CN201146196Y - Encapsulation structure of LED - Google Patents
Encapsulation structure of LED Download PDFInfo
- Publication number
- CN201146196Y CN201146196Y CNU2007203094294U CN200720309429U CN201146196Y CN 201146196 Y CN201146196 Y CN 201146196Y CN U2007203094294 U CNU2007203094294 U CN U2007203094294U CN 200720309429 U CN200720309429 U CN 200720309429U CN 201146196 Y CN201146196 Y CN 201146196Y
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- substrate
- light
- emitting diode
- encapsulating structure
- conductive pad
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Abstract
An LED packaging structure comprises a baseplate, a flute, a conductive mat and a conductive embolism. The flute is arranged at one end of the baseplate for containing an LED chip; the conductive mat is arranged on the surface of the baseplate and electrically connected with the bottom of the flute; the other end of the baseplate is the conductive embolism that runs through the baseplate and electrically isolates the flute and the conductive mat; wherein, when the LED chip is arranged in the flute, the two electrodes of the LED chip are respectively and electrically connected with the bottom of the conductive embolism and the flute.
Description
Technical field
The utility model relates to a kind of light-emitting diode, and particularly relevant for a kind of encapsulating structure of light-emitting diode.
Background technology
Light-emitting diode is a kind of environmental protection lighting light source of energy savings, and it has possessed characteristics such as high-durability, the life-span is long, light and handy, power consumption is low, is a highly desirable New Times lighting source.Especially under the surging gradually situation of present energy expenditure, light-emitting diode more is subjected to the attention and the utilization of industrial circle, so as to replacing other bigger luminescent devices of power consumption in the past.In addition, light-emitting diode is of a great variety, of many uses, becomes important tool indispensable in the modern life already.
The main purpose of LED package is to guarantee correctly to connect between light-emitting diode chip for backlight unit and the encapsulating structure and electrically contact, and is not subjected to machinery, heat, humidity and other all external shocks by encapsulating structure protection chip.Because light-emitting diode is mainly used in illumination,,, be the important topic in the LED package to improve visual effect so how this promotes its brightness and uniformity luminous or projection effectively when encapsulation.
The utility model content
The utility model is to provide a kind of encapsulating structure of light-emitting diode on the one hand, and it comprises substrate, groove, conductive pad and conductive plug.The material of substrate is a megohmite insulant, and at an end of substrate with radium-shine formation groove, in order to hold light-emitting diode chip for backlight unit.The inwall of groove has a metal level, to reflect the light that light-emitting diode chip for backlight unit sends.Conductive pad is positioned on the surface of substrate, electrically connects the bottom of groove, and its material comprises metal.The other end of substrate is a conductive plug, and conductive plug runs through substrate, and electrically isolates from groove and conductive pad.Wherein, when light-emitting diode chip for backlight unit was positioned in the groove, two electrodes of light-emitting diode chip for backlight unit were electrically connected to the bottom of conductive plug and groove respectively.
By the light of the metal layer reflection light-emitting diode in the groove, and promote whole luminosity.In addition, owing to light-emitting diode is accommodated in the groove, so the thickness of encapsulating structure is reduced.
The utility model is to provide a kind of encapsulating structure of light-emitting diode on the other hand, and it comprises substrate, through hole, conductive pad and conductive plug.Through hole is positioned at an end of substrate, and runs through substrate.On the inwall of through hole, electroplate the last layer metal level.Conductive pad is positioned on the surface of substrate, covers the opening of through hole.Conductive plug is positioned at the other end of substrate, and runs through substrate, and electrically isolates from conductive pad.Wherein, light-emitting diode chip for backlight unit is placed in the space that is surrounded by through hole and conductive pad, and two electrodes of light-emitting diode chip for backlight unit are electrically connected to conductive plug and conductive pad respectively.
According to the above, the present invention is by plating the layer of metal layer at the through hole inwall, the light that sends with the reflection light-emitting diode, and make whole lighting efficiency better.
The beneficial effects of the utility model are, hold light-emitting diode chip for backlight unit by groove or through hole, to dwindle the thickness of encapsulating structure.And, by the light of the metal layer reflection light-emitting diode on groove or the through hole inwall, and promote luminosity.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, and provides further explanation the utility model.But conduct is not to qualification of the present utility model.
Description of drawings
For above-mentioned and other purpose of the utility model, feature, advantage and embodiment can be become apparent, being described in detail as follows of appended accompanying drawing:
Figure 1A is depicted as the stereogram according to the encapsulating structure of the light-emitting diode of an embodiment of the present utility model;
Figure 1B is depicted as the profile according to AA ' line among Figure 1A;
Figure 2 shows that profile according to the encapsulating structure of the light-emitting diode of another embodiment of the present utility model.
Wherein, Reference numeral:
100: encapsulating structure 110: substrate
112: surface 114: surface
120: groove 130: conductive pad
140: conductive plug 150: through hole
152: opening 154: opening
160: space 170: metal level
200: light-emitting diode chip for backlight unit 202: electrode
204: electrode
Embodiment
In order to make narration of the present utility model more detailed and complete, but conjunction with figs. with reference to following various embodiment, the identical assembly of duplicate numbers representative in the icon.On the other hand, well-known circuit unit is not described among the embodiment, with the restriction of avoiding causing the utility model unnecessary.
For the whole lighting efficiency that makes the led lighting assembly better, among the embodiment of the present utility model, by on substrate, producing a groove, to hold light-emitting diode, the groove inwall plates the reflectivity of layer of metal layer with the increase groove, and makes whole lighting efficiency better.
Please refer to Figure 1A and Figure 1B.Figure 1A is depicted as the stereogram according to the encapsulating structure 100 of the light-emitting diode of present embodiment, and Figure 1B is depicted as the profile according to AA ' line among Figure 1A.One substrate 110, a groove 120, a conductive pad 130 and a conductive plug 140 are arranged in the encapsulating structure 100, be described as follows in regular turn.
The material of the substrate 110 of encapsulating structure 100 is megohmite insulants, and it comprises acid amides triazine resin (Bismaleimide-Triazine; BT).One end of substrate 110 is with radium-shine formation one groove 120, so that light-emitting diode chip for backlight unit 200 is contained in wherein.Because light-emitting diode chip for backlight unit 200 is to be fixed in the groove 120, but not is fixed on the substrate 110, so the thickness of encapsulating structure 100 is descended.
In the present embodiment, plate layer of metal in the mode of electroplating on the inwall of groove 120, and form metal level 170.The reflection coefficient height of metal, so metal level 170 can reflect the light that light-emitting diode sends, to improve luminosity.And because the thermal conductivity of metal is good, so metal level 170 can shed the heat that light-emitting diode chip for backlight unit 200 is sent rapidly.The material of metal level 170 can be metals such as copper, nickel or silver, is good with silver wherein.
One conductive pad 130 is arranged on the surface 112 of substrate 110, electrically connect the bottom of groove 120, be used for electrically connecting power supply circuit (not illustrating).When light-emitting diode chip for backlight unit 200 was fixed in the groove 120, an electrode 202 of light-emitting diode chip for backlight unit 200 electrically connected the bottom of groove 120, and was electrically connected to power supply circuit by conductive pad 130.Simultaneously, the heat sent of light-emitting diode chip for backlight unit 200 also can see through conductive pad 130 and spread out of.Hence one can see that, and the material of conductive pad 130 is good with conductivity and the high metal of thermal conductivity, for example copper, nickel and silver.In the present embodiment, conductive pad 130 is made of three-layer metal, and its material is respectively copper, nickel and silver.
The other end of substrate 110 has a conductive plug 140, and conductive plug 140 vertically runs through whole base plate 110, also electrically connects power supply circuit, and electrically isolated with conductive pad 130 and groove 120.Another electrode 204 of light-emitting diode chip for backlight unit 200 electrically connects conductive plug 140, and is electrically connected to power supply circuit.The material of conductive plug 140 is a conductive materials, for example metal or polysilicons such as copper, nickel or silver.In the present embodiment, conductive plug is made of three-layer metal, and this three-layer metal is respectively copper, nickel and silver.
In the present embodiment, hold light-emitting diode chip for backlight unit 200 with a groove 120.In another embodiment, then on substrate 110, form a hole of running through substrate 110, hold light-emitting diode chip for backlight unit 200 with radium-shine.
Please refer to Fig. 2, it is depicted as the profile according to the encapsulating structure 100 of another embodiment of the utility model.In this embodiment, with radium-shine punching, form a through hole 150 that vertically runs through substrate 110 at an end of substrate 110, its opening 152 and opening 154 respectively the position on the surface 112 and surface 114 of substrate 110.
Similarly, present embodiment also has a metal level 170, around the inwall of through hole 150, with the reflection light that light-emitting diode was sent, improves luminosity.The material of metal level 170 can be metals such as copper, nickel or silver, is good with silver wherein.
By two embodiment of above-mentioned the utility model as can be known, use encapsulating structure of the present utility model, hold light-emitting diode chip for backlight unit, to dwindle the thickness of encapsulating structure by groove or through hole.And, by the light of the metal layer reflection light-emitting diode on groove or the through hole inwall, and promote luminosity.
The utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (10)
1. the encapsulating structure of a light-emitting diode is characterized in that, comprises:
One substrate, the material of this substrate are megohmite insulant;
One groove is positioned at an end of this substrate, to hold a light-emitting diode chip for backlight unit;
One metal level is positioned at the inwall of this groove, to reflect the light that this light-emitting diode chip for backlight unit sends;
One conductive pad is positioned on the surface of this substrate, electrically connects the bottom of this groove, and the material of this conductive pad comprises metal; And
One conductive plug is positioned at the other end of this substrate, with respect to this groove, and runs through this substrate, and electrically isolates from this conductive pad and this groove;
Wherein, two electrodes of this light-emitting diode chip for backlight unit are electrically connected to the bottom of this conductive plug and this groove respectively.
2. encapsulating structure according to claim 1 is characterized in that, the material of this metal level is a silver.
3. encapsulating structure according to claim 1 is characterized in that the material of this conductive pad comprises copper, nickel and silver.
4. encapsulating structure according to claim 1 is characterized in that, the material of this conductive plug is a metal.
5. encapsulating structure according to claim 4 is characterized in that the material of this conductive plug comprises copper, nickel and silver.
6. encapsulating structure according to claim 1 is characterized in that, the material of this substrate comprises acid amides triazine resin.
7. the encapsulating structure of a light-emitting diode is characterized in that, comprises:
One substrate, the material of this substrate are megohmite insulant;
One through hole is positioned at an end of this substrate, runs through this substrate;
One metal level is around the inwall of this through hole;
One conductive pad is positioned on the surface of this substrate, covers an opening of this through hole, and the material of this conductive pad comprises metal, and wherein a light-emitting diode chip for backlight unit is positioned in the space that this through hole and this conductive pad surrounded; And
One conductive plug is positioned at the other end of this substrate, and with respect to this through hole, and this conductive plug runs through this substrate, and electrically isolates from this conductive pad;
Wherein, two electrodes of this light-emitting diode chip for backlight unit are electrically connected to this conductive plug and this conductive pad respectively.
8. encapsulating structure according to claim 7 is characterized in that, the material of this metal level is a silver.
9. encapsulating structure according to claim 7 is characterized in that the material of this conductive pad comprises copper, nickel and silver.
10. encapsulating structure according to claim 7 is characterized in that the material of this conductive plug comprises copper, nickel and silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203094294U CN201146196Y (en) | 2007-12-21 | 2007-12-21 | Encapsulation structure of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203094294U CN201146196Y (en) | 2007-12-21 | 2007-12-21 | Encapsulation structure of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201146196Y true CN201146196Y (en) | 2008-11-05 |
Family
ID=40083081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007203094294U Expired - Fee Related CN201146196Y (en) | 2007-12-21 | 2007-12-21 | Encapsulation structure of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201146196Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711133A (en) * | 2017-01-09 | 2017-05-24 | 丽智电子(昆山)有限公司 | SOT-23 (Small Outline Transistor-23) surface mount device packaging structure |
-
2007
- 2007-12-21 CN CNU2007203094294U patent/CN201146196Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106711133A (en) * | 2017-01-09 | 2017-05-24 | 丽智电子(昆山)有限公司 | SOT-23 (Small Outline Transistor-23) surface mount device packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081105 Termination date: 20101221 |