CN115175460A - Method for forming board edge chamfer, processing method of circuit board and circuit board - Google Patents

Abstract

The invention provides a method for forming a board edge chamfer, a processing method of a circuit board and the circuit board, wherein the method for forming the board edge chamfer comprises the steps of installing two V-cut knives on V-cut equipment, and enabling the knife tips of the two V-cut knives to be opposite; clamping a whole plate on V-cut equipment, wherein the whole plate is positioned between two V-cut knives, a plurality of sub plates are arranged on the whole plate, and a belt to be cut is arranged between every two adjacent sub plates; and respectively cutting two opposite surfaces of the split plate by two V-cut knives to form chamfers at the edges of the split plate. The method for forming the plate edge chamfer provided by the invention can improve the chamfering efficiency, and the chamfer consistency on each sub-plate is better.

Description

Method for forming board edge chamfer, circuit board processing method and circuit board

technical field

The invention relates to the technical field of printed circuit boards, in particular to a method for forming a board edge chamfer, a processing method for a circuit board and a circuit board.

Background technique

In the production process of a printed circuit board (PCB), for the circuit board to be inserted, the edge of the circuit board is chamfered to facilitate the insertion of the circuit board.

In the prior art, the entire board is first processed into sub-boards of the required size, and then the edges of the sub-boards are chamfered. The beveling machine can be used to chamfer the edge of the sub-board, but the beveling machine can only be applied to the sub-board of the specified shape and size due to structural limitations. You can also use a milling machine to chamfer the edge of the sub-board, first chamfer the edge of the sub-board on one side, then turn the sub-board over, and chamfer the edge of the other side of the sub-board.

There are two existing ways to chamfer the sub-board, the chamfering efficiency is low and the chamfering angle is inconsistent.

SUMMARY OF THE INVENTION

The invention provides a method for forming a board edge chamfer, a processing method for a circuit board, and a circuit board. By using the method for forming a board edge chamfer to chamfer a sub-board, the chamfering efficiency can be improved, and each sub-board is chamfered. Angle consistency is good.

The invention provides a method for forming a plate edge chamfer, which comprises installing two V-cut knives on a V-cut device, and the tips of the two V-cut knives are opposite to each other;

Clamping the whole board on the V-cut equipment, the whole board is located between two V-cut knives, wherein, the whole board has a plurality of sub-boards, and there are strips to be cut between two adjacent sub-boards;

Two V-cut knives are used to cut the two opposite surfaces of the sub-board respectively to form a chamfer on the edge of the sub-board.

In a possible embodiment, the method for forming a board edge chamfer provided by the present invention, respectively cutting two opposite surfaces of the sub-board with two V-cut knives, to form a chamfer on the edge of the sub-board, comprising:

The V-cut knife cuts the surface of the sub-board to form a chamfered bevel on the sub-board that is inclined toward the edge of the sub-board, and the two chamfered bevels together form a chamfer of the edge of the sub-board.

In a possible embodiment, the method for forming a plate edge chamfer provided by the present invention, the V-cut knife cuts the surface of the sub-board, before forming the chamfer slope inclined toward the edge of the sub-board on the sub-board, it includes:

Determine the tip angle of the V-cut knife according to the inclination angle of the chamfer bevel.

In a possible embodiment, the method for forming a plate edge chamfer provided by the present invention, determining the tip angle of the V-cut knife according to the inclination angle of the chamfering slope includes:

Determine the tip angle of the V-cut knife according to the formula,

β=(90°-α)×2

Among them, α is the tip angle of the V-cut knife, and β is the inclination angle of the chamfering bevel.

In a possible implementation manner, in the method for forming a plate edge chamfer provided by the present invention, the error value of the inclination angle of the chamfered slope is less than or equal to 1°.

In a possible embodiment, the method for forming a plate edge chamfer provided by the present invention is to cut two opposite surfaces of the sub-board respectively by using two V-cut knives, so that after the edge of the sub-board is chamfered, the method includes:

The whole board is cut along the strip to be cut to divide the whole board into a plurality of sub-boards with chamfers.

In a possible embodiment, the method for forming a plate edge chamfer provided by the present invention, cutting the whole plate along the to-be-cut tape, to divide the whole plate into a plurality of sub-plates with chamfers, comprising:

The whole board is installed on the splitting machine, and the splitting machine cuts the entire board along the strip to be cut to divide the entire board into a plurality of split boards with chamfers.

In a possible embodiment, the method for forming a plate edge chamfer provided by the present invention comprises:

Trim the shape of the chamfered parting plate.

The present invention also provides a method for processing a circuit board, including adopting the above-mentioned method for forming a board edge chamfer.

The present invention also provides a circuit board, which is formed by the above-mentioned processing method of the circuit board.

The present invention provides a method for forming a board edge chamfer, a processing method for a circuit board and a circuit board. In the method for forming a board edge chamfer, two V-cut knives are installed on the V-cut equipment, and two V-cut The tips of the cutting knives are opposite to each other, clamp the whole board on the V-cut equipment, set the stroke of the V-cut knife according to the position of the chamfering on the sub-board, and the two V-cut knives simultaneously according to the set stroke Cut opposite surfaces of the split to form chamfers on the edges of the split. Before dividing the whole board into boards, the edge of each board is chamfered, so that each board on the whole board is positioned by the relative position of the whole board and the V-cut machine when chamfering, and the two V-cut The cutter cuts both surfaces of the split board at the same time. Compared with the prior art, when using a beveling machine or a milling machine for chamfering, it is necessary to first divide the circuit board, and then chamfer the board edges of each sub-board one by one. The chamfering efficiency is high, and the chamfering consistency of each sub-board is better.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

1 is a flowchart of a method for forming a plate edge chamfer provided by an embodiment of the present invention;

2 is a schematic structural diagram of a V-cut knife and a circuit board in a method for chamfering a board edge provided by an embodiment of the present invention;

Fig. 3 is the side view of Fig. 2;

FIG. 4 is a first structural schematic diagram of an entire board in a method for forming a board edge chamfer provided by an embodiment of the present invention;

5 is a second structural schematic diagram of the entire board in the method for forming a board edge chamfer provided by an embodiment of the present invention;

6 is a third structural schematic diagram of the entire board in the method for forming a board edge chamfer provided by an embodiment of the present invention;

7 is a fourth schematic structural diagram of the entire board in the method for forming a board edge chamfer provided by an embodiment of the present invention;

Fig. 8 is the sectional view of A-A section in Fig. 4;

Fig. 9 is an enlarged view at B in Fig. 8;

FIG. 10 is a schematic diagram of a process of inserting a split board and a connecting board in a method for forming a board edge chamfer provided by an embodiment of the present invention.

Description of reference numbers:

100-V-cut knife;

110-knife tip;

200-fixed shaft;

300-whole board;

310-parting plate; 311-side to be chamfered; 312-upper surface; 313-lower surface; 314-chamfering bevel; 315-side edge;

320 - tape to be cut;

330 - craft edge;

400-connection board;

410 - Socket.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, a fixed connection may be made, or an intermediate connection may be made. The medium is indirectly connected, which can be the internal communication of two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, It is constructed and operated in a particular orientation and therefore should not be construed as a limitation of the present application.

The terms "first", "second" and "third" (if present) in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It is to be understood that the data so used may be interchanged under appropriate circumstances such that the embodiments of the application described herein can, for example, be practiced in sequences other than those illustrated or described herein.

Furthermore, the terms "comprising" and "having" and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product or maintenance tool comprising a series of steps or units not necessarily limited to those expressly listed but may include other steps or units not expressly listed or inherent to these processes, methods, products or maintenance tools.

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components.

In the production process of the printed circuit board, for the circuit board to be inserted, the edge of the circuit board will be chamfered to facilitate the insertion of the circuit board. For example, when the edge of the circuit board has gold fingers, the edge of the circuit board is usually chamfered, so that the circuit board can be inserted into sockets of other circuit boards and electrically connected with other circuit boards through the gold fingers.

In order to save costs, the printed circuit board can adopt the design method of splicing, which refers to splicing the circuit board units after the circuit board unit design is completed, so as to reduce the waste of substrates during production and realize mass production. . In this application, for the convenience of description, the circuit board of the panel design is called the whole board, and the circuit board unit is called the sub-board.

In the prior art, the entire board is first processed into sub-boards of the required size, and then the edges of the sub-boards are chamfered. The beveling machine can be used to chamfer the edge of the sub-board. The beveling machine includes a transmission mechanism, an angle adjustment head, a cutter head and a clamping mechanism. The clamping mechanism is used to position the sub-board. The transmission mechanism and the angle adjustment mechanism To change the angle of the cutter head relative to the surface of the sub-board, the two surfaces of the sub-board need to be processed twice to complete the chamfer, the production efficiency is low, and the angle of the two chamfers is difficult to ensure the same. The complex angle adjustment process of the beveling machine also makes the chamfering efficiency low. In addition, the beveling machine cannot be used for chamfering for irregularly shaped sub-boards or sub-boards whose dimensions do not match the clamping mechanism of the beveling machine.

It is also possible to use a milling machine to chamfer the edge of the sub-board. The milling machine also chamfers the edge of the sub-board on one side, then turns the sub-board over, and chamfers the edge of the other side of the sub-board. The two sides of the plate need to be processed twice to complete the chamfering, the production efficiency is low, and it is difficult to ensure the same angle of the two chamfering.

Based on this, the present invention provides a method for forming board edge chamfering, a processing method for a circuit board, and a circuit board. By using the method for forming board edge chamfering to chamfer the sub-board, the chamfering efficiency can be improved, and each sub-board can be chamfered. The consistency of the chamfer on the board is good.

1 is a flow chart of a method for forming a board edge chamfering provided by an embodiment of the present invention; FIG. 2 is a schematic structural diagram of a V-cut knife and a circuit board in the method for board edge chamfering provided by an embodiment of the present invention; FIG. 3 is a Figure 2 side view. 1 to 3, the method for forming a plate edge chamfer provided by the present invention includes:

S101. Install two V-cut knives 100 on a V-cut device, and the tool tips 110 of the two V-cut knives 100 are opposite to each other.

The V-cut equipment is used to machine two opposite V-shaped grooves on the upper and lower surfaces of the circuit board, so that subsequent operators can cut the circuit board along the V-shaped grooves. The V-cut knife 100 is installed on the V-cut equipment. cutting tool. Specifically, please continue to refer to FIG. 2 and FIG. 3 , the V-cut knife 100 may be in the shape of a disc, the center of the V-cut knife 100 has a mounting hole, the V-cut device has a first mounting fixture, and the first mounting fixture It may be a fixed shaft 200 that passes through the mounting hole to fix the V-cut knife 100 on the V-cut device. Two opposing V-cut knives 100 are usually installed on the V-cut equipment, and the V-cut knives 100 also have knives 110 for cutting, the knives 110 are V-shaped, and the knives of the two V-cut knives 100 relatively.

S102, clamping the whole board 300 on the V-cut equipment, the whole board 300 is located between the two V-cut knives 100, wherein the whole board 300 has a plurality of sub-boards 310, and two adjacent sub-boards There are strips 320 to be cut between 310 .

FIG. 4 is a schematic structural diagram 1 of the entire board in the method for forming a board edge chamfer provided by an embodiment of the present invention; FIG. 5 is a schematic structural diagram 2 of the entire board in the method for forming a board edge chamfer according to an embodiment of the present invention; 6 is a schematic diagram 3 of the structure of the whole board in the method for forming a board edge chamfer provided by an embodiment of the present invention; FIG. 7 is a schematic diagram 4 of the structure of the entire board in the method for forming a board edge chamfer provided by the embodiment of the present invention. Referring to FIG. 4 to FIG. 7 , the edge of the entire board 300 also has a process edge 330 , the V-cut equipment has a second installation fixture for fixing the entire board 300 , and the second installation fixture is clamped on the process edge of the entire board 300 . , to clamp the whole plate 300 on the V-cut device.

The to-be-cut tape 320 is an area without lines on the entire board 300, and the to-be-cut tape 320 is used to separate the entire board into a plurality of sub-boards 310 (it can be understood that the separation here means that there is no electrical connection between the sub-boards 310, But physically the strips 320 to be cut still connect the sub-boards 310 together), the sub-boards 310 are circuit boards that need to be chamfered, and chamfering the edges of the sub-boards 310 can facilitate the sub-board 310 to be plugged with other circuit boards.

S103 , using two V-cut knives 100 to cut two opposite surfaces of the sub-board 310 respectively, so as to form a chamfer on the edge of the sub-board 310 .

The sub-boards 310 are arranged in a matrix on the entire board 300. For example, the sub-boards 310 can be arranged on the entire board 300 in a rectangular matrix as shown in FIG. 4 to FIG. Matrix of other shapes.

Each of the sub-boards 310 may be rectangular, circular, or other shapes, and in this embodiment, a rectangle is used as an example for description. Please continue to refer to FIG. 4 to FIG. 7 , the sub-board 310 usually has an edge to be chamfered 311 on one side, and the to-be-chamfered edge 311 on each sub-board 310 can be located on the same side of each sub-board 310 , thereby The stroke of the V-cut knife 100 can be simplified and the efficiency of chamfering can be improved. It should be noted that the length of the edge to be chamfered 311 may be equal to the length of the side edge, and the length of the edge to be chamfered 311 may also be smaller than the length of the side edge.

The sub-board 310 may also have edges to be chamfered 311 on two or more than two sides. The arrangement principle of 311 is for the purpose of simplifying the stroke of the V-cut knife 100 .

The stroke of the V-cut knife 100 is set according to the position of the edge 311 to be chamfered on the sub-plate 310 . Then the V-cut equipment is activated, and the two V-cut knives 100 simultaneously cut the edges to be chamfered 311 on the two opposite surfaces of the sub-board 310 according to the set stroke, so as to form a chamfer on the edge of the sub-board 310 . The chamfering of each sub-plate 310 on the whole plate 300 can be completed in one chamfering process, thereby improving the chamfering efficiency, and the chamfering consistency of each sub-plate 310 is better.

In the method for forming a board edge chamfer provided by the present invention, two V-cut knives 100 are installed on the V-cut equipment, and the tips 110 of the two V-cut knives 100 are opposite to each other, and the entire board 300 is clamped on the V-cut device. On the V-cut equipment, the stroke of the V-cut knife is set according to the position on the sub-plate 310 that needs to be chamfered. The edge of the split plate 310 is chamfered. Before dividing the whole board 300 into boards 310, chamfering is performed on the edge of each board 310, so that each board 310 on the board 300 is positioned by the relative position of the board 300 and the V-cut machine when chamfering , and the two V-cut knives cut both surfaces of the sub-board 310 at the same time. Compared with the prior art, when using a beveling machine or a milling machine for chamfering, it is necessary to first divide the circuit board, and then chamfer the board edges of each sub-board one by one. The chamfering efficiency is improved, and the consistency of the chamfering on each sub-plate 310 is good.

Next, the specific process of forming the chamfer on each sub-plate 310 will be described.

Using the two V-cut knives 100 to respectively cut two opposite surfaces of the sub-board 310 to form a chamfer on the edge of the sub-board 310 includes: cutting the surface of the sub-board 310 by the V-cut knife 100 to form a chamfer on the sub-board 310 The chamfered chamfer 314 is inclined toward the edge of the sub-board 310 , and the two chamfered chamfers 314 together form a chamfer of the edge of the sub-board 310 .

FIG. 8 is a cross-sectional view of the section A-A in FIG. 4 ; FIG. 9 is an enlarged view at B in FIG. 8 . Referring to FIG. 8 and FIG. 9 , the sub-board 310 has an upper surface 312 and a lower surface 313 opposite to each other, and both the upper surface 312 and the lower surface 313 have edges 311 to be chamfered. The V-cut knife 100 abutting the to-be-chamfered edge 311 of the upper surface 312 is used for cutting the to-be-chamfered edge 311 on the upper surface, and the V-cut knife 100 abutting to the to-be-chamfered edge 311 of the lower surface 313 is used for cutting Cut the edge to be chamfered 311 on the lower surface.

Please continue to refer to FIG. 8 and FIG. 9 , the side wall of the V-cut knife 100 that is in contact with the edge 311 to be chamfered on the upper surface 312 cuts a chamfered slope 314 on the edge 311 to be chamfered, which is in contact with the edge of the lower surface 313 . The side wall of the V-cut knife 100 contacted by the edge 311 to be chamfered cuts another chamfered slope 314 on the edge 311 to be chamfered. The two chamfered slopes 314 are opposite and have the same inclination angle. Both of the two chamfered inclined surfaces 314 extend toward the side edge 315 of the sub-board 310 , so that a chamfer is formed at the edge of the sub-board 310 and the side edge 315 of the sub-board 310 .

Please continue to refer to FIG. 8 . It should be noted that when the V-cut knife 100 is cutting the to-be-chamfered edge 311 of the sub-board 310 , the cutting edge 110 of the V-cut knife 100 is aligned with the side edge 315 for cutting. However, since the blade tip 110 of the V-cut knife 100 is V-shaped as shown in FIG. 3 , the side of the blade tip 110 in contact with the to-be-cut strip 320 will cut off part of the to-be-cut strip 320 , so that between the to-be-cut strip 320 and the to-be-cut strip 320 A V-shaped groove is formed between the edges 311 to be chamfered.

FIG. 10 is a schematic diagram of a process of inserting a split board and a connecting board in a method for forming a board edge chamfer provided by an embodiment of the present invention. Referring to FIG. 10 , the circuit board plugged with the sub-board 310 is called the connecting board 400 , and the connecting board 400 has a socket 410 . When the sub-board 310 is inserted into the socket 410 , the two chamfered slopes 314 and the The chamfer formed by 315 can play a guiding role in the plugging process.

In the present embodiment, before using the V-cut knife 100 to cut the surface of the sub-board 310 to form the chamfered bevel 314 on the sub-board 310 that is inclined toward the edge of the sub-board 310 , including: according to the inclination angle of the chamfered bevel 314 Determine the angle of the tip 110 of the V-cut knife 100.

During specific production, different types of sub-plates 310 have different requirements on the size of the chamfer. Therefore, before chamfering, the angle of the blade tip 110 of the V-cut knife 100 needs to be selected according to the specific requirements.

The angle of the tip 110 of the V-cut knife 100 may be selected in the manner described below. Determining the edge angle α of the V-cut knife 100 according to the inclination angle β of the chamfering slope 314 includes: determining the edge angle of the V-cut knife 100 according to the formula,

α=(90°-β)×2

Among them, α is the edge angle of the V-cut knife 100 , and β is the inclination angle of the chamfering slope.

Please continue to refer to FIG. 8 , the chamfered slope 314 , the upper surface 312 (or the lower surface 313 ) and the side edge 315 form a right triangle, and the inclination angle β of the chamfered slope 314 refers to the chamfered slope 314 and the upper surface 312 (or The angle between the lower surface 313), thus, 90° minus the inclination angle β is the angle between the chamfered slope 314 and the side edge 315, and the angle between the chamfer slope 314 and the side edge 315 multiplied by two is V- The cutting edge angle α of the cutting blade 100 .

In this embodiment, the error value of the inclination angle β of the chamfered slope 314 is less than or equal to 1°.

The tip angle α of the V-cut knife 100 has been determined when the V-cut knife 100 is manufactured, and the tip angle α of the V-cut knife is usually controlled at ±0.5°. Therefore, it can be ensured that the error value of the inclination angle β cut by the V-cut knife 100 is less than or equal to 1°. Therefore, the accuracy of the inclination angle β can be ensured by selecting the appropriate tool tip angle α. Compared with the prior art In the case where the bevel angle β needs to be adjusted manually when machining the bevel with a bevel machine or a milling machine, the use of the V-cut cutter 100 for chamfering has higher accuracy, which can meet the use of the sub-board 310 that requires high chamfer accuracy. .

In this embodiment, the two V-cut knives 100 are used to cut two opposite surfaces of the sub-board 310 respectively, so as to form a chamfer on the edge of the sub-board 310, including: cutting the entire board 300 along the to-be-cut tape 320 to cut The whole plate 300 is divided into a plurality of sub-plates 310 with chamfers.

It can be understood that after the chamfering of the sub-boards 310 is completed, the sub-boards 310 are still connected together by the strips 320 to be cut. Therefore, the whole board 300 needs to be cut along the strips 320 to be cut to divide the whole board 300 A plurality of sub-boards 310 are formed. At this time, the side edges 315 of the sub-boards 310 are chamfered.

The whole board 300 can be divided into the boards 310 in various ways, and the process of dividing the whole board 300 into the boards 310 is described below by taking the use of a board dividing machine as an example.

Cutting the whole board 300 along the to-be-cut strip 320 to divide the whole board 300 into a plurality of sub-boards 310 with chamfers includes: installing the whole board 300 on a sub-board machine, and the sub-board machine cuts the whole board 300 along the to-be-cut strip 320 , so as to divide the whole board 300 into a plurality of sub-boards 310 with chamfers.

The splitter is a device used to divide the whole board 300 into boards 310. The splitter is provided with a splitter fixture, which can be a fixture with a bottom suction cup, and the entire board 300 is installed by the splitter fixture. on the splitter.

Please continue to refer to FIG. 8 , when the sub-board 310 is chamfered, the V-cut knife forms a V-shaped groove in the area where the sub-board 310 and the tape to be cut 320 are connected, and the V-shaped groove on the upper surface 312 and the lower surface 313 The V-shaped grooves are opposite to each other. Therefore, the thickness of this area is smaller than that of other areas on the entire board 300 . The splitting component in the splitting machine cuts the entire board 300 along the V-shaped groove, thereby dividing the entire board 300 into split boards 310 with chamfered corners.

After cutting the whole board 300 along the to-be-cut strip 320 to divide the whole board 300 into a plurality of sub-boards 310 with chamfers, the process includes: trimming the outer shape of the sub-boards 310 with chamfers.

Trimming the shape of the sub-board 310 refers to trimming off the to-be-cut tape 320 and burrs on the sub-board 310 , so that the sub-board 310 has good appearance and electrical performance.

The present invention also provides a method for processing a circuit board, including adopting the above-mentioned method for forming a board edge chamfer.

The method for forming the edge chamfer of the board has been described in detail in the above embodiments, and will not be repeated here.

The processing of circuit boards includes exposure and development, etching, electroplating and inspection well known to those skilled in the art. A number of processes can be selected for processing circuit boards according to different circuit boards.

The present invention also provides a circuit board, which is formed by using the circuit board processing method provided by the above embodiments.

Among them, the processing method of the circuit board has been described in detail in the above embodiments, and will not be repeated here.

The circuit board can be a circuit board with gold fingers on the edge of the board, so as to be electrically connected with other circuit boards by plugging. By chamfering the edge of the circuit board, it is convenient for the circuit board to be electrically connected to other circuit boards.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (10)

1. a method for forming a plate edge chamfer, is characterized in that, comprising: Install two V-cut knives on the V-cut equipment, and the tips of the two V-cut knives are opposite; The whole plate is clamped on the V-cut equipment, and the whole plate is located between the two V-cut knives, wherein the whole plate has a plurality of sub-plates, and two adjacent ones are There is a strip to be cut between the sub-plates; The two opposite surfaces of the sub-board are respectively cut by the two V-cut knives to form a chamfer on the edge of the sub-board. 2 . The method for forming a plate edge chamfer according to claim 1 , wherein the two opposite surfaces of the sub-board are respectively cut by the two V-cut knives, so that the The edge forming chamfer includes: The V-cut knife cuts the surface of the sub-board to form a chamfered bevel on the sub-board that is inclined toward the edge of the sub-board, and the two chamfered bevels together form the edge of the sub-board the chamfer. 3 . The method for forming a chamfered edge of a board according to claim 2 , wherein the V-cut knife cuts the surface of the sub-board to form an edge toward the sub-board on the sub-board. 4 . The sloped chamfer slopes previously included: The tip angle of the V-cut knife is determined according to the inclination angle of the chamfering bevel. 4. The method for forming a plate edge chamfer according to claim 3, wherein the determining the angle of the tip of the V-cut knife according to the inclination angle of the chamfering slope comprises: Determine the tip angle of the V-cut knife according to the formula, β=(90°-α)×2 Wherein, α is the tip angle of the V-cut knife, and β is the inclination angle of the chamfering bevel. 5 . The method for forming a plate edge chamfer according to claim 4 , wherein the error value of the inclination angle of the chamfered slope is less than or equal to 1°. 6 . 6 . The method for forming a plate edge chamfer according to claim 1 , wherein the two opposite surfaces of the sub-board are respectively cut by the two V-cut knives, so that the After the edge is chamfered includes: The whole board is cut along the to-be-cut strip to divide the whole board into a plurality of sub-boards with the chamfers. 7 . The method for forming a plate edge chamfer according to claim 6 , wherein the entire plate is cut along the to-be-cut strip to divide the entire plate into a plurality of pieces having the chamfers. 8 . The sub-boards include: The entire board is mounted on a splitter, and the splitter cuts the entire board along the to-be-cut strip to divide the entire board into a plurality of split boards with the chamfers. 8 . The method for forming a plate edge chamfer according to claim 6 , wherein the entire plate is cut along the to-be-cut strip to divide the entire plate into a plurality of pieces having the chamfers. 9 . After the sub-board includes: The profile of the sub-plate with the chamfer is trimmed. 9 . A method for processing a circuit board, comprising using the method for forming a board edge chamfer according to any one of claims 1 to 8 . 10 . 10 . A circuit board, characterized in that it is formed by the method for processing a circuit board according to claim 9 .

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