CN205959981U - Electronic component - Google Patents
Electronic component Download PDFInfo
- Publication number
- CN205959981U CN205959981U CN201620750896.XU CN201620750896U CN205959981U CN 205959981 U CN205959981 U CN 205959981U CN 201620750896 U CN201620750896 U CN 201620750896U CN 205959981 U CN205959981 U CN 205959981U
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- Prior art keywords
- mentioned
- magnetic substrate
- printed wiring
- wiring board
- electronic unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
Landscapes
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Dc-Dc Converters (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model provides an electronic component, this electronic component province space performance is excellent to heat dispersion and low noise performance are excellent. This electronic component possesses: printed wiring board (10), it has an interarea, as surface mounting assembly's IC chip (21), its install in an interarea is and including semiconductor component, and magnetic substance base plate (30), it is formed with the inductance element, is formed with cavity portion (31) and surrounds the dyke portion (32) of cavity portion (31) at magnetic substance base plate (30), is formed with a plurality of terminals (33) of being connected usefulness with printed wiring board (10) in dyke portion (32), is acceping IC chip (21) the position in cavity portion (31), and install in printed wiring board (10) magnetic substance base plate (30) an interarea.
Description
Technical field
This utility model is related to electronic unit, is more particularly to constituted using the magnetic substrate being built-in with inductance element
Electronic unit.
Background technology
In the past, it was known to and be provided with including switch element on an interarea of the magnetic substrate being formed with inductance element
IC (integrated circuit) chip, the dc-dc module (for example, patent documentation 1) of the various parts such as capacitor.
Above-mentioned dc-dc module is installed on printed wiring board by another interarea of above-mentioned magnetic substrate.And
And, using above-mentioned switch element, the input voltage from power supplys such as batteries is switched, and using above-mentioned inductor element with
And said chip capacitor smoothed after above-mentioned input voltage is converted to stable output voltage.This output voltage is supplied
To the various functions circuit region to above-mentioned printed wiring board.
According to above-mentioned dc-dc module, above-mentioned inductance element can be formed as small-sized, and above-mentioned IC chip with
And above-mentioned capacitor overlaps in the top of above-mentioned inductance element, therefore, it is possible to obtain excellent save space performance.
Patent documentation 1：No. 4325747 publications of Japanese Patent No.
Above-mentioned switch element generates heat in switch motion.However, in aforesaid dc-dc module, on including
State and be folded with above-mentioned magnetic substrate between the above-mentioned IC chip of switch element and above-mentioned printed wiring board, thus be difficult to improve to
The heat dispersion of above-mentioned printed wiring board.In addition, in order to suppress the radiated noise from above-mentioned IC chip, above-mentioned capacitor, having
When there is additionally required noise countermeasure based on shielding case etc..
The problem of this radiating and radiated noise is not limited to dc-dc, is being formed with the magnetic of inductance element
Structure base board is installed in the electronic unit of surface mounting assembly including febrifacient semiconductor element and also can widely be produced.
Utility model content
For this reason, the purpose of this utility model is to provide save space excellent performance, and heat dispersion and low noise
The excellent electronic unit of energy.
To achieve these goals, the electronic unit of a mode of the present utility model possesses：Printed wiring board, it has
One interarea；Surface mounting assembly, it is installed on said one interarea and includes semiconductor element；And magnetic substrate,
It is formed with inductance element, is formed with cavity portion and the dyke surrounding this cavity portion in above-mentioned magnetic substrate, in above-mentioned dike
Portion is formed with the multiple terminals being connected with above-mentioned printed wiring board, and above-mentioned magnetic substrate houses in above-mentioned surface mounting assembly
Position in above-mentioned cavity portion is installed on the said one interarea of above-mentioned printed wiring board.
According to this structure, because above-mentioned surface mounting assembly is installed on above-mentioned printed wiring board, so being pacified by above-mentioned surface
The heat that dress part produces is directly conducted to above-mentioned printed wiring board and is diffused.Thus, it is installed on magnetic with surface mounting assembly
The module that completes that the radiating of gonosome substrate and surface mounting assembly intervenes magnetic substrate is compared, and heat dispersion improves.
Further, since above-mentioned surface mounting assembly is contained in above-mentioned cavity portion, so above-mentioned magnetic substrate is as electro-magnetic shielding cover
Work, thus suppressing radiated noise.Further, since by above-mentioned surface mounting assembly and above-mentioned magnetic substrate overlap in
The identical region of above-mentioned printed wiring board, it is possible to obtaining and completing the substantially equal save space performance of module.In addition, using
Family can be based on the skill relevant with the installation important document combining above-mentioned magnetic substrate and above-mentioned surface mounting assembly, function
Art information, to import above-mentioned electronic unit with the cost importing the situation same degree completing module.
Additionally, it is preferred that, above-mentioned magnetic substrate is laminated with the multiple magnetic being each configured with face inner wire and interlayer conductor
Gonosome layer, above-mentioned inductance element connects the above-mentioned face inner wire of above-mentioned multiple magnetic layer by above-mentioned interlayer conductor.
According to this structure, specifically above-mentioned magnetic base can be constituted by the magnetic multilager base plate being built-in with inductance element
Plate.
Additionally, it is preferred that, the top surface of above-mentioned surface mounting assembly is contacted with the bottom surface of above-mentioned cavity portion.
According to this structure, the heat being produced by above-mentioned surface mounting assembly can not only conduct to above-mentioned printed wiring board,
But also can conduct and be diffused to above-mentioned magnetic substrate, therefore heat dispersion improves further.
Additionally, it is preferred that, it is provided with above-mentioned cavity portion and above-mentioned magnetic substrate is carried out with above-mentioned surface mounting assembly
Fixing resin.
According to this structure, before above-mentioned magnetic substrate is installed on above-mentioned printed wiring board, can be by above-mentioned surface
Installing component is fixed in above-mentioned cavity portion in advance.Thus, for instance, it is possible to by singlepass by above-mentioned magnetic substrate and
The above-mentioned surface mounting assembly being fixed in above-mentioned cavity portion is installed on above-mentioned printed wiring board, thus the efficiency of installation exercise carries
High.
Additionally, it is preferred that, above-mentioned multiple terminals are formed at the position surrounding above-mentioned cavity portion.
According to this structure, the installed surface from above-mentioned magnetic substrate that is, above-mentioned dyke and above-mentioned printed wiring can be reduced
The radiated noise being formed between plate.
Additionally, it is preferred that, above-mentioned semiconductor element is switch element, and above-mentioned surface mounting assembly also includes more than one electricity
Container, above-mentioned inductance element is choking-winding, and above-mentioned electronic unit is dc-dc.
According to this structure, it is obtained in that the dc-dc that heat dispersion is excellent and radiated noise is little.
Additionally, it is preferred that, at least one of outside terminal of above-mentioned surface mounting assembly is upper with above-mentioned magnetic substrate
State terminal to electrically connect through being formed from the wiring of above-mentioned printed wiring board.
According to this structure, compared with the situation that above-mentioned surface mounting assembly is installed on above-mentioned magnetic substrate, above-mentioned magnetic
Reducing around wiring, therefore, it is possible to above-mentioned inductance element is distributed in more spaces in gonosome substrate.Thus, easily constitute
The inductance element that L-value is larger and Q-value is good.
Additionally, it is preferred that, also contain effector part in above-mentioned cavity portion, in the outside terminal of above-mentioned surface mounting assembly
At least one be connected through being formed from the wiring of above-mentioned printed wiring board with above-mentioned effector part.
According to this structure, with using the wiring being formed in above-mentioned magnetic substrate be connected above-mentioned surface mounting assembly with upper
The situation stating effector part is compared, and can reduce the non-required stray inductance producing in wiring.
Additionally, it is preferred that, above-mentioned printed wiring board has the thermal component with above-mentioned surface mounting assembly thermal coupling.
According to this structure, can reliably conduct via above-mentioned thermal component and spread and produced by above-mentioned surface mounting assembly
Heat.
According to electronic unit of the present utility model, it is obtained in that heat dispersion is excellent, radiation noise is less, and is suitable to little
The electronic unit of type.
Brief description
Fig. 1 is the side view of an example of the construction of the dc-dc representing embodiment 1.
Fig. 2 is the side view of an example of the construction of the dc-dc representing embodiment 1.
Fig. 3 A is the vertical view of an example of configuration of the terminal of the dc-dc representing embodiment 1 and part
Figure.
Fig. 3 B is the vertical view of an example of configuration of the terminal of the dc-dc representing embodiment 1 and part
Figure.
Fig. 3 C is the vertical view of an example of configuration of the terminal of the dc-dc representing embodiment 1 and part
Figure.
Fig. 4 is the circuit diagram of an example of the dc-dc representing embodiment 1.
Fig. 5 is an example of the configuration of conductor of setting in each layer of magnetic substrate representing and constituting embodiment 1
Top view.
Fig. 6 is the side view of an example of the structure of the magnetic substrate representing embodiment 1.
Fig. 7 is the side view of an example of the construction of the dc-dc representing embodiment 2.
Fig. 8 is the side view of an example of the construction of the dc-dc representing embodiment 2.
Fig. 9 A is the vertical view of an example of configuration of the terminal of the dc-dc representing embodiment 3 and part
Figure.
Fig. 9 B is the vertical view of an example of configuration of the terminal of the dc-dc representing embodiment 3 and part
Figure.
Fig. 9 C is the vertical view of an example of configuration of the terminal of the dc-dc representing embodiment 3 and part
Figure.
Figure 10 is the side view of an example of the construction of the magnetic substrate representing variation.
Figure 11 is the side view of an example of the construction of the magnetic substrate representing variation.
Description of reference numerals：
1st, 2,3 ... dc-dc；10 ... printed wiring boards；11st, 11a, 11b, 11c, 11d ... terminal；12 ... wirings are led
Body；19 ... electric conductivity cements；21 ... IC chips；22nd, 23 ... capacitors；29 ... resins；30th, 30a, 30b ... magnetic substrate；
31 ... cavity portion；32 ... dykes；33 ... terminals；34 ... coil-conductors；311st, 312 ... peristomes；344～346 ... face inner wires；
351～355 ... interlayer conductors；361～366 ... magnetic layer；381st, 382 ... nonmagnetic material layers.
Specific embodiment
Hereinafter, using accompanying drawing, embodiment of the present utility model is described in detail.Additionally, the enforcement of following explanation
Mode all represents summary or specific example.Numerical value shown in following embodiment, shape, material, element, structure
Configuration and connected mode of key element etc. is become to be examples, its purport does not limit this utility model.By following embodiment party
The element not being recorded in independent claims in element in formula illustrates as arbitrary element.
In addition, the ratio of the size of the element shown in accompanying drawing or size is not tight.
(embodiment 1)
The electronic unit of embodiment 1 possesses the surface mount being installed on printed wiring board and including semiconductor element
Part and have cavity portion and be formed with the magnetic substrate of inductance element, is installed on above-mentioned print in above-mentioned magnetic substrate
Above-mentioned surface mounting assembly is housed in above-mentioned cavity portion, above-mentioned surface mounting assembly is installed on above-mentioned magnetic during brush wiring plate
Above-mentioned printed wiring board in substrate and above-mentioned printed wiring board.In embodiment 1, to as the one of this electronic unit
The dc-dc of individual example illustrates.
Fig. 1 is the side view of an example of the construction of dc-dc 1 representing embodiment 1.As shown in figure 1,
Dc-dc 1 possesses printed wiring board 10, IC chip 21, capacitor 22,23 and magnetic substrate 30.Herein, IC core
Piece 21 and capacitor 22,23 are examples of surface mounting assembly.
Printed wiring board 10 has an interarea (being upper surface in the example of Fig. 1), is formed at this interarea and magnetic
Terminal 11 and the wiring conductor 12 being formed inside that gonosome substrate 30 connects.
Magnetic substrate 30 have cavity portion 31, surround cavity portion 31 dyke 32, be formed at dyke 32 and with printing cloth
Terminal 33 and the coil-conductor 34 forming inductance element that line plate 10 connects.The detailed configuration of magnetic substrate 30 is entered
Row is aftermentioned.
After Fig. 1 represents that printed wiring board 10 is mounted with IC chip 21 and capacitor 22,23, and magnetic base is installed
State before plate 30.In the condition shown in figure 1, IC chip 21 and capacitor 22,23 are pacified using electric conductivity cement 19
It is loaded on the terminal 11 of regulation, configure conductive cement 19 in the terminal 11 for installing magnetic substrate 30.
As an example, electric conductivity cement 19 is solder, and IC chip 21 and capacitor 22,23 can also be by welderings
The printing of cream and backflow are installed on printed wiring board 10.In addition, IC chip 21 can also pass through wire bonding and printed wiring
Plate 10 connects.
Fig. 2 is the side view of an example of the construction under the completion statuses representing dc-dc 1.Fig. 2 represents in figure
1 printed wiring board 10 is further fitted with the state of magnetic substrate 30.In the state of fig. 2, IC chip 21, electric capacity
Inductance element (coil-conductor 34) in device 22,23 and magnetic substrate 30 utilizes the wiring conductor in printed wiring board 10
12 are electrically connected, and form DC-DC converter circuit described later.
Conducted by the heat that IC chip 21 produces in action and be diffused to wiring conductor 12.In other words, wiring is led
Body 12 and IC chip 21 thermal coupling, also as thermal component function.For example, arrange to supply stable earthing potential
Big wiring conductor 12 (so-called solid pattern) there is high thermoconductivity and big thermal capacity, thus for radiate also effective.
Additionally, a part for wiring conductor 12 can also be provided as the radiating special-purpose member without electrical connection.In addition, IC chip
21 top surface can be contacted with the bottom surface of cavity portion 31, and in this case, the heat being produced by IC chip 21 can not only conduct
It is diffused to magnetic substrate 30 to printed wiring board 10 additionally it is possible to conduct, therefore heat dispersion improves further.
Fig. 3 A, Fig. 3 B, Fig. 3 C are the vertical views of the example of configuration representing the terminal of dc-dc 1 and part
Figure.
Fig. 3 A represents an interarea of the printed wiring board 10 before part installation.Said one master in printed wiring board 10
Face, the terminal 11b that the terminal 11a being connected with IC chip 21 is connected with capacitor 22,23 and with magnetic substrate 30
The terminal 11c connecting exposes, and the wiring conductor 12 within utilization will connect between the terminal of regulation.
After Fig. 3 B represents and is mounted with IC chip 21 and capacitor 22,23, and before magnetic substrate 30 is installed
The said one interarea of printed wiring board 10.This state is corresponding with Fig. 1, is provided with IC chip 21 and electricity in terminal 11a, 11b
Container 22,23, terminal 11c exposes on said one interarea.
Fig. 3 C represents the said one interarea being mounted with the printed wiring board 10 after magnetic substrate 30.This state and figure
2 is corresponding, and terminal 11c is connected with the terminal 33 of magnetic substrate 30, and IC chip 21 and capacitor 22,23 are contained in magnetic base
In the cavity portion 31 of plate 30.
Next, illustrating to the circuit and action of dc-dc 1.
Fig. 4 is the circuit diagram of an example of the circuit representing dc-dc 1.Switch IC in Fig. 4, capacitor C1,
C2, inducer L and wiring correspond respectively to the electricity in aforesaid IC chip 21, capacitor 22,23 and magnetic substrate 30
Sensing unit (coil-conductor 34), the terminal 11 of printed wiring board 10 and wiring conductor 12.
In DC-DC converter circuit shown in Fig. 4, one end of capacitor C1 and the other end and input terminal Vin with
And ground terminal GND connects respectively, one end of capacitor C2 and the other end are divided with output terminal Vout and ground terminal GND
Do not connect.The coil terminals Lo of switch IC (SWIC) is connected with output terminal Vout via inducer L, feedback terminal FB and output
Terminal Vout connects.
This DC-DC converter circuit makes built-in switch element in switch IC be switched with the frequency specifying, using electricity
Sensor L1 and capacitor C2 smooths the input voltage being supplied to input terminal Vin, thus exports desired output voltage
To output terminal Vout.This switch element can also be for example MOSFET (mos field effect transistor：
Metal Oxide Semiconductor Field Effect Transistor).
Switch IC based on the output voltage being input to feedback terminal FB, by for example making switching frequency certain and making pulse
PWM (the pulse width modulation of variable-width：Pulse Width Modulation) control, so that output voltage stabilization is to set
The mode of voltage is controlled.
Next, illustrating to the construction of magnetic substrate 30.Magnetic substrate 30 is to be laminated multiple ceramic base material layers
And the multilager base plate constituting.
Fig. 5 is the top view of an example of the configuration of conductor of setting in each layer representing and constituting magnetic substrate 30.
In Figure 5, according to the order of stacking, show the configuration of conductor in magnetic layer 361～366 and peristome.In magnetic
Body layer 361～366 is provided with peristome 311,312, terminal 33, face inner wire 344～346 and interlayer conductor 351～355.
Peristome 311,312 forms cavity portion 31.Face inner wire 344,345,346 is an example of coil-conductor 34,
And the interarea along magnetic layer is formed.Interlayer conductor 351～355 is through-thickness insertion magnetic layer and the conductor that formed.
Face inner wire 344,345,346 utilizes interlayer conductor 354,355 and spiral-shaped connection, is consequently formed inductance element.
Magnetic layer 361～366 is for example made up of magnetic ceramics base material.For magnetic ceramics, such as using Armco magnetic iron element
Body pottery.Specifically, can use with ferrum oxide as main component, and comprise more than at least one of zinc, nickel and copper
Ferrite.
For terminal 33, face inner wire 344～346 and interlayer conductor 351～355, for example, can use based on silver
Want metal or the alloy of composition.For terminal 33, for example, can also implement plating using nickel, palladium or gold.
The magnetic ferrite pottery constituting each layer of magnetic substrate 30 can be so-called LTCC pottery (Low
Temperature Co-fired Ceramics), in this case, the firing temperature of magnetic substrate 30 be silver point with
Under, can be using silver for above-mentioned conductor.Lead by using the low silver-colored composition face inner wire 344～346 of resistivity and interlayer
Body 351～355, and form loss less and the excellent DC-DC converter circuit of circuit characteristic such as electrical efficiency.Particularly, pass through
For above-mentioned conductor using silver, magnetic substrate 30 can be fired under the oxidative environment gas such as such as air.
Fig. 6 is the decomposition stacking figure representing each layer constituting magnetic substrate 30 according to the order of stacking.
The configuration that magnetic substrate 30 is e.g. passed through according to Fig. 5 configures conductive paste in the precalculated position forming conductor, and
Prepare to dig through multiple ceramic green sheets of the magnetic of peristome, the order according to Fig. 6 carry out overlap and in unfired duplexer area
Integration domain, and fire this unfired stacking body region in the lump and make.
So it is formed in the magnetic substrate 30 being internally formed inductance element.As described above, magnetic substrate 30 exists
The position that IC chip 21 and capacitor 22,23 are contained in cavity portion 31 is installed on printed wiring board 10, thus constituting
Dc-dc 1.
Additionally, in above-mentioned, though with the example of dc-dc 1 to by printed wiring board 10, surface mounting assembly (IC
Chip 21, capacitor 22,23) and the electronic unit that constitutes of magnetic substrate 30 be illustrated, but this electronic unit is not
It is defined in dc-dc.Being capable of the various ministry of electronics industry of functional realiey with structure same as described above and according to IC chip 21
Part.
For example, it is also possible to by as IC chip 21 using wireless near field communication control IC chip, to realize into
The electronic unit of row wireless near field communication.In this case it is also possible to be formed as out the inductance element of magnetic substrate 30
Put formula magnetic circuit coil, and this open type magnetic map is used in aerial coil.In addition, for example, it is also possible to by being used as IC core
Piece 21 uses digital power amplifier IC chip, to realize D level amplifier.In this case it is also possible to electricity by magnetic substrate 30
Sensing unit is used in low pass filter.In such manner, it is possible to realize having using the structure of the electronic unit of embodiment not limit
Electronic unit in the various functions of dc-dc.
The structure of the electronic unit according to embodiment, is obtained in that following effect.
First, it is obtained in that good heat dispersion.Because above-mentioned surface mounting assembly is installed on above-mentioned printed wiring board,
So above-mentioned printed wiring board is directly conducted to by the heat that above-mentioned surface mounting assembly produces being diffused.Thus, with surface
The module that completes that installing component is installed on magnetic substrate is compared, and heat dispersion improves.
The raising of heat dispersion is to stay out of magnetic substrate by the heat being produced by surface mounting assembly and directly dissipates
Heat to be realized in above-mentioned printed wiring board.In addition, be arranged at the wiring conductor of above-mentioned printed wiring board as with above-mentioned surface
This effect of thermal component function of installing component thermal coupling also contributes to the raising of heat dispersion.
In addition, being to contact with the bottom surface of above-mentioned cavity portion by the top side configuration of above-mentioned surface mounting assembly, by above-mentioned surface
The heat that installing component produces not only conducts to above-mentioned printed wiring board, but also conducts and expanded to above-mentioned magnetic substrate
Dissipate, thus also can improve heat dispersion further.
Second, suppress radiated noise.This is because above-mentioned surface mounting assembly is contained in above-mentioned cavity portion, thus above-mentioned
Magnetic substrate works as electro-magnetic shielding cover.
3rd, save space excellent performance.Due to by above-mentioned surface mounting assembly and above-mentioned magnetic substrate overlap in
The identical region of above-mentioned printed wiring board, it is possible to obtain the excellent save space performance substantially equal with completing module.
Structure according to above-mentioned electronic unit is additionally it is possible to obtain following effect.
The terminal of at least one of outside terminal of above-mentioned surface mounting assembly and above-mentioned magnetic substrate is via formation
Electrically connect in the wiring of above-mentioned printed wiring board.Therefore, it is installed on above-mentioned magnetic substrate with by above-mentioned surface mounting assembly
Situation compare, can reduce in above-mentioned magnetic substrate around wiring such that it is able to more spaces be distributed to above-mentioned
Inductance element.Thus, easily constitute the inductance element that L-value is larger and Q-value is good.
In addition, at least one of outside terminal of above-mentioned surface mounting assembly and the effector part being contained in cavity portion
(such as capacitor) connects through being formed from the wiring of above-mentioned printed wiring board, therefore with using being formed at above-mentioned magnetic base
Wiring in plate connects above-mentioned surface mounting assembly compared with the situation of above-mentioned effector part, can reduce produce in wiring non-
Required stray inductance.
Above-mentioned electronic unit can be by above-mentioned printed wiring board, above-mentioned surface mounting assembly and above-mentioned magnetic
The group parts that substrate is constituted it is also possible to only provide above-mentioned magnetic substrate as semi-finished product.User can based on will be above-mentioned
The relevant technical information of what magnetic substrate and above-mentioned surface mounting assembly combined install important document, function, with imported
The cost becoming the situation same degree of module imports above-mentioned electronic unit.Above-mentioned technical information for example can also include being arranged at
The terminal patterns of above-mentioned printed wiring board, the information of the kind of specified above-mentioned surface mounting assembly.
(embodiment 2)
The electronic unit of embodiment 2, compared with the electronic unit of embodiment 1, sets in the cavity portion of magnetic substrate
It is equipped with different to this point of above-mentioned magnetic substrate and the resin that above-mentioned surface mounting assembly is fixed.Hereinafter, changed with DC-DC
The example of device illustrates to the electronic unit of embodiment 2.
Fig. 7 is the side view of an example of the construction of dc-dc 2 representing embodiment 2.The DC-DC of Fig. 7 turns
Parallel operation 2, compared with the dc-dc 1 of Fig. 1, is provided with resin 29, IC chip 21 and capacitor 22,23 in cavity portion 31
It is fixed on this point in the cavity portion 31 of magnetic substrate 30 using resin 29 different.
Fig. 7 represents IC chip 21 and after capacitor 22,23 is fixed on magnetic substrate 30 using resin 29, and pacifies
It is loaded on the state before printed wiring board 10.As shown in fig. 7, IC chip 21 and capacitor 22,23 can also be installed on print
It is fixed on magnetic substrate 30 using resin 29 before brush wiring plate 10.
Fig. 8 is the side view of an example of the construction under the completion statuses representing dc-dc 2.Fig. 8 represents in figure
7 printed wiring board 10 is provided with the state of magnetic substrate 30, IC chip 21 and capacitor 22,23.Shown in Fig. 8
Under state, the inductance element (coil-conductor 34) in IC chip 21, capacitor 22,23 and magnetic substrate 30 is using printing
Wiring conductor 12 in wiring plate 10 is electrically connected, and forms the DC-DC converter circuit of Fig. 4.
Using dc-dc 2, also same with dc-dc 1, it is obtained in that raising, the radiated noise of heat dispersion
Suppression and save space performance effect.And, in dc-dc 2, can be by IC chip 21, capacitor 22,23
Printed wiring board 10 is installed on together with magnetic substrate 30 with the state being fixed on magnetic substrate 30.Thereby, it is possible to pass through
Singlepass (the such as printing of a soldering paste and reflow process) installs IC chip 21, capacitor 22,23 and magnetic base
Plate 30 is such that it is able to make installation exercise more effective.
(embodiment 3)
The electronic unit of embodiment 3 compared with the electronic unit of embodiment 1, for magnetic substrate 30 is installed on
The shape of the terminal of printed wiring board 10 is different.Hereinafter, with the example of dc-dc, the electronic unit of embodiment 3 is entered
Row explanation.
Fig. 9 A, Fig. 9 B, Fig. 9 C are the vertical views of the example of configuration representing the terminal of dc-dc 3 and part
Figure.
Fig. 9 A represents an interarea of the printed wiring board 10 before part installation.Compared with the printed wiring board 10 of Fig. 3 A,
Change the shape of the terminal 11d being connected with magnetic substrate 30.Corresponding with this change, in magnetic substrate 30,
Change the shape of the terminal 33 being connected with printed wiring board 10.
After Fig. 9 B represents and is mounted with IC chip 21 and capacitor 22,23, and before magnetic substrate 30 is installed
The said one interarea of printed wiring board 10.
Fig. 9 C represents the said one interarea being mounted with the printed wiring board 10 after magnetic substrate 30.In this state
Under, terminal 11d is connected with the terminal 33 of magnetic substrate 30, and IC chip 21 and capacitor 22,23 are contained in magnetic substrate
In 30 cavity portion 31.
In dc-dc 3, because magnetic substrate 30 is using the terminal 33 being formed at the position surrounding cavity portion 31
It is connected with printed wiring board 10, it is possible to reducing the dyke 32 from the installed surface as magnetic substrate 30 and printed wiring
Radiated noise between plate 10.
(variation)
More than, the electronic unit of embodiment of the present utility model is illustrated, but this utility model does not limit
In each embodiment.Without departing from purport of the present utility model, then people in the art is implemented for present embodiment
Element in the mode of various modifications that member is expected, the different embodiments of combination and the mode that builds can also
It is contained in the range of one or more mode of the present utility model.
For example, in embodiments, show the part setting in the multiple magnetic layer constituting magnetic substrate
There is the example of coil-conductor, but coil-conductor can also be arranged at whole magnetic layer.
Figure 10 is the side view of an example of the construction representing this magnetic substrate 30a.Magnetic substrate 30a is constituted
It is that the magnetic layer 362,363 being not provided with coil-conductor in magnetic substrate 30 is also equipped with coil-conductor 34.According to magnetic
Gonosome substrate 30a is additionally it is possible to form, using the region in dyke 32, the inductance element that L-value is larger and Q-value is good.
In addition, in embodiments, show the example that the whole substrate layers constituting magnetic substrate are magnetic layer, but
Nonmagnetic material layer can also be laminated in magnetic substrate.
Figure 11 is the side view of an example of the construction representing this magnetic substrate 30b.Magnetic substrate 30b is for example
It is configured to for the magnetic layer 361 of magnetic substrate 30 to be changed to nonmagnetic material layer 381, and be added with nonmagnetic material layer 382.
In magnetic substrate 30b, nonmagnetic material layer 381,382 exposes as an interarea and another interarea.Nonmagnetic material
Layer 381,382 is made up of the low permeability less than magnetic layer 362～366 permeability or nonmagnetic ceramic base material.For
Nonmagnetic pottery, for example, can use the aluminum pottery with non magnetic ferrite pottery, aluminum as main component.
Typically, the ceramic base material of magnetic is than nonmagnetic ceramic base material bad mechanical strength, therefore in magnetic substrate 30b
In, by nonmagnetic material layer is configured at an interarea and another interarea, mechanical intensity can be strengthened.In addition,
Substrate layer near the central authorities of stacking can be formed as nonmagnetic material layer, in this case, inductance element can be made to have slow
Magnetic with the change of the L-value in DC superposition characteristic.
Industrial utilization feasibility
This utility model for example can be as dc-dc etc., using the magnetic substrate being built-in with inductance element
The electronic unit constituting utilizes.
Claims (9)
1. a kind of electronic unit it is characterised in that
Possess：
Printed wiring board, it has an interarea；
Surface mounting assembly, it is installed on one interarea and includes semiconductor element；And
Magnetic substrate, it is formed with inductance element,
It is formed with cavity portion and the dyke surrounding this cavity portion in described magnetic substrate,
It is formed with the multiple terminals being connected with described printed wiring board in described dyke,
The position that described magnetic substrate is contained in described cavity portion in described surface mounting assembly is installed on described printing cloth
One interarea of line plate.
2. electronic unit according to claim 1 it is characterised in that
Described magnetic substrate stacking is each configured with face inner wire and multiple magnetic layer of interlayer conductor form,
Described inductance element is configured to connect the described face inner wire of the plurality of magnetic layer by described interlayer conductor.
3. electronic unit according to claim 1 and 2 it is characterised in that
The top surface of described surface mounting assembly is contacted with the bottom surface of described cavity portion.
4. electronic unit according to claim 1 and 2 it is characterised in that
It is provided with the resin that described magnetic substrate is fixed with described surface mounting assembly in described cavity portion.
5. electronic unit according to claim 1 and 2 it is characterised in that
The plurality of terminal is formed at the position surrounding described cavity portion.
6. electronic unit according to claim 1 and 2 it is characterised in that
Described semiconductor element is switch element,
Described surface mounting assembly also includes more than one capacitor,
Described inductance element is choking-winding,
Described electronic unit is dc-dc.
7. electronic unit according to claim 1 and 2 it is characterised in that
The described terminal of at least one of outside terminal of described surface mounting assembly and described magnetic substrate is via formation
Electrically connect in the wiring of described printed wiring board.
8. electronic unit according to claim 1 and 2 it is characterised in that
Effector part, at least one of outside terminal of described surface mounting assembly and institute is also contained in described cavity portion
State effector part to connect through being formed from the wiring of described printed wiring board.
9. electronic unit according to claim 1 and 2 it is characterised in that
Described printed wiring board has the thermal component with described surface mounting assembly thermal coupling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015141537A JP6432460B2 (en) | 2015-07-15 | 2015-07-15 | DC-DC converter |
| JP2015-141537 | 2015-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205959981U true CN205959981U (en) | 2017-02-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620750896.XU Active CN205959981U (en) | 2015-07-15 | 2016-07-15 | Electronic component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6432460B2 (en) |
| CN (1) | CN205959981U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107241011A (en) * | 2017-06-22 | 2017-10-10 | 郑州云海信息技术有限公司 | A kind of power module and electronic product |
| CN107768350A (en) * | 2017-09-22 | 2018-03-06 | 江苏长电科技股份有限公司 | A kind of projective table type induction structure and preparation method thereof |
| CN110676249A (en) * | 2019-09-29 | 2020-01-10 | 江苏长电科技股份有限公司 | Packaging structure of cavity device |
| CN111490674A (en) * | 2019-01-29 | 2020-08-04 | 株式会社电装 | Power supply device |
| CN111726932A (en) * | 2019-03-22 | 2020-09-29 | 乾坤科技股份有限公司 | Magnetic device and stacked electronic structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7324240B2 (en) * | 2021-03-05 | 2023-08-09 | 株式会社タムラ製作所 | power supply |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000331835A (en) * | 1999-05-21 | 2000-11-30 | Taiyo Yuden Co Ltd | Laminated electronic part and circuit module |
| JP4217438B2 (en) * | 2002-07-26 | 2009-02-04 | Ｆｄｋ株式会社 | Micro converter |
| JP4472453B2 (en) * | 2004-07-29 | 2010-06-02 | 富士通マイクロエレクトロニクス株式会社 | Ultra-compact power converter and magnetic device |
| JP2008060427A (en) * | 2006-08-31 | 2008-03-13 | Tdk Corp | Passive component and electronic component module |
| EP2136610A4 (en) * | 2008-01-25 | 2011-07-13 | Ibiden Co Ltd | Multilayer wiring board and its manufacturing method |
| JP3147172U (en) * | 2008-10-06 | 2008-12-18 | トレックス・セミコンダクター株式会社 | Coil integrated DC / DC converter |
| JP5150553B2 (en) * | 2009-04-16 | 2013-02-20 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
| JP5840860B2 (en) * | 2010-10-26 | 2016-01-06 | 京セラ株式会社 | Inductor parts and electronic devices |
| JP5890148B2 (en) * | 2011-10-31 | 2016-03-22 | 京セラ株式会社 | Coil-embedded substrate and electronic device |
| US9711279B2 (en) * | 2013-10-28 | 2017-07-18 | Infineon Technologies Austria Ag | DC-DC converter assembly with an output inductor accommodating a power stage attached to a circuit board |
-
2015
- 2015-07-15 JP JP2015141537A patent/JP6432460B2/en active Active
-
2016
- 2016-07-15 CN CN201620750896.XU patent/CN205959981U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107241011A (en) * | 2017-06-22 | 2017-10-10 | 郑州云海信息技术有限公司 | A kind of power module and electronic product |
| CN107768350A (en) * | 2017-09-22 | 2018-03-06 | 江苏长电科技股份有限公司 | A kind of projective table type induction structure and preparation method thereof |
| CN111490674A (en) * | 2019-01-29 | 2020-08-04 | 株式会社电装 | Power supply device |
| CN111490674B (en) * | 2019-01-29 | 2024-03-29 | 株式会社电装 | Power supply device |
| CN111726932A (en) * | 2019-03-22 | 2020-09-29 | 乾坤科技股份有限公司 | Magnetic device and stacked electronic structure |
| CN110676249A (en) * | 2019-09-29 | 2020-01-10 | 江苏长电科技股份有限公司 | Packaging structure of cavity device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6432460B2 (en) | 2018-12-05 |
| JP2017027970A (en) | 2017-02-02 |
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