CN209845439U

CN209845439U - Printed circuit board assembly PCBA and terminal

Info

Publication number: CN209845439U
Application number: CN201920349879.9U
Authority: CN
Inventors: 唐后勋; 贺江山
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2019-03-19
Filing date: 2019-03-19
Publication date: 2019-12-24
Anticipated expiration: 2029-03-19

Abstract

The utility model discloses a printed circuit board subassembly PCBA and terminal, printed circuit board subassembly PCBA includes: a Printed Circuit Board (PCB); the heat dissipation structure is positioned in the PCB and comprises a cavity and cooling liquid filled in the cavity; and the metal heat dissipation layer is arranged on the PCB and connected with the heat dissipation structure. The embodiment of the utility model releases the space occupied by the heat pipe in the terminal by arranging the heat dissipation structure in the PCB, and the heat dissipation structure does not occupy the board layout space resource on the surface of the circuit board, thereby reducing the thickness of the whole machine; the heat dissipation structure is connected with the metal heat dissipation layer on the PCB, so that the heat dissipation area can be increased, and the heat dissipation effect is improved.

Description

Printed circuit board assembly PCBA and terminal

Technical Field

The utility model relates to the field of communication technology, especially, relate to a printed circuit board assembly PCBA and terminal.

Background

Along with the higher and higher performance requirement of the terminal, the power consumption of the device is larger and larger, and meanwhile, the heating devices on the mainboard of the product are more and more concentrated, so the heating problem of the product is more and more serious. In this case, in the current heat dissipation technology, a heat pipe technology is used to perform a heat dissipation process on a Printed Circuit Board Assembly (PCBA).

In the prior art, two technical methods are used for processing a heat pipe, one of the two technical methods is to embed the heat pipe into the surface of a main upper structural part of a terminal, the processing method needs to additionally increase the heat pipe between the main upper structural part and a heating device so as to quickly conduct heat on the heating device to other areas, but the heat pipe has a specific thickness, so that the heat pipe occupies the structural space of the whole machine and causes the increase of the thickness of the whole machine; secondly, the heat pipe is embedded into the surface of a Printed Circuit Board (PCB), but this method can cause the heat pipe to occupy a large amount of device placing space on the surface layer of the PCB, wasting PCB layout resources, and causing the increase in the size of the PCB and the whole machine.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a printed circuit board assembly PCBA and terminal to the heat pipe setting mode among the solution prior art leads to the problem that terminal thickness increases.

In a first aspect, an embodiment of the present invention provides a printed circuit board assembly PCBA, include:

a Printed Circuit Board (PCB);

the heat dissipation structure is positioned in the PCB and comprises a cavity and cooling liquid filled in the cavity; and

and the metal heat dissipation layer is arranged on the PCB and connected with the heat dissipation structure.

In a second aspect, the present invention further provides a terminal, including the above-mentioned printed circuit board assembly PCBA.

Thus, according to the above scheme of the present invention, the heat dissipation structure is disposed inside the PCB, so that the space occupied by the heat pipe inside the terminal is released, and the heat dissipation structure does not occupy the board layout space resource on the surface of the circuit board, so as to reduce the thickness of the whole device; the heat dissipation structure is connected with the metal heat dissipation layer on the PCB, so that the heat dissipation area can be increased, and the heat dissipation effect is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 shows one of the PCBA structural schematics of the present invention;

FIG. 2 shows a second schematic structural view of a printed circuit board assembly PCBA according to an embodiment of the present invention;

fig. 3 shows a top view of a printed circuit board assembly PCBA in accordance with an embodiment of the present invention.

Description of reference numerals: 1. PCB, 2, heat radiation structure, 3, metal heat dissipation layer, 4, metal circuit, 11, first via hole, 12, third via hole.

Detailed Description

Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

As shown in fig. 1 and 2, embodiments of the present invention provide a printed circuit board assembly PCBA, comprising: a printed circuit board PCB 1;

the heat dissipation structure 2 is positioned inside the PCB1, and the heat dissipation structure 2 includes a cavity and a cooling liquid filled in the cavity;

and a metal heat dissipation layer 3 mounted on the PCB1, the metal heat dissipation layer 3 being connected to the heat dissipation structure 2.

In this embodiment, the heat dissipation structure 2 is disposed inside the PCB1, and includes a cavity and a cooling liquid filled in the cavity, and the heat dissipation structure 2 may be a heat pipe or other heat dissipation structures; heat radiation structure 2 links to each other with the metal heat dissipation layer 3 of PCB1 surface, metal heat dissipation layer 3 can be for laying the ground net copper foil on PCB1 surface, and the heat that generates heat the device on the circuit board and produce passes through metal heat dissipation layer 3 transmits to heat radiation structure 2 reaches for the radiating purpose of the device that generates heat.

The embodiment of the utility model has the advantages that the heat dissipation structure is arranged inside the PCB, the heat pipe embedded on the main upper structural part or the surface of the PCB is cancelled, the whole machine space occupied by the heat pipe is released, and the heat dissipation structure does not occupy the board layout space resource on the surface of the circuit board, so that the thickness of the whole machine can be reduced; the heat dissipation structure is connected with the large-area metal heat dissipation layer on the PCB, so that the heat dissipation area can be increased, and the heat dissipation effect is improved.

Specifically, the outer surface of the PCB1 is formed with metal lines 4, and the height of the metal heat dissipation layer 3 relative to the outer surface of the PCB1 is not higher than the height of the metal lines 4 relative to the outer surface of the PCB 1.

The height of the metal heat dissipation layer 3 relative to the outer surface of the PCB1 is set to be not higher than the height of the metal circuit 4 relative to the outer surface of the PCB1, so that the whole thickness of the circuit board can be ensured not to be increased relative to the prior art, and the heat dissipation structure 2 is arranged inside the PCB1, so that a main upper structural component or a heat pipe embedded in the surface of the PCB can be eliminated, and the thickness of the terminal is reduced. The surface of the metal circuit 4 is covered with printing ink, so that the functions of circuit protection, insulation and oxidation resistance can be achieved; the nickel-gold plating layer is deposited on the surface of the metal heat dissipation layer 3, so that the oxidation resistance is realized, and the flatness of the surface of the circuit board can be improved.

The outer surface of the PCB1 is provided with a first electronic device, and the first electronic device is positioned above the metal heat dissipation layer 3. The first electronic device is in contact with the metal heat sink layer 3.

The first electronic device can be a heating device and is positioned above the metal heat dissipation layer 3, and the generated heat is transmitted to the heat dissipation structure 2 inside the PCB through the metal heat dissipation layer 3, so that the heat conduction function is realized.

Optionally, the heat dissipation structure 2 is a heat pipe. The PCB1 includes a first cavity and one or at least two sequentially stacked insulating dielectric layers, wherein the first cavity is located in one or more adjacent insulating dielectric layers, and the heat pipe is located in the first cavity. Taking two layers of circuit boards as an example, as shown in fig. 1, a first cavity is formed in an insulating medium layer of a PCB, the heat pipe is disposed in the first cavity, at least one first via hole 11 is formed in the PCB1, the first via hole 11 penetrates from an outer surface of the PCB1 to the first cavity, and the metal heat dissipation layer 3 is connected to a housing of the heat pipe through the first via hole 11; wherein, a heat conducting material is formed on the inner wall of the first via hole 11.

The heat that the device that generates heat that the setting is on shown PCB1 surface produced passes through metal heat dissipation layer 3, passes through again first via hole 11 transmits to the surface of heat pipe, the heat pipe intussuseption is filled with the coolant liquid, makes to be full of liquid in the imbibition capillary porous material of hugging closely the heat pipe inner wall, and inside the heat pipe was transmitted by the pipe wall of heat pipe, the evaporation zone of heat pipe was heated, and liquid evaporation vaporization in the imbibition core flows to the condensation segment, gives out heat and condenses into liquid at the condensation segment, and liquid flows back to the evaporation segment along the effect of capillary porous material dependence capillary again, so circulate, realizes that the heat passes to the other end by the one end of heat pipe.

When the circuit board is the multilayer circuit board, including the insulating medium layer that the multilayer piles up in proper order, can set up the heat pipe as required and the mounted position of the device that generates heat, for example when the device that generates heat arranges on the top layer of PCB, can set up the heat pipe in the insulating medium layer that contacts with the PCB top layer, also can all set up in a plurality of insulating medium layers the heat pipe, the casing of heat pipe links to each other through first via hole and the metal heat dissipation layer 3 on insulating medium layer surface, for example ground network copper foil, realizes the thermal conduction of the device that generates heat.

As shown in fig. 1, before the printed circuit board assembly PCBA is manufactured, a laser or mechanical deep drill method is used to partially remove the inside of the insulating dielectric layer to form a partial groove, the heat pipe is placed in the groove, another insulating dielectric layer is covered on the top of the groove, and then copper foil pressing, laser drilling, circuit etching, hole filling, ink and surface treatment are performed on the basis to form a circuit board with the heat pipe inside. The embodiment utilizes the space inside the PCB to place the heat pipe, removes the external heat pipe in the prior art, can reduce the thickness of the whole machine, and does not occupy the board distribution space on the surface layer of the PCB; the heat pipe is connected with the metal heat dissipation layer through the first through hole, so that the heat dissipation area is increased, and the heat dissipation effect is improved; and moreover, the heat pipe can be embedded on the surface of the main upper structural part or the PCB at the same time, so that the heat dissipation performance of the whole machine is further improved.

The heat dissipation structure 2 may also be in another implementation form, and optionally, the PCB1 includes one or at least two sequentially stacked insulating medium layers; one or more adjacent insulating medium layers are provided with a through part, openings at two ends of the through part are respectively covered with a metal covering layer, and the metal covering layer and the side wall of the through part enclose to form a cavity of the heat dissipation structure 2; wherein, when the opening of the through part is positioned on the outer surface of the PCB1, the metal covering layer is the metal heat dissipation layer 3.

When the opening of the through part is located inside the PCB1, at least one second via hole is further formed in the PCB1, the second via hole is communicated from the outer surface of the PCB1 to the metal covering layer, and the metal heat dissipation layer 3 is connected with the metal covering layer through the second via hole; and a heat conduction material is formed on the inner wall of the second through hole.

Taking two layers of circuit boards as an example, as shown in fig. 2, the through portion is provided on an insulating medium layer of a PCB, openings at two ends of the through portion are respectively covered with a metal covering layer, the opening of the through portion is located on the outer surface of the PCB1, the metal covering layer is the metal heat dissipation layer 3, the metal covering layer and a cavity of the heat dissipation structure 2 formed by surrounding side walls of the through portion are filled with a cooling liquid, heat generated by a heating device arranged on the surface of the PCB1 is transferred to the heat dissipation structure 2 through the metal heat dissipation layer 3, and the heat dissipation structure 2 transmits the heat to the other end by using the cooling liquid in the cavity and dissipates the heat.

As shown in fig. 3, a plurality of third vias 12 are opened on the PCB1 around the periphery of the through portion, the third vias 12 are connected to the metal covering layers at two ends of the through portion, and a heat conductive material is formed on inner walls of the third vias 12. The third via hole 12 is arranged around the cavity of the heat dissipation structure 2, can transfer heat generated by a heating device on the surface of the PCB, and is connected with the metal covering layers with openings at two ends of the through part, so that the heat dissipation area can be increased, and the heat dissipation effect is improved. The shape of the heat dissipation structure 2 may be set as required, and may be the shape of the heat dissipation structure 2 shown in fig. 2 and 3, or may be other shapes.

When the printed circuit board assembly PCBA is a multilayer circuit board, the PCBA comprises a plurality of layers of sequentially stacked insulating medium layers, the through part can be arranged according to requirements and installation positions of heating devices, for example, when the heating devices are arranged on the surface layer of the PCB, the through part can be arranged on the insulating medium layer contacted with the surface layer of the PCB, or the through part can be arranged on a plurality of adjacent insulating medium layers; when the device that generates heat arranges on the top layer of PCB to the portion that link up sets up when PCB is inside PCB1 is last to have seted up a plurality of second via holes for the intercommunication covers the metal coating of portion tip and the metal heat dissipation layer 3 on PCB surface link up, like this, the heat that the device that generates heat on PCB surface produced can pass through metal heat dissipation layer 3 and the second via hole, transmit to metal coating, and then transmit to inside heat radiation structure 2, realize the thermal conduction of the device that generates heat.

As shown in fig. 2, before the printed circuit board assembly PCBA is manufactured, a laser or mechanical drill method is used to remove a local whole of the insulating medium layer to form the through part cover layer, the through part and the metal cover layer are surrounded, a cavity formed by covering and combining metal is covered at two ends of the through part respectively, vacuum is extracted, and cooling liquid is injected; and then, a laser drilling technology is used for manufacturing a closed long row of holes, namely third through holes, around the cavity, and on the basis, laser drilling, circuit etching, hole filling, printing ink and surface treatment are carried out to form the circuit board with the heat dissipation structure. The embodiment does not need to separately manufacture the heat pipe in advance, and the heat dissipation structure can be manufactured according to the actually available space on the PCB, so that the flexibility is higher.

The embodiment of the utility model has the advantages that the heat dissipation structure is arranged inside the PCB, the heat pipe embedded on the main upper structural part or the surface of the PCB is cancelled, the whole machine space occupied by the heat pipe is released, and the heat dissipation structure does not occupy the board layout space resource on the surface of the circuit board, so that the thickness of the whole machine can be reduced; the heat dissipation structure is connected with the large-area metal heat dissipation layer on the PCB, so that the heat dissipation area can be increased, and the heat dissipation effect is improved. Furthermore, the embodiment of the present invention is not limited to the application of the double-sided circuit board, and can be extended to a multilayer (more than three layers) stacked circuit board.

The present invention provides a terminal device, which is described in detail below by way of specific embodiments. For convenience of illustration, a mobile phone is used as a specific example of the terminal device of the present invention for illustration, and it can be understood by those skilled in the art that, besides the mobile phone is used as the terminal device, the present invention is also applicable to other terminal devices with a display screen, such as a tablet computer, an e-book reader, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, a laptop portable computer, a car computer, a desktop computer, a set-top box, an intelligent tv, a wearable device, etc., all fall within the protection scope of the embodiments of the present invention.

The utility model provides a terminal, including foretell printed circuit board assembly PCBA. The PCB of the printed circuit board assembly PCBA is internally provided with a heat dissipation structure, a main upper structural member or a heat pipe embedded on the surface of the PCB is omitted, the whole machine space occupied by the heat pipe is released, and the thickness of the whole machine can be reduced.

The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the invention.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.

The foregoing is directed to the preferred embodiments of the present invention, and it will be understood by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and that such changes and modifications are intended to be included within the scope of the invention.

Claims

1. A printed circuit board assembly, PCBA, comprising:

a printed circuit board PCB (1);

the heat dissipation structure (2) is positioned in the PCB (1), and the heat dissipation structure (2) comprises a cavity and cooling liquid filled in the cavity; and

install metal heat dissipation layer (3) on PCB (1), metal heat dissipation layer (3) with heat radiation structure (2) link to each other.

2. Printed circuit board assembly, PCBA, according to claim 1, characterized in that the outer surface of the PCB (1) is formed with metal tracks (4) and that the height of the metal heat sink layer (3) relative to the outer surface of the PCB (1) is not higher than the height of the metal tracks (4) relative to the outer surface of the PCB (1).

3. A printed circuit board assembly, PCBA, according to claim 1, characterized in that the PCB (1) has a first electronic component mounted on its outer surface, and that the first electronic component is located above the metal heat sink layer (3).

4. A printed circuit board assembly, PCBA, according to claim 3, characterized in that the first electronic component is in contact with the metal heat sink layer (3).

5. Printed circuit board assembly, PCBA, according to any of the claims 1 to 4, characterised in that the heat dissipation structure (2) is a heat pipe.

6. Printed circuit board assembly, PCBA, according to claim 5, characterized in that the PCB (1) comprises a first cavity and one or at least two successively stacked layers of insulating medium, wherein the first cavity is located in one or more adjacent layers of insulating medium and the heat pipe is located within the first cavity.

7. The printed circuit board assembly, PCBA, according to claim 6, characterized in that the PCB (1) is provided with at least one first via hole (11), said first via hole (11) penetrating from the outer surface of the PCB (1) to said first cavity, said metal heat sink layer (3) being connected to the housing of said heat pipe through said first via hole (11);

wherein, a heat conduction material is formed on the inner wall of the first through hole (11).

8. Printed circuit board assembly, PCBA, according to any of claims 1 to 4, characterized in that the PCB (1) comprises one or at least two successively stacked layers of insulating medium; one or more adjacent insulating medium layers are provided with a through part, openings at two ends of the through part are respectively covered with a metal covering layer, and the metal covering layer and the side wall of the through part enclose a cavity body forming the heat dissipation structure (2).

9. Printed circuit board assembly, PCBA, according to claim 8, characterized in that the metal cover layer is the metal heat sink layer (3) when the opening of the through-going portion is located at the outer surface of the PCB (1);

when the opening of the through part is positioned inside the PCB (1), at least one second through hole is further formed in the PCB (1), the second through hole is communicated from the outer surface of the PCB (1) to the metal covering layer, and the metal heat dissipation layer (3) is connected with the metal covering layer through the second through hole;

and a heat conduction material is formed on the inner wall of the second through hole.

10. The printed circuit board assembly, PCBA, according to claim 9, characterised in that the PCB (1) has a plurality of third vias (12) formed around the perimeter of the through-going portion, the third vias (12) being connected to the metal covering of the through-going portion opening, and the third vias (12) having a thermally conductive material formed on the inner walls thereof.

11. A terminal, comprising a printed circuit board assembly, PCBA, as claimed in any one of claims 1 to 10.