CN205320365U - LED inverts circuit board - Google Patents
LED inverts circuit board Download PDFInfo
- Publication number
- CN205320365U CN205320365U CN201521121260.0U CN201521121260U CN205320365U CN 205320365 U CN205320365 U CN 205320365U CN 201521121260 U CN201521121260 U CN 201521121260U CN 205320365 U CN205320365 U CN 205320365U
- Authority
- CN
- China
- Prior art keywords
- plastic frame
- frame body
- base plate
- pad
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a LED inverts circuit board, including the metal soleplate and the plastic frame body, this metal soleplate's surface is provided with circuit pad, positive bonding pad and negative electrode bonding pad, is provided with the locating hole on this metal soleplate, the shaping is inlayed on metal soleplate's surface to this plastic frame body, and the plastic frame body has a holding chamber, and the circuit pad is arranged in the holding chamber, and it is external that positive bonding pad and negative electrode bonding pad are located plastic frame. Inlay the surface of shaping at metal soleplate through utilizing the plastic frame body, need not to weld, the concatenation with the process such as punch, the processing procedure of effective product of simplifying, increase production efficiency, and reduction cost of manufacture, it is more miniaturized to make the product volume, the plastic frame body is wideer simultaneously, can play better spotlight effect, product performance is better, furthermore, through being provided with the circuit pad that is used for welding face down chip, make this product can adopt face down chip, avoid appearing the crowded phenomenon of electric current, and reduction thermal resistance, and the radiating effect is good, can lead to the heavy current uses.
Description
Technical field
The utility model relates to LED field technology, refers in particular to a kind of LED upside-down mounting wiring board.
Background technology
In LED Application Areas, LED module, because of features such as its super brightness, low-power consumption, long service life, installation simplicity, is widely used in the places such as advertising lamp box, mark signboard, publicity Warning Mark. Along with the maturation gradually of LED module technology, its range of application will be more extensive.
In LED module, most Chang Shiyong's is exactly COB encapsulation, current COB-LED convex surface light source needs to carry out to weld in an assembling process, splice and the operation such as punching, consuming time, and cost height, small product size is also big, and in addition, it adopts current COB-LED convex surface light source is positive cartridge chip, current crowding phenomenon easily occurs, and thermal resistance is higher.
Practical novel content
In view of this, the utility model is for the disappearance of prior art existence, its main purpose is to provide a kind of LED upside-down mounting wiring board, and it can effectively solve, and existing LED-COB convex surface light source making is consuming time, cost height, volume greatly and the problem that current crowding phenomenon, thermal resistance are higher easily occur.
For achieving the above object, the utility model adopts following technical scheme:
A kind of LED upside-down mounting wiring board, includes metal base plate and plastic frame body; The surface of this metal base plate is provided with the line pad for welding flip-chip and for the positive terminal pad of welding source and the equal connection line pad of negative terminal pad, positive terminal pad and negative terminal pad, this metal base plate is provided with pilot hole; This plastic frame body produced by insert molding is on the surface of metal base plate, and plastic frame body has the accommodating cavity of an accommodation flip-chip, and line pad is arranged in accommodating cavity, and positive terminal pad and negative terminal pad are positioned at outside plastic frame body.
Preferably, described metal base plate is copper material or aluminium matter.
Preferably, described metal base plate is square.
Preferably, described plastic frame body is square.
Preferably, described pilot hole is multiple, and multiple pilot hole is evenly distributed on around line pad.
Preferably, the periphery of described metal base plate is provided with multiple fixed orifices.
Preferably, the inner side-wall of described accommodating cavity is spination.
The utility model compared with prior art has obvious advantage and useful effect, specifically, as shown from the above technical solution:
By utilizing plastic frame body produced by insert molding on the surface of metal base plate, without the need to carrying out welding, splice and the operation such as punching, the processing procedure of the product effectively simplified, improve production efficiency, and reduce cost of manufacture, making small product size more miniaturization, plastic frame body is wider simultaneously, can play better optically focused effect, product use properties is better, in addition, by being provided with the line pad for welding flip-chip so that this product can adopt flip-chip, avoid that current crowding phenomenon occurs, and reduce thermal resistance, good heat dissipation effect, big current can be led to and use.
For more clearly setting forth constitutional features of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the side-view of the better embodiment of the utility model;
Fig. 2 be the utility model better embodiment in the front view of base plate.
Accompanying drawing identifier declaration:
10, metal base plate 11, pilot hole
12, fixed orifices 20, plastic frame body
21, accommodating cavity 31, line pad
32, positive terminal pad 33, negative terminal pad.
Embodiment
Please refer to shown in Fig. 1 and Fig. 2, that show the concrete structure of the better embodiment of the utility model, include metal base plate 10 and plastic frame body 20.
The surface of this metal base plate 10 is provided with the line pad 31 for welding flip-chip and for the positive terminal pad 32 of welding source and negative terminal pad 33, positive terminal pad 32 and negative terminal pad 33 all connection line pads 31, this metal base plate 10 is provided with pilot hole 11; This metal base plate 10 is for playing thermolysis, in the present embodiment, described metal base plate 10 is copper material or aluminium matter, described metal base plate 10 is square, described pilot hole 11 is multiple, multiple pilot hole 11 is evenly distributed on line pad 31 around, and, the periphery of described metal base plate 10 is provided with multiple fixed orifices 12.
This plastic frame body 20 produced by insert molding is on the surface of metal base plate 10, and plastic frame body 20 has the accommodating cavity 21 of an accommodation flip-chip, and line pad 31 is arranged in accommodating cavity 21, and positive terminal pad 32 and negative terminal pad 33 are positioned at outside plastic frame body 20. In the present embodiment, described plastic frame body 20 is square. And, the inner side-wall of described accommodating cavity 21 is spination, sawtooth is of a size of: long 0.65x width 1.0mm, to increase fluorescent glue bonding force, further, each corner in accommodating cavity 21 be the fillet that falls of 1.0mm, accommodating cavity 21 angle that relatively side is opened each other is 60 °, to form optically focused shape, increase light effect.
Design focal point of the present utility model is: by utilizing plastic frame body produced by insert molding on the surface of metal base plate, without the need to welding, the operations such as splicing and punching, the processing procedure of the product effectively simplified, improve production efficiency, and reduce cost of manufacture, make small product size more miniaturization, plastic frame body is wider simultaneously, better optically focused effect can be played, product use properties is better, in addition, by being provided with the line pad for welding flip-chip, make this product can adopt flip-chip, avoid that current crowding phenomenon occurs, and reduce thermal resistance, good heat dissipation effect, big current can be led to use.
Below know-why of the present utility model is described in conjunction with specific embodiments.These describe just in order to explain principle of the present utility model, and can not be interpreted as the restriction to the utility model protection domain by any way. Based on explanation herein, the technician of this area does not need to pay creative work can associate other embodiment of the present utility model, and these modes all will fall within protection domain of the present utility model.
Claims (7)
1. a LED upside-down mounting wiring board, it is characterised in that: include metal base plate and plastic frame body; The surface of this metal base plate is provided with the line pad for welding flip-chip and for the positive terminal pad of welding source and the equal connection line pad of negative terminal pad, positive terminal pad and negative terminal pad, this metal base plate is provided with pilot hole; This plastic frame body produced by insert molding is on the surface of metal base plate, and plastic frame body has the accommodating cavity of an accommodation flip-chip, and line pad is arranged in accommodating cavity, and positive terminal pad and negative terminal pad are positioned at outside plastic frame body.
2. LED upside-down mounting wiring board as claimed in claim 1, it is characterised in that: described metal base plate is copper material or aluminium matter.
3. LED upside-down mounting wiring board as claimed in claim 1, it is characterised in that: described metal base plate is square.
4. LED upside-down mounting wiring board as claimed in claim 1, it is characterised in that: described plastic frame body is square.
5. LED upside-down mounting wiring board as claimed in claim 1, it is characterised in that: described pilot hole is multiple, and multiple pilot hole is evenly distributed on around line pad.
6. LED upside-down mounting wiring board as claimed in claim 1, it is characterised in that: the periphery of described metal base plate is provided with multiple fixed orifices.
7. LED upside-down mounting wiring board as claimed in claim 1, it is characterised in that: the inner side-wall of described accommodating cavity is spination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521121260.0U CN205320365U (en) | 2015-12-31 | 2015-12-31 | LED inverts circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521121260.0U CN205320365U (en) | 2015-12-31 | 2015-12-31 | LED inverts circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205320365U true CN205320365U (en) | 2016-06-15 |
Family
ID=56199581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521121260.0U Expired - Fee Related CN205320365U (en) | 2015-12-31 | 2015-12-31 | LED inverts circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205320365U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021077328A1 (en) * | 2019-10-23 | 2021-04-29 | 瑞仪(广州)光电子器件有限公司 | Backlight module and display device |
-
2015
- 2015-12-31 CN CN201521121260.0U patent/CN205320365U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021077328A1 (en) * | 2019-10-23 | 2021-04-29 | 瑞仪(广州)光电子器件有限公司 | Backlight module and display device |
| CN113168048A (en) * | 2019-10-23 | 2021-07-23 | 瑞仪(广州)光电子器件有限公司 | Backlight module and display device |
| US11320583B2 (en) | 2019-10-23 | 2022-05-03 | Radiant(Guangzhou) Opto-Electronics Co, Ltd | Backlight module and display device |
| CN113168048B (en) * | 2019-10-23 | 2023-08-25 | 瑞仪(广州)光电子器件有限公司 | Backlight module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ren Longfei Inventor before: Ren Longfei Inventor before: Yin Jianjun |
|
| COR | Change of bibliographic data | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160615 Termination date: 20161231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |