CN110676249A - Packaging structure of cavity device - Google Patents
Packaging structure of cavity device Download PDFInfo
- Publication number
- CN110676249A CN110676249A CN201910936917.5A CN201910936917A CN110676249A CN 110676249 A CN110676249 A CN 110676249A CN 201910936917 A CN201910936917 A CN 201910936917A CN 110676249 A CN110676249 A CN 110676249A
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- cavity device
- layer
- main substrate
- stress
- stress relief
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
The invention relates to a packaging structure of a cavity device, which comprises a main substrate, the cavity device and a plastic packaging layer, wherein the main substrate comprises a main substrate first surface and a main substrate second surface which are oppositely arranged, the plastic packaging layer covers the main substrate first surface and encapsulates the cavity device, the plastic packaging layer comprises a plastic packaging layer first surface far away from the main substrate and a plastic packaging layer second surface close to the main substrate, and at least one stress release groove positioned on the peripheral side of the cavity device is arranged in the plastic packaging layer. Through the arrangement, the problem that the cavity device fails due to the fact that the plastic sealing layer wrapping the cavity device in the existing packaging structure is prone to generating poor stress to the cavity device and forming a pulling effect under the effects of expansion with heat and contraction with cold and moisture absorption and expansion can be solved.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a packaging structure of a cavity device.
Background
At present, in the field of semiconductor packaging technology, a chip or a packaging device is generally subjected to plastic packaging by using a plastic packaging material, so as to form a plastic packaging layer to wrap and protect the chip or the packaging device.
In the subsequent reliability test, the plastic package layer in the package structure can form a stress action on the cavity device due to the expansion and contraction action or the moisture absorption and expansion action, and the cavity device is easy to lose efficacy under the influence of the acting force such as the pulling of the stress, so that the overall reliability performance, the package yield and the service life of the package structure are reduced.
Disclosure of Invention
The invention aims to provide a packaging structure of a cavity device, and aims to solve the problem that a plastic packaging layer for packaging the cavity device in the conventional packaging structure is easy to generate bad stress and form the functions of pulling and the like on the cavity device under the functions of thermal expansion and cold contraction and moisture absorption and expansion, so that the cavity device is failed.
In order to achieve one of the above objectives, an embodiment of the present invention provides a package structure of a cavity device, including a main substrate, a cavity device, and a plastic package layer, where the main substrate includes a first surface of the main substrate and a second surface of the main substrate that are opposite to each other, the plastic package layer covers the first surface of the main substrate and encapsulates the cavity device, the plastic package layer includes a first surface of the plastic package layer away from the main substrate and a second surface of the plastic package layer close to the main substrate, and at least one stress relief groove located on an outer peripheral side of the cavity device is disposed in the plastic package layer.
As a further improvement of an embodiment of the present invention, the stress relief groove is an annular stress relief groove formed around the cavity device.
As a further improvement of an embodiment of the present invention, the stress relaxation groove is not in contact with the primary base plate first surface.
As a further improvement of the embodiment of the present invention, the first surface of the plastic package layer is further provided with an open slot extending toward the cavity device, and at least a portion of the open slot is located opposite to the cavity device.
As a further improvement of an embodiment of the present invention, the opening groove is an inverted trapezoidal opening groove.
As a further improvement of an embodiment of the present invention, the stress relief groove is filled with a stress buffer layer or a moisture barrier layer.
As a further improvement of an embodiment of the present invention, the stress relief groove is in contact with the primary base plate first surface to expose the primary base plate.
As a further improvement of an embodiment of the present invention, the open groove is filled with a stress buffer layer or a moisture barrier layer.
As a further improvement of an embodiment of the present invention, the open groove communicates with the stress relief groove.
As a further improvement of an embodiment of the present invention, a shielding layer electrically connected to the ground terminal of the main substrate is further disposed on the periphery of the package structure, the stress buffer layer or the moisture barrier layer is made of a conductive material, and the shielding layer is in contact with the stress buffer layer or the moisture barrier layer.
Compared with the prior art, the invention has the beneficial effects that: in the packaging structure, the plastic packaging layer wraps the cavity device, and at least one stress release groove is formed in the outer peripheral side of the cavity device so as to reduce the plastic packaging material filled in the periphery of the cavity device, and further reduce the adverse stress influence of the plastic packaging layer on the cavity device under the action of thermal expansion and cold contraction or the action of moisture absorption and expansion.
Drawings
Fig. 1 is a schematic structural diagram of a cavity device package structure in embodiment 1 of the present invention;
fig. 2 is a schematic structural view of a cavity device in example 1 of the present invention;
fig. 3 is a schematic structural diagram of a cavity device package structure in embodiment 2 of the present invention;
fig. 4 is a schematic structural diagram of a cavity device package structure in embodiment 3 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. As in the present invention, for convenience of description, in the package structure, a side of the main substrate close to the cavity device is a front side of the main substrate, and a side far from the cavity device is a back side of the main substrate; the direction of the plane of the main substrate is the horizontal direction, and the thickness direction of the main substrate is the vertical direction or the vertical direction.
As shown in fig. 1 to 4, an embodiment of the present invention provides a package structure of a cavity device, including a main substrate 1, a cavity device 5, and a molding layer 3, where the main substrate 1 includes a main substrate first surface 11 and a main substrate second surface 12 that are oppositely disposed, the molding layer 3 covers the main substrate first surface 11 and encapsulates the cavity device 5, the molding layer 3 includes a molding layer first surface 31 far away from the main substrate 1 and a molding layer second surface 32 close to the main substrate 1, and at least one stress relief groove 7 located at an outer peripheral side of the cavity device 5 is disposed in the molding layer 3.
Specifically, in the packaging structure, the cavity device 5 is arranged on the first surface 11 of the main substrate, and the plastic package layer 3 covers the first surface 11 of the main substrate and wraps the cavity device 5; defining one surface of the plastic package layer 3, which is far away from the main substrate 1, as a plastic package layer first surface 31, and defining the other surface of the plastic package layer 3, which is close to the main substrate 1, as a plastic package layer second surface; when the packaging structure is affected by thermal expansion and cold contraction, at least one stress release groove 7 is arranged on the outer peripheral side of the cavity device 5 for reducing the stress effect of the plastic package material in the plastic package layer 3 on the cavity device 5 wrapped in the plastic package layer, so that the peripheral plastic package material of the cavity device 5 can be reduced, and the effects of stress pulling and the like of the plastic package material on the cavity device 5 under the thermal expansion and cold contraction effect or the moisture absorption and expansion effect are reduced.
Here, the outer circumference side of the cavity device 5 refers to a position close to the outer sidewall of the cavity device 5, and the stress relief groove 7 may be a ring-shaped stress relief groove 7 surrounding the outer circumference side of the cavity device 5, or may be one or more independently divided strip-shaped stress relief grooves 7 located on the outer circumference side of the cavity device 5.
Meanwhile, both sides of the main substrate 1 can be subjected to plastic packaging, that is, the first surface 11 or the second surface 12 of the main substrate can be provided with packaging devices and subjected to plastic packaging to package all the packaging devices.
In the plastic packaging layer 3, the extension direction of the stress release groove 7 is not limited, and the stress release groove can extend along the thickness direction or the horizontal direction of the plastic packaging layer 3, so long as the peripheral plastic packaging material of the cavity device 5 can be reduced, thereby greatly reducing the adverse stress influence on the cavity device 5 under the action of thermal expansion and cold contraction or the action of moisture absorption and expansion and avoiding damage.
Optionally, in the package structure, the cavity device 5 may be a ceramic or organic substrate LGA or BGA device that is packaged at a time, or may be other devices such as a wafer level package device. Besides the cavity devices 5, other package devices can be arranged according to actual requirements, and the type and the number are not limited.
Further, the stress relief groove 7 is an annular stress relief groove 7 formed around the cavity device 5.
Further, the stress relief groove 7 is not in contact with the primary base plate first surface 11.
As shown in fig. 1 to 2, the stress relief groove 7 is an annular stress relief groove 7 surrounding the outer periphery of the cavity device 5, i.e., the stress relief groove 7 forms an annular shape in the planar direction of the molding layer 3. The annular stress relief groove 7 may be hidden in the plastic package layer 3, or the plastic package layer 3 may be exposed to show an annular shape on the first surface 31 of the plastic package layer.
In addition, the stress relief groove 7 is located above the metal or dielectric layer of the primary substrate 1, and the stress relief groove 7 and the primary substrate first surface 11 are not in contact with each other, so that the surface metal of the primary substrate 1 can be prevented from being oxidized.
Alternatively, the lower end of the stress relief groove 7 may extend toward the primary substrate 1 until the stress relief groove 7 contacts the primary substrate first surface 11, so that the primary substrate 1 may be exposed out of the molding layer 3, that is, the stress relief groove 7 may contact the metal or dielectric layer of the primary substrate 1, or may even partially overlap the metal or dielectric layer of the primary substrate 1, and then the stress relief groove 7 may be filled with a conductive or non-conductive material in a subsequent process, so as to seal the stress relief groove 7 and prevent the exposure of the primary substrate 1 from metal oxidation.
Further, the first surface 31 of the molding compound layer is further provided with an open slot 9 extending towards the direction of the cavity device 5, and at least part of the open slot 9 is opposite to the cavity device 5.
Further, the opening groove 9 is an inverted trapezoidal opening groove 9.
Further, the open groove 9 communicates with the stress relief groove 7.
As shown in fig. 3, the first surface 31 of the molding compound layer is further provided with an open slot 9 to reduce the molding compound above the cavity device 5, thereby reducing the stress effect of the corresponding molding compound on the cavity device 5; the open slot 9 at least partially corresponds to the cavity device 5 below and extends from the first surface 31 of the molding layer towards the cavity device 5, whereby the open slot 9 directly above the cavity device 5 can greatly reduce the stress that the cavity device 5 may be subjected to.
The processing technology of the open slot 9 is not limited, and the open slot may be formed by mold stripping or laser lithography. The shape of the open slot is not limited, and the open slot can be an inverted trapezoidal open slot which is easy to demould and can also be an open slot with other shapes such as a porous array slot. For the convenience of demoulding process, the open slot 9 is set to be in an inverted trapezoidal shape, so that the demoulding process can be conveniently and quickly carried out.
In addition, the open groove 9 can be communicated with the stress release groove 7, so that the open groove 9 and the stress release groove 7 can be photoetched on the first surface 31 of the plastic packaging layer at the same time through laser processing, the processing technology is simplified, and the production efficiency is high. Of course, the open slot 9 and the stress relief slot 7 may also be arranged in a spacing structure according to the actual layout of the peripheral package devices, so as to facilitate different subsequent processes.
Further, the stress relief groove 7 is filled with a stress buffer layer or a moisture barrier layer 8.
Further, the open grooves 9 are filled with stress buffers or moisture barriers 8.
Further, the stress relief groove 7 is in contact with the primary base plate first surface 11 to expose the primary base plate 1.
As shown in fig. 4, the stress relief grooves 7 and the open grooves 9 may be filled with a low modulus stress buffering and moisture barrier material to further protect the cavity device 5 and reduce the stress effect that the cavity device 5 may be subjected to. At this time, the stress relief groove 7 may be in contact with the primary base plate first surface 11, thereby exposing the surface metal of the primary base plate 1 without being oxidized.
Optionally, the materials filled in the stress relief groove 7 and the open groove 9 are not limited, and may be conductive materials or non-conductive materials. Meanwhile, the two materials may be filled in different types, for example, the opening groove 9 may be filled with low stress and low moisture absorption materials, and the stress relief groove 7 may be filled with conductive materials.
Furthermore, the periphery of the package structure is further provided with a shielding layer electrically connected with the ground terminal of the main substrate 1, the stress buffer layer or the moisture barrier layer 8 is made of a conductive material, and the shielding layer 2 is in contact with the stress buffer layer or the moisture barrier layer 8.
As shown in fig. 4, the periphery of the package structure is further provided with a shielding layer 2, the shielding layer 2 encapsulates the plastic package layer 3 and covers the side surface of the main substrate 1, and the shielding layer 2 is electrically connected to the ground terminal of the main substrate 1, so as to perform EMI shielding on the whole package structure to protect the whole package structure. When the stress relief groove 7 and the open groove 9 in the package structure are communicated with each other, the stress buffer layer or the moisture barrier layer 8 filled in the stress relief groove 7 and the open groove 9 may be made of a conductive material, and the stress buffer layer or the moisture barrier layer 8 is in contact with the shielding layer 2, and at this time, the conductive stress buffer layer or the moisture barrier layer 8 may be used as a part of the EMI shielding structure, so as to further perform an internal shielding function on the cavity device 5.
For ease of understanding, examples are described in detail below:
example 1
As shown in fig. 1 to fig. 2, the cavity device package structure in this embodiment includes a main substrate 1, a cavity device 5, other package devices, a molding compound layer 3, and a stress relief groove 7; the cavity device 5 is arranged on the first surface 11 of the main substrate, the plastic package layer 3 covers the first surface 11 of the main substrate and wraps the cavity device 5 and other packaging devices; one surface of the plastic package layer 3, which is far away from the main substrate 1, is a plastic package layer first surface 31, and the other surface, which is close to the main substrate 1, is a plastic package layer second surface 32; in the molding layer 3, a stress relief groove 7 is circumferentially arranged on the outer peripheral side of the cavity device 5, and the stress relief groove 7 forms a ring-shaped pattern on the first molding layer surface 31. The stress relief groove 7 is located above the metal or dielectric layer of the primary substrate 1 and does not contact the primary substrate first surface 11, thereby preventing oxidation of the surface metal of the primary substrate 1.
Therefore, under the condition that the encapsulation effect of the plastic package layer 3 on the packaging device on the main substrate 1 is not influenced, the volume size of the annular stress release groove 7 is reasonably designed so as to reduce the effects of stress pulling and the like of the plastic package material on the cavity device 5 under the effects of expansion with heat and contraction with cold or under the effect of moisture absorption and expansion.
The cavity device 5 may be a ceramic or organic substrate LGA or BGA device that is packaged at a time, or may be another device such as a wafer level package device. Besides the cavity devices 5, other package devices can be arranged according to actual requirements, and the type and the number are not limited.
Example 2
As shown in fig. 3, the cavity device package structure in this embodiment also includes a main substrate 1, a cavity device 5, a plastic package layer 3, and a stress relief groove 7, and has a different function from the first embodiment in that an inverted trapezoidal open groove 9 is further formed on a first surface 31 of the plastic package layer, and the inverted trapezoidal open groove 9 is located right above the cavity device 5 and extends from the first surface 31 of the plastic package layer toward the cavity device 5; and communicates with the stress relief groove 7, the stress relief groove 7 extending from the bottom of the inverted trapezoidal opening groove 9 toward the primary base plate 1. Thus, the inverted trapezoidal open slot 9 can be conveniently and quickly demoulded; or the open groove 9 and the stress release groove 7 are simultaneously photoetched through laser processing, so that the processing technology is simplified, and the production efficiency is high.
Example 3
As shown in fig. 4, in the cavity device package structure in the present embodiment, what is different from the second embodiment is that the opening groove 9 and the stress releasing groove 7 are further filled with a stress buffer layer or a moisture barrier layer 8, and the periphery of the package structure is further provided with a shielding layer 2; the shielding layer 2 is electrically connected with the grounding end of the main substrate 1 so as to carry out EMI shielding on the whole packaging structure to protect the packaging structure; meanwhile, the stress buffer layer or moisture barrier layer 8 is in contact with the shielding layer 2 and is made of a conductive material, so that the conductive stress buffer layer or moisture barrier layer 8 forms a part of the EMI shielding structure, and plays a role in further EMI shielding protection for the cavity device 5 inside the packaging structure.
In summary, in the cavity device package structure provided by the present invention, the cavity device 5 is disposed on the first surface 11 of the main substrate, and the plastic package layer 3 covers the first surface 11 of the main substrate and wraps the cavity device 5 therein; in the plastic package layer 3, at least one stress release groove 7 is arranged on the outer peripheral side of the cavity device 5, so that the plastic package material on the periphery of the cavity device 5 can be reduced and isolated, the stress pulling and other effects of the peripheral plastic package material on the cavity device 5 under the action of thermal expansion and cold contraction or the action of moisture absorption and expansion are reduced, and the cavity device 5 is prevented from being damaged by adverse stress.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A packaging structure of a cavity device comprises a main substrate, the cavity device and a plastic package layer, wherein the main substrate comprises a main substrate first surface and a main substrate second surface which are oppositely arranged, the plastic package layer covers the main substrate first surface and encapsulates the cavity device, the plastic package layer comprises a plastic package layer first surface far away from the main substrate and a plastic package layer second surface close to the main substrate, the packaging structure is characterized in that,
at least one stress relief groove positioned on the outer periphery side of the cavity device is formed in the plastic packaging layer.
2. The package structure of the cavity device as claimed in claim 1, wherein the stress relief groove is an annular stress relief groove formed around the cavity device.
3. The package structure of the cavity-containing device as recited in claim 1, wherein the stress relief groove is not in contact with the primary substrate first surface.
4. The cavity device package structure of claim 1, wherein the molding layer first surface is further provided with an open slot extending toward the cavity device, and at least a portion of the open slot is located opposite to the cavity device.
5. The cavity device package structure of claim 4, wherein the open slots are inverted trapezoidal open slots.
6. The encapsulation structure of the cavity device as claimed in claim 4, wherein the stress relief groove is filled with a stress buffer layer or a moisture barrier layer.
7. The cavity device package structure of claim 6, wherein the stress relief groove is in contact with the primary substrate first surface to expose the primary substrate.
8. The encapsulation structure of the cavity device as claimed in claim 4, wherein the open slots are filled with a stress buffer layer or a moisture barrier layer.
9. The cavity device package structure of claim 8, wherein the open trench communicates with the stress relief trench.
10. The package structure of the cavity device as claimed in claim 9, wherein a shielding layer electrically connected to the ground terminal of the main substrate is further disposed on the periphery of the package structure, the stress buffer layer or the moisture barrier layer is made of a conductive material, and the shielding layer is in contact with the stress buffer layer or the moisture barrier layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910936917.5A CN110676249B (en) | 2019-09-29 | 2019-09-29 | Packaging structure of cavity device |
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|---|---|---|---|
| CN201910936917.5A CN110676249B (en) | 2019-09-29 | 2019-09-29 | Packaging structure of cavity device |
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| CN110676249A true CN110676249A (en) | 2020-01-10 |
| CN110676249B CN110676249B (en) | 2022-09-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116782506A (en) * | 2023-08-24 | 2023-09-19 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
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| CN116782506B (en) * | 2023-08-24 | 2023-11-24 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110676249B (en) | 2022-09-06 |
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