CN208538821U - A kind of small-sized encapsulated radiator - Google Patents
A kind of small-sized encapsulated radiator Download PDFInfo
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- CN208538821U CN208538821U CN201820977512.7U CN201820977512U CN208538821U CN 208538821 U CN208538821 U CN 208538821U CN 201820977512 U CN201820977512 U CN 201820977512U CN 208538821 U CN208538821 U CN 208538821U
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- substrate
- thermally conductive
- temperature sensitive
- gap
- metal layer
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Abstract
The utility model discloses a kind of small-sized encapsulated radiators, including substrate, package casing, high heat consumption device and high-temperature Sensitive Apparatus, the bottom surface ground metal layer of the corresponding substrate of package casing is divided so that the high heat consumption device and the corresponding grounded metal interlayer of the high temperature sensitive device form gap, it is thermally isolated by the realization of the substrate media of high thermal resistance, in gap or close to the cylindrical thermally conductive through-hole column of the edge of device setting item or the thermally conductive through-hole of discrete form.By the design for the segmentation radiator structure that the encapsulation to substrate carries out, in the case where not influencing system electrical property and then higher hot property can be obtained.
Description
Technical field
The utility model relates to chip package field more particularly to a kind of small-sized encapsulated radiators.
Background technique
System-in-Package technology (System in Package, SiP) is a kind of multiple active devices (chip) and passive
Device (resistance, capacitor, inductance etc.) is integrated in the high-density integration technology in the equipment of an encapsulation.By High Density Integration,
Meet user to system compact, multi-functional, low-power consumption, the requirement of high reliability.
Currently, the form of SiP may be 2D plane or utilize 3D stacking or multi-chip package (Multi-chip
Package；MCP) effectively to reduce package area or both aforementioned various combinations.More broadly SiP contains embedded set
The functional base plate structure of passive device or active device.System in package is more prone to produce compared with the encapsulation of other simple function products
Heat dissipation problem.
Heat dissipation problem caused by system in package substantially has the following:
1. the calorific value of chip stack poststack will increase, but heat dissipation area not relative increase, therefore heat generation density greatly improves；
2. although multi-chip package still possesses former heat dissipation area, due to close to each other, the thermal coupling enhancing of heat source, thus
Cause even more serious heat problem；
3. the passive device in embedded set substrate also has certain heating problem, since substrate heat dissipation is bad, can also generate tight
The heat problem of weight；
4. packing density increases since encapsulation volume reduces, so that heat dissipation is not easy to solve, it is therefore desirable to which higher efficiency dissipates
Thermal design.
For the hot arraign topic of SIP, current correlative study is simultaneously few, and system in package sinking path includes:
Using the encapsulating structure of LGA (Land Grid Array), the material of Thermal conductivity is embedded in reinforce in substrate
The heat transmission and dissipating effect of substrate.
Change layout designs or encapsulating structure, shorten heat-transfer path or reduces the thermal resistance in path.
The higher power device of heat will be generated directly to be connected with metal cavity, reduce the concentration of heat source.
High heat consumption device and high-temperature Sensitive Apparatus are scattered, and by the substrate media of high thermal resistance realize heat every
From the thermal coupling for reducing different circuit parts is right.
Reduced using heat dissipation channel (Thermal Vias) chip surface to air (Junction to Air) heat
Resistance.
The concentration of heat source is reduced by additional equal backing or cooling fin.
For example, the structure of the DC-DC converter of two chip SIP encapsulation technologies of utilization of Amkor company exploitation.It is radiating
Using falling into array (Land Grid Array in design；LGA encapsulating structure), plated with copper (Cu) is in heat through-hole to reinforce
The heat transmission and dissipating effect of substrate, and then obtain higher hot property.
From the point of view of heat dissipation path, the heat that encapsulation chip generates is largely divided into two parts up and down, upward part
Heat can be transmitted to environment space through encapsulation upper surface, and downward heat is then transmitted to environment space through substrate.From chip to outer
The encapsulation of shell is the most important part in heat dissipation design.When chip top structure does not add any radiator, the transmitting of heat
Substrate substrate and tin ball bonding point are mainly penetrated, accounts for about 80-90%.In conventional substrate design, bottom surface ground metal layer is
One piece of complete ameristic good thermal conductivity bulk metal layer.
Utility model content
For overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of heat dissipations of small-sized encapsulated to fill
It sets, can solve the bad problem of system in package heat dissipation effect.
The purpose of this utility model is implemented with the following technical solutions:
A kind of small-sized encapsulated radiator, including substrate, package casing, high heat consumption device and high-temperature Sensitive Apparatus,
The package casing encapsulates the high heat consumption device and the high-temperature Sensitive Apparatus on the substrate, the high heat consumption device
In on the substrate, the bottom surface of the corresponding substrate of the package casing is grounded gold for part and the high-temperature Sensitive Apparatus dispersed placement
Belong to layer to divide so that the high heat consumption device and the high temperature sensitive device corresponding grounded metal interlayer formation gap, pass through height
The substrate media realization of thermal resistance is thermally isolated.
Preferably, device further includes the thermally conductive through-hole column of a cylindricality, and segmentation is arranged in the thermally conductive through-hole column of described cylindricality
The thermally conductive through-hole column of described cylindricality is led the stratum of substrate close to the position in the gap by the ground metal layer, is played
Downward heat transfer and the high-temperature Sensitive Apparatus is thermally isolated.
Preferably, device further includes good heat conductor, and the good heat conductor is embedded in rising for the ground metal layer of the substrate
It is thermally isolated in the gap of effect.
Preferably, the good heat conductor is the thermally conductive through-hole of the thermally conductive through-hole column of a cylindricality or discrete form.
Preferably, the high heat consumption device is power amplifier, and the high-temperature Sensitive Apparatus is low-noise amplifier.
Preferably, the heat dissipation area with metal layer and conductor part on the substrate ends greater than the gap location substrate
Area is thermally isolated.
Compared with prior art, the utility model has the beneficial effects that: being radiated by the segmentation that the encapsulation to substrate carries out
The design of structure in the case where not influencing system electrical property and then can obtain higher hot property.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the first embodiment of small-sized encapsulated radiator of the utility model；
Fig. 2 is a kind of schematic diagram of the second embodiment of small-sized encapsulated radiator of the utility model；
Fig. 3 is a kind of schematic diagram of the 3rd embodiment of small-sized encapsulated radiator of the utility model；
Fig. 4 is a kind of schematic diagram of the fourth embodiment of small-sized encapsulated radiator of the utility model；
Fig. 5 is a kind of schematic diagram of 5th embodiment of small-sized encapsulated radiator of the utility model.
In figure: 100, high heat consumption device；200, high temperature sensitive device；300, gap；400, the thermally conductive through-hole column of cylindricality；
500, the thermally conductive through-hole of discrete form.
Specific embodiment
Below with reference to the attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu is fully described by, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole realities
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that it can be directly on another component when component is referred to as " being fixed on " another component
Or there may also be components placed in the middle.When a component is considered as " connection " another component, it, which can be, is directly connected to
To another component or it may be simultaneously present component placed in the middle.When a component is considered as " being set to " another component, it
It can be and be set up directly on another component or may be simultaneously present component placed in the middle.Term as used herein is " vertical
", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
The utility model integrated use sinking path, considers how heat preferably penetrates substrate substrate and tin ball bonding point
It is transmitted to package casing, a kind of combination is proposed and is thermally isolated and the design of the base plate heat radiation structure of heat exchange pattern.The radiator structure
The bottom surface ground metal layer of substrate is divided, so that high heat consumption device and the corresponding grounded metal interlayer of high temperature sensitive device are formed
Gap is thermally isolated by the substrate media realization of high thermal resistance；And near-thermal is leaned in the substrate ground metal layer of high-temperature Sensitive Apparatus
Isolated interstice position is embedded in good heat conductor and realizes preferably downward heat transfer；Good thermal conductivity can also be embedded in gap is thermally isolated
Body, the good heat conductor can be the thermally conductive through-hole of discrete form, be also possible to the cylindrical thermally conductive through-hole column (VIABAR) of item,
These good heat conductors are placed in conjunction with package outside heat-conducting mode reasonable layout to enhance the heat of substrate media leakage heat and pass
It leads and is thermally isolated.Meeting user to system compact, multi-functional, low-power consumption, the requirement of high reliability simultaneously, the radiator structure
The cooling requirements of system can preferably be met.
Thermally conductive through-hole is such as placed on to the underface of heat source chip, plated with copper (Cu) is in thermally conductive through-hole to reinforce the heat of substrate
Pass heat dissipation effect.In conventional substrate design, the metal layer that bottom surface connects is complete one piece ameristic.
Unlike the prior art, the radiator structure of the utility model includes the novel compositions of following four part:
(1) high heat consumption device and high-temperature Sensitive Apparatus are scattered；
(2) the thermally conductive bottom surface ground metal layer to package casing is divided, keeps above-mentioned high heat consumption device and high-temperature quick
The ground metal layer of inductor component has the gap of one fixed width, is thermally isolated by the substrate media realization of high thermal resistance；
(3) the thermally conductive through-hole column of cylindricality led to stratum is placed close to the place in gap in segmentation ground metal layer
(VIABAR), while playing the role of downward heat transfer and heat source temperature-sensitive device is thermally isolated；
(4) the substrate ground metal layer that is scattered in high heat consumption device and high-temperature Sensitive Apparatus is thermally isolated in gap
It is embedded in the radiating structure of good heat conductor, which can be the thermally conductive through-hole of discrete form, be also possible to a cylindricality
Thermally conductive through-hole VIABAR.
Referring to attached drawing 1-5, specifically, small-sized encapsulated radiator includes substrate (not shown), (figure is not for package casing
Show), high heat consumption device 100 and high-temperature Sensitive Apparatus 200, package casing is by high heat consumption device 100 and high-temperature Sensitive Apparatus
200 are encapsulated on substrate, and on substrate, package casing is corresponding for high heat consumption device 100 and 200 dispersed placement of high-temperature Sensitive Apparatus
The bottom surface ground metal layer segmentation (cut-off rule referring to the dotted line in Fig. 1-5 at) of substrate make high heat consumption device 100 and high temperature
The corresponding grounded metal interlayer of Sensitive Apparatus 200 forms gap 300, is thermally isolated by the substrate media realization of high thermal resistance.
- Fig. 5 referring to fig. 2 combines radiator structure, and device further includes the thermally conductive through-hole column 400 of a cylindricality, and cylindricality is thermally conductive
Position of the ground metal layer close to gap of segmentation is arranged in through-hole column 400, and the thermally conductive through-hole column of cylindricality is led substrate
Stratum plays downward heat transfer and high-temperature Sensitive Apparatus is thermally isolated.
Further, device further includes good heat conductor, which is the thermally conductive through-hole of discrete form, and by good thermal conductivity
Body is embedded in the serving in the gap being thermally isolated of the ground metal layer of substrate.
In specific implementation, high heat consumption device is power amplifier, and high-temperature Sensitive Apparatus is low-noise amplifier, is made certainly
It is not limited to power amplifier and low-noise amplifier for the component in encapsulation, herein only with example.
Area is thermally isolated greater than the cut-off of gap location substrate in heat dissipation area with metal layer and conductor part on substrate.Make
For total design principle, such area arrangement can guarantee good heat dissipation effect.
Specifically, respectively as the embodiment of Fig. 1 to Fig. 5 is as follows:
Embodiment one
Referring to Fig. 1, high heat consumption device 100 (such as power amplifier), which is set on the corresponding substrate of package casing, is located at corner
Place, heat radiation function is increased with this.Multiple high-temperature Sensitive Apparatuses 200 are also set to the corner side of package casing as far as possible,
The bottom surface ground plane metal of substrate is divided, and the cut-off rule is as shown in phantom in Figure 1, and the block being divided into makes high heat consumption device
100 and the corresponding grounded metal interlayer of high temperature sensitive device 200 formed gap 300.
Embodiment two
As shown in Fig. 2, placing the item for being thermally isolated at the stratum edge for the block of high-temperature Sensitive Apparatus 200 being divided into
The thermally conductive through-hole column 400 of cylindricality.
Embodiment three
As shown in figure 3, the thermally conductive through-hole 500 of discrete form is placed in the gap between the metal layer block by being divided into.
Example IV
As shown in figure 4, the thermally conductive through-hole column 400 of a cylindricality is placed in the gap between the metal layer block by being divided into.
Embodiment five
As shown in figure 5, placing the item for being thermally isolated at the stratum edge for the block of high-temperature Sensitive Apparatus 200 being divided into
The thermally conductive through-hole 500 of discrete form is placed in the thermally conductive through-hole column 400 of cylindricality, the gap between the metal layer block by being divided into.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection of the utility model claims
Within the scope of.
Claims (6)
1. a kind of small-sized encapsulated radiator, including substrate, package casing, high heat consumption device and high-temperature Sensitive Apparatus, institute
It states package casing to encapsulate the high heat consumption device and the high-temperature Sensitive Apparatus on the substrate, the high heat consumption device
With the high-temperature Sensitive Apparatus dispersed placement on the substrate, it is characterised in that:
The bottom surface ground metal layer of the corresponding substrate of the package casing is divided so that the high heat consumption device and the height are temperature sensitive
The corresponding grounded metal interlayer of inductor component forms gap, is thermally isolated by the substrate media realization of high thermal resistance.
2. the apparatus according to claim 1, it is characterised in that: device further includes the thermally conductive through-hole column of a cylindricality, by the item
The ground metal layer of segmentation is arranged in close to the position in the gap in the thermally conductive through-hole column of cylindricality, and described cylindricality is thermally conductive
Through-hole column leads the stratum of substrate, plays downward heat transfer and the high-temperature Sensitive Apparatus is thermally isolated.
3. device according to claim 1 or 2, it is characterised in that: device further includes good heat conductor, and the good heat conductor is embedding
The ground metal layer entered in the substrate serves in the gap being thermally isolated.
4. device according to claim 3, it is characterised in that: the good heat conductor is the thermally conductive through-hole column or discrete of a cylindricality
The thermally conductive through-hole of form.
5. the apparatus according to claim 1, it is characterised in that: the high heat consumption device is power amplifier, the high temperature
Degree Sensitive Apparatus is low-noise amplifier.
6. the apparatus according to claim 1, it is characterised in that: with the heat dissipation of metal layer and conductor part on the substrate
Area is thermally isolated greater than gap location substrate cut-off in area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820977512.7U CN208538821U (en) | 2018-06-22 | 2018-06-22 | A kind of small-sized encapsulated radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820977512.7U CN208538821U (en) | 2018-06-22 | 2018-06-22 | A kind of small-sized encapsulated radiator |
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| Publication Number | Publication Date |
|---|---|
| CN208538821U true CN208538821U (en) | 2019-02-22 |
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| CN201820977512.7U Active CN208538821U (en) | 2018-06-22 | 2018-06-22 | A kind of small-sized encapsulated radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589141A (en) * | 2022-02-23 | 2022-06-07 | 洪婉芳 | Building board washs dust collector fast |
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2018
- 2018-06-22 CN CN201820977512.7U patent/CN208538821U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589141A (en) * | 2022-02-23 | 2022-06-07 | 洪婉芳 | Building board washs dust collector fast |
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