CN208889702U - A kind of adopting surface mounted LED light emitting diode - Google Patents
A kind of adopting surface mounted LED light emitting diode Download PDFInfo
- Publication number
- CN208889702U CN208889702U CN201821429886.1U CN201821429886U CN208889702U CN 208889702 U CN208889702 U CN 208889702U CN 201821429886 U CN201821429886 U CN 201821429886U CN 208889702 U CN208889702 U CN 208889702U
- Authority
- CN
- China
- Prior art keywords
- led chip
- substrate
- light emitting
- lens
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000005266 casting Methods 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of adopting surface mounted LED light emitting diodes, including substrate, the upper end of the substrate is fixedly connected with cooling pad, and the upper end fitting of cooling pad is equipped with LED chip, the upper end of the substrate and be located at LED chip outside be provided with lens, and casting glue is filled between lens and LED chip, the upper end of the substrate and be located at lens outer wall be packaged with transparent epoxy resin glue, the two sides of the bottom of the substrate are symmetrically arranged with mounting groove, and agrees in mounting groove and have conductive sheet, connecting line is electrically connected between the conductive sheet and the bottom wall of LED chip, the bottom of the conductive sheet is provided with pad.The utility model structure is simple, easy to operate, and weld job is more convenient, and uniformity is more preferable, while LED operation is more stable, extends service life, is suitable for being widely popularized.
Description
Technical field
The utility model relates to technical field of electronic devices more particularly to a kind of adopting surface mounted LED light emitting diodes.
Background technique
Existing LED light emitting diode is direct insertion LED, and when installation needs to carry out its pin (PIN foot) bending, cuts
The processing such as foot, in above-mentioned treatment process PIN foot be easily deformed, deviation, influence that the circuit board of LED light emitting diode is installed
Overall effect.LED light emitting diode on the market can only be used as plug-in unit class product and use simultaneously, can not carry out SMT attachment and make
Industry, while traditional direct insertion LED light emitting diode stability is poor, service life is shorter.
Utility model content
In order to solve the problems, such as to mention in above-mentioned background technique, the utility model provides a kind of adopting surface mounted LED light-emitting diodes
Pipe.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of adopting surface mounted LED light emitting diode, including substrate, the upper end of the substrate is fixedly connected with cooling pad, and dissipates
The upper end fitting of heat pad is equipped with LED chip, and the upper end of the substrate and the outside for being located at LED chip are provided with lens, and thoroughly
Transparent epoxy resin is packaged with filled with casting glue, the upper end of the substrate and the outer wall for being located at lens between mirror and LED chip
Glue, the two sides of the bottom of the substrate are symmetrically arranged with mounting groove, and agree in mounting groove and have conductive sheet, the conductive sheet and LED core
Connecting line is electrically connected between the bottom wall of piece, the bottom of the conductive sheet is provided with pad.
Preferably, the LED chip is fitted and connected by adhesive and cooling pad.
Preferably, the upper surface of the LED chip is equipped with one layer of fluorescence coating.
Preferably, the pad is made of metallic copper or tin.
Compared with prior art, the utility model has the beneficial effects that in use, only needing pad being welded in PCB
On welding post on plate, so that the welding of paster type light emitting type is realized, simultaneously because the bottom of LED chip is provided with
Cooling pad has certain heat dissipation effect, so that LED operation is more stable, and the upper surface of LED chip is equipped with one
Layer fluorescence coating can increase LED chip light emission luminance, and the upper end of substrate and the outside for being located at LED chip are provided with lens, and thoroughly
It is filled with casting glue between mirror and LED chip, multiple protective is carried out to LED chip, sealing performance is ensure that, makes its work more
Stablize, extends service life.To sum up, the utility model structure is simple, easy to operate, and weld job is more convenient, neatly
Degree is more preferable, while LED operation is more stable, extends service life, is suitable for being widely popularized.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
In figure: substrate 1, LED chip 3, fluorescence coating 4, lens 5, casting glue 6, transparent epoxy resin glue 7, connects cooling pad 2
Wiring 8, conductive sheet 9, pad 10.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1, a kind of adopting surface mounted LED light emitting diode, including substrate 1, the upper end of substrate 1 are fixedly connected with cooling pad
2, and the upper end fitting of cooling pad 2 is equipped with LED chip 3, LED chip 3 is fitted and connected by adhesive with cooling pad 2, substrate 1
Upper end and be located at LED chip 3 outside be provided with lens 5, and between lens 5 and LED chip 3 be filled with casting glue 6, substrate
1 upper end and the outer wall for being located at lens 5 are packaged with transparent epoxy resin glue 7, and the upper surface of LED chip 3 is equipped with one layer of fluorescence coating
4,3 light emission luminance of LED chip can be increased, the two sides of the bottom of substrate 1 are symmetrically arranged with mounting groove, and agree in mounting groove and lead
Electric piece 9, is electrically connected with connecting line 8 between conductive sheet 9 and the bottom wall of LED chip 3, the bottom of conductive sheet 9 is provided with pad
10, pad 10 is made of metallic copper or tin, pad 10 is welded on the welding post on pcb board, to realize patch
The welding of flat type LED.
Working principle: in the utility model, in use, the welding post for only needing to be welded in pad 10 on pcb board
On, to realize the welding of paster type light emitting type, and height is consistent, uniformity is more preferable, simultaneously because the bottom of LED chip 3
Portion is provided with cooling pad 2, has certain heat dissipation effect, so that LED operation is more stable, and LED chip 3 is upper
End face is equipped with one layer of fluorescence coating 4, can increase by 3 light emission luminance of LED chip, the upper end of substrate 1 and the outside for being located at LED chip 3
Lens 5 are provided with, and are filled with casting glue 6 between lens 5 and LED chip 3, multiple protective is carried out to LED chip 3, ensure that
Sealing performance keeps its work more stable, extends service life.
More than, the only preferable specific embodiment of the utility model, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, according to the utility model
Technical solution and its utility model design be subject to equivalent substitution or change, should all cover the protection scope of the utility model it
It is interior.
Claims (4)
1. a kind of adopting surface mounted LED light emitting diode, including substrate (1), it is characterised in that: the upper end of the substrate (1) is fixed to be connected
It is connected to cooling pad (2), and the upper end fitting of cooling pad (2) is equipped with LED chip (3), the upper end of the substrate (1) and is located at
The outside of LED chip (3) is provided with lens (5), and is filled with casting glue (6) between lens (5) and LED chip (3), the base
The upper end of plate (1) and be located at lens (5) outer wall be packaged with transparent epoxy resin glue (7), the two sides of the bottom pair of the substrate (1)
Claim to be equipped with mounting groove, and agrees in mounting groove and have conductive sheet (9), electricity between the conductive sheet (9) and the bottom wall of LED chip (3)
Property is connected with connecting line (8), and the bottom of the conductive sheet (9) is provided with pad (10).
2. a kind of adopting surface mounted LED light emitting diode according to claim 1, it is characterised in that: the LED chip (3) is logical
Adhesive is crossed to be fitted and connected with cooling pad (2).
3. a kind of adopting surface mounted LED light emitting diode according to claim 1, it is characterised in that: the LED chip (3)
Upper surface is equipped with one layer of fluorescence coating (4).
4. a kind of adopting surface mounted LED light emitting diode according to claim 1, it is characterised in that: the pad (10) is adopted
It is made of metallic copper or tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821429886.1U CN208889702U (en) | 2018-09-03 | 2018-09-03 | A kind of adopting surface mounted LED light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821429886.1U CN208889702U (en) | 2018-09-03 | 2018-09-03 | A kind of adopting surface mounted LED light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208889702U true CN208889702U (en) | 2019-05-21 |
Family
ID=66510904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821429886.1U Expired - Fee Related CN208889702U (en) | 2018-09-03 | 2018-09-03 | A kind of adopting surface mounted LED light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208889702U (en) |
-
2018
- 2018-09-03 CN CN201821429886.1U patent/CN208889702U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190521 |