CN205810809U - The encapsulating structure of LED - Google Patents
The encapsulating structure of LED Download PDFInfo
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- CN205810809U CN205810809U CN201620660529.0U CN201620660529U CN205810809U CN 205810809 U CN205810809 U CN 205810809U CN 201620660529 U CN201620660529 U CN 201620660529U CN 205810809 U CN205810809 U CN 205810809U
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- led
- several
- wafer
- moistureproof
- encapsulating structure
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Abstract
The encapsulating structure of a kind of LED, including housing, lead frame, several LED wafer and encapsulation glue, housing is provided with opening；Wire erection is in housing, and to which is provided with several be regularly arranged wafer fixed area；Several LED wafer are divided on several wafer fixed areas；Encapsulation glue is located on housing, and several LED wafer hermetically sealed.It is regularly arranged wafer fixed area owing to lead frame is provided with several, except beneficially punch process, ensure the stability of product, also can make to encapsulate glue in time encapsulating several LED wafer of glue package uniformly to flow on each wafer fixed area, ensure that several LED wafer being located on several wafer fixed areas can be sealed encapsulation with this, improve the overall moisture-resistance reliability of the encapsulating structure of LED, simultaneously, may also be advantageous for reducing the use of encapsulation glue, reduce the production cost of enterprise.
Description
Technical field
This utility model relates to the technical field of light fixture, particularly relates to the encapsulating structure of a kind of LED.
Background technology
LED (Light Emitting Diode) is the semiconductor device of a kind of solid-state, and it can be direct
Electricity is converted into light.Understandably, light emitting diode, for using electroluminescence, that it changes the luminescence of electric filament lamp tungsten filament and electricity-saving lamp
The principle that tricolor powder is luminous.And, clearly, life-span length, light efficiency be high, radiationless and low-power consumption for the feature of LED.
The spectrum almost all of LED concentrates on visible light frequency band.LED light source may utilize the red, green, blue principle of three primary colours,
Computer technology makes three kinds of colors have 256 grades of gray scales and arbitrarily mix under controlling, and can produce 256 × 256 × 256=
16777216 kinds of colors, form different photochromic combination and variation multiterminal, it is achieved colourful dynamic variation effect and various figure
Picture.
In view of the intrinsic advantage of LED, at present, it is widely applied on display screen market.But, current LED shows
There is the problem that moisture-resistance reliability is poor in screen encapsulating structure, often runs into heavy rain weather, and those are arranged on the LED display of open air
The easily lethal lamp phenomenon because of watered and wetting；Simultaneously, current LED display encapsulating structure uses more marine glue mostly
Water, to ensure the hermetically sealed of product, can use waterproof glue too much, not only can increase product cost, cause product price relatively
Height, also can reduce product competitiveness.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Utility model content
The purpose of this utility model is to overcome the defect of prior art, it is provided that the encapsulating structure of LED, existing to solve
LED display encapsulating structure in technology exists that moisture-resistance reliability glue poor, waterproof uses more and to cause production cost higher
Problem.
This utility model is achieved in that the encapsulating structure of LED, including:
Housing, described housing is provided with and is available for parts and enters its internal opening；
Lead frame, described wire erection in described housing, and described lead frame to be provided with several be regularly arranged
Wafer fixed area；
Several LED wafer, several described LED wafer are divided on several described wafer fixed areas；
Encapsulation glue, described encapsulation glue is located on described housing, and several described LED wafer hermetically sealed.
Specifically, several described wafer fixed area rectangular array are arranged.
Specifically, described lead frame is additionally provided with the pin for the pin connection of several described LED wafer is fixing to fix
It is provided with between district, and described pin fixed area and described wafer fixed area in order to moistureproof moisture-proof construction.
Further, described moisture-proof construction includes that a moistureproof step, described moistureproof step include the first moistureproof plane and phase
For the described first moistureproof moistureproof plane of plane upwardly extending second, described pin fixed area is located at the described first moistureproof plane
On, described wafer fixed area is located in the described second moistureproof plane.
Further, the described second moistureproof plane is 0.5-relative to the difference in height distance of the described first moistureproof plane
1.0mm。
Specifically, the position being positioned at the described enclosure interior on described lead frame is provided with to increase described in several
The lighting angle of the lighting angle of LED wafer increases structure.
Further, described lighting angle increase structure include a stage portion, described stage portion at least include from interior outward
Tilt upward to extend and carry out reflecting and increasing light lighting angle so that light thereon will be irradiated by LED wafer several described
First divergence of beam face and intersecting with described first divergence of beam face connect and along the horizontal direction of described housing extended with
Carry out reflecting and the second divergence of beam of increasing light lighting angle by being irradiated light thereon by LED wafer several described
Face.
Further, described stage portion is 0.2-0.3mm relative to the distance at described opening top.
It is preferred that the surface of described stage portion is provided with concaveconvex structure.
Specifically, described lead frame is provided with use relative to the other end of the end face being provided with described wafer fixed area
To increase the integrated structure of described lead frame and the bonded area of described housing.
The technique effect of the encapsulating structure of LED of the present utility model is: be rule owing to lead frame is provided with several
The wafer fixed area of arrangement, except beneficially punch process, it is ensured that the stability of product, also can in encapsulation glue package several
Make to encapsulate glue during LED wafer uniformly to flow on each wafer fixed area, ensure to be located on several wafer fixed areas with this
Several LED wafer can be sealed encapsulation, improve the overall moisture-resistance reliability of the encapsulating structure of LED, also can have meanwhile
It is beneficial to reduce the use of encapsulation glue, reduces the production cost of enterprise.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the encapsulating structure of LED of the present utility model；
Fig. 2 is the schematic diagram of another angle of the encapsulating structure of LED of the present utility model, to show that lighting angle increases
Structure；
Fig. 3 is the schematic diagram of another angle of the encapsulating structure of LED of the present utility model, to show that lighting angle increases
Structure；
Fig. 4 is the schematic diagram of another angle of the encapsulating structure of LED of the present utility model, to show integrated structure；
Fig. 5 is the schematic diagram of the moisture-proof construction of the encapsulating structure of LED of the present utility model.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to this utility model.Should be appreciated that specific embodiment described herein is only in order to explain
This utility model, is not used to limit this utility model.
Refer to Fig. 1 to Fig. 3, below the embodiment of the encapsulating structure of LED of the present utility model is illustrated.
The encapsulating structure 100 of the LED of the present embodiment, is predominantly applied to be located at the surface mounted type LED display screen of open air, its
Including housing 10, lead frame 20, several LED wafer (not indicating in figure) and encapsulation glue (not indicating in figure), below to this
Each parts of the encapsulating structure 100 of LED are described further:
Housing 10 is for using Shooting Technique molding, meanwhile, when injection, can increase the thickness of housing 10 wall thickness, to increase
Product moisture effect, and reduce the consumption of encapsulation glue with this, cost-effective；And housing 10 is provided with and is available for parts and enters in it
The opening 11 in portion；
Lead frame 20 is predominantly used for forming line construction, and it is located in housing 10 by glue, and on this lead frame 10
Being provided with several by the way of punch process is regularly arranged wafer fixed area 21, and wherein, wafer fixed area 21 is square
Shape, in order to punch process；
Several LED wafer are divided on several wafer fixed areas 21；
Encapsulation glue is anti-ultraviolet glue, to ensure service life and the reliability of encapsulation glue；It addition, encapsulation glue
It is located on housing 10, and several LED wafer hermetically sealed.
It is regularly arranged wafer fixed area 21 owing to lead frame 20 is provided with several, except beneficially punch process,
Ensure the stability of product, also can make to encapsulate glue in time encapsulating several LED wafer of glue package and uniformly flow to each crystalline substance
On sheet fixed area 21, ensure that several LED wafer being located on several wafer fixed areas 21 can be sealed encapsulation with this, carry
The overall moisture-resistance reliability of the encapsulating structure 100 of high LED, meanwhile, may also be advantageous for reducing the use of encapsulation glue, reduces enterprise
The production cost of industry.
Referring to Fig. 1, several wafer fixed area 21 rectangular array in the present embodiment are arranged, in order to punching press adds
Work.And selectively, several wafer fixed areas 21 also may be configured as other array of shapes such as linear array.
Refer to Fig. 5, and combine Fig. 1, the lead frame 20 in the present embodiment is additionally provided with the pin for several LED wafer
Connect fixing pin fixed area 22, and be provided with between pin fixed area 22 and wafer fixed area 21 in order to moistureproof moisture-proof construction
30。
And the preferred implementation of moisture-proof construction 30 is, it includes a moistureproof step 31, and moistureproof step 31 includes that first prevents
Tide plane 311 and second protection against the tide plane 312 the most vertically extending relative to the first protection against the tide plane 311, pin fixed area 22 sets
In the first moistureproof plane 311, wafer fixed area 21 is located in the second moistureproof plane 312.
By the setting of moistureproof step 31, be conducive to separating LED wafer and the setting of pin, whole encapsulation can be improved with this
The moisture effect of structure.
In order to ensure while reaching required moisture effect, global design, the second moistureproof plane 312 phase can be simplified again
Difference in height distance for the first moistureproof plane 311 is 0.5-1.0mm, it is preferable that difference in height distance is 0.7mm.
Refer to Fig. 2, in the present embodiment, be positioned at the position within housing 10 on lead frame 20 and be provided with to increase
The lighting angle of the lighting angle adding several LED wafer increases structure 40, improves the encapsulating structure 100 of whole LED with this
Irradiated area.
And the preferred implementation that lighting angle increases structure 40 is that it includes that a stage portion 41, stage portion 41 are at least wrapped
Include from interior tilt the most upward to extend carry out reflecting and increasing light is luminous so that light thereon will be irradiated by several LED wafer
First divergence of beam face 411 of angle and intersecting with the first divergence of beam face 411 connects and extends along the horizontal direction of housing 10
Arrange to carry out reflecting and the second divergence of beam of increasing light lighting angle by being irradiated light thereon by several LED wafer
Face 412.
Accordingly, when several LED wafer energising work, its light produced first irradiates on the first divergence of beam face 411,
And light can carry out reflecting by the first divergence of beam face 411 and increase its lighting angle；Then, light can be refracted to second
Divergence of beam face 412, and carry out reflecting by the second divergence of beam face 412 and increase its lighting angle further, thus, just may be used
Increase the irradiated area of the encapsulating structure 100 of whole LED.
It is preferred that this stage portion 41 is 0.2-0.3mm relative to the distance at opening 11 top, in order to production and processing, and
Preferably, this distance is 0.25mm.
It addition, more uniform in order to make encapsulation glue flow in stage portion 41, the surface of stage portion 41 is provided with miniature recessed
Male structure, is equivalent to, and makes the surface coarsening of stage portion 41.
Refer to Fig. 4, relative to another of end face being provided with wafer fixed area 21 on the lead frame 20 in the present embodiment
End face is provided with the integrated structure 50 increasing lead frame 20 with the bonded area of housing 10.And integrated structure 50 is led for being located at
Stamp on coil holder 20 bottom face or concaveconvex structure, can increase the bonded area of lead frame 20 and housing 10 with this.
The foregoing is only this utility model preferred embodiment, its structure is not limited to the above-mentioned shape enumerated,
All any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, should be included in this reality
Within novel protection domain.
Claims (10)
- The encapsulating structure of 1.LED lamp, it is characterised in that including:Housing, described housing is provided with and is available for parts and enters its internal opening；Lead frame, described wire erection in described housing, and described lead frame to be provided with several be regularly arranged wafer Fixed area；Several LED wafer, several described LED wafer are divided on several described wafer fixed areas；Encapsulation glue, described encapsulation glue is located on described housing, and several described LED wafer hermetically sealed.
- 2. the encapsulating structure of LED as claimed in claim 1, it is characterised in that: several described wafer fixed areas are rectangular Array is arranged.
- 3. the encapsulating structure of LED as claimed in claim 1, it is characterised in that: it is additionally provided with on described lead frame for several The pin of described LED wafer connects fixing pin fixed area, and sets between described pin fixed area and described wafer fixed area Useful with moistureproof moisture-proof construction.
- 4. the encapsulating structure of LED as claimed in claim 3, it is characterised in that: described moisture-proof construction includes a moistureproof step, Described moistureproof step includes the first moistureproof plane and relative to the described first moistureproof moistureproof plane of plane upwardly extending second, institute Stating pin fixed area to be located in the described first moistureproof plane, described wafer fixed area is located in the described second moistureproof plane.
- 5. the encapsulating structure of LED as claimed in claim 4, it is characterised in that: the described second moistureproof plane is relative to described The difference in height distance of the first moistureproof plane is 0.5-1.0mm.
- 6. the encapsulating structure of LED as claimed in claim 1, it is characterised in that: it is positioned at the described shell on described lead frame The position in internal portion is provided with to increase the lighting angle of the lighting angle of several described LED wafer increases structure.
- 7. the encapsulating structure of LED as claimed in claim 6, it is characterised in that: described lighting angle increases structure and includes one Stage portion, described stage portion at least includes tilting to extend will be irradiated on it by LED wafer several described the most upward from interior Light carry out reflecting and the first divergence of beam face of increasing light lighting angle and with described first divergence of beam face phase commissure Connect and extended will be reflected by LED wafer irradiation light thereon several described along the horizontal direction of described housing And the second divergence of beam face of increasing light lighting angle.
- 8. the encapsulating structure of LED as claimed in claim 7, it is characterised in that: described stage portion begins relative to described opening The distance of end is 0.2-0.3mm.
- 9. the encapsulating structure of LED as claimed in claim 7, it is characterised in that: the surface of described stage portion is provided with concavo-convex knot Structure.
- 10. the encapsulating structure of the LED as described in any one of claim 1-9, it is characterised in that: on described lead frame relative to The other end of the end face being provided with described wafer fixed area is provided with the combination increasing described lead frame with described housing The integrated structure of area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620660529.0U CN205810809U (en) | 2016-06-28 | 2016-06-28 | The encapsulating structure of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620660529.0U CN205810809U (en) | 2016-06-28 | 2016-06-28 | The encapsulating structure of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205810809U true CN205810809U (en) | 2016-12-14 |
Family
ID=57511746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620660529.0U Expired - Fee Related CN205810809U (en) | 2016-06-28 | 2016-06-28 | The encapsulating structure of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205810809U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110649138A (en) * | 2018-06-27 | 2020-01-03 | 弘凯光电(深圳)有限公司 | LED light-emitting unit and LED light-emitting device |
-
2016
- 2016-06-28 CN CN201620660529.0U patent/CN205810809U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110649138A (en) * | 2018-06-27 | 2020-01-03 | 弘凯光电(深圳)有限公司 | LED light-emitting unit and LED light-emitting device |
| CN110649138B (en) * | 2018-06-27 | 2021-06-29 | 弘凯光电(深圳)有限公司 | LED light-emitting unit and LED light-emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20210628 |