CN109561587A - A kind of production method of printed circuit board - Google Patents

A kind of production method of printed circuit board Download PDF

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Publication number
CN109561587A
CN109561587A CN201811432844.8A CN201811432844A CN109561587A CN 109561587 A CN109561587 A CN 109561587A CN 201811432844 A CN201811432844 A CN 201811432844A CN 109561587 A CN109561587 A CN 109561587A
Authority
CN
China
Prior art keywords
circuit board
detected
circuit
plate
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811432844.8A
Other languages
Chinese (zh)
Inventor
童雷
童炳武
童大望
潘世丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Linuo Circuit Technology Co Ltd
Original Assignee
Jiangmen Linuo Circuit Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangmen Linuo Circuit Technology Co Ltd filed Critical Jiangmen Linuo Circuit Technology Co Ltd
Priority to CN201811432844.8A priority Critical patent/CN109561587A/en
Publication of CN109561587A publication Critical patent/CN109561587A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Abstract

The present invention provides a kind of production methods of printed circuit board, pass through the design of cut-off rule in forming step, it is still attached in plate after capable of making circuit board punching shaping, particularly with the production of the circuit board of small size, without the Design Orientation hole in each circuit board, the face damage for reducing circuit board, improves the production efficiency and qualification rate of circuit board;In detecting step, first passes through and compare the difference of the reflected intensity that infrared reflection type sensor detection infrared ray is returned by gauge orifice and to gaging hole back reflection to judge the quality of via hole, such as: the position in hole and the blockage in hole;Then the quality for carrying out detecting its each circuit one by one to circuit board, the short-circuit conditions in each circuit of circuit board to be detected are judged by comparing the difference of the inductance value in each circuit of probe in detecting preferred circuit plate and each circuit of circuit board to be detected.The present invention has the advantages that easy to process, productivity is high, detection efficiency is high, detection is accurate and checks high-efficient.

Description

A kind of production method of printed circuit board
Technical field
The present invention relates to printed circuit board technology field more particularly to a kind of production methods of printed circuit board.
Background technique
Direction with circuit board towards installation small in size, light-weight, three-dimensional and high connecting reliability is developed, so that small Size circuit plate is more and more in printed circuit board industry, and sharp processing and product inspection are must can not during circuit board making Few two procedures, wherein sharp processing is specifically the production for utilizing sharp processing equipment (such as punching machine, edge milling machines) that will produce layout Product are processed into the veneer form or delivery jigsaw form of customer requirement;Product inspection is specially that finished circuit board is used before shipment Naked eye borrows tool (such as magnifying glass) inspection board surface quality situation, guarantees that delivery circuit board meets customer requirement.
In the prior art, sharp processing is carried out using milling machine technique to small-sized circuit board, still, due to small size electricity Road plate suqare is smaller, and Design Orientation hole is difficult in plate, so that small-sized circuit board is difficult to fix during sharp processing, to lead The problems such as causing the offset of circuit board shape, breakage;Moreover, adding when the size of circuit board is less than the dust exhaust apparatus of process equipment Circuit board is easy to be siphoned away loss by dust exhaust apparatus during work;In addition, when testing to small-sized circuit board, due to plate Part is smaller, and reviewer takes inconvenience, so that checkability is reduced, moreover, the hand of reviewer holds in checkout procedure The check position of plate is blocked, easily so as to cause the outflow of problem plate.
Summary of the invention
Technical problem to be solved by the present invention lies in, provide it is a kind of it is easy to process, productivity is high, detection efficiency is high, inspection Survey the production method for accurately and checking high-efficient printed circuit board.
In order to solve the above technical problem, the present invention provides a kind of printed circuit board production method comprising it is as follows Process: sawing sheet, heavy copper, pattern transfer, graphic plating, moves back film, etching, green oil, character, plating golden finger, molding and survey at drilling Examination, which is characterized in that specific step is as follows with the test for the molding:
S1: plate to be punched is obtained;Wherein, there is N number of board area to be punched, and N >=1 on the plate;
S2: the outline die along circuit board goes out the cut-off rule for separating circuit board from plate for manpower;
S3: the plate with N number of preferred circuit plate is put into the workbench of detection device after step S2 processing;
S4: before carrying out detecting circuit board to be detected, first pass through first movement mechanism will test stick be successively moved to The opposite position of each gauge orifice in preferred circuit plate, passes through the motor encoder of data collecting module collected first movement mechanism Detect that the standard coordinate data of each standard hole site are sent in data storage module;Meanwhile data collecting module collected Infrared reflection type sensor detects infrared ray and passes through the reflected intensity that gauge orifice back reflection is returned, and is converted into electric signal transmission Into data storage module;
Then, each group probe is moved to the detection endpoint with circuit each in preferred circuit plate by the second mobile mechanism Opposite position, the inductance value in each circuit and by inductance Value Data in examination criteria circuit board after probe and test side point contact It is sent in data storage module;
S5: according to the standard coordinate data in data storage module Plays hole, stick will test by first movement mechanism and move Move with position corresponding to the standard coordinate data, it is logical that infrared ray is detected by data acquisition module outside line reflection sensor It crosses gauge orifice and returns to the reflected intensity of infrared reflection type sensor after workbench reflection, and be converted into electric signal and be sent to number According in contrast module, infrared ray in circuit board to be detected is calculated by data comparison module and passes through the reflection that gauge orifice back reflection is returned The deviation for the reflected intensity that infrared ray is returned by gauge orifice back reflection in intensity and preferred circuit plate;
When in circuit board to be detected infrared ray by gauge orifice back reflection return reflected intensity with it is red in preferred circuit plate When the deviation for the reflected intensity that outside line is returned by gauge orifice back reflection is not within the scope of test stone, decline test bar makes it End is inserted into in gaging hole;
If the end of test bar cannot be inserted into which in gaging hole, circuit board to be detected is considered as substandard product;
If the end of test bar can be inserted into in gaging hole, test bar resets, when in circuit board to be detected infrared ray by mark The reflected intensity that infrared ray is returned by gauge orifice back reflection in the reflected intensity and preferred circuit plate that quasi- hole back reflection is returned When deviation is not within the scope of test stone, then circuit board to be detected is considered as substandard product;
If the end of test bar can be inserted into in gaging hole, test bar resets, when infrared ray reflection sensor detect to To the deviation of the intensity of illumination of gaging hole and the intensity of illumination in preferred circuit plate Plays hole in test stone in detection circuit board When in range, then it should be considered as qualification to gaging hole;
S6: repeating step S4 and detect to other to gaging hole, complete all detections to gaging hole in circuit board to be detected, All to be considered as qualification to gaging hole, circuit board to be detected enters the detection of next step;
S7: each group probe is moved to the detection endpoint with circuit each in circuit board to be detected by the second mobile mechanism The inductance in each circuit in circuit board to be detected is detected after the test side point contact of opposite position, probe and circuit board to be detected Inductance Value Data is simultaneously sent in data comparison module by value, and is calculated in circuit board to be detected each time by data comparison module The deviation of the inductance value in each circuit in the inductance value and preferred circuit plate on road;
When the deviation of the inductance value in circuit and the inductance value in corresponding circuit in preferred circuit plate in circuit board to be detected When not within the scope of test stone, then circuit board to be detected is considered as substandard product;
When the inductance value for comparing circuit in circuit board to be detected is being examined with the inductance value in corresponding circuit in preferred circuit plate When testing in critical field, then circuit board to be detected is considered as qualified products;
S8: if circuit board to be detected is qualified products, by data comparison module to data outputting module send it is described to Detection circuit board passes through checking information;If circuit board to be detected is substandard product, exported by data comparison module to data Module sends the circuit board to be detected and passes through non-checking information.
Preferably, further including for providing the current module of detection electric current to probe.
Preferably, further including that can fill circuit board to be detected from the first transfer that processing unit (plant) is transferred to workbench It sets.
Preferably, first transfer device is manipulator.
Implement a kind of production method of printed circuit board of the invention, compared with prior art, has following beneficial to effect Fruit:
(1) present invention is still attached in plate after capable of making circuit board punching shaping by the design of cut-off rule, especially right It is easy to process without the Design Orientation hole in each circuit board in the production of the circuit board of small size, reduce the shape of circuit board Damage, improves the production efficiency and qualification rate of circuit board, moreover, can directly take plate when examining the circuit board of small size The inspection of circuit board is carried out, each circuit board is tested without taking one by one, to improve the checkability and standard of circuit board True rate;In addition, circuit board can be made neatly to place by plate during turn sequence and check to circuit board, electricity is reduced The quantity that road sheetpile scratches when putting improves circuit board qualification rate, meanwhile, check the quantity of plate directly to obtain the number of circuit board Efficiency is checked in amount, raising.
(2) present invention first pass through compare infrared reflection type sensor detection infrared ray by gauge orifice and after gaging hole it is anti- The difference for the reflected intensity come is emitted back towards to judge the quality of via hole, such as: the blockage of hole location and hole, when circuit board to be detected Middle infrared ray passes through the reflected intensity returned to gaging hole back reflection and returns with infrared ray in preferred circuit plate by gauge orifice back reflection When the deviation for the reflected intensity come is not within the scope of test stone, then circuit board to be detected is substandard product;Then pass through The difference for comparing the inductance value in each circuit of probe in detecting preferred circuit plate and each circuit of circuit board to be detected is to be checked to judge The short-circuit conditions in each circuit of slowdown monitoring circuit plate, when the inductance in the circuit of the inductance value and preferred circuit plate in circuit board circuit to be detected When the deviation of value is not within the scope of test stone, then circuit board to be detected is substandard product, holds that the variation of inductance value more Easily detection.The present invention has the advantages that testing result is accurate, detection efficiency is high, detection time is short and at low cost.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, the attached drawing to embodiment is simply situated between below It continues.
Fig. 1 is the structural schematic diagram of plate;
Fig. 2 is a kind of structural schematic diagram of the production method of printed circuit board provided by the invention;
Fig. 3 is a kind of system schematic of the production method of printed circuit board provided by the invention;
Marked in the figure: 1 is plate, 2 be board area, and 3 be cut-off rule, and 41 be preferred circuit plate, and 42 be electricity to be detected Road plate, 5 be first movement mechanism, and 6 be test bar, and 7 be motor encoder, and 8 be data acquisition module, and 9 be data storage module, 10 be infrared reflection type sensor, and 11 be data comparison module, and 12 be data outputting module, and 13 be the second mobile mechanism, 14 It is workbench for probe, 15,16 be current module.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1 to Figure 3, the preferred embodiment of the present invention, a kind of production method of printed circuit board, including as flowed down Journey: sawing sheet, heavy copper, pattern transfer, graphic plating, moves back film, etching, green oil, character, plating golden finger, molding and test at drilling, It is characterized in that, specific step is as follows with the test for the molding:
S1: plate 1 to be punched is obtained;Wherein, there is N number of board area 2 to be punched on the plate 1, and N >= 1;
S2: the outline die along circuit board goes out the cut-off rule 3 for separating circuit board from plate 1 for manpower;
S3: the plate 1 with N number of preferred circuit plate 41 is put into the workbench 15 of detection device after step S2 processing;
S4: it before carrying out detecting circuit board 42 to be detected, first passes through first movement mechanism 5 and will test stick 6 and successively move To the position opposite with each gauge orifice in preferred circuit plate 41, the electricity of first movement mechanism 5 is acquired by data acquisition module 8 Machine encoder 7 detects that the standard coordinate data of each standard hole site are sent in data storage module 9;Meanwhile data are adopted Collect module 8 and acquire the reflected intensity that the detection infrared ray of infrared reflection type sensor 10 is returned by gauge orifice back reflection, and turns Electric signal is turned to be sent in data storage module 9;
Then, each group probe 14 is moved to the inspection with circuit each in preferred circuit plate 41 by the second mobile mechanism 13 Survey the opposite position of endpoint, inductance value and general of the probe 14 with each circuit in examination criteria circuit board 41 after the point contact of test side Inductance Value Data is sent in data storage module 9;
S5: according to the standard coordinate data in 9 Plays hole of data storage module, stick 6 will test by first movement mechanism 5 Be moved to position corresponding to the standard coordinate data, pass through data acquisition module 8 acquire infrared reflection type sensor 10 Detection detection infrared ray returns to the reflected intensity of infrared reflection type sensor after workbench reflection by gauge orifice, and converts It is sent in data comparison module 11 for electric signal, and infrared ray in circuit board 42 to be detected is calculated by data comparison module 11 The reflected intensity returned by gauge orifice back reflection is returned with infrared ray in preferred circuit plate 41 by gauge orifice back reflection anti- Penetrate the deviation of intensity;
When infrared ray passes through the reflected intensity and preferred circuit plate 41 that gauge orifice back reflection is returned in circuit board 42 to be detected In the reflected intensity returned by gauge orifice back reflection of corresponding infrared ray not within the scope of test stone when, decline test bar 6 Make the insertion of its end in gaging hole;
If the end of test bar 6 cannot be inserted into which in gaging hole, circuit board 42 to be detected is considered as substandard product;
If the end of test bar 6 can be inserted into in gaging hole, test bar 6 resets, when infrared ray passes through in circuit board 42 to be detected The reflected intensity that gauge orifice back reflection is returned is crossed to return with corresponding infrared ray in preferred circuit plate 41 by gauge orifice back reflection Reflected intensity deviation still not within the scope of test stone when, then circuit board 42 to be detected is considered as substandard product;
If the end of test bar 6 can be inserted into in gaging hole, test bar 6 resets, when infrared ray passes through in circuit board 42 to be detected The reflected intensity that gauge orifice back reflection is returned is crossed to return with corresponding infrared ray in preferred circuit plate 41 by gauge orifice back reflection Reflected intensity within the scope of test stone when, then to gaging hole should be considered as qualification;
S6: it repeats step S4 and is detected to other to gaging hole, complete all inspections to gaging hole in circuit board 42 to be detected It surveys, all circuit boards to be detected 42 for being considered as qualifying to gaging hole enter the detection of next step;
S7: each group probe 14 is moved to the inspection with each circuit in circuit board 42 to be detected by the second mobile mechanism 13 The opposite position of endpoint is surveyed, is detected after probe 14 and the test side point contact of circuit board 42 to be detected each in circuit board 42 to be detected Inductance Value Data is simultaneously sent in data comparison module 11 by the inductance value in a circuit, and is calculated by data comparison module 11 to be checked The deviation of the inductance value in each circuit and the inductance value in each circuit in preferred circuit plate 41 in slowdown monitoring circuit plate 42;
When in circuit board 42 to be detected the inductance value in circuit in preferred circuit plate 41 inductance value in corresponding circuit it is inclined When difference is not within the scope of test stone, then circuit board 42 to be detected is considered as substandard product;
When the inductance value with the inductance value in corresponding circuit in preferred circuit plate 41 for comparing circuit in circuit board 42 to be detected When within the scope of test stone, then circuit board 42 to be detected is considered as qualified products;
S8: it if circuit board to be detected 42 is qualified products, is sent by data comparison module 11 to data outputting module 12 The circuit board to be detected 42 passes through checking information;If circuit board 42 to be detected is substandard product, pass through data comparison module 11, which send the circuit board to be detected 42 to data outputting module 12, passes through non-checking information.
It illustratively, further include for providing the current module 16 of detection electric current to probe 14.
It illustratively, further include that circuit board 42 to be detected can be filled from the first transfer that processing unit (plant) is transferred to workbench 15 It sets, first transfer device is manipulator, is suitable for various sizes of circuit board.
As a result, the invention has the following advantages that
(1) present invention is still attached in plate after capable of making circuit board punching shaping by the design of cut-off rule, especially right It is easy to process without the Design Orientation hole in each circuit board in the production of the circuit board of small size, reduce the shape of circuit board Damage, improves the production efficiency and qualification rate of circuit board, moreover, can directly take plate when examining the circuit board of small size The inspection of circuit board is carried out, each circuit board is tested without taking one by one, to improve the checkability and standard of circuit board True rate;In addition, circuit board can be made neatly to place by plate during turn sequence and check to circuit board, electricity is reduced The quantity that road sheetpile scratches when putting improves circuit board qualification rate, meanwhile, check the quantity of plate directly to obtain the number of circuit board Efficiency is checked in amount, raising.
(2) present invention first pass through compare infrared reflection type sensor detection infrared ray by gauge orifice and after gaging hole it is anti- The difference for the reflected intensity come is emitted back towards to judge the quality of via hole, such as: the blockage of hole location and hole, when circuit board to be detected Middle infrared ray passes through the reflected intensity returned to gaging hole back reflection and returns with infrared ray in preferred circuit plate by gauge orifice back reflection When the deviation for the reflected intensity come is not within the scope of test stone, then circuit board to be detected is substandard product;Then pass through The difference for comparing the inductance value in each circuit of probe in detecting preferred circuit plate and each circuit of circuit board to be detected is to be checked to judge The short-circuit conditions in each circuit of slowdown monitoring circuit plate, when the inductance in the circuit of the inductance value and preferred circuit plate in circuit board circuit to be detected When the deviation of value is not within the scope of test stone, then circuit board to be detected is substandard product, holds that the variation of inductance value more Easily detection.The present invention has the advantages that testing result is accurate, detection efficiency is high, detection time is short and at low cost.
Above disclosed is only presently preferred embodiments of the present invention, cannot limit the right of the present invention with this certainly Range, therefore according to equivalent variations made by scope of the present invention patent, it is still within the scope of the present invention.

Claims (4)

1. a kind of production method of printed circuit board, including following process: sawing sheet, drilling, heavy copper, pattern transfer, graphic plating, Move back film, etching, green oil, character, plating golden finger, molding and test, which is characterized in that the specific step of the molding and the test It is rapid as follows:
S1: plate to be punched is obtained;Wherein, there is N number of board area to be punched, and N >=1 on the plate;
S2: the outline die along circuit board goes out the cut-off rule for separating circuit board from plate for manpower;
S3: the plate with N number of preferred circuit plate is put into the workbench of detection device after step S2 processing;
S4: it before carrying out detecting circuit board to be detected, first passes through first movement mechanism and will test stick and be successively moved to and standard The opposite position of each gauge orifice in circuit board is detected by the motor encoder of data collecting module collected first movement mechanism Standard coordinate data to each standard hole site are sent in data storage module;Meanwhile data collecting module collected is infrared Line reflection type sensor detects infrared ray and passes through the reflected intensity that gauge orifice back reflection is returned, and is converted into electric signal and is sent to number According in storage module;
Then, each group probe is moved to by the second mobile mechanism opposite with the detection endpoint in circuit each in preferred circuit plate Position, the inductance value in probe and each circuit in examination criteria circuit board after the point contact of test side simultaneously sends inductance Value Data Into data storage module;
S5: according to the standard coordinate data in data storage module Plays hole, stick will test by first movement mechanism and be moved to With position corresponding to the standard coordinate data, infrared ray is detected by data collecting module collected infrared reflection type sensor The reflected intensity of infrared reflection type sensor is returned to after workbench reflection by gauge orifice, and is converted into electric signal and is sent to In data comparison module, by data comparison module calculate infrared ray in circuit board to be detected return by gauge orifice back reflection it is anti- Penetrate the deviation for the reflected intensity that infrared ray is returned by gauge orifice back reflection in intensity and preferred circuit plate;
When infrared ray in the reflected intensity and preferred circuit plate that infrared ray is returned by gauge orifice back reflection in circuit board to be detected When the deviation for the reflected intensity returned by gauge orifice back reflection is not within the scope of test stone, decline test bar makes its end Insertion is in gaging hole;
If the end of test bar cannot be inserted into which in gaging hole, circuit board to be detected is considered as substandard product;
If the end of test bar can be inserted into in gaging hole, test bar resets, when infrared ray passes through gauge orifice in circuit board to be detected The deviation for the reflected intensity that infrared ray is returned by gauge orifice back reflection in the reflected intensity and preferred circuit plate that back reflection is returned When value is not within the scope of test stone, then circuit board to be detected is considered as substandard product;
If the end of test bar can be inserted into in gaging hole, test bar resets, when infrared ray reflection sensor detect it is to be detected To the deviation of the intensity of illumination of gaging hole and the intensity of illumination in preferred circuit plate Plays hole in test stone range in circuit board When interior, then it should be considered as qualification to gaging hole;
S6: it repeats step S4 and is detected to other to gaging hole, complete all detections to gaging hole in circuit board to be detected, own It is considered as qualification to gaging hole, circuit board to be detected enters the detection of next step;
S7: each group probe is moved to by the second mobile mechanism opposite with the detection endpoint in circuit each in circuit board to be detected Position, detect the inductance value in each circuit in circuit board to be detected simultaneously after the test side point contact of probe and circuit board to be detected Inductance Value Data is sent in data comparison module, and each circuit in circuit board to be detected is calculated by data comparison module The deviation of the inductance value in each circuit in inductance value and preferred circuit plate;
When the inductance value in circuit does not exist with the deviation of the inductance value in corresponding circuit in preferred circuit plate in circuit board to be detected When within the scope of test stone, then circuit board to be detected is considered as substandard product;
When the inductance value with the inductance value in corresponding circuit in preferred circuit plate that compare circuit in circuit board to be detected are examining mark When in quasi- range, then circuit board to be detected is considered as qualified products;
S8: described to be detected to data outputting module transmission by data comparison module if circuit board to be detected is qualified products Circuit board passes through checking information;If circuit board to be detected is substandard product, by data comparison module to data outputting module It sends the circuit board to be detected and passes through non-checking information.
2. the production method of printed circuit board as described in claim 1, which is characterized in that further include for providing inspection to probe Survey the current module of electric current.
3. the production method of printed circuit board as described in claim 1, which is characterized in that further including can be by circuit board to be detected The first transfer device of workbench is transferred to from processing unit (plant).
4. the production method of printed circuit board as claimed in claim 3, which is characterized in that first transfer device is machinery Hand.
CN201811432844.8A 2018-11-28 2018-11-28 A kind of production method of printed circuit board Pending CN109561587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811432844.8A CN109561587A (en) 2018-11-28 2018-11-28 A kind of production method of printed circuit board

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Application Number Priority Date Filing Date Title
CN201811432844.8A CN109561587A (en) 2018-11-28 2018-11-28 A kind of production method of printed circuit board

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Publication Number Publication Date
CN109561587A true CN109561587A (en) 2019-04-02

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Application Number Title Priority Date Filing Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109581189A (en) * 2018-11-28 2019-04-05 江门市利诺达电路科技有限公司 A kind of production method of small-sized circuit board
CN110753450A (en) * 2019-11-25 2020-02-04 深圳市景旺电子股份有限公司 Manufacturing method of rigid-flex board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001337050A (en) * 2000-05-29 2001-12-07 Nikkiso Co Ltd Method and apparatus for inspecting printed board
CN101581749A (en) * 2008-05-16 2009-11-18 北大方正集团有限公司 Method and system for circuit test of printed circuit board
CN202143302U (en) * 2011-07-13 2012-02-08 龚晓刚 PCB jointed board
CN203523148U (en) * 2013-10-18 2014-04-02 北大方正集团有限公司 PCB (printed circuit board) jointed plate
CN204612645U (en) * 2015-05-27 2015-09-02 苏州艾迪亚电子科技有限公司 Circuit board mounting hole checkout equipment
CN108124384A (en) * 2017-11-15 2018-06-05 江门崇达电路技术有限公司 Small size wiring board method for processing forming without interior positioning

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001337050A (en) * 2000-05-29 2001-12-07 Nikkiso Co Ltd Method and apparatus for inspecting printed board
CN101581749A (en) * 2008-05-16 2009-11-18 北大方正集团有限公司 Method and system for circuit test of printed circuit board
CN202143302U (en) * 2011-07-13 2012-02-08 龚晓刚 PCB jointed board
CN203523148U (en) * 2013-10-18 2014-04-02 北大方正集团有限公司 PCB (printed circuit board) jointed plate
CN204612645U (en) * 2015-05-27 2015-09-02 苏州艾迪亚电子科技有限公司 Circuit board mounting hole checkout equipment
CN108124384A (en) * 2017-11-15 2018-06-05 江门崇达电路技术有限公司 Small size wiring board method for processing forming without interior positioning

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109581189A (en) * 2018-11-28 2019-04-05 江门市利诺达电路科技有限公司 A kind of production method of small-sized circuit board
CN110753450A (en) * 2019-11-25 2020-02-04 深圳市景旺电子股份有限公司 Manufacturing method of rigid-flex board

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