CN102984892B - A kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product - Google Patents
A kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product Download PDFInfo
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- CN102984892B CN102984892B CN201210462253.1A CN201210462253A CN102984892B CN 102984892 B CN102984892 B CN 102984892B CN 201210462253 A CN201210462253 A CN 201210462253A CN 102984892 B CN102984892 B CN 102984892B
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Abstract
The invention discloses a kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product, belong to hole metallization field.Methods described includes：To the thick copper of through hole plating of high thickness to diameter ratio circuit board, the copper thickness into the through hole reaches necessary requirement；Drilled on the through hole for be coated with thick copper, bore unnecessary thick copper, obtain plated-through hole.The high thickness to diameter ratio circuit board realizes hole metallization by the above method.The present invention makes to stay in the thick copper on through hole and meets needs thickness by way of boring and falling the unnecessary thick copper being plated on through hole, thus without carrying out Special controlling to covering power during plating thickness copper, the thick copper speed of plating is fast, and hole metallization efficiency is effectively lifted；A large amount of capital purchase electroplating device need not be put into and novel electroplating liquid medicine is changed, processing cost is effectively reduced.
Description
Technical field
The present invention relates to hole metallization field, more particularly to a kind of hole metallization method, the circuit of high thickness to diameter ratio circuit board
Plate and electronic product.
Background technology
The hole metallization of circuit board refers to that one layer of copper is plated on the inwall of the through hole between circuit board top layer and bottom so that
The top layer of circuit board is connected with each other with bottom.The hole metallization of circuit board is generally realized by the way of Traditional DC plating.With
The development of high speed transmission technology, circuit board capacity is continuously increased, thus the number of plies of circuit board is continuously increased, corresponding circuit board
Thickness is continuously increased, meanwhile, in order to reduce the loss of through hole as far as possible, circuit board through-hole aperture is less and less, so as to bring circuit
Plate radius-thickness ratio is increasing.Traditional DC plating copper technology is not enough due to covering power, it is impossible to meet high thickness to diameter ratio circuit board apertures
The requirement of metallization, the circuit board for especially having matching requirements to through hole, traditional plating mode is even more and is difficult to meet public to aperture
Poor demand.
At present, covering power is improved by following two modes, so as to realize that high thickness to diameter ratio circuit board apertures metallize：
（1）, photo etching component by improveing electroplating liquid medicine, and reduce through hole aperture to the mode of the voltage drop at through hole hole center and change
Good traditional direct current electrode position mode, to realize the hole metallization of high thickness to diameter ratio circuit board；（2）, used by pulse plating equipment
The mode of pulse plating realizes the hole metallization of high thickness to diameter ratio circuit board.
Realize it is of the invention during, inventor find prior art at least there is problems with：
Above two method input is larger, and production cost is high；To realize covering power higher, the electric current for using is smaller,
Efficiency can be than relatively low.
The content of the invention
In order to solve problem of the prior art, a kind of hole metallization of high thickness to diameter ratio circuit board is the embodiment of the invention provides
Method, methods described improves the efficiency of circuit board apertures metallization and reduces hole metallization cost.The technical scheme is as follows：
On the one hand, there is provided a kind of hole metallization method of high thickness to diameter ratio circuit board, methods described includes：
To the thick copper of through hole plating of high thickness to diameter ratio circuit board, the copper thickness into the through hole reaches necessary requirement；
Drilled on the through hole for be coated with thick copper, bore unnecessary thick copper, obtain plated-through hole.
With reference in a first aspect, in the first mode in the cards, the thick copper of plating is by the way of direct current electrode position.
With reference to first aspect and the first mode in the cards, in second mode in the cards, the drilling
By the way of optical borehole.
With reference to first aspect, the first mode in the cards and second mode in the cards, may at the third
In the mode of realization, the plated-through hole is used to be connected with compression connector, the plated-through hole and the connector
The diameter of one end of connection is identical with the diameter of the stitch of the connector.
With reference to the third mode in the cards, in the 4th kind of mode in the cards, it is described drilling by using with
The isometrical brill nozzle of the stitch is realized.
With reference to the third mode in the cards and the 4th kind of mode in the cards, in the 5th kind of mode in the cards
In, the plated-through hole and 0.1-0.9 times that the depth of one end that the connector is connected is the via depth.
With reference to first aspect, the first mode in the cards, second mode in the cards, the third may realize
Mode, the 4th kind of mode in the cards and the 5th kind of mode in the cards, in the 6th kind of mode in the cards, institute
The radius-thickness ratio for stating high thickness to diameter ratio circuit board is 20-30:1.
On the other hand, there is provided a kind of high thickness to diameter ratio circuit board, the circuit board realizes hole metallization by the above method.
On the other hand, a kind of electronic product is additionally provided, the electronic product includes being provided with the connector of stitch, and above-mentioned
High thickness to diameter ratio circuit board, the stitch is crimped in the plated-through hole of the circuit board.
With reference on the other hand, in the first mode in the cards, described electronic product is specially router and friendship
Change planes.
The beneficial effect that technical scheme provided in an embodiment of the present invention is brought is：
By way of boring and falling the unnecessary thick copper being plated on through hole, make to stay in the thick copper on through hole and meet needs thickness, because
And without carrying out Special controlling to covering power when plating thick copper, the thick copper speed of plating is fast, hole metallization efficiency is effectively lifted；No
Need input a large amount of capital purchase electroplating device and change novel electroplating liquid medicine, effectively reduce processing cost.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the implementation method flow chart of the high thickness to diameter ratio circuit board apertures metallization that the embodiment of the present invention one is provided；
Fig. 2 a are the schematic diagrames of step 101 corresponding product in the embodiment of the present invention one
Fig. 2 b are the schematic diagrames of step 102 corresponding product in the embodiment of the present invention one；
Fig. 3 is the high thickness to diameter ratio circuit board manufacturing method flow chart that the embodiment of the present invention nine is provided；
Fig. 4 a are the schematic diagrames of step 301 corresponding product in the embodiment of the present invention nine；
Fig. 4 b are the schematic diagrames of step 302 corresponding product in the embodiment of the present invention nine；
Fig. 4 c are the schematic diagrames of another corresponding product of step 302 in the embodiment of the present invention nine；
Fig. 4 d are the schematic diagrames of step 303 corresponding product in the embodiment of the present invention nine.
In accompanying drawing, the component list representated by each label is as follows：
1st, through hole, 2, the copper in through hole it is thick, 3, unnecessary thick copper, 4, the length of stitch, 5, base copper thickness, 6, thin copper, 7, dry
Film, 8, other regions in addition to through hole, 9, pad.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
Embodiment one
Referring to Fig. 1 and Fig. 2 a-2b, a kind of hole metallization method of high thickness to diameter ratio circuit board is the embodiment of the invention provides,
Including：
Step 101：To the thick copper of through hole plating of high thickness to diameter ratio circuit board, the copper thickness into the through hole reaches necessary requirement；
Referring to Fig. 2 a, the through hole 1 to high thickness to diameter ratio circuit board plates thick copper, and the copper thickness 2 into through hole reaches necessary requirement, leads to
Copper thick 2 in hole is general with reference to IPC（The Institute of the Interconnecting and
PackingElectronic Circuit, electronic circuit interconnection and encapsulation association）Copper facing thickness calibration determine.
Step 102：Drilled on the through hole for be coated with thick copper, bore unnecessary thick copper, obtain plated-through hole.
Referring to Fig. 2 a and 2b, drilled on the through hole 1 for be coated with thick copper, bore unnecessary thick copper 3, obtain plated-through hole.
The hole metallization method of high thickness to diameter ratio circuit board provided in an embodiment of the present invention, falls to be plated in many on through hole by brill
The mode of remaining thick copper, makes to stay in the thick copper on through hole and meets needs thickness, thus without carry out spy to covering power during plating thickness copper
Different control, the thick copper speed of plating is fast, and hole metallization efficiency is effectively lifted；Need not put into a large amount of capital purchase electroplating device and
Novel electroplating liquid medicine is changed, processing cost is effectively reduced.
Embodiment two
On the basis of embodiment one, thick copper is specifically plated by the way of direct current electrode position, in other embodiments, can also adopted
Thick copper is plated with modes such as pulse platings.
The mode equipment of direct current electrode position and use liquid medicine low cost, it is quick realize the thick copper of plating on the premise of to have saved plating thick
Copper cost.
Embodiment three
On the basis of embodiment one or embodiment two, specifically using optical borehole（optical drill）Mode enter
Row drilling.
Because the off normal of optical borehole can be controlled in the +/- 1mil of ＜, therefore copper in through hole is ensured is thick meets needs
Under the premise of, when ensure that plated-through hole is used as pilot hole, hole tolerance can be controlled in +/- 1mil.
Example IV
A kind of hole metallization method of high thickness to diameter ratio circuit board is the embodiment of the invention provides, including：
Step 201：By the way of direct current electrode position, to the thick copper of through hole plating of high thickness to diameter ratio circuit board, into the through hole
Copper thickness reach necessary requirement；
Referring to Fig. 2 a, the through hole 1 to high thickness to diameter ratio circuit board plates thick copper, and the copper thickness 2 into through hole reaches necessary requirement, leads to
Copper thick 2 in hole is general with reference to IPC（The Institute of the Interconnecting and
PackingElectronic Circuit, electronic circuit interconnection and encapsulation association）Copper facing thickness calibration determine.
Step 202：By the way of optical borehole, drilled on the through hole for be coated with thick copper, bore unnecessary thick copper,
Obtain plated-through hole, the plated-through hole is used to be connected with compression connector, the plated-through hole and the connection
The diameter of one end of device connection is identical with the diameter of the stitch of the connector.
Referring to Fig. 2 a and 2b, using optical borehole（optical drill）Mode bored on the through hole 1 for be coated with thick copper
Hole, bores unnecessary thick copper 3, obtains plated-through hole, and the plated-through hole is used to be connected with compression connector, the metal
Change through hole identical with the diameter of the stitch of the connector with the diameter of one end that the connector is connected.In the present embodiment,
The two ends of the plated-through hole are connected with the connector, therefore, the diameter at the plated-through hole two ends with it is described
The diameter of the stitch of connector is identical, and in other embodiments, the plated-through hole can also only have one end with the connection
Device is connected.
Because the mode covering powers such as Traditional DC plating and pulse plating are limited, the thick satisfaction of copper in through hole is made is required
When, through hole aperture and the hole tolerance at aperture are bigger than normal, are unfavorable for the installation of connector presser.The embodiment of the present invention is according to stitch
Diameter bore plating unnecessary thick copper in through-holes, make one end that the plated-through hole is connected with the connector
Aperture and the diameter at aperture are identical with the diameter of the stitch of the connector, eliminate hole tolerance, are conducive to crimping
The installation of formula connector.
Embodiment five
On the basis of example IV, drilling is realized by using the brill nozzle isometrical with the stitch.
The embodiment of the present invention bores unnecessary thickness by carrying out disposable drilling using the brill nozzle isometrical with the stitch
Copper, has saved drilling time, can also carry out the side of multiple drilling using the brill nozzle smaller than pin diameter in other embodiments
Formula realizes boring the purpose of unnecessary thick copper.
Embodiment six
On the basis of example IV or five, drilling depth is 0.1-0.9 times of the depth of through hole 1, i.e., described metallization is logical
The depth of one end that hole is connected with the connector is 0.1-0.9 times of the depth of through hole 1, with the complete position of the stitch for ensureing connector
In in the plated-through hole, specific depth can determine according to the length 4 of connector stitch.
Embodiment seven
On the basis of example IV or embodiment five or embodiment six, the thick footpath of the high thickness to diameter ratio circuit board is more than
20:1.At present, the radius-thickness ratio upper limit of the circuit board that can be processed is 30:1.
The mode radius-thickness ratio 20 difficult to realize of Traditional DC plating:The processing of more than 1 plate, reason is：Plate thickness footpath
Compare high, covering power is poor, when meeting copper facing in hole, aperture and surface copper are relatively thick, it is impossible to realize outer layer it is highly dense walk
Line is designed；The copper facing of high thickness to diameter ratio plate is realized using too low current density, solution is exchanged and electric current distribution is poor in hole.
Solution exchange capacity is poor, Local C u in hole2+Concentration is relatively low, then adds low current density activation polarization less than normal, so that local-crystalized
It is abnormal thick, elapse over time, local-crystalized thick position is further exacerbated by crystallizing thick, most end form due to point effect
Into column crystallization.The embodiment of the present invention overcomes Traditional DC plating and cannot process radius-thickness ratio more than 20:1 circuit board lack
Fall into.
Embodiment eight
A kind of high thickness to diameter ratio circuit board is the embodiment of the invention provides, the circuit board is provided according to embodiment one ~ seven
Hole metallization method realizes hole metallization.
High thickness to diameter ratio circuit board provided in an embodiment of the present invention, by way of boring and falling the unnecessary thick copper being plated on through hole,
Make to stay in the thick copper on through hole and meet needs thickness, thus without carry out Special controlling, the thick copper of plating to covering power during plating thickness copper
Speed is fast, and hole metallization efficiency is effectively lifted；A large amount of capital purchase electroplating device need not be put into and novel electroplating is changed
Liquid medicine, effectively reduces processing cost.
Embodiment nine
Referring to Fig. 3 and Fig. 4 a-4d, the embodiment of the invention provides a kind of high thickness to diameter ratio circuit board, the circuit board plus
Work method includes：
Step 301：According to the size of connector presser stitch, through hole is made on high thickness to diameter ratio circuit board；
Referring to Fig. 4 a, in embodiments of the present invention, the radius-thickness ratio of high thickness to diameter ratio circuit board is with 20：As a example by 1, in other implementations
Other radius-thickness ratios can be selected in example, is not intended to limit the invention, the two-sided base copper thickness 5 of circuit board is current routine copper
Thickness, can select 1/2OZ, 1/3OZ or 1OZ etc..
, using nozzle drilling is bored on the circuit board of the high thickness to diameter ratio, the diameter for being drilled is than the stitch for the embodiment of the present invention
Diameter it is big, the diameter for being drilled in embodiments of the present invention 4mil bigger than the diameter of the stitch in other embodiments may be used
To determine the size of drilling according to the specific size of stitch.
Except the heavy copper that removes photoresist after drilling, the thin copper 6 of 2-3um is plated in drilling, complete the making of through hole 1.
Step 302：Thick copper is plated to the through hole with the mode of direct current electrode position, required for the copper thickness into the through hole reaches
Ask；
Referring to Fig. 4 b, the dry film 7 of plating resist is pasted on the high thickness to diameter ratio circuit board for plated thin copper 6, dry film 7 is covered in addition to through hole
Other regions 8, the aperture both sides of through hole 1 have the not lid plating resist dry film 7 of part pad 9.
Referring to Fig. 4 c, for the electricity that the high thickness to diameter ratio circuit board after patch dry film 13 carries out thick copper using Traditional DC plating line
Plating, is electroplated to the unilateral copper thickness at the aperture of through hole 1 to more than 3mil, and the copper thickness 2 in through hole reaches the thick requirement of circuit board copper.Plating
After the completion of remove the plating resist dry film 7 of skim-coat.
Step 303：With the brill nozzle isometrical with the stitch, by the way of optical borehole, the described logical of thick copper is being coated with
Drilled on hole, bore unnecessary thick copper, the depth of drilling is identical with the length of the stitch.
Referring to Fig. 4 d, in embodiments of the present invention, using big brill nozzles such as diameter and stitch from electrolysis control deep drilling, brill falls
Depth it is equal with the length 4 of the stitch of connector.
Step 304：Carry out the processing and fabricating of circuit board outer layer circuit.
The processing and fabricating of circuit board outer layer circuit is carried out after the completion of secondary drilling, thickness footpath high provided in an embodiment of the present invention is obtained
Compare circuit board.Because now copper coating thickness can control, in effective thickness specification, to be conducive to circuit board fine-line
Processing and fabricating.
High thickness to diameter ratio circuit board processing cost provided in an embodiment of the present invention is low；Radius-thickness ratio can be more than >=20:1 can prop up
The growth requirement of support high speed circuit board and Large Copacity circuit board；High thickness to diameter ratio circuit board provided in an embodiment of the present invention and connector
Hole tolerance during connection is effectively controlled；On the premise of copper thickness demand in meeting connection and through hole, face copper thickness is obtained
Effectively control, while realizing compatibling problem at a high speed with the highly dense wiring in surface.
Embodiment ten
A kind of electronic product is the embodiment of the invention provides, the electronic product includes being provided with the connector of stitch, and high
Radius-thickness ratio circuit board, the stitch is crimped in the plated-through hole of the circuit board.
The electronic products such as described electronic product, specially router and interchanger.
Electronic product provided in an embodiment of the present invention, processing cost is low；Its circuit board radius-thickness ratio can be more than >=20:1 energy
Enough support the growth requirement of high speed circuit board and Large Copacity circuit board；Aperture when its high thickness to diameter ratio circuit board is connected with connector
Tolerance is effectively controlled；On the premise of copper thickness demand in meeting connection and through hole, face copper thickness is obtained effectively its circuit board
Control, while realizing compatibling problem at a high speed with the highly dense wiring in surface.
The embodiments of the present invention are for illustration only, and the quality of embodiment is not represented.
Described is only presently preferred embodiments of the present invention, is not intended to limit the invention, all in the spirit and principles in the present invention
Within, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (5)
1. a kind of hole metallization method of high thickness to diameter ratio circuit board, it is characterised in that methods described includes：
To the thick copper of through hole plating of high thickness to diameter ratio circuit board, the copper thickness into the through hole reaches necessary requirement；
Drilled on the through hole for be coated with thick copper, bore unnecessary thick copper, obtain plated-through hole, wherein the metallization is logical
Hole is used to be connected with connector, the plated-through hole and the diameter of one end that the connector is connected and the pin of the connector
The diameter of pin is identical, and the drilling bores unnecessary thickness by carrying out disposable drilling using the brill nozzle isometrical with the stitch
Copper, the plated-through hole is the through hole for being connected with compression connector.
2. the hole metallization method of high thickness to diameter ratio circuit board according to claim 1, it is characterised in that the plating thickness copper is adopted
With the mode of direct current electrode position.
3. the hole metallization method of high thickness to diameter ratio circuit board according to claim 1, it is characterised in that the drilling is used
The mode of optical borehole.
4. the hole metallization method of the high thickness to diameter ratio circuit board according to any one of claims 1 to 3, it is characterised in that institute
Plated-through hole is stated with 0.1-0.9 times that the depth of one end that the connector is connected is the via depth.
5. the hole metallization method of the high thickness to diameter ratio circuit board according to any one of claims 1 to 3, it is characterised in that institute
The radius-thickness ratio for stating high thickness to diameter ratio circuit board is 20-30:1.
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| CN201210462253.1A CN102984892B (en) | 2012-11-15 | 2012-11-15 | A kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210462253.1A CN102984892B (en) | 2012-11-15 | 2012-11-15 | A kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product |
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| CN102984892B true CN102984892B (en) | 2017-06-13 |
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| CN103747637A (en) * | 2014-01-10 | 2014-04-23 | 杭州华三通信技术有限公司 | PCB (printed circuit board) machining method and PCB |
| CN108601226A (en) * | 2018-04-25 | 2018-09-28 | 星河电路（福建）有限公司 | A kind of superelevation radius-thickness ratio micropore chisels brill processing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4554873B2 (en) * | 2002-04-22 | 2010-09-29 | 日本電気株式会社 | Wiring board, electronic device, electronic component mounting method and manufacturing method |
| CN102438412B (en) * | 2011-11-14 | 2013-09-25 | 东莞生益电子有限公司 | Back drilling method of PCB (Printed Circuit Board) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
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