CN111757606A - Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material - Google Patents
Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material Download PDFInfo
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- CN111757606A CN111757606A CN202010656311.9A CN202010656311A CN111757606A CN 111757606 A CN111757606 A CN 111757606A CN 202010656311 A CN202010656311 A CN 202010656311A CN 111757606 A CN111757606 A CN 111757606A
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- Prior art keywords
- board
- frequency
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- circuit
- slotline
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a manufacturing method of a mixed compression plate containing a high-frequency material and an FR4 material, and relates to the field of mixed compression circuit boards. The scheme starts from the process and the flow: designing a groove on the surface layer of the high-frequency material for stress relief to match the expansion and contraction of the FR4 material; the FR4 material was baked before browning to ensure that the FR4 panel expansion and contraction was complete before pressing. Thereby reducing the expansion and contraction difference of the two plates in the pressing process, solving the problem of warping and bending of the mixed pressing plate and improving the yield of products.
Description
Technical Field
The invention relates to the technical field of mixed-compression circuit boards, in particular to a manufacturing method of a mixed-compression board containing a high-frequency material and an FR4 material.
Background
When the multilayer board is manufactured, after each layer of circuit is manufactured independently, the circuit is positioned and pressed through optical equipment, and the circuits of all layers are overlapped and pressed to form a circuit board. In a conventional multilayer board, the circuit layers are made of the same single material, and copper and a medium on two sides of the core board are designed symmetrically, so that the processing is convenient.
With the rapid development of communication technology, the requirement of high-speed signal lines cannot be met by using conventional substrates (such as FR4), and only high-frequency materials can be used. For the multilayer board, if all high-frequency materials are used, the cost is greatly increased, and in practical application, not all circuit layers need to meet the requirement of high-speed signals. Therefore, in order to reduce the cost, various communication manufacturers have designed multilayer boards with a hybrid structure, in which the surface layer for carrying high-speed signals is made of a high-frequency material, and the power supply layer and the ground layer are made of FR4 materials.
However, during production and processing, the two materials adopted in the mixed pressing design have large difference in technical specification parameters, so that the problem of plate warping after mixed pressing is easy to occur, and the product reject ratio is high.
Disclosure of Invention
The invention aims to solve the technical problem of how to solve the problem that a mixed compression plate containing a high-frequency material and an FR4 material is easy to warp during pressing.
In order to solve the above problems, the present invention proposes the following technical solutions:
a manufacturing method of a mixed compression plate containing a high-frequency material and an FR4 material comprises the following steps:
treatment of the high-frequency plate:
s1, carrying out circuit manufacturing on the circuit surface of the high-frequency plate, and etching a slotline at the typesetting gap of the large copper surface of the high-frequency plate, wherein the width of the slotline is smaller than the typesetting distance;
s2, performing brown oxidation treatment on the high-frequency board of which the circuit is manufactured;
treatment of FR4 boards:
s3, carrying out circuit manufacturing on the circuit surface of the FR4 board, and carrying out whole board exposure on the large copper surface of the FR4 board;
s4, baking the FR4 board with the manufactured circuit;
s5, performing brown oxidation treatment on the baked FR4 board;
and (3) laminating:
and S6, pressing the high-frequency plate obtained in the S2 and the FR4 plate obtained in the S5.
The further technical scheme is that the depth of the grooving line is the same as the copper thickness of the large copper surface of the high-frequency plate.
The technical scheme is that the large copper surface of the high-frequency plate is the surface of the mixed pressing plate.
The technical scheme is that in the step S2, inner layer line inspection is further included before the browning process.
The further technical scheme is that in the step S4, inner layer circuit inspection is further included before baking the board.
The technical solution is that in step S6, when laminating, the laminated structure from top to bottom is FR4 plate-inner layer-high frequency plate.
The further technical scheme is that the width of the grooving line is 0.13-0.5 mm.
The further technical scheme is that the width of the grooving line is 0.15-0.3 mm.
The further technical scheme is that the width of the grooving line is 0.15-0.2 mm.
The further technical scheme is that the high-frequency plate at least comprises 2 jointed plates.
Compared with the prior art, the invention can achieve the following technical effects:
in the scheme, the inventor analyzes the characteristics of different materials of the mixed pressing plate, and the CTE value of the high-frequency material is small, the stability is high, the CTE value of the FR4 material is large, and the expansion and contraction are large, so that the plate is bent towards the FR4 material during mixed pressing. In order to solve the problem of the warping of the board, the scheme starts from the process and the flow: designing a groove on the surface layer of the high-frequency material for stress relief to match the expansion and contraction of the FR4 material; the FR4 material was baked before browning to ensure that the FR4 panel expansion and contraction was complete before pressing. Thereby reducing the expansion and contraction difference of the two plates in the pressing process, solving the problem of warping and bending of the mixed pressing plate and improving the yield of products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a layout diagram of a high frequency board;
fig. 2 is a flowchart of a method for manufacturing a hybrid board containing a high-frequency material and FR4 material according to an embodiment of the present invention.
Reference numerals
A slotline 1.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Referring to fig. 1-2, an embodiment of the present invention provides a method for manufacturing a hybrid board containing a high-frequency material and an FR4 material, including the following steps:
treatment of the high-frequency plate:
s1, carrying out circuit manufacturing on the circuit surface of the high-frequency plate, and etching a slotline at the typesetting gap of the large copper surface of the high-frequency plate, wherein the width of the slotline is smaller than the typesetting distance;
s2, performing brown oxidation treatment on the high-frequency board of which the circuit is manufactured;
treatment of FR4 boards:
s3, carrying out circuit manufacturing on the circuit surface of the FR4 board, and carrying out whole board exposure on the large copper surface of the FR4 board;
s4, baking the FR4 board with the manufactured circuit;
s5, performing brown oxidation treatment on the baked FR4 board;
and (3) laminating:
and S6, pressing the high-frequency plate obtained in the S2 and the FR4 plate obtained in the S5.
It can be understood that in the step of conducting the circuit on the circuit surface of the high-frequency board, the large copper surface can be simultaneously subjected to the etching grooving, and no additional process is required to be added.
And baking the FR4 board with the manufactured circuit, wherein baking parameters are determined according to TG of the board so as to ensure that the FR4 board completes expansion and contraction before pressing and reduce expansion and contraction difference during pressing.
In a specific embodiment, the depth of the slotline is the same as the copper thickness of the large copper surface of the high-frequency board. When the circuit is manufactured, the base material is etched and exposed on the large copper surface of the high-frequency plate, so that the stress release in the pressing process is ensured.
In a specific embodiment, the large copper surface of the high-frequency plate is the surface of the mixing plate.
In a specific embodiment, in step S2, before the browning process, an inner layer circuit check is further included.
In a specific embodiment, in step S4, before baking the board, the method further includes checking an inner layer circuit.
In a specific embodiment, in the step S6, the FR4 plate, the inner layer, and the high frequency plate are stacked from top to bottom in sequence during the pressing.
Because the CTE value of the high-frequency material is small, the stability is high, and the CTE value of the FR4 material is large, the expansion and contraction are large, the board bends towards the direction of the FR4 material during mixed compression. Therefore, when the high-frequency plate is pressed and typeset, the high-frequency plate needs to be positioned at the bottom layer to further play a role in releasing stress, and when the high-frequency plate needs to be positioned at the bottom layer, the plate is not easy to bow upwards to form rebound in the curing process, so that bending deformation can be avoided to the maximum extent.
In other embodiments, the width of the slotline is 0.13-0.5 mm. Preferably, the width of the slotline is 0.15-0.3 mm. More preferably, the width of the slotline is 0.15-0.2 mm.
In one embodiment, the slotline is 6 mils.
In other embodiments, the high frequency plate comprises at least 2 panels.
As shown in fig. 1, the layout has 4 panels. A gap exists between every two jointed boards, and when in grooving, the effect of stress release can be achieved only by designing the grooving line 1 in the gap, and the finished product cannot be influenced.
It is understood that the design specification dimensions of the high frequency board and the FR4 board are adapted.
In the specific implementation, a person skilled in the art can design the jointed board according to the size and design requirements of the board, and the invention is not limited to this.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A manufacturing method of a mixed compression plate containing a high-frequency material and an FR4 material is characterized by comprising the following steps:
treatment of the high-frequency plate:
s1, carrying out circuit manufacturing on the circuit surface of the high-frequency plate, and etching a slotline at the typesetting gap of the large copper surface of the high-frequency plate, wherein the width of the slotline is smaller than the typesetting distance;
s2, performing brown oxidation treatment on the high-frequency board of which the circuit is manufactured;
treatment of FR4 boards:
s3, carrying out circuit manufacturing on the circuit surface of the FR4 board, and carrying out whole board exposure on the large copper surface of the FR4 board;
s4, baking the FR4 board with the manufactured circuit;
s5, performing brown oxidation treatment on the baked FR4 board;
and (3) laminating:
and S6, pressing the high-frequency plate obtained in the S2 and the FR4 plate obtained in the S5.
2. The method for manufacturing a hybrid board comprising a high-frequency material and an FR4 material according to claim 1, wherein the depth of the slotline is the same as the copper thickness of the large copper surface of the high-frequency board.
3. The method for manufacturing a hybrid board comprising a high-frequency material and FR4 material according to claim 1, wherein the large copper surface of the high-frequency board is the surface of the hybrid board.
4. The method for manufacturing a hybrid board comprising the high-frequency material and the FR4 material according to claim 1, wherein the step S2 further comprises an inner layer circuit inspection before the browning process.
5. The method for manufacturing a hybrid board comprising FR4 and hf materials according to claim 1, wherein the step S4 further comprises inspecting the inner layer circuit before baking the board.
6. The method for manufacturing a hybrid board comprising the high-frequency material and the FR4 material as claimed in claim 1, wherein in the step S6, the stacked structure from top to bottom is FR4 board-inner layer-high-frequency board.
7. The method for manufacturing a hybrid board comprising a high-frequency material and an FR4 material according to claim 1, wherein the width of the slotline is 0.13-0.5 mm.
8. The method for manufacturing a hybrid board comprising a high-frequency material and an FR4 material according to claim 7, wherein the width of the slotline is 0.15-0.3 mm.
9. The method for manufacturing a hybrid board comprising a high-frequency material and an FR4 material according to claim 8, wherein the width of the slotline is 0.15-0.2 mm.
10. The method for manufacturing a hybrid laminated board comprising a high-frequency material and FR4 material according to claim 1, wherein the high-frequency board comprises at least 2 panels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010656311.9A CN111757606A (en) | 2020-07-09 | 2020-07-09 | Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010656311.9A CN111757606A (en) | 2020-07-09 | 2020-07-09 | Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material |
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| CN111757606A true CN111757606A (en) | 2020-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010656311.9A Pending CN111757606A (en) | 2020-07-09 | 2020-07-09 | Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888173A (en) * | 2021-01-19 | 2021-06-01 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
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|---|---|---|---|---|
| KR20040016329A (en) * | 2002-08-16 | 2004-02-21 | 삼성전기주식회사 | Multi-layer printed circuit board and method for embedding optical fiber within the same |
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| JP2015207578A (en) * | 2014-04-17 | 2015-11-19 | 日本特殊陶業株式会社 | Multilayer ceramic substrate and method for manufacturing the same |
| CN106376172A (en) * | 2016-11-29 | 2017-02-01 | 中国电子科技集团公司第二十九研究所 | Mixed-lamination metal-based microwave printed board and design method thereof |
| CN110012620A (en) * | 2019-04-09 | 2019-07-12 | 深圳市景旺电子股份有限公司 | High frequency board fabrication method |
| CN209787552U (en) * | 2019-03-01 | 2019-12-13 | 奥特斯(中国)有限公司 | Component carrier structure |
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2020
- 2020-07-09 CN CN202010656311.9A patent/CN111757606A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040016329A (en) * | 2002-08-16 | 2004-02-21 | 삼성전기주식회사 | Multi-layer printed circuit board and method for embedding optical fiber within the same |
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| JP2015207578A (en) * | 2014-04-17 | 2015-11-19 | 日本特殊陶業株式会社 | Multilayer ceramic substrate and method for manufacturing the same |
| CN106376172A (en) * | 2016-11-29 | 2017-02-01 | 中国电子科技集团公司第二十九研究所 | Mixed-lamination metal-based microwave printed board and design method thereof |
| CN209787552U (en) * | 2019-03-01 | 2019-12-13 | 奥特斯(中国)有限公司 | Component carrier structure |
| CN110012620A (en) * | 2019-04-09 | 2019-07-12 | 深圳市景旺电子股份有限公司 | High frequency board fabrication method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888173A (en) * | 2021-01-19 | 2021-06-01 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
| CN112888173B (en) * | 2021-01-19 | 2023-10-31 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
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Application publication date: 20201009 |
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