CN115175460A - Method for forming board edge chamfer, processing method of circuit board and circuit board - Google Patents
Method for forming board edge chamfer, processing method of circuit board and circuit board Download PDFInfo
- Publication number
- CN115175460A CN115175460A CN202210860876.8A CN202210860876A CN115175460A CN 115175460 A CN115175460 A CN 115175460A CN 202210860876 A CN202210860876 A CN 202210860876A CN 115175460 A CN115175460 A CN 115175460A
- Authority
- CN
- China
- Prior art keywords
- plate
- chamfer
- cut
- edge
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Milling Processes (AREA)
Abstract
The invention provides a method for forming a board edge chamfer, a processing method of a circuit board and the circuit board, wherein the method for forming the board edge chamfer comprises the steps of installing two V-cut knives on V-cut equipment, and enabling the knife tips of the two V-cut knives to be opposite; clamping a whole plate on V-cut equipment, wherein the whole plate is positioned between two V-cut knives, a plurality of sub plates are arranged on the whole plate, and a belt to be cut is arranged between every two adjacent sub plates; and respectively cutting two opposite surfaces of the split plate by two V-cut knives to form chamfers at the edges of the split plate. The method for forming the plate edge chamfer provided by the invention can improve the chamfering efficiency, and the chamfer consistency on each sub-plate is better.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for forming a board edge chamfer, a processing method of a circuit board and the circuit board.
Background
In the production process of a Printed Circuit Board (PCB), the edge of the PCB is chamfered for the PCB to be inserted, so as to facilitate the insertion of the PCB.
In the prior art, the whole plate is firstly processed into the divided plate with the required size, and then the plate edges of the divided plate are chamfered. The plate edges of the plate dividing can be chamfered by using a beveling machine, and the beveling machine can only be suitable for the plate dividing with specified shape and size due to structural limitation. Or chamfering the plate edges of the split plate by using a milling machine, chamfering the plate edges on one surface of the split plate, turning over the split plate, and chamfering the plate edges on the other surface of the split plate.
The split plates are chamfered by the two existing modes, so that the chamfering efficiency is low and the chamfering angles are inconsistent.
Disclosure of Invention
The invention provides a method for forming plate edge chamfers, a circuit board processing method and a circuit board.
The invention provides a method for forming a plate edge chamfer, which comprises the steps of installing two V-cut knives on V-cut equipment, wherein the knife tips of the two V-cut knives are opposite;
clamping a whole plate on V-cut equipment, wherein the whole plate is positioned between two V-cut knives, a plurality of sub plates are arranged on the whole plate, and a belt to be cut is arranged between every two adjacent sub plates;
and respectively cutting two opposite surfaces of the split plate by two V-cut knives to form chamfers at the edges of the split plate.
In a possible embodiment, the method for forming a chamfer on an edge of a plate, provided by the invention, the step of cutting two opposite surfaces of the plate by two V-cut knives respectively to form a chamfer on the edge of the plate comprises the following steps:
the V-cut knife cuts the surface of the division plate to form a chamfer bevel inclined towards the edge of the division plate on the division plate, and the two chamfer bevels jointly form a chamfer of the edge of the division plate.
In one possible embodiment, the present invention provides a method of forming a chamfer of a plate edge, before the V-cut knife cuts a surface of the divided plate to form a chamfer slope inclined toward an edge of the divided plate on the divided plate, comprising:
and determining the tool tip angle of the V-cut knife according to the inclination angle of the chamfer inclined plane.
In one possible embodiment, the method for forming a chamfer of a plate edge, the determining a nose angle of the V-cut knife according to an inclination angle of a chamfer bevel, includes:
determining the tool nose angle of the V-cut knife according to a formula,
β＝(90°-α)×2
wherein alpha is the angle of the tool nose of the V-cut tool, and beta is the inclination angle of the chamfer inclined plane.
In one possible embodiment, the present invention provides a method of forming a chamfer of a plate edge, wherein an error value of an inclination angle of the chamfer bevel is less than or equal to 1 °.
In a possible embodiment, the present invention provides a method for forming a chamfer on an edge of a plate, which includes cutting two opposite surfaces of the plate by two V-cut knives, respectively, to form a chamfer on the edge of the plate, and then:
and cutting the whole plate along the band to be cut so as to divide the whole plate into a plurality of sub-plates with chamfers.
In one possible embodiment, the present invention provides a method of forming a chamfer of a board edge, cutting a whole board along a band to be cut to divide the whole board into a plurality of divided boards having chamfers, comprising:
and mounting the whole plate on a plate dividing machine, and cutting the whole plate along the belt to be cut by the plate dividing machine so as to divide the whole plate into a plurality of divided plates with chamfers.
In one possible embodiment, the method for forming a plate edge chamfer provided by the present invention comprises, after cutting a whole plate along a strip to be cut to divide the whole plate into a plurality of divided plates having chamfers:
the outer shape of the divided plate having the chamfer is trimmed.
The invention also provides a processing method of the circuit board, which comprises the method for forming the board edge chamfer.
The invention also provides a circuit board formed by adopting the processing method of the circuit board.
According to the method for forming the board edge chamfer, the two V-cut knives are arranged on the V-cut equipment, the knife tips of the two V-cut knives are opposite, the whole board is clamped on the V-cut equipment, the stroke of the V-cut knife is set according to the position needing chamfering on the board, and the two V-cut knives simultaneously cut two opposite surfaces of the board according to the set stroke, so that the chamfer is formed on the edge of the board. Before the whole plate is divided into the sub-plates, the edges of the sub-plates are chamfered, so that the sub-plates on the whole plate are positioned by the relative positions of the whole plate and the V-cut machine during chamfering, and the two V-cut knives simultaneously cut two surfaces of the sub-plates. Compared with the prior art that the circuit board needs to be cut apart firstly when a beveling machine or a milling machine is used for chamfering, chamfering is carried out on the board edges of the sub-boards one by one, the method for forming the chamfering of the board edges can improve chamfering efficiency, and the consistency of chamfering on the sub-boards is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a flowchart of a method for forming a chamfer on a plate edge according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a V-cut knife and a circuit board in the method for chamfering board edges according to the embodiment of the present invention;
FIG. 3 is a side view of FIG. 2;
FIG. 4 is a first schematic structural diagram of a whole board in a method for forming a board edge chamfer according to an embodiment of the present invention;
FIG. 5 is a second schematic structural diagram of a whole board in the method for forming a board edge chamfer according to the embodiment of the present invention;
FIG. 6 is a third schematic structural diagram of a whole board in the method for forming a chamfer on an edge of a board according to the embodiment of the present invention;
FIG. 7 is a fourth schematic structural diagram of a whole board in the method for forming a board edge chamfer according to the embodiment of the present invention;
FIG. 8 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 4;
FIG. 9 is an enlarged view at B in FIG. 8;
fig. 10 is a schematic diagram illustrating a process of inserting the sub-board into the connecting board in the method for forming a chamfer on a board edge according to the embodiment of the present invention.
Description of reference numerals:
a 100-V-cut knife;
110-a tool tip;
200-a fixed shaft;
300-the whole plate;
310-splitting the plate; 311-edge to be chamfered; 312 — upper surface; 313-lower surface; 314-chamfering the bevel; 315-side;
320-the tape to be cut;
330-process edge;
400-a connecting plate;
410-socket.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present application, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interaction between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
The terms "first," "second," and "third" (if any) in the description and claims of this application and the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.
Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or maintenance tool that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or maintenance tool.
Circuit boards (also known as Printed circuit boards) are providers of electrical connections for electronic components.
In the production process of the printed circuit board, the circuit board to be inserted can be chamfered at the edge of the circuit board so as to facilitate the insertion of the circuit board. For example, when the edge of the circuit board has a gold finger, the edge of the circuit board is usually chamfered to facilitate the insertion of the circuit board into a socket of another circuit board and the electrical connection with the other circuit board through the gold finger.
In order to save cost, the printed circuit board can adopt a design mode of a jointed board, and the jointed board is used for jointing the circuit board units after the circuit board units are designed, so that the waste of base materials is reduced during production, and mass production is realized. In the present application, for convenience of description, the circuit board designed by the jointed board is referred to as a whole board, and the circuit board unit is referred to as a sub board.
In the prior art, the whole plate is firstly processed into the divided plate with the required size, and then the plate edges of the divided plate are chamfered. Can use the hypotenuse machine to carry out the chamfer to the flange limit of dividing the board, the hypotenuse machine includes drive mechanism, angle modulation aircraft nose, tool bit and fixture, fixture is used for fixing a position and divides the board, changes the tool bit for dividing the angle of board face through drive mechanism and angle modulation mechanism's cooperation, divides two faces of board to need to accomplish the chamfer through twice processing, and production efficiency is low to the angle of twice chamfer is difficult to guarantee unanimously. The angular adjustment process of beveling machine is complicated also to make the chamfer inefficient, in addition, to the irregular minute board of shape or the unmatched minute board of fixture of size and beveling machine, can't carry out the chamfer through the beveling machine.
The edge of the plate can be chamfered by using a milling machine, the milling machine is used for chamfering the edge of the plate on one surface of the plate, the plate is turned over, the edge of the plate on the other surface of the plate is chamfered, the chamfering can be finished by processing the two surfaces of the plate twice, the production efficiency is low, and the angle of the twice chamfering is difficult to guarantee to be consistent.
Based on the method, the chamfering efficiency can be improved by chamfering the sub-boards by the method for forming the plate edge chamfer, and the consistency of the chamfer on each sub-board is better.
FIG. 1 is a flowchart of a method for forming a chamfer on a plate edge according to an embodiment of the present invention; FIG. 2 is a schematic structural diagram of a V-cut knife and a circuit board in the method for chamfering board edges according to the embodiment of the present invention; fig. 3 is a side view of fig. 2. Referring to fig. 1 to 3, the method for forming a plate edge chamfer provided by the invention comprises the following steps:
s101, mounting the two V-cut knives 100 on the V-cut equipment, wherein the knife edges 110 of the two V-cut knives 100 are opposite.
The V-cut equipment is used for processing two opposite V-shaped grooves on the upper surface and the lower surface of the circuit board so that a subsequent operator can cut the circuit board along the V-shaped grooves, and the V-cut knife 100 is a cutting knife arranged on the V-cut equipment. Specifically, as shown in fig. 2 and fig. 3, the V-cut knife 100 may be a disk shape, the center of the V-cut knife 100 has a mounting hole, the V-cut device has a first mounting fixture, the first mounting fixture may be a fixing shaft 200, and the fixing shaft 200 passes through the mounting hole to fix the V-cut knife 100 on the V-cut device. Two opposite V-cut knives 100 are usually arranged on the V-cut equipment, the V-cut knife 100 is also provided with a knife tip 110 for cutting, the knife tip 110 is in a V shape, and the knife tips of the two V-cut knives 100 are opposite.
S102, clamping the whole plate 300 on the V-cut device, wherein the whole plate 300 is located between two V-cut knives 100, the whole plate 300 is provided with a plurality of split plates 310, and a belt 320 to be cut is arranged between every two adjacent split plates 310.
FIG. 4 is a first schematic structural diagram of a whole board in a method for forming a board edge chamfer according to an embodiment of the present invention; FIG. 5 is a second schematic structural diagram of a whole board in the method for forming a board edge chamfer according to the embodiment of the present invention; FIG. 6 is a third schematic structural diagram of a whole board in the method for forming a chamfer on an edge of a board according to the embodiment of the present invention; fig. 7 is a fourth schematic structural diagram of a whole plate in the method for forming a chamfer of a plate edge according to the embodiment of the present invention. Referring to fig. 4 to 7, the edge of the whole plate 300 further has a technical edge 330, and the V-cut apparatus has a second mounting jig for fixing the whole plate 300, and the second mounting jig is clamped on the technical edge of the whole plate 300 to clamp the whole plate 300 on the V-cut apparatus.
The tape 320 to be cut is an area without a circuit on the whole board 300, the tape 320 to be cut is used to divide the whole board into a plurality of sub-boards 310 (it is understood that there is no electrical connection between the sub-boards 310, but the tape 320 to be cut physically still connects the sub-boards 310 together), the sub-boards 310 are circuit boards that need to be chamfered, and the edges of the sub-boards 310 are chamfered to facilitate the sub-boards 310 to be plugged with other circuit boards.
And S103, respectively cutting two opposite surfaces of the sub plate 310 through two V-cut knives 100 to form chamfers on the edges of the sub plate 310.
The partial plates 310 are arranged in a matrix on the entire plate 300, for example, the partial plates 310 may be arranged in a rectangular matrix as shown in fig. 4 to 7 on the entire plate 300, and the partial plates 310 may be arranged in a matrix of other shapes on the entire plate 300.
Each sub-plate 310 may be rectangular, circular, or other shapes, and in the present embodiment, a rectangular shape is used as an example for illustration. With continued reference to fig. 4 to 7, the sub-plates 310 generally have a to-be-chamfered edge 311 on one side edge, and the to-be-chamfered edge 311 on each sub-plate 310 may be located on the same side edge of each sub-plate 310, so that the stroke of the V-cut knife 100 may be simplified, and the chamfering efficiency may be improved. It should be noted that the length of the edge 311 to be chamfered may be equal to the length of the side edge, and the length of the edge 311 to be chamfered may also be smaller than the length of the side edge.
The sub-plate 310 may also have the to-be-chamfered edge 311 on two or more side edges, for example, when the two side edges of the sub-plate 310 have the to-be-chamfered edges 311, the to-be-chamfered edges 311 on each sub-plate 310 are arranged in a manner that the stroke of the V-cut knife 100 is simplified.
The stroke of the V-cut knife 100 is set according to the position of the edge 311 to be chamfered on the divided plate 310. Then, the V-cut apparatus is started, and the two V-cut knives 100 simultaneously cut the edges 311 to be chamfered on the opposite surfaces of the division plate 310 according to the set stroke to form chamfers on the edges of the division plate 310. The chamfering of the respective divided plates 310 on the entire plate 300 can be completed in one chamfering process, and thus, the chamfering efficiency can be improved, and the chamfering uniformity on the respective divided plates 310 is good.
According to the method for forming the plate edge chamfer, two V-cut knives 100 are arranged on a V-cut device, the knife points 110 of the two V-cut knives 100 are opposite, the whole plate 300 is clamped on the V-cut device, the stroke of the V-cut knives is set according to the position needing chamfering on the divided plate 310, and the two V-cut knives 100 simultaneously cut the two opposite surfaces of the divided plate 310 according to the set stroke, so that the chamfer is formed on the edge of the divided plate 310. Before the whole plate 300 is divided into the divided plates 310, the edges of each divided plate 310 are chamfered so that each divided plate 310 on the whole plate 300 is positioned by the relative position of the whole plate 300 and the V-cut machine at the time of chamfering, and two V-cut knives simultaneously cut both surfaces of the divided plate 310. Compared with the prior art that the circuit board needs to be cut apart firstly when a beveling machine or a milling machine is used for chamfering, chamfering is carried out on the board edges of the sub-boards one by one, the method for forming the chamfering of the board edges can improve the chamfering efficiency, and the consistency of the chamfering on the sub-boards 310 is good.
Next, a specific process of forming the chamfer on each of the divided plates 310 will be described.
Cutting the opposite surfaces of the division plate 310 by the two V-cut knives 100, respectively, to form a chamfer at the edge of the division plate 310 includes: the V-cut knife 100 cuts the surface of the divided plate 310 to form a chamfered slope 314 inclined toward the edge of the divided plate 310 on the divided plate 310, and the two chamfered slopes 314 together form a chamfer of the edge of the divided plate 310.
FIG. 8 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 4; fig. 9 is an enlarged view of fig. 8 at B. Referring to fig. 8 and 9, the sub-plate 310 has an upper surface 312 and a lower surface 313 opposite to each other, and the upper surface 312 and the lower surface 313 each have a to-be-chamfered edge 311 thereon. The V-cut knife 100 abutting against the edge 311 to be chamfered of the upper surface 312 is used to cut the edge 311 to be chamfered on the upper surface, and the V-cut knife 100 abutting against the edge 311 to be chamfered of the lower surface 313 is used to cut the edge 311 to be chamfered on the lower surface.
With continued reference to fig. 8 and 9, a chamfer inclined surface 314 is cut on the to-be-chamfered edge 311 of the side wall of the V-cut knife 100 contacting with the to-be-chamfered edge 311 of the upper surface 312, another chamfer inclined surface 314 is cut on the to-be-chamfered edge 311 of the side wall of the V-cut knife 100 contacting with the to-be-chamfered edge 311 of the lower surface 313, the two chamfer inclined surfaces 314 are opposite, and the inclination angles of the two chamfer inclined surfaces 314 are the same. Both chamfered bevels 314 extend towards the side edges 315 of the partial plate 310, forming a chamfer with the side edges 315 of the partial plate 310 at the edge of the partial plate 310.
With continued reference to fig. 8, it should be noted that when the V-cut knife 100 cuts the edge 311 to be chamfered of the dividing plate 310, the knife tip 110 of the V-cut knife 100 is aligned with the side edge 315 for cutting, and since the knife tip 110 of the V-cut knife 100 is V-shaped as shown in fig. 3, a part of the tape 320 to be cut is cut off at the side where the knife tip 110 contacts the tape 320 to be cut, so as to form a V-shaped groove between the tape 320 to be cut and the edge 311 to be chamfered.
Fig. 10 is a schematic view illustrating a process of inserting the sub-board and the connection board in the method for forming the board edge chamfer according to the embodiment of the present invention. Referring to fig. 10, the circuit board inserted into the sub-board 310 is referred to as a connection board 400, and the connection board 400 has a socket 410, and when the sub-board 310 is inserted into the socket 410, the two chamfered slopes 314 and the chamfer formed by the side 315 can play a role of guiding during the insertion process.
In the present embodiment, before the surface of the divided plate 310 is cut using the V-cut knife 100 to form the chamfer slope 314 inclined toward the edge of the divided plate 310 on the divided plate 310, it includes: the angle of the tip 110 of the V-cut knife 100 is determined according to the inclination angle of the chamfer 314.
In specific production, different types of the dividing plates 310 have different requirements on the size of the chamfer, and therefore, before chamfering, the angle of the tool nose 110 of the V-cut knife 100 needs to be selected according to specific requirements.
The angle of the tip 110 of the V-cut knife 100 may be selected as described below. Determining the nose angle α of the V-cut knife 100 according to the inclination angle β of the chamfer bevel 314 includes: the nose angle of the V-cut knife 100 is determined according to the formula,
α＝(90°-β)×2
wherein alpha is the angle of the tool nose of the V-cut tool 100, and beta is the inclination angle of the chamfer inclined plane.
As shown in fig. 8, the chamfer bevel 314, the upper surface 312 (or the lower surface 313) and the side 315 form a right triangle, and the inclination angle β of the chamfer bevel 314 is an included angle between the chamfer bevel 314 and the upper surface 312 (or the lower surface 313), so that the included angle between the chamfer bevel 314 and the side 315 is obtained by subtracting the inclination angle β from 90 °, and the included angle between the chamfer bevel 314 and the side 315 multiplied by two is the tip angle α of the V-cut knife 100.
In the present embodiment, the error value of the inclination angle β of the chamfer angle 314 is less than or equal to 1 °.
The point angle α of the V-cut knife 100 has been determined when manufacturing the V-cut knife 100, and is typically controlled to ± 0.5 °. Therefore, the error value of the inclination angle beta cut by the V-cut knife 100 can be ensured to be less than or equal to 1 degree, the accuracy of the inclination angle beta can be ensured by selecting a proper knife tip angle alpha, compared with the prior art that the inclination angle beta needs to be adjusted manually when a beveling machine or a milling machine is used for processing a bevel edge, the precision of processing the chamfer by using the V-cut knife 100 is higher, and the use of the sub-plate 310 with higher requirement on the chamfer precision can be met.
In the present embodiment, the two opposing surfaces of the divided plate 310 are cut by two V-cut knives 100, respectively, to include after the edges of the divided plate 310 are chamfered: the entire plate 300 is cut along the band to be cut 320 to divide the entire plate 300 into a plurality of divided plates 310 having chamfers.
It will be appreciated that after the chamfering of the respective partial plates 310 is completed, the respective partial plates 310 are still connected together by the tape 320 to be cut, and therefore, the entire plate 300 needs to be cut along the tape 320 to be cut to divide the entire plate 300 into the plurality of partial plates 310, in which case the side edges 315 of the partial plates 310 have the chamfering.
The whole board 300 can be divided into the divided boards 310 in various ways, and the process of dividing the whole board 300 into the divided boards 310 will be described below by using a board dividing machine as an example.
Cutting the whole plate 300 along the band to be cut 320 to divide the whole plate 300 into a plurality of divided plates 310 having chamfers includes: the whole plate 300 is mounted on a board separator which cuts the whole plate 300 along the tape 320 to be cut to divide the whole plate 300 into a plurality of divided plates 310 having chamfers.
The board separator is a device for dividing the entire board 300 into the divided boards 310, and has a board dividing jig, which may be a jig having a bottom suction cup, and the entire board 300 is mounted on the board separator by the board dividing jig.
As shown in fig. 8, when the dividing plate 310 is chamfered, the V-cut knife forms a V-shaped groove in the area where the dividing plate 310 is connected to the tape 320 to be cut, and the V-shaped groove on the upper surface 312 is opposite to the V-shaped groove on the lower surface 313, so that the thickness of the area is smaller than the thickness of other areas on the whole plate 300. The plate dividing part of the plate dividing machine cuts the whole plate 300 along the V-shaped grooves, thereby dividing the whole plate 300 into the divided plates 310 having the chamfers.
The cutting of the entire plate 300 along the band to be cut 320 to divide the entire plate 300 into a plurality of divided plates 310 having chamfers includes: the outer shape of the division plate 310 having the chamfer is trimmed.
Trimming the outer shape of the division plate 310 means trimming off the tape 320 to be cut and burrs on the division plate 310, so that the division plate 310 has good appearance and electrical performance.
The invention also provides a processing method of the circuit board, which comprises the method for forming the board edge chamfer.
The method for forming the plate edge chamfer is described in detail in the above embodiments, and is not described in detail herein.
The processing of the circuit board includes exposure and development, etching, plating and inspection as is well known to those skilled in the art. A plurality of processes among them may be selected according to different circuit boards to process the circuit boards.
The invention also provides a circuit board formed by adopting the processing method of the circuit board provided by the embodiment.
The processing method of the circuit board is described in detail in the above embodiments, and is not described in detail herein.
The circuit board can be a circuit board with gold fingers on the edge of the circuit board so as to be electrically connected with other circuit boards through plugging. The edge of the circuit board is chamfered, so that the circuit board can be conveniently and electrically connected with other circuit boards.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method of forming a board edge chamfer, comprising:
installing two V-cut knives on V-cut equipment, wherein the knife tips of the two V-cut knives are opposite;
clamping a whole plate on the V-cut equipment, wherein the whole plate is positioned between the two V-cut knives, a plurality of sub plates are arranged on the whole plate, and a belt to be cut is arranged between every two adjacent sub plates;
and respectively cutting two opposite surfaces of the sub-plate by the two V-cut knives so as to form a chamfer on the edge of the sub-plate.
2. The method for forming a plate edge chamfer of claim 1, wherein the cutting the two opposite surfaces of the divided plate by the two V-cut knives to form a chamfer at the edge of the divided plate comprises:
the V-cut knife cuts the surface of the sub plate to form a chamfer inclined surface inclined towards the edge of the sub plate on the sub plate, and the two chamfer inclined surfaces together form a chamfer of the edge of the sub plate.
3. The method of forming a plate edge chamfer of claim 2, wherein the V-cut knife cuts the surface of the subplate to form a chamfer bevel on the subplate that slopes toward the edge of the subplate before comprising:
and determining the tool nose angle of the V-cut knife according to the inclination angle of the chamfer inclined plane.
4. The method of forming a board edge chamfer of claim 3, wherein the determining the nose angle of the V-cut knife as a function of the angle of inclination of the chamfer bevel comprises:
determining the tool nose angle of the V-cut knife according to a formula,
β＝(90°-α)×2
wherein alpha is the angle of the tool nose of the V-cut knife, and beta is the inclination angle of the chamfer inclined plane.
5. The method of forming a plate edge chamfer of claim 4, wherein the error value of the angle of inclination of the chamfer bevel is less than or equal to 1 °.
6. The method for forming a plate edge chamfer of claim 1, wherein the cutting of the two opposing surfaces of the subplate by the two V-cut knives comprises, after forming a chamfer on the edge of the subplate:
cutting the whole plate along the band to be cut to divide the whole plate into a plurality of divided plates having the chamfer.
7. The method of forming a board edge chamfer of claim 6, wherein said cutting the entire board along the strip to be cut to divide the entire board into a plurality of sub-boards having the chamfer comprises:
and mounting the whole plate on a plate dividing machine, wherein the plate dividing machine cuts the whole plate along the strip to be cut so as to divide the whole plate into a plurality of divided plates with the chamfers.
8. The method of forming a board edge chamfer of claim 6, wherein said cutting the entire board along the strip to be cut to divide the entire board into a plurality of sub-boards having the chamfer comprises:
and trimming the shape of the sub-plate with the chamfer.
9. A method of processing a circuit board, comprising the method of forming a board edge chamfer according to any one of claims 1 to 8.
10. A circuit board formed by the method for processing a circuit board according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210860876.8A CN115175460A (en) | 2022-07-21 | 2022-07-21 | Method for forming board edge chamfer, processing method of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210860876.8A CN115175460A (en) | 2022-07-21 | 2022-07-21 | Method for forming board edge chamfer, processing method of circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115175460A true CN115175460A (en) | 2022-10-11 |
Family
ID=83495938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210860876.8A Pending CN115175460A (en) | 2022-07-21 | 2022-07-21 | Method for forming board edge chamfer, processing method of circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115175460A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115568101A (en) * | 2022-11-01 | 2023-01-03 | 清远市富盈电子有限公司 | PCB processing method and milling machine workbench used by same |
-
2022
- 2022-07-21 CN CN202210860876.8A patent/CN115175460A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115568101A (en) * | 2022-11-01 | 2023-01-03 | 清远市富盈电子有限公司 | PCB processing method and milling machine workbench used by same |
| CN115568101B (en) * | 2022-11-01 | 2024-02-27 | 清远市富盈电子有限公司 | PCB processing method and milling machine workbench used by same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3780431A (en) | Process for producing computer circuits utilizing printed circuit boards | |
| US6427892B1 (en) | Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards | |
| US20080156518A1 (en) | Alignment and cutting of microelectronic substrates | |
| CN115175460A (en) | Method for forming board edge chamfer, processing method of circuit board and circuit board | |
| CN111148351B (en) | Processing method of 5G small-sized base station power amplifier module PCB with step groove | |
| KR100986793B1 (en) | Flexible printed circuit board fixing jig | |
| US4582309A (en) | Jigs for locating electrical components | |
| CN110418505A (en) | A kind of precision PCB blank plate and its processing molding method | |
| CN210899800U (en) | Half-hole PCB jointed board | |
| CN106465544B (en) | PCB scoreboard method and its relevant device | |
| CN111093329B (en) | Small-size stepped PCB forming method | |
| CN210908747U (en) | Welding jig for rigid-flex board of server | |
| CN218314459U (en) | Cutting device | |
| JPS5947704A (en) | Angular chip resistor and method of producing same | |
| CN112454484B (en) | Machining process for manufacturing PCB bevel edge by forming machine | |
| CN217968948U (en) | Puncture needle marking tool | |
| CN220087574U (en) | Board separating jig with sliding block | |
| CN113727525B (en) | Resin plug hole air guide plate and manufacturing method thereof | |
| CN213638367U (en) | Circuit board assembly | |
| CN105828532A (en) | Board separating method for jointed board for circuit boards | |
| CN217596533U (en) | Simple CNC fixing and clamping tool jig | |
| CN118102593A (en) | PCB separating method | |
| JP2001105387A (en) | V-cutting method and v-cutting device | |
| US20020078560A1 (en) | Process for contemporaneous manufacture and interconnection between adjoining printed wiring boards | |
| JPH06169137A (en) | Aggregate board and component mounting method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |