CN104747939A - Heat radiation and light emitting diode - Google Patents
Heat radiation and light emitting diode Download PDFInfo
- Publication number
- CN104747939A CN104747939A CN201510098858.0A CN201510098858A CN104747939A CN 104747939 A CN104747939 A CN 104747939A CN 201510098858 A CN201510098858 A CN 201510098858A CN 104747939 A CN104747939 A CN 104747939A
- Authority
- CN
- China
- Prior art keywords
- heat
- diode
- pedestal
- luminous diode
- dissipating luminous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
Abstract
The invention discloses a heat radiation and light emitting diode. The heat radiation and light emitting diode comprises a base, a base shell, diode bodies, a bonding lead, an LED chip and a heat radiator. The diode bodies, the bonding lead, the LED chip and the heat radiator are arranged in the base. The base shell is arranged on the upper portion of the base, the bonding lead is connected between the diode bodies, and the heat radiator is arranged on the lower portion of the LED chip. In this way, according to the heat radiation and light emitting diode, the heat radiator is added in the base, a lens is arranged in the middle of the upper portion of the base shell, heat generated by the diode can be effectively diffused out in time, the light emitting efficiency of the diode is improved, and the service life is long.
Description
Technical field
The present invention relates to the field of diode, particularly relate to a kind of heat-dissipating luminous diode.
Background technology
In prior art, diode packaging structure is generally by pedestal, light-emittingdiode chip and cover body composition.But the radiating mode of this kind of packaging structure is single, can not effectively be shed timely and effectively by the heat that light-emittingdiode produces, so cause the luminous efficiency of prior art light-emittingdiode not high, service life is short.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of heat-dissipating luminous diode, the centre position increasing radiator and base shell top in pedestal is provided with lens, effectively the heat that diode produces can be shed timely and effectively, improve the luminous efficiency of diode, long service life.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of heat-dissipating luminous diode, comprise pedestal, base shell and be positioned at the diode of pedestal, bonding wire, LED chip and radiator, described base shell is arranged on the top of pedestal, described bonding wire is connected between diode, and described radiator is arranged on the bottom of LED chip.
In a preferred embodiment of the present invention, described pedestal is provided with locating hole, described locating hole is separately positioned on four angles of pedestal.
In a preferred embodiment of the present invention, described heat-dissipating luminous diode also comprises anode pin and negative electrode pin, and described anode pin and negative electrode pin are arranged on the limit, the left and right sides of pedestal respectively.
In a preferred embodiment of the present invention, described negative electrode pin is bent structure.
In a preferred embodiment of the present invention, described heat-dissipating luminous diode also comprises lens, and described lens are arranged on the centre position on base shell top.
In a preferred embodiment of the present invention, described lens adopt transparent silicon grease material.
The invention has the beneficial effects as follows: heat-dissipating luminous diode of the present invention, the centre position increasing radiator and base shell top in pedestal is provided with lens, effectively the heat that diode produces can be shed timely and effectively, improve the luminous efficiency of diode, long service life.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a preferred embodiment of the heat-dissipating luminous diode of the present invention;
Reference numeral is as follows: 1, pedestal, and 2, base shell, 3, diode, 4, bonding wire, 5, LED chip, 6, radiator, 7, anode pin, 8, negative electrode pin, 9, lens, 11, locating hole.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
As shown in Figure 1, the embodiment of the present invention comprises:
A kind of heat-dissipating luminous diode, comprise pedestal 1, base shell 2 and be positioned at the diode 3 of pedestal 1, bonding wire 4, LED chip 5 and radiator 6, described base shell 2 is arranged on the top of pedestal 1, described bonding wire 4 is connected between diode 3, and described radiator 6 is arranged on the bottom of LED chip 5.
In above-mentioned, described pedestal 1 is provided with locating hole 11, described locating hole 11 is separately positioned on four angles of pedestal 1, by pedestal 1 and base shell 2 being fixed connection at locating hole 11 mounting screw.
Further, described heat-dissipating luminous diode also comprises anode pin 7 and negative electrode pin 8, and described anode pin 7 and negative electrode pin 8 are arranged on the limit, the left and right sides of pedestal 1 respectively.Wherein, described negative electrode pin 8 is in bent structure.
Further, described heat-dissipating luminous diode also comprises lens 9, and described lens 9 are arranged on the centre position on base shell 2 top.Wherein, described lens 9 adopt transparent silicon grease material, can effectively be shed timely and effectively by the heat that diode produces.
In sum, heat-dissipating luminous diode of the present invention, the centre position increasing radiator 6 and base shell 2 top in pedestal 1 is provided with lens 9, can effectively be shed timely and effectively by the heat that diode 3 produces, improve the luminous efficiency of diode 9, long service life.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a heat-dissipating luminous diode, it is characterized in that, comprise pedestal, base shell and be positioned at the diode of pedestal, bonding wire, LED chip and radiator, described base shell is arranged on the top of pedestal, described bonding wire is connected between diode, and described radiator is arranged on the bottom of LED chip.
2. heat-dissipating luminous diode according to claim 1, is characterized in that, described pedestal is provided with locating hole, and described locating hole is separately positioned on four angles of pedestal.
3. heat-dissipating luminous diode according to claim 1, is characterized in that, described heat-dissipating luminous diode also comprises anode pin and negative electrode pin, and described anode pin and negative electrode pin are arranged on the limit, the left and right sides of pedestal respectively.
4. heat-dissipating luminous diode according to claim 3, is characterized in that, described negative electrode pin is bent structure.
5. heat-dissipating luminous diode according to claim 1, is characterized in that, described heat-dissipating luminous diode also comprises lens, and described lens are arranged on the centre position on base shell top.
6. heat-dissipating luminous diode according to claim 5, is characterized in that, described lens adopt transparent silicon grease material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510098858.0A CN104747939A (en) | 2015-03-06 | 2015-03-06 | Heat radiation and light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510098858.0A CN104747939A (en) | 2015-03-06 | 2015-03-06 | Heat radiation and light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104747939A true CN104747939A (en) | 2015-07-01 |
Family
ID=53588033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510098858.0A Pending CN104747939A (en) | 2015-03-06 | 2015-03-06 | Heat radiation and light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104747939A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2896528Y (en) * | 2005-11-28 | 2007-05-02 | 李家茂 | High-power LED package structure |
| CN201196385Y (en) * | 2008-04-01 | 2009-02-18 | 佛山市国星光电股份有限公司 | Surface labeling LED |
| TWM381179U (en) * | 2010-01-15 | 2010-05-21 | Forward Electronics Co Ltd | LED packaging structure |
| CN201568770U (en) * | 2009-12-23 | 2010-09-01 | 严钱军 | AC LED lighting source module |
| CN102623612A (en) * | 2011-01-31 | 2012-08-01 | 科锐公司 | Package, system, and method for high luminous lED having improved resin fillings and high adhesion force |
| CN204042541U (en) * | 2014-08-29 | 2014-12-24 | 深圳市穗晶光电科技有限公司 | A kind of detachable LED lamp pearl |
| CN204420678U (en) * | 2015-03-06 | 2015-06-24 | 太仓天宇电子有限公司 | A kind of heat-dissipating luminous diode |
-
2015
- 2015-03-06 CN CN201510098858.0A patent/CN104747939A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2896528Y (en) * | 2005-11-28 | 2007-05-02 | 李家茂 | High-power LED package structure |
| CN201196385Y (en) * | 2008-04-01 | 2009-02-18 | 佛山市国星光电股份有限公司 | Surface labeling LED |
| CN201568770U (en) * | 2009-12-23 | 2010-09-01 | 严钱军 | AC LED lighting source module |
| TWM381179U (en) * | 2010-01-15 | 2010-05-21 | Forward Electronics Co Ltd | LED packaging structure |
| CN102623612A (en) * | 2011-01-31 | 2012-08-01 | 科锐公司 | Package, system, and method for high luminous lED having improved resin fillings and high adhesion force |
| CN204042541U (en) * | 2014-08-29 | 2014-12-24 | 深圳市穗晶光电科技有限公司 | A kind of detachable LED lamp pearl |
| CN204420678U (en) * | 2015-03-06 | 2015-06-24 | 太仓天宇电子有限公司 | A kind of heat-dissipating luminous diode |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150701 |