CN2896528Y - High-power LED package structure - Google Patents
High-power LED package structure Download PDFInfo
- Publication number
- CN2896528Y CN2896528Y CNU2005201420336U CN200520142033U CN2896528Y CN 2896528 Y CN2896528 Y CN 2896528Y CN U2005201420336 U CNU2005201420336 U CN U2005201420336U CN 200520142033 U CN200520142033 U CN 200520142033U CN 2896528 Y CN2896528 Y CN 2896528Y
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 230000008021 deposition Effects 0.000 claims description 61
- 238000010276 construction Methods 0.000 claims description 33
- 238000005538 encapsulation Methods 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010445 mica Substances 0.000 description 5
- 229910052618 mica group Inorganic materials 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A high-power LED packaging structure can be applied to some special purposes such as projection lamp, pocket lamp, vehicle lamp, ultraviolet-ray and infrared- ray light-source structure as well as general illuminative light-source structure. Wherein, by taking the LED as light source, a single LED chip or more will be fixed on the loading surface of a metal heat-sinker with good heat conduction. The lower part of the metal heat-sinker is embedded with a heat-conducting base, and a heat conducting insulative layer is arranged between the metal heat-sinker and the heat-conducting base to integrate the three as one, which increases the mechanical strength of the utility model, expands the area of heat conduction, promotes the integral heat-extraction effect. While the load surface can quickly guide the heat energy generated by the chip to the metal heat-sinker that has a more heavy quality than the chip. The metal heat-sinker can quickly expand the heat energy and guide to the conducting base to enable fast extraction of the heat energy generated by the chip.
Description
Technical field
The utility model relates to a kind of high-power LED encapsulation construction.
Background technology
In recent years, the field that light-emitting diode (LED) is employed is quite extensive, as the light source on the LCD screen, projecting lamp, traffic lights livery and automobile the 3rd brake light etc., obviously replace the shinny bulb epoch of filament gradually, yet existing light-emitting diode (LED) bulb, with regard to the bulb of single chips, though be that volume is little, but energy of light source is little, many restrictions on purposes, requiring to improve under the bulb source brightness situation, and increase considerably its quantity and apply power, but the thermal source that described luminescence chip produced only relies on the LED metallic support to dispel the heat, there is no other heat dissipation metal body assists, so magnitude of current that described chip bore, because of the not good magnitude of current that causes being supplied with of chip cooling is restricted, the relative brightness power that chip sent is along with influence, because the brightness and the magnitude of current that chip sent are proportional, so the described chip brightness of current decay also with reduction, and then make the chip power of existing light-emitting diode (LED) be subjected to suitable restriction, and can't promote its light-source brightness again, under long-time the use, the internal temperature of described many light-emitting diodes (LED) is being difficult under heat radiation and the too high situation of temperature, cause in the light-emitting diode chip too high and burn in ambient temperature easily, the brightness power that each chip sent also can't obtain maximum performance, cause the failure rate of described bulb structure to improve, and the waste of material resources; The plane is in conjunction with the multilayer mode in addition, be that chip directly is fixedly arranged on the thin shape copper foil, utilize colloid that described copper foil is posted solid in the metal derby top again, when chip produces thermal source,, make the chip thermal source be difficult for conducting in the horizontal proliferation mode because described thin shape copper foil is thinner, and directly described thermal source is conducted on the metal derby of below with vertical mode, under the limitation of thermal source diffusion pipeline, make chip temperature still be in the condition of high temperature, and shorten chip useful life; Another kind of existing light-source structure, be that chip is fixedly arranged on metal derby, described metal derby below is provided with the mica sheet of insulating heat-conductive, when assembling is to utilize screw, and metal derby and mica sheet are locked on the lamp base device, and metal derby and lamp base device are combined into one, but when the plant of screw do is sealed, under human factor, make described mica sheet produce locating bias, and influence its thermal source conduction easily.
The disappearance of prior art:
1. existing light-emitting diode quantity wants many, just enough supplies the client required light source, and causes structural volume significantly to increase.
2. light-emitting diode quantity is too much, and is very high through the long-time institute's heat energy that causes that uses, and seriously shortens light-emitting diode useful life.
3. the heat energy that chip produces of light-emitting diode can only see through metallic support or thin shape Copper Foil do heat radiation conduction, being directly proportional with electric current at chip brightness, to close be down, the magnitude of current of described light-emitting diode is restricted, and the brightness power that each chip sent also can't obtain maximum performance, cause the failure rate of described bulb structure to improve, and the waste of material resources.
4. prior art is the mica sheet that is provided with insulating heat-conductive below metal derby, when assembling easily under human factor, make described mica sheet produce locating bias, and influence its thermal source conduction.
Summary of the invention
The purpose of this utility model promptly provides a kind of high-power LED encapsulation construction, be to be light source with light-emitting diode (LED), and supply its DC power supply with power line, can be applicable to special purpose such as projecting lamp, flashlight, car light, ultraviolet ray and infrared ray source structure, and the light-source structure of general lighting, with light-emitting diode (LED) is light source, can be more than single or single with light-emitting diode (LED) chip, be bonded to the loading end on the heat conduction good metal heat deposition body, below the metal heat deposition body, set and be installed with a heat conducting base, and between metal heat deposition body and heat conducting base, be provided with the heat conductive insulating layer, make the triplicity one, can increase mechanical strength of the present utility model, dielectric strength, with the expansion heat-conducting area, increase the integral heat sink effect, and described loading end can be with the heat energy that chip produced, the quality that leads fast is on the metal heat deposition body of chip, described metal heat deposition body is then fast again with described heat energy diffusion, and be directed on the heat conducting base, the heat energy that chip is produced sheds fast, and significantly reduce chip temperature, make each chip can bear more high-amperage, and then under a minority chip, just can reach high brightness and maximum power, improve the application of resource, and set in the end face outer rim of metal heat deposition body and to be installed with a lampshade cup, be provided with lens in lampshade cup upper end, described heat conducting base is to adopt copper or aluminum alloy material.
A purpose more of the present utility model is that a kind of high-power LED encapsulation construction is being provided, be provided with lens in described lampshade cup upper end, described lens can adopt glass or acryl material, and described lens can adopt the eyeglass of convex lens, concavees lens or level crossing, can tell according to the visitor and require and described lens of conversion arbitrarily, use the change lens curvature, and different ray cast angles, required to satisfy the client, to improve use flexibility of the present utility model.
Another purpose of the present utility model is that a kind of high-power LED encapsulation construction is being provided; described lampshade cup material can adopt aluminium alloy or plastic material; and be set to the arcwall face of a thing line at lampshade cup inner edge; described arcwall face design helps the reflection of light-emitting diode light beam to concentrate; with astigmatism and concentration applications as different crevice projection angles; and described lampshade cup combines with heat conducting base; as purposes fixing and protection; except that can directly absorbing the heat energy of heat deposition body, more make the integrally-built thermal endurance and the impact property of body better.
Another purpose of the present utility model is that a kind of high-power LED encapsulation construction is being provided, described heat conducting base can have circle, square and geometric contour structures, and lens, lampshade cup and metal heat deposition body can change with the heat conducting base contour structures, and change, to meet the consistency of outward appearance kenel.
To achieve these goals, the utility model provides a kind of high-power LED encapsulation construction, is made up of lens, lampshade cup, chip, metal heat deposition body and heat conducting base; It is characterized in that: with light-emitting diode chip for backlight unit more than single or single, be bonded to the loading end on the heat conduction good metal heat deposition body, below the metal heat deposition body, set and be installed with a heat conducting base, and between metal heat deposition body and heat conducting base, be provided with the heat conductive insulating layer, metal heat deposition body and heat conducting base and heat conductive insulating layer are combined into one, set in the end face outer rim of metal heat deposition body and to be installed with a lampshade cup, be provided with lens in lampshade cup upper end.
Described lampshade cup upper port is provided with a recessed edge, is provided with arcwall face to lampshade cup center convergent at recessed edge adjacent, and is provided with the ring-type tangent plane in lampshade cup lower port.
Be equipped with lens in the recessed edge of lampshade cup, and be coated with glue at lens and recessed intermarginal composition surface, lens and lampshade cup can be set firmly be integral, described lens adopt convex lens, concavees lens or level crossing.
Be provided with platform in metal heat deposition body end face center, loading end center at platform is provided with several chips, and on described loading end, be provided with two relative holes, be installed with a support by sealing in each hole, and each support extends evagination in the outside, metal heat deposition body lower end, is welded with the metal wire that is connected with chip at each cradle top surface point.
Be placed in platform outer rim on the metal heat deposition body in the lower port of lampshade cup, described ring-type tangent plane fits in the platform lateral border, and between lampshade cup and metal heat deposition body, be coated with the heat conductive insulating layer, lampshade cup and metal heat deposition body and heat conductive insulating layer can be set firmly be integral.
Be provided with a circular groove in the center of heat conducting base, described circular groove center is provided with two relative holes, the metal heat deposition body is set in the circular groove that is fixedly arranged on the heat conducting base, in two supports of metal heat deposition body lower end, two set holes on the heat conducting base, and evagination is in heat conducting base lower edge face, and between metal heat deposition body and heat conducting base, be coated with the heat conductive insulating layer, the metal heat deposition body is fixedly arranged on the heat conducting base, have a burnishing surface between formation metal heat deposition body and heat conducting base, then evagination has a platform on described burnishing surface.
Be penetrated with support in two holes on heat conducting base, and be provided with sealing in two holes, being formed on heat conducting base lower edge face evagination has two firm supports.
Be provided with the screw that supplies that runs through in heat conducting base end face outside and make the sealed circular hole of planting.
Described heat conducting base has circle, square, strip and any geometric contour structures, and lens, lampshade cup and metal heat deposition body can change with the heat conducting base contour structures, and changes, to meet the consistency of outward appearance kenel.
Advantage of the present utility model:
1. the utility model is the heat energy that luminescence chip is produced, via the heavy hot piece of metal, thermal conductive insulation glue, heat conducting base and lampshade cup, by above metal derby layer by layer set firmly into a body, the heat energy of chip can be spread out of, and in the atmosphere that sheds rapidly, make luminescence chip can bear the bigger magnitude of current, increase its chip brightness, and maximum power is provided.
2. only need use a small amount of chip, can send high brightness and maximum power, material resources can effectively use, and reduces the expense of material cost.
3. the heat energy that chip produced sheds fast, and significantly reduces chip temperature, can improve the useful life of light-emitting diode.
4. the heat conducting base upper grooves is to set fixingly for heat deposition body, and is provided with the heat conductive insulating layer between the two, can increase mechanical strength of the present utility model, dielectric strength, and enlarges heat-conducting area, increase integral heat sink effect.
Description of drawings
Fig. 1 is an exploded view of the present utility model;
Fig. 2 is a constitutional diagram of the present utility model;
Fig. 3 is a profile of the present utility model;
Fig. 4 is first kind of embodiment schematic diagram of the present utility model;
Fig. 5 is the constitutional diagram of strip high-power LED encapsulation construction of the present utility model;
Fig. 6 is second kind of embodiment schematic diagram of the present utility model;
Fig. 7 is the embodiment schematic diagram of square high-power LED encapsulation construction of the present utility model;
Fig. 8 is the third embodiment schematic diagram of the present utility model.
Description of reference numerals: high-power LED encapsulation construction 1; Lens 11; Lampshade cup 12; Glue 120; Recessed edge 121; Arcwall face 122; Tangent plane 123; Lower port 124; Chip 13; Metal wire 131; Support 132; Metal heat deposition body 14; Heat conductive insulating layer 140; Platform 141; Loading end 142; Hole 143; Heat conducting base 15; Sealing 150; Circular hole 151; Circular groove 152; Hole 153; Desk lamp 2; Circular lampshade 21; Strip high-power LED encapsulation construction 3; Heat conducting base 31; Metal heat deposition body 32; Lampshade cup 33; Desk lamp 4; Square lampshade 41; Square high-power LED encapsulation construction 5; Projecting lamp 6.
Embodiment
See also Fig. 1, Fig. 2 and shown in Figure 3, the utility model high-power LED encapsulation construction, by among the figure as can be known, high-power LED encapsulation construction 1 is made up of lens 11, lampshade cup 12, chip 13, metal heat deposition body 14 and heat conducting base 15; Be provided with the circular hole 151 that runs through in heat conducting base 15 end face outsides, circular hole 151 can be done to plant sealed for screw, make the utility model can be installed on projecting lamp, flashlight, car light, ultraviolet ray and infrared ray source structure, perhaps in the general lighting equipment, and the center is provided with a circular groove 152 above heat conducting base 15, described circular groove 152 is to set fixing for metal heat deposition body 14, and be provided with heat conductive insulating layer 140 at metal heat deposition body 14 and 15 of heat conducting bases, make three 14,140,15 are combined into one, and then increase mechanical strength of the present utility model, with the expansion heat-conducting area, increase the integral heat sink effect, and be formed with a burnishing surface at metal heat deposition body 14 and 15 of heat conducting bases, on the described burnishing surface only evagination one platform 141 is arranged, be provided with several light-emitting diodes (LED) chip 13 in loading end 142 centers of platform 141, be welded with metal wire 131 at 13 each points of several chips, and on described loading end 142, be provided with two relative holes 143, in each hole 143, be installed with a support 132 by sealing 150, each support 132 extensible evagination is in the outside, metal heat deposition body 14 lower ends, and be welded with the metal wire 131 that is connected with chip 13 at each support 132 end faces point, because the groove 152 on the described heat conducting base 15 can be set for metal heat deposition body 14 and be set firmly, this moment can be through two set holes 153 in the circular groove 152 on the heat conducting base 15 at two supports 132 of metal heat deposition body 14 lower ends, and evagination is in heat conducting base 15 lower edge faces, in its two hole 153, be provided with sealing 150 again, being formed on heat conducting base 15 lower edge face evaginations has two firm supports 132, and described two supports 132 can connect for external power supply; Above metal heat deposition body 14, be provided with hollow form lampshade cup 12, described lampshade cup 12 upper port are provided with a recessed edge 121, be provided with arcwall face 122 at recessed edge 121 adjacents to lampshade cup 12 center convergents, described lampshade cup 12 lower port 124 are provided with ring-type tangent plane 123, the lower port 124 of described lampshade cup 12 can be placed in platform 141 outer rims on the metal heat deposition body 14, making described ring-type tangent plane 123 is the lateral borders that fit in platform 141, and be provided with heat conductive insulating layer 140 at lampshade cup 12 and 14 of metal heat deposition bodies, make three 12,14,140 set firmly and are integral, in the recessed edge 121 of lampshade cup 12, can be equipped with lens 11, and the composition surface at 121 at lens 11 and recessed edge is coated with glue 120, lens 11 and lampshade cup 12 can be set firmly be integral, described lens adopt convex lens, concavees lens or level crossing; When two supports, 132 external direct current power supplies, several chips 13 of institute's set above metal heat deposition body 14, under the conduction of current of metal wire 131, make several chips 13 produce heat energy, and scatter light source, and the heat energy that several chips 13 are produced can lead quality fast on the metal heat deposition body 14 of chip 13,14 of described metal heat deposition bodies spread described heat energy fast again, and be directed on the heat conducting base 15, the heat energy that chip 13 is produced sheds fast, and significantly reduce chip 13 temperature, make each chip 13 can bear more high-amperage, and then, just can reach high brightness and maximum power a minority chip 13 times, to improve the application of resource, and be arranged on the lens 11 of lampshade cup 12 upper ends, but mat changes the curvature mirror of lens 11, and gets different ray cast angles, to increase the utility model flexibility in the use.
Described heat conducting base has circle, square, strip and any geometric contour structures, and lens, lampshade cup and metal heat deposition body can change with the heat conducting base contour structures, and changes, to meet the consistency of outward appearance kenel.
See also shown in Figure 4; the utility model high-power LED encapsulation construction; by among the figure as can be known; high-power LED encapsulation construction 1 of the present utility model is to be fixed in the circular lampshade 21 of desk lamp 2 tops by screw; because the employed power supply of the utility model is to adopt direct voltage; make light-source brightness of the present utility model highly stable, do not have the brightness flicker phenomenon, with protection user eyes indefatigability.
See also shown in Figure 5, the utility model high-power LED encapsulation construction, by among the figure as can be known, described strip high-power LED encapsulation construction 3 is to be installed with a metal heat deposition body 32 at strip heat conducting base 31 intermediate recess places, on metal heat deposition body 32 end faces, be provided with several chips, and will extend outside heat conducting base 31 lower surfaces with the support that chip is done to be electrically connected, and on metal heat deposition body 32 the chimeric lampshade cup 33 that is installed with, the heat energy that chip is produced sheds fast, and significantly reduce chip temperature, and can bear more high-amperage, and then under a minority chip, just can reach high brightness and maximum power, to improve the application of resource.
See also shown in Figure 6, the utility model high-power LED encapsulation construction, by among the figure as can be known, strip high-power LED encapsulation construction 3 of the present utility model is can be fixed in the square lampshade 41 of desk lamp 4 tops, can increase practicality of the present utility model and flexibility.
See also shown in Figure 7, the utility model high-power LED encapsulation construction, by among the figure as can be known, square high-power LED encapsulation construction 5 of the present utility model is can be fixed in the square lampshade 41 of desk lamp 4 tops, can increase practicality of the present utility model.
See also shown in Figure 8, the utility model high-power LED encapsulation construction, by among the figure as can be known, high-power LED encapsulation construction 1 of the present utility model can be fixed on the projecting lamp 6, because thermal diffusivity of the present utility model is good, can bear more high-amperage again, can send high brightness and maximum power, and can tell requirement and adjust described magnitude of current size arbitrarily according to the visitor, with the described light-source brightness of conversion.
Above-listed detailed description is specifying at a possible embodiments of the present utility model, described embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model skill spirit does and implement or change, all should be included in the claim of this case.
Claims (9)
1. a high-power LED encapsulation construction is made up of lens, lampshade cup, chip, metal heat deposition body and heat conducting base; It is characterized in that: with light-emitting diode chip for backlight unit more than single or single, be bonded to the loading end on the heat conduction good metal heat deposition body, below the metal heat deposition body, set and be installed with a heat conducting base, and between metal heat deposition body and heat conducting base, be provided with the heat conductive insulating layer, metal heat deposition body and heat conducting base and heat conductive insulating layer are combined into one, set in the end face outer rim of metal heat deposition body and to be installed with a lampshade cup, be provided with lens in lampshade cup upper end.
2. high-power LED encapsulation construction as claimed in claim 1 is characterized in that: described lampshade cup upper port is provided with a recessed edge, is provided with arcwall face to lampshade cup center convergent at recessed edge adjacent, and is provided with the ring-type tangent plane in lampshade cup lower port.
3. high-power LED encapsulation construction as claimed in claim 1, it is characterized in that: in the recessed edge of lampshade cup, be equipped with lens, and be coated with glue at lens and recessed intermarginal composition surface, lens and lampshade cup can be set firmly be integral, described lens adopt convex lens, concavees lens or level crossing.
4. high-power LED encapsulation construction as claimed in claim 1, it is characterized in that: be provided with platform in metal heat deposition body end face center, loading end center at platform is provided with several chips, and on described loading end, be provided with two relative holes, be installed with a support by sealing in each hole, and each support extends evagination in the outside, metal heat deposition body lower end, is welded with the metal wire that is connected with chip at each cradle top surface point.
5. high-power LED encapsulation construction as claimed in claim 1, it is characterized in that: be placed in platform outer rim on the metal heat deposition body in the lower port of lampshade cup, described ring-type tangent plane fits in the platform lateral border, and between lampshade cup and metal heat deposition body, be coated with the heat conductive insulating layer, lampshade cup and metal heat deposition body and heat conductive insulating layer can be set firmly be integral.
6. high-power LED encapsulation construction as claimed in claim 1, it is characterized in that: be provided with a circular groove in the center of heat conducting base, described circular groove center is provided with two relative holes, the metal heat deposition body is set in the circular groove that is fixedly arranged on the heat conducting base, in two supports of metal heat deposition body lower end, two set holes on the heat conducting base, and evagination is in heat conducting base lower edge face, and between metal heat deposition body and heat conducting base, be coated with the heat conductive insulating layer, the metal heat deposition body is fixedly arranged on the heat conducting base, have a burnishing surface between formation metal heat deposition body and heat conducting base, then evagination has a platform on described burnishing surface.
7. high-power LED encapsulation construction as claimed in claim 1 is characterized in that: be penetrated with support in two holes on heat conducting base, and be provided with sealing in two holes, being formed on heat conducting base lower edge face evagination has two firm supports.
8. high-power LED encapsulation construction as claimed in claim 1 is characterized in that: be provided with the screw that supplies that runs through in heat conducting base end face outside and make the sealed circular hole of planting.
9. high-power LED encapsulation construction as claimed in claim 1 is characterized in that: described heat conducting base has the contour structures of circle, square or strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005201420336U CN2896528Y (en) | 2005-11-28 | 2005-11-28 | High-power LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005201420336U CN2896528Y (en) | 2005-11-28 | 2005-11-28 | High-power LED package structure |
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| Publication Number | Publication Date |
|---|---|
| CN2896528Y true CN2896528Y (en) | 2007-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005201420336U Expired - Fee Related CN2896528Y (en) | 2005-11-28 | 2005-11-28 | High-power LED package structure |
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| Country | Link |
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| CN (1) | CN2896528Y (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009094829A1 (en) * | 2008-01-07 | 2009-08-06 | Jie She | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly |
| WO2011050757A1 (en) * | 2009-10-28 | 2011-05-05 | Huo Jian | Led device |
| CN102074637A (en) * | 2009-11-19 | 2011-05-25 | 深圳市光峰光电技术有限公司 | Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure |
| CN102261574A (en) * | 2010-05-28 | 2011-11-30 | 艾迪光电（杭州）有限公司 | Light-emitting diode (LED) lamp with heat conducting piece built-in lamp shade |
| CN101295759B (en) * | 2007-11-30 | 2011-12-07 | 曹宏国 | Power type LED encapsulation base plate |
| CN102943969A (en) * | 2012-11-21 | 2013-02-27 | 深圳华瀚新能源材料有限公司 | Light-emitting diode (LED) lamp using heat conduction high-polymer material for heat dissipation |
| CN103574358A (en) * | 2013-09-30 | 2014-02-12 | 达亮电子（苏州）有限公司 | Lamp structure |
| CN103769340A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Sealant pouring device of LED (Light Emitting Diode) car lamp |
| CN104747939A (en) * | 2015-03-06 | 2015-07-01 | 太仓天宇电子有限公司 | Heat radiation and light emitting diode |
| CN109099394A (en) * | 2017-06-21 | 2018-12-28 | 黑拉有限责任两合公司 | Lighting device and fixing means for vehicle |
| CN109945133A (en) * | 2016-12-30 | 2019-06-28 | 杭州光锥科技有限公司 | Projecting Lamp lens, light emitting module and Projecting Lamp |
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2005
- 2005-11-28 CN CNU2005201420336U patent/CN2896528Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295759B (en) * | 2007-11-30 | 2011-12-07 | 曹宏国 | Power type LED encapsulation base plate |
| WO2009094829A1 (en) * | 2008-01-07 | 2009-08-06 | Jie She | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly |
| WO2011050757A1 (en) * | 2009-10-28 | 2011-05-05 | Huo Jian | Led device |
| CN102074637A (en) * | 2009-11-19 | 2011-05-25 | 深圳市光峰光电技术有限公司 | Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure |
| WO2011060618A1 (en) * | 2009-11-19 | 2011-05-26 | 深圳市光峰光电技术有限公司 | Method and structure for encapsulating solid-state lighting chip and light sources using the encapsulating structure |
| CN102261574A (en) * | 2010-05-28 | 2011-11-30 | 艾迪光电（杭州）有限公司 | Light-emitting diode (LED) lamp with heat conducting piece built-in lamp shade |
| CN102943969A (en) * | 2012-11-21 | 2013-02-27 | 深圳华瀚新能源材料有限公司 | Light-emitting diode (LED) lamp using heat conduction high-polymer material for heat dissipation |
| CN103574358A (en) * | 2013-09-30 | 2014-02-12 | 达亮电子（苏州）有限公司 | Lamp structure |
| CN103769340A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Sealant pouring device of LED (Light Emitting Diode) car lamp |
| CN104747939A (en) * | 2015-03-06 | 2015-07-01 | 太仓天宇电子有限公司 | Heat radiation and light emitting diode |
| CN109945133A (en) * | 2016-12-30 | 2019-06-28 | 杭州光锥科技有限公司 | Projecting Lamp lens, light emitting module and Projecting Lamp |
| CN109099394A (en) * | 2017-06-21 | 2018-12-28 | 黑拉有限责任两合公司 | Lighting device and fixing means for vehicle |
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Owner name: CHINA TAIWAN GUANGJU ELECTRIC CO., LTD. Free format text: FORMER OWNER: LI JIAMAO Effective date: 20130313 |
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Effective date of registration: 20130313 Address after: Taiwan Xindian District, New Taipei City China Po Road 235 Lane 8 Building No. 3 Patentee after: Taiwan, China Light giant electric Limited by Share Ltd Address before: Taiwan, China Patentee before: Li Jiamao |
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