric capacity 12 in arrangement placement, Fig. 3
Common ground area, it is clear that, this arrangement mode of electric capacity 12 can more facilitate electric capacity 12 in the cabling of circuit board.Need
Illustrate, because electric capacity 12 can perform the work of input capacitance or output capacitance, institute according to the working condition of power module
With general designation of the electric capacity 12 herein for input and output capacitors.In addition, Fig. 3 is the signal to the arrangement mode of electric capacity 12,
The overall quantity for not limiting electric capacity 12 is 6 or often the quantity of row's electric capacity 12 is 3, and the overall quantity of electric capacity 12 is root
Depending on the free space of circuit board 13 and the power of power module, often the quantity of row's electric capacity 12 can also be inconsistent in addition,
Also it should be decided according to the actual requirements.
In addition, as a preferred embodiment, electric capacity 12 is specially 0805 electric capacity.
Because 0805 electric capacity has the very high accuracy of manufacture, it is ensured that good operating frequency characteristics.Further, since its
For single chip architecture, so being not susceptible to damage, with high reliability.In addition, also can be normal under the adverse circumstances such as high temperature low temperature
Work.So can be improved in power module from 0805 electric capacity while ensureing that power module has good working state
Its service life, so as to improve the product quality of power module.
Embodiment three
Hereinbefore the embodiment for power module is described in detail, and the present invention also provides a kind of including above-mentioned
The electronic product of power module, because the embodiment of electronic product part is mutually corresponding with power module section Example, therefore
The embodiment of electronic product part refers to the description of the embodiment of power module part, wouldn't repeat here.
A kind of electronic product that the present embodiment is provided includes power module described above, and the power module spatially enters
Go optimization, inductance is connected to circuit board in bridge like, and frame is in the top of electric capacity., can under such space layout mode
To think that inductance and electric capacity use shared space in overlapping form in the plane, therefore save to need to account in the plane
Space.It can be seen that, above-mentioned space layout mode effectively reduces the plane space of circuit board shared by power module.It is another
Aspect, due to need not be reduced for the space shared by saving power module inductance area and electric capacity quantity in power module and then
It is forced to improve working frequency, so also further reducing the use cost of power module, and then reduces making for electronic product
Use cost.
A kind of power module and electronic product provided by the present invention are described in detail above.Each in specification
Embodiment is described by the way of progressive, and what each embodiment was stressed is the difference with other embodiment, each
Between embodiment identical similar portion mutually referring to.For device disclosed in embodiment, because it is public with embodiment
The method opened is corresponding, so description is fairly simple, related part is referring to method part illustration.It should be pointed out that for
For those skilled in the art, under the premise without departing from the principles of the invention, if can also be to present invention progress
Dry to improve and modify, these are improved and modification is also fallen into the protection domain of the claims in the present invention.
It should also be noted that, in this manual, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between there is any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, article or equipment including a series of key elements not only include that
A little key elements, but also other key elements including being not expressly set out, or also include be this process, method, article or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except also there is other identical element in the process including the key element, method, article or equipment.
Claims (9)
1. a kind of power module, including control chip and circuit board, it is characterised in that the electricity also including electric capacity and with pin
Sense, the inductance is connected by the pin with the circuit board, and is placed in bridge like on the circuit board；The electric capacity is placed in
In space between the circuit board and the inductance, and it is connected with the circuit board.
2. power module according to claim 1, it is characterised in that the L-shaped bending in the end of the pin.
3. power module according to claim 2, it is characterised in that the direction of the L-type bending is towards the electric capacity
Direction.
4. power module according to claim 1, it is characterised in that the width of the pin is the width of the inductance
2/3。
5. power module according to claim 4, it is characterised in that in the input capacitance and the electric capacity in the electric capacity
Output capacitance parallel to the pin, and positioned at both sides of the inductance without pin be in symmetry arrangement.
6. power module according to claim 1, it is characterised in that the electric capacity fits in the inductance and placed.
7. power module according to claim 6, it is characterised in that the electric capacity fits in the circuit board and placed.
8. the power module according to claim 1-7 any one, it is characterised in that the electric capacity is specially 0805 electricity
Hold.
9. a kind of electronic product, it is characterised in that including the power module described in claim 1-8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710480718.9A CN107241011A (en) | 2017-06-22 | 2017-06-22 | A kind of power module and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710480718.9A CN107241011A (en) | 2017-06-22 | 2017-06-22 | A kind of power module and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107241011A true CN107241011A (en) | 2017-10-10 |
Family
ID=59987652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710480718.9A Pending CN107241011A (en) | 2017-06-22 | 2017-06-22 | A kind of power module and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107241011A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110417235A (en) * | 2018-04-28 | 2019-11-05 | 台达电子企业管理（上海）有限公司 | Inductance and power module applied to power module |
| CN113923920A (en) * | 2020-07-09 | 2022-01-11 | 比亚迪股份有限公司 | Filtering module and electronic equipment with same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063676A (en) * | 2002-07-26 | 2004-02-26 | Fdk Corp | Micro-converter |
| CN205959981U (en) * | 2015-07-15 | 2017-02-15 | 株式会社村田制作所 | Electronic component |
-
2017
- 2017-06-22 CN CN201710480718.9A patent/CN107241011A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063676A (en) * | 2002-07-26 | 2004-02-26 | Fdk Corp | Micro-converter |
| CN205959981U (en) * | 2015-07-15 | 2017-02-15 | 株式会社村田制作所 | Electronic component |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110417235A (en) * | 2018-04-28 | 2019-11-05 | 台达电子企业管理（上海）有限公司 | Inductance and power module applied to power module |
| CN110417235B (en) * | 2018-04-28 | 2023-08-29 | 台达电子企业管理（上海）有限公司 | Inductance applied to power module and power module |
| CN113923920A (en) * | 2020-07-09 | 2022-01-11 | 比亚迪股份有限公司 | Filtering module and electronic equipment with same |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171010 |