JP7324240B2 - power supply - Google Patents

Description

The present invention relates to a power supply device having a circuit board on which semiconductor elements, capacitive elements, control ICs, and the like are mounted.

Regarding this type of power supply device, there is known a prior art that focuses on the conductive heat dissipation structure of the component parts (see, for example, Patent Document 1). In this prior art, power semiconductors that generate high heat are classified as high heat generation parts, while input filters, control circuits, electrolytic capacitors, etc., which themselves generate little heat, are classified as low heat generation parts. A structure is adopted in which the substrates to be mounted are separated from each other.

JP 2014-117106 A

However, in the structure of the prior art, in order to protect the low heat generation components from the heat of the high heat generation components, the separated substrates are arranged in a large separation in the height direction, so the power supply device (unit) as a whole is reduced accordingly. The volume has increased inadvertently. This is also the case when a heat sink is used to dissipate heat from power semiconductor components. Even if the height of the board can be kept low, a heat sink for heat dissipation is placed on the board instead. As a result, there is a problem that the volume of the entire device increases.

The present invention provides a technology capable of miniaturizing the unit.

The present invention provides a power supply. The present invention employs the following solutions. It should be noted that the power supply device of the present invention can be realized by the following solution means alone or in combination, and the power supply device does not always have to have all the solution means.
(1) All power semiconductor components are surface-mounted.
(2) Do not mount heat dissipation components such as heat sinks and heat pipes on the board.
(3) The control IC component is mounted on a different board from the power semiconductor component.
(4) Mount multiple electrolytic capacitors (bulk capacitors).

Technical approaches to the problems of the above solutions (1) to (4) are outlined below.
That is, solution (1) contributes to lowering the spatial density by using surface-mounted parts for all power semiconductor parts. Surface-mounting of power semiconductor components suppresses an increase in volume in the height direction, making it possible to reduce the size of the unit.

Solution (2) is employed together with surface mounting of power semiconductor components. That is, since the heat of the power semiconductor component is dissipated through the power loop circuit board on which it is mounted, there is no need to use heat dissipating components such as heat sinks and heat pipes. Thereby, miniaturization of the unit can be realized. On the other hand, in order to mount a surface mount type power semiconductor component, it becomes necessary to secure a space in the direction along the substrate surface (above the substrate surface).

Here, solution (3) is preferably adopted. In other words, the power semiconductor parts (parts for the power loop) were mounted on the power loop circuit board, and the multiple control IC parts required for their control were separately miniaturized (reduced to a small board). It shall be mounted on the control circuit board. As a result, sufficient space is secured on the power loop circuit board for surface-mounting all the power loop components, and the size of the unit can be reduced.

Note that the method of separating the substrates separately has already been adopted in the prior art (Patent Document 1), etc., but the solution (3) of the present invention has the following technical features.
In other words, even if they are structurally separate substrates, all control IC parts must be supplied with a stable reference potential on the control circuit substrate. It must be connected stably to the reference potential of the capacitor (bulk capacitor). However, if the substrate is structurally separated, the distance of the conductor (pattern) for connecting from the reference potential area on the power loop circuit board to the reference potential of each control IC component becomes longer, and the distance variation causes There is a risk that the reference potential of each control IC part becomes unstable. For example, when a plurality of control IC parts with different operating frequencies are used, the reference potential level fluctuates due to the influence of the frequency of the control IC part closest to the reference potential, and the reference potential applied to the other control IC parts becomes unstable. easy to become.

[First configuration]
Therefore, in the power supply device of the present invention, when the control circuit board is mounted on the power loop circuit board, the control circuit board is arranged in parallel with the power loop circuit board having a region serving as the reference potential of the electrolytic capacitor. and

With the above configuration, conductors (wiring) can be connected to arbitrary multiple points on the control circuit board at the shortest distance from the reference potential area of the electrolytic capacitor on the power loop circuit board. . Such "connection at the shortest distance" can be realized by mounting the control circuit board parallel to the power loop circuit board. It cannot be realized if it is implemented. That is, in this case, the distances from the position of the reference potential on the power loop circuit board to arbitrary points on the control circuit board vary greatly in the vertical direction, so the distance to higher points will be longer no matter what. This is because

In this regard, if the control circuit board is arranged parallel to the power loop circuit board as in the present invention, the vertical voltage from the area serving as the reference potential on the power loop circuit board to an arbitrary point on the control circuit board Since the height in the direction is uniform, even if a plurality of control IC components are mounted at arbitrary positions on the control circuit board, the distance to each reference potential can be minimized. As a result, the conductor wiring can be made shorter, and the risk of destabilizing the reference potential of each control IC component during operation of the power supply can be reliably suppressed.

Furthermore, according to the first configuration, by structurally downsizing the control circuit board and using the power loop circuit board as the main board (standard size board), the conductor pattern impedance of the power loop circuit board is lowered and noise is generated. It also has the effect of reducing risk. Furthermore, since a large substrate area can be secured, the heat radiation effect from the conductor pattern is also improved.

[Second configuration]
In the power loop circuit board, at least two electrolytic capacitors are mounted in a positional relationship in which the respective terminals are arranged linearly, so that the area serving as the reference potential of the plural electrolytic capacitors is arranged in the arrangement of the plural terminals. It can be set as the structure currently formed in the linear shape which followed.

As a result, the area (range) of the reference potential formed on the power loop circuit board (main board) can be expanded from a point-like shape to a linear shape, and the area can be controlled from the expanded reference potential region. The wiring length of the reference potential to the circuit board can be made shorter and easier.

[Third configuration]
The control circuit board can be arranged between the power loop circuit board and the main body of the electrolytic capacitor mounted in a posture parallel to the power loop circuit board.

As a result, when viewed from the power loop circuit board, the control circuit board is first placed in a parallel position directly above, and the electrolytic capacitor is placed above it with the cylindrical main body facing sideways (horizontal). It is possible to improve the space efficiency and contribute to the miniaturization of the unit.

[Fourth configuration]
The switching semiconductor element used in the conversion section (conversion circuit) such as the AC-DC conversion section and the DC-DC conversion section is surface-mounted on the power loop circuit board as a surface-mounted power loop component, The heat dissipation of the switching semiconductor element is conducted through the power loop circuit board without using a heat sink for heat dissipation.

As a result, heat radiation components such as heat sinks can be eliminated, and the overall size and cost can be reduced.

According to the present invention, miniaturization of the unit can be realized.

1 is a functional block diagram showing the overall configuration of an AC-DC conversion power supply device 100; FIG. 1 is a perspective view showing the overall structure of an AC-DC conversion power supply device 100; FIG. 3 is an exploded perspective view showing the electrolytic capacitors C10, C20 and the control circuit board 130 separated from the power loop circuit board 102. FIG. 2A and 2B are a plan view (A) and a front view (B) of the AC-DC conversion power supply device 100. FIG. 2 is a bottom view of AC-DC conversion power supply device 100. FIG. 2 is a bottom view of the AC-DC conversion power supply device 100 showing a state in which a control circuit board 130 is separated from a power loop circuit board 102. FIG. FIG. 3 is a three-dimensional diagram schematically showing wiring of a reference potential according to the present embodiment; FIG. 4 is a three-dimensional view schematically showing wiring connection of a comparative example to be compared with the present embodiment;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, an AC-DC conversion power supply with a standard size (for example, 3 inches by 5 inches) is taken as an example of the power supply, but the present invention is not limited to this.

FIG. 1 is a functional block diagram showing the overall configuration of an AC-DC conversion power supply device 100. As shown in FIG. The AC-DC conversion power supply device 100 is composed of two structurally separated boards, one being a power loop circuit board 102 as a main board and the other being a control circuit board 130 being a sub board. be. In the block configuration of FIG. 1, various functional blocks constituting the AC-DC converter and the DC-DC converter are all arranged on the power loop circuit board 102, but the control ICs 152, 154, 156 on the primary side are All are arranged on the control circuit board 130 . The functional block configuration of the AC-DC conversion power supply device 100 will be described below.

[Main board (power loop circuit board)]
The AC-DC conversion power supply device 100 includes an input filter 105, a rectifier 109, a power factor correction circuit (PFC) 110, a bulk capacitor 111, an LLC resonance circuit 112, etc. as primary side elements, and an auxiliary power supply circuit 114. ing. The AC-DC conversion power supply device 100 also includes a secondary side control circuit 127 in addition to a synchronous rectification section 128 and a smoothing section 129 as secondary side elements.

The input from the AC power supply is noise-filtered by the input filter 105, full-wave rectified by the rectifier 109, then switched by the power factor correction circuit 110, and boosted energy is stored in the bulk capacitor 111. The input filter 105 has inductors (L1, L2, etc. not shown in FIG. 1), and the rectifying section 109 has power semiconductors (D1, D2, D3, D4), etc. that form a diode bridge. The power factor correction circuit 110 includes inductors, switching semiconductor elements (Q1, Q2, Q3), rectifier diodes, and the like. The LLC resonant circuit 112 has switching semiconductor elements (Q4, Q5), a capacitor, an inductor, and a transformer T1. Then, the LLC resonance circuit 112 drives the primary side of the transformer T1 (DC-DC conversion), synchronous rectification and smoothing are performed on the secondary side, and a large current of low voltage is output as a DC current.

The auxiliary power supply circuit 114 drives the transformer T2 for auxiliary power supply with the DC current from the rectifying section 109 and supplies auxiliary power to the secondary side control circuit 127 . The secondary side control circuit 127 has secondary side circuits such as a synchronous rectification control section 127a, an overcurrent protection section 127b, an overvoltage protection section 127c, and an overheat protection section 127d.

[Sub board (control circuit board)]
The AC-DC conversion power supply device 100 controls the operation of the power factor correction circuit 110 (switching semiconductor elements Q1, Q2, Q3) with the control IC 152, and also controls the operation of the LLC resonance circuit 112 (switching semiconductor elements Q4, Q5). In addition to being controlled by the control IC 154 , the control IC 156 controls the auxiliary power supply circuit 114 (driving the transformer T<b>2 ) for the operation of the secondary side control circuit 127 .

[Multiple electrolytic capacitors]
Here, in this embodiment, two electrolytic capacitors C10 and C20 are used for the bulk capacitor 111 as a function block element, and the negative terminals of the plurality of electrolytic capacitors C10 and C20 are linearly arranged. , a reference potential region (ground pattern GP0) linearly extending along the arrangement of the negative terminals is formed on the power loop circuit board 102. As shown in FIG. As a result, the area serving as the reference potential of the electrolytic capacitors C10 and C20 is expanded from the "point" to the "line". The reference potential of the electrolytic capacitors C10 and C20 is the reference potential of the entire primary side power loop.

[Ground wiring of control IC]
Regarding the connection with the control circuit board 130, which is a sub-board, since the reference potentials of the electrolytic capacitors C10 and C20 are formed in a linear region on the power loop circuit board 102, each control IC 152, 154, 156 can be Ground wiring (GP1, GP2, GP3) can be connected. That is, even if the control ICs 152, 154, and 156 are separately mounted (arranged) on the control circuit board 130, wiring from the reference potential area on the power loop circuit board 102 side to various places on the control circuit board 130 side can be minimized. This is because the control circuit board 130 is arranged parallel to the power loop circuit board 102 in addition to the fact that the reference potential region is linearly formed by the electrolytic capacitors C10 and C20 as described above. is also a factor. This point will be described below.

[Overall structure]
FIG. 2 is a perspective view showing the overall structure of the AC-DC conversion power supply device 100. As shown in FIG. 3 is an exploded perspective view showing the electrolytic capacitors C10, C20 and the control circuit board 130 separated from the power loop circuit board 102. FIG.

As described above, the AC-DC conversion power supply 100 includes the power loop circuit board 102 and the control circuit board 130, and the main power loop circuit board 102 has standardized external dimensions (eg, 3 inches by 5 inches). , whereas the sub control circuit board 130 has a smaller outer shape. Further, in this type of power supply device, the electrolytic capacitors C10 and C20 are usually mounted in a state in which the cylindrical body portion is laid horizontally. A control circuit board 130 is arranged between the body portions of the two electrolytic capacitors C10 and C20.

In addition, the inductors L1 and L2 and the transformers T1 and T2 are mounted on the power loop circuit board 102, and the AC power supply input connector 104 and electronic components 106, 107, 108, etc. are mounted on the upper surface of FIGS. is implemented in The power loop circuit board 102 is mounted with a secondary side sub-board 120 and various electronic components 122, as well as a DC power supply output connector 124, a signal output connector 126, and the like.

Electrolytic capacitors C10 and C20 are mounted so that terminals 10a and 20a of both poles are bent substantially at a right angle and inserted through through holes 102a of power loop circuit board 102, respectively. However, since the body portions of the two electrolytic capacitors C10 and C20 are offset from each other in the axial direction (substrate surface direction), the four through holes 102a are not all on the same line and are slightly offset, but overall arranged linearly.

The control circuit board 130 has four U-shaped cutouts 130a formed on one side edge thereof, and the four terminals 10a and 20a are accommodated in the cutouts 130a at corresponding positions. It is The four notches 130a also have different lengths according to the positional relationship between the two electrolytic capacitors C10 and C20.

The connection between the power loop circuit board 102 and the control circuit board 130 is made using a connection terminal arrangement (not shown) (only reference numeral 132 is shown in FIG. 3). For this reason, a large number of through holes 130b are arranged in another side edge of the control circuit board 130, and a large number of through holes 102b are arranged in positions corresponding to the power loop circuit board 102 as well. formed by The control circuit board 130 is also connected to the through hole 103b using a connection terminal (not shown), and is supported by the power loop circuit board 102 using a supporting terminal (not shown).

4A and 4B are a plan view (A) and a front view (B) of the AC-DC conversion power supply device 100. FIG. As also shown in FIG. 4, the control circuit board 130 has an outline that is slightly larger than the projection range of the main bodies of the two electrolytic capacitors C10 and C20 in plan view. However, the outer dimensions of the control circuit board 130 are not limited to this example.

In addition, the control circuit board 130 is mounted parallel to the power loop circuit board 102, and the position from the power loop circuit board 102 is kept lower than most of the mounted components. Therefore, even if the bodies of the electrolytic capacitors C10 and C20 are arranged above the control circuit board 130, the height from the power loop circuit board 102 is higher than that of other mounted components (eg inductors L1 and L2, transformers T1, T1, etc.). T3, secondary side sub-substrate 120, etc.).

Although not shown in FIGS. 3 and 4, other electronic components such as capacitors, inductors, resistors, and phototransistors are mounted on the upper surface of the power loop circuit board 102 at various locations.

[Surface mounting of power loop components]
5 is a bottom view of the AC-DC conversion power supply device 100. FIG. Therefore, various electronic components mounted on the bottom side of the power loop circuit board 102 are appropriately shown in FIG. Also, in FIG. 5, the arrangement of the control circuit board 130 and the electrolytic capacitors C10 and C20 mounted on the upper surface side of the power loop circuit board 102 is indicated by broken lines.

As shown in FIG. 5, the power semiconductors D1, D2, D3 and D4 and the switching semiconductor elements Q1, Q2, Q3, Q4 and Q5 are mounted on the bottom surface of the power loop circuit board 102. ing. These power loop components are all surface-mounted on the bottom surface of the power loop circuit board 102 by using surface-mounted components. Although not shown in FIG. 5, on the bottom side of the power loop circuit board 102, other rectifying diodes and switching semiconductor elements (MOSFETs) used for the primary and secondary sides are surface-mounted in various places. In addition, electronic parts such as capacitors and resistors are also mounted.

[Ground wiring]
FIG. 6 is a bottom view of the AC-DC conversion power supply device 100 showing a state in which the control circuit board 130 is separated from the power loop circuit board 102. FIG. In addition, in FIG. 6, the ground pattern GP0 and the ground wirings GP1, GP2, and GP3 formed on the power loop circuit board 102 are shaded. In addition, in FIG. 6, various semiconductor components are indicated by two-dot chain lines in order to prevent complication.

As described above, the ground pattern GP0 is a reference potential region formed with reference to the negative terminals 10a and 20a of the two electrolytic capacitors C10 and C20. In the present embodiment, the terminals 10a and 20a of the two electrolytic capacitors C10 and C20 are linearly arranged so that the ground pattern GP0 spanning the two negative terminals 10a and 20a is linear (linear). ) is formed to extend to

From such a ground pattern GP0, three systems of ground wirings GP1, GP2, and GP3 extend toward a range facing the control circuit board 130. Among them, the ground wiring GP1 extends through the through holes 102b and 102b. It is connected to the control circuit board 130 through 130b. Another ground wiring GP2 is connected to the through hole 102c at a position between the two electrolytic capacitors C10 and C20, for example, and is connected to the control circuit board 130 through a through hole 130c formed at a position opposite to the through hole 102c. there is The remaining ground wiring GP3 is connected to a through-hole 102d formed at a position different from the through-hole 102b by extending in the opposite direction to the ground wiring GP1, and is formed at a position opposite to the through-hole 102d. It is connected to the control circuit board 130 at 130d.

The ground pattern GP10 and the ground wirings GP1, GP2, and GP3 shown in FIG. 6 may be formed in the inner layer of the power loop circuit board 102. FIG.

Three ground patterns GP10, GP20, and GP30 are formed on the control circuit board 130 so as to face the three systems of ground wiring GP1, GP2, and GP3, respectively. These ground patterns GP10 and GP20 are also formed in the inner layer of the control circuit board 130. As shown in FIG.

A ground pattern GP10 facing the ground wiring GP1 is connected to the through hole 130b, a ground pattern GP20 facing the ground wiring GP2 is connected to the through hole 130c, and a ground wiring GP3 is connected to the ground wiring GP3. The opposing ground pattern GP30 is connected to the through hole 130d.

Although not shown in FIG. 6, the control ICs 152 , 154 , 156 are mounted on the surface (lower surface) of the control circuit board 130 facing the power loop circuit board 102 . The ground terminal of the control IC 152 is connected to the ground pattern GP10, the ground terminal of another control IC 154 is connected to the ground pattern GP20, and the ground terminal of the other control IC 156 is connected to the ground pattern GP10. It is connected to GP30. As a result, it is possible to form the wiring of the shortest reference potential from the reference potential of the electrolytic capacitors C10, C20 to each of the control ICs 152, 154, 156. FIG. This point will be further described below.

[Principle of shortest connection wiring]
FIG. 7 is a three-dimensional diagram schematically showing the wiring of the reference potential according to this embodiment. Therefore, FIG. 7 schematically shows the power loop circuit board 102, the control circuit board 130, the ground pattern GP0, the ground wirings GP1, GP2, GP3, and the like. Also, the control ICs 152, 154 and 156 are shown in a simplified manner. In the following description, directions are indicated by the XYZ axes shown in FIG. 7 as appropriate.

As described above, in the present embodiment, by providing a plurality of electrolytic capacitors C10 and C20, the area serving as the reference potential is linearly formed as the ground pattern GP0. In addition, in this embodiment, the control circuit board 130 faces the ground pattern GP<b>0 and is arranged parallel to the power loop circuit board 102 . In FIG. 7, the control circuit board 130 is arranged at a position shifted in the X-axis direction from directly above the ground pattern GP0 for easy understanding. The substrate 130 also faces the ground pattern GP0. Therefore, in this embodiment, the shortest distance from the ground pattern GP0 to any point on the control circuit board 130 can be connected as follows. Note that the control circuit board 130 may face only a portion of the ground pattern GP0, or may not face the ground pattern GP0.

[Shortest connection (1)]
For example, in FIG. 7, considering the case of connecting to the ground terminal of the control IC 152 located on the frontmost side in the Y-axis direction, since the ground pattern GP0 is formed linearly extending in the Y-axis direction, the ground There is no need to intentionally extend the ground wiring GP1 in the Y-axis direction from the pattern GP0. In addition, since the control circuit board 130 is arranged in parallel with the power loop circuit board 102, the Z-axis direction of the height direction is constant regardless of the position of the control IC 152, and the connection terminal 132 is placed at the corresponding position. Just place it. Therefore, the wiring length from the ground pattern GP0 mainly depends only on the distance in the X-axis direction, and the wiring lengths in the Y-axis and Z-axis directions are always constant regardless of the position of the control IC 152. It can be made as short as possible.

[Shortest connection (2)]
Next, when connecting to the ground terminal of the control IC 154 located in the center in the Y-axis direction, it is sufficient to form the ground wiring GP2 directly from the ground pattern GP0 in the X-axis direction. The shortest connection can be achieved simply by using

[Shortest connection (3)]
When connecting to the ground terminal of the control IC 156 located on the farthest side in the Y-axis direction, the ground pattern GP0 is also formed linearly extending in the Y-axis direction. There is no need to extend the ground wiring GP3 in the direction. Similarly, since it is only necessary to arrange the connection terminals 132 at corresponding positions in the Z-axis direction, the wiring length from the ground pattern GP0 also mainly depends only on the distance in the X-axis direction. The wiring length in the Z-axis direction can be made the shortest by always having a fixed length regardless of the position of the control IC 156 .

[Explanation using a comparative example]
FIG. 8 is a three-dimensional diagram schematically showing wiring connection of a comparative example to be compared with the present embodiment. The superiority of the shortest connection according to this embodiment will become clearer from comparison with the following comparative example.

In this comparative example, the reference potential GP200 of the main substrate 202 is formed at one "point". In the comparative example, the sub-board 230 is vertically mounted on the main board 202 . In such a comparative example, the distance from the reference potential GP200 to any point on the sub-board 230 varies greatly depending on the position of each point. A specific description will be given below.

[Connection distance (1)]
First, consider the connection with the point located on the frontmost side when viewed in the Y-axis direction. In this case, it is almost unnecessary to extend the wiring GP201 in the Y-axis direction from the reference potential GP200 on the main board 202, and in the X-axis direction, the wiring GP201 can be minimized to the position of the sub-board 230. As for the direction, the length of the wiring GP201 is affected by the height of the point on the sub-board 230 . As shown in FIG. 8, when the position of the point is low in the Z-axis direction, the wiring GP201 is shortened accordingly, but when the position of the point is high, the wiring GP201 is correspondingly long.

[Connection distance (2)]
Next, consider the connection with the central point when viewed in the Y-axis direction. In this case, it is necessary to extend the wiring GP201 from the reference potential GP200 on the main substrate 202 in the XY axis direction, and from there, the wiring GP202 is formed to the position of the sub substrate 230 in the X axis direction. In the Z-axis direction as well, the length of the wiring GP202 is affected by the height on the sub-board 230 at which the point is located. Also in this case, the higher the position of the point in the Z-axis direction, the longer the wiring GP202.

[Connection distance (3)]
When considering the connection with the point located on the farthest side in the Y-axis direction, on the main board 202, it is first necessary to greatly extend the wiring GP201 in the Y-axis direction from the reference potential GP200. The wiring GP202 is formed up to the position of the sub-board 230 in the axial direction. Similarly, in the Z-axis direction, the length of the wiring GP 202 is affected by the height of the point on the sub-board 230. As shown in FIG. If the position is higher than others, the wiring GP202 will be correspondingly longer.

Thus, in the case of the comparative example, it is difficult to minimize the wiring distance from the point-like reference potential GP200 to an arbitrary point on the sub-board 230 . Therefore, if the control IC parts are mounted in different places on the sub-board 230, there is a risk that the ground wiring length to each control IC part varies greatly, and the reference potential becomes unstable due to the difference in the operating frequency of each control IC part. There is

In contrast, in the present embodiment, the wiring length from the ground pattern GP0 serving as the reference potential to each of the control ICs 152, 154, and 156 is minimized without being affected by the position on the control circuit board 130 as described above. can do. As a result, the stability of the operation of the control ICs 152, 154, and 156 can be enhanced, and control operation failures can be suppressed.

According to this embodiment, the following advantages are obtained.
(1) The flexibility of wiring is increased.
This is because the use of the plurality of electrolytic capacitors C10 and C20 results in a "line (linear)" rather than a "point (point-like)" reference potential. Specifically, as shown in FIGS. 6 and 7, it can be seen that the degree of freedom in forming the ground wirings GP1, GP2, GP3, etc. from the linearly extending ground pattern GP0 is extremely high.

(2) The stability of the operation of the control IC is increased.
This is because a plurality of electrolytic capacitors C10 and C20 are used, and the power loop circuit board 102 and the control circuit board 130 are separated from each other and arranged in parallel with the power loop circuit board 102. , 156 in the shortest possible time. It should be noted that the stability of the operation has already been described.

(3-1) The mounting density of the power supply device is increased (downsizing of the unit).
First, miniaturization is achieved by suppressing the expansion in two-dimensional directions. This is achieved by separating the power loop circuit board 102 and the control circuit board 130 and arranging them in parallel with the power loop circuit board 102, and using a plurality of electrolytic capacitors C10 and C20 to reduce the volume of each capacitor. and made it easier to fill the space for that amount. For example, as shown in FIG. 2 and the like, various mounting components can be mounted at high density even within a limited space on the power loop circuit board 102 having standard size external dimensions.

(3-2) The mounting density of the power supply device is increased (downsizing of the unit).
Secondly, surface mounting of semiconductor components for power loops has been realized. This is mainly due to the fact that the power loop circuit board 102 and the control circuit board 130 are separated. In other words, surface-mounted components require a considerable mounting area, but the use of a separate board provides ample space. A semiconductor for the loop can be surface-mounted.

(3-3) The mounting density of the power supply device is increased (downsizing of the unit).
Thirdly, there is no need for a heat dissipation component (heat sink) for the semiconductor component for the power loop. Mainly, the power loop circuit board 102 and the control circuit board 130 are separated from each other, and surface-mount components are used in the space secured in the power loop circuit board 102. This makes it possible to mount the power supply device of this embodiment in an application. This is because heat can be dissipated to the chassis. In one embodiment, the AC-DC conversion power supply device 100 is used by being installed in other application equipment that uses a DC power supply (for example, equipment in a wireless base station, etc.). The heat of the semiconductor is transmitted to the power loop circuit board 102 on which these are surface-mounted, and can be further dissipated from there to the chassis side of the application equipment on which they are mounted, and the heat can be dissipated directly from the power loop circuit board 102 as well. becomes.

The present invention can be modified in various ways without being restricted by the above-described embodiments.
The arrangement of various mounted components is not limited to the illustrated example, and may be changed as appropriate. In addition, the power loop circuit board 102 does not have to have the standard size, and may have an optimum size according to the application.

The number of electrolytic capacitors should be at least two or more, and the number is not limited to two. Moreover, the arrangement of the terminals of the plurality of electrolytic capacitors may be any arrangement such as a straight line or a curved line, as long as the region serving as the reference potential can be made linear.
Further, in one embodiment, the area serving as the reference potential is formed in a linear shape, but the area serving as the reference potential may be formed in a planar shape. Therefore, the terminal arrangement of the plurality of electrolytic capacitors may be in a two-dimensional form spread over the surface.

The arrangement of the control circuit board 130 does not have to be completely parallel to the power loop circuit board 102 in a geometrical sense, and it is sufficient if a parallel posture is maintained for the intention of manufacture. Therefore, even if there is a slight angle between the power loop circuit board 102 and the control circuit board 130, they are included in the parallel arrangement.

In one embodiment, the control circuit board 130 is arranged at a position that overlaps the ground pattern GP0 serving as the reference potential in plan view, but the control circuit board 130 may be arranged at a position that does not overlap in plan view.

The bodies of the electrolytic capacitors C10 and C20 may not be parallel to the power loop circuit board 102 as in one embodiment, but may be angled to some extent, or may be arranged with the arrangement of the terminals 10a and 20a therebetween. The body portion may be located on the opposite side of one embodiment.

In addition, the structure shown in the drawings in the embodiment is merely a preferred example, and it goes without saying that the present invention can be preferably carried out by adding various elements to the basic structure or by substituting a part thereof. Nor.

100 AC-DC conversion power supply device 102 Power loop circuit board 130 Control circuit board C10, C20 Electrolytic capacitors 10a, 20a Terminals D1, D2, D3, D4 Bridge diode (power semiconductor element)
Q1, Q2, Q3, Q4, Q5 MOSFET (switching semiconductor element)

Claims (3)

a power loop circuit board having at least one of an AC-DC converter and a DC-DC converter formed by mounting a plurality of power loop components, and having a region serving as a reference potential for an electrolytic capacitor;
A control circuit board mounted with a plurality of control IC components for controlling the conversion unit and mounted in a posture parallel to the power loop circuit board,
The power loop circuit board,
At least two or more of the electrolytic capacitors are mounted in a positional relationship in which their respective terminals are linearly arranged, so that the reference potential area of the plurality of electrolytic capacitors is arranged linearly along the arrangement of the terminals. is formed and
The plurality of control IC components on the control circuit board,
A power supply device , wherein the area formed linearly on the power loop circuit board is divided into a plurality of locations and individually connected to a reference potential. The power supply device according to claim 1,
The control circuit board is
It is arranged between the power loop circuit board and the main body of the electrolytic capacitor mounted in a posture in which the axial direction of the cylindrical main body is parallel to the power loop circuit board. and power supply. The power supply device according to claim 1 or 2,
The switching semiconductor element used in the conversion section is surface-mounted on the power loop circuit board as a surface-mounted power loop component, so that the switching semiconductor element can dissipate heat from the power loop without using a heat sink for heat dissipation. A power supply device characterized in that it is performed by transmitting through a circuit board.