CN203395810U

CN203395810U - Light-emitting diode (LED) light source

Info

Publication number: CN203395810U
Application number: CN201320461652.6U
Authority: CN
Inventors: 曾昌景; 王峰
Original assignee: HUIZHOU FORYOU OPTOELECTRONICS TECHNOLOGY Co Ltd
Current assignee: HUIZHOU FORYOU OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date: 2013-07-30
Filing date: 2013-07-30
Publication date: 2014-01-15
Anticipated expiration: 2023-07-30

Abstract

The utility model discloses a light-emitting diode (LED) light source. The LED light source comprises a support (1), wires (2), wafers (3) and a colloid structure (4), wherein the support (1) is provided with an accommodating groove, the wires (2) and the wafers (3) are arranged in the accommodating groove, and the accommodating groove is filled with the colloid structure (4). The surface of the colloid structure (4) is a convex cambered surface, the value range of the protrusion height L of the convex cambered surface is 0.05mm-2mm, and the protrusion height L is the maximum distance from the convex cambered surface to the upper surface of the support (1).Compared with a colloid structure with the surface being a plane or a concave cambered surface, the LED light source with the colloid structure surface being the convex cambered surface effectively improves luminous flux and optimizes lighting effect.

Description

LED light source

Technical Field

The utility model relates to a lighting apparatus technical field, in particular to LED light source.

Background

An LED (Light-Emitting Diode) device is a semiconductor electronic component capable of Emitting Light, and has a wide application range.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a first LED light source in the prior art; fig. 2 is a schematic structural diagram of a second LED light source in the prior art.

As shown in fig. 1, a groove is formed in a support 01, a wafer 03 is placed on the bottom surface of the groove and electrically connected through a wire 02, a colloid structure 04 is packaged in the groove, and the surface of the colloid structure 04 is a plane.

As shown in fig. 2, a groove is formed in the support 01, the wafer 03 is placed on the bottom surface of the groove and electrically connected through a wire 02, the colloid structure 04 is packaged in the groove, and the surface of the colloid structure 04 is a concave arc surface.

With the wider application range of the LED light source, the requirements for the performance of the LED light source are also increased. The luminous flux of the current LED light source is low, so that the luminous efficiency is poor.

Therefore, how to improve the luminous flux and optimize the luminous efficiency is a problem to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a LED light source to improve its luminous flux, optimize the light efficiency.

In order to achieve the above object, the utility model provides a following technical scheme:

an LED light source comprising: the chip packaging structure comprises a bracket provided with an accommodating groove, a lead and a wafer which are arranged in the accommodating groove, and a colloid structure filled in the accommodating groove;

the surface of the colloid structure is a convex cambered surface, and the value range of the convex height L of the convex cambered surface is 0.05 mm-2 mm; the height L of the protrusion is the maximum distance from the convex arc surface to the upper surface of the bracket.

Preferably, in the LED light source, the radian of the convex arc surface is 0.06 pi to pi.

Preferably, in the LED light source, the wire is a gold wire.

Preferably, in the LED light source, the number of the chips is plural.

Preferably, in the LED light source, the plurality of wafers are uniformly distributed on the bottom surface of the accommodating groove.

Preferably, in the LED light source, the wire connects a plurality of the chips in series.

According to the above technical scheme, the utility model provides a surface of colloid structure is the LED light source of convex cambered surface, compares for plane or concave cambered surface with the surface of colloid structure among the prior art, has improved its luminous flux effectively, has optimized the light efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of a first LED light source in the prior art;

FIG. 2 is a schematic diagram of a second LED light source of the prior art;

fig. 3 is a schematic structural diagram of an LED light source provided by an embodiment of the present invention.

Wherein,

a support-01, a lead-02, a wafer-03, a colloid structure-04,

a support-1, a lead-2, a wafer-3 and a colloid structure-4.

Detailed Description

The utility model discloses a LED light source to improve its luminous flux, optimize the light efficiency.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an LED light source according to an embodiment of the present invention.

As shown in fig. 3, an embodiment of the present invention provides an LED light source, including: the chip packaging structure comprises a bracket 1 provided with an accommodating groove, a lead 2 and a wafer 3 which are arranged in the accommodating groove, and a colloid structure 4 filled in the accommodating groove; the side of the colloid structure 4 far away from the bracket 1 is a convex cambered surface, and the value range of the convex height L of the convex cambered surface is 0.05 mm-2 mm; the height L of the bulge is the maximum distance from the convex cambered surface to the upper surface of the bracket 1.

The embodiment of the utility model provides a colloid structure 4's surface is the LED light source of convex cambered surface, compares for plane or concave cambered surface with among the prior art colloid structure's surface, has improved its luminous flux effectively, has optimized the light efficiency.

For the specific parameters, refer to the following table.

Table 1 experimental data for different colloidal structures

Compared with the LED light source in the prior art, the LED light source provided by this embodiment is: the light flux of the colloid structure on the surface of the convex cambered surface is higher than that of the colloid structure on the surface of the plane and that of the colloid structure on the surface of the concave cambered surface, and the light efficiency is optimized.

Because the support of the LED light source is smaller, the distance from the highest point of the convex cambered surface to the upper surface of the support 1 is set to be 0.05-2 mm. The light effect is improved, and meanwhile, the mutual interference between the colloid structure and the outside is avoided.

Furthermore, the radian of the convex cambered surface is 0.06 pi-pi.

Preferably, the wire 2 is a gold wire. In order to improve the conductive effect of the wires 2 on the wafer 3 and save the cost, the wires 2 may be silver wires, and the materials of the wires 2 are not particularly limited and are within the protection range.

As shown in fig. 3, the number of wafers 3 is plural in order to improve the illumination effect.

The preferred quantity of wafer 3 of the embodiment of the utility model is 10, and the distance between the wafer 3 of the lateral wall that is close to the holding tank and the lateral wall of holding tank equals with the distance between two adjacent wafers 3.

It may also be provided as a single chip 3, such as an SMD LED (Surface Mount Device lighting Diode) or the like.

Furthermore, a plurality of wafers 3 are uniformly distributed on the bottom surface of the accommodating groove. So that make the utility model discloses the light-emitting of the LED light source that the embodiment provided is even.

A plurality of wafers 3 are connected in series through the wires 2 and are arranged in the accommodating groove, and then the encapsulating operation is completed through filling the accommodating groove with the colloid structure 4. Through be one with the quantity of wire 2 and with a plurality of wafers 3 concatenations, be convenient for the utility model discloses the assembly of the LED light source that the embodiment provided to, production efficiency has been improved effectively.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An LED light source comprising: the chip packaging structure comprises a bracket (1) provided with an accommodating groove, a lead (2) and a wafer (3) which are arranged in the accommodating groove, and a colloid structure (4) filled in the accommodating groove; it is characterized in that the preparation method is characterized in that,

the surface of the colloid structure (4) is a convex cambered surface, and the value range of the convex height L of the convex cambered surface is 0.05-2 mm; the height L of the protrusion is the maximum distance from the convex arc surface to the upper surface of the bracket (1).

2. The LED light source of claim 1 wherein the arc of the convex arc is from 0.06 pi to pi.

3. LED light source according to claim 1, characterized in that the wires (2) are gold wires.

4. LED light source according to claim 1, characterized in that the number of the chips (3) is plural.

5. The LED light source as claimed in claim 4, characterized in that a plurality of said wafers (3) are evenly distributed on the bottom surface of said receiving groove.

6. LED light source as claimed in claim 5, characterized in that said wire (2) connects a plurality of said dies (3) in series.