CN209470157U - High-power LED composite aluminum substrate - Google Patents

Abstract

The utility model discloses high-power LED composite aluminum substrates, including aluminum base plate and several LED bulbs, shielded layer is fixed at the top of aluminum base plate, thermal insulation layer is fixed at the top of shielded layer, integrated circuit board is fixed at the top of thermal insulation layer, insulating layer is fixed at the top of integrated circuit board, the top fixation of insulating layer is plugged with several LED bulbs, and the bottom of each LED bulb is fixed with two light bulb pins.Two light bulb pins of LED bulb are connected in integrated circuit board by the utility model, and thermal insulation layer is set at the back of integrated circuit board, then increasing the contact area between aluminum base plate and thermal insulation layer by heating column, be conducive to radiate in this way, and the centre of the device is embedded with shielded layer, the interference that electromagnetic field in external environment can effectively be completely cut off by the barrier of shielded layer, guarantees the normal work of LED bulb with this.

Description

High-power LED composite aluminum substrate

Technical field

The utility model relates to aluminum substrates, specially high-power LED composite aluminum substrate.

Background technique

Aluminum substrate is common in LED illumination product, there is tow sides, and white is welding LED pin on one side, and another side is in Existing aluminium true qualities, contact after generally smearing thermally conductive solidifying slurry with thermal conduction portions.In general, LED grain is to beat gold thread, eutectic or cover Crystal type is linked on its substrate and forms LED wafer, and then LED wafer is fixed on the circuit board of system again.LED heat dissipation Aluminum substrate mainly utilizes its heat-radiating substrate material itself to have preferable heat conductivity, and heat source is exported from LED grain.

In existing high-power LED illumination heat dissipation technology, one is usually coated behind high-power LED Layer heat-conducting silicone grease, is then welded on the anode and cathode of great power LED above aluminum substrate, heat caused by light emitting diode It is to be transmitted on aluminum substrate to radiate by heat-conducting silicone grease, heat dissipation effect is simultaneously bad, in addition the inside of existing aluminum substrate Lack shielding protection layer mostly, is easy the interference by the electromagnetic field in external environment.Therefore we make improvement to this, propose High-power LED composite aluminum substrate.

Utility model content

To solve defect of the existing technology, the utility model provides high-power LED composite aluminum substrate.

In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:

The utility model high-power LED composite aluminum substrate, including aluminum base plate and several LED bulbs, the aluminum base It is fixed with shielded layer at the top of plate, thermal insulation layer, the top of the thermal insulation layer are fixed at the top of the shielded layer Portion is fixed with integrated circuit board, and insulating layer is fixed at the top of the integrated circuit board, and the top of the insulating layer is fixed Several LED bulbs are plugged with, the bottom of each LED bulb is fixed with two light bulb pins, two light bulbs The one end of pin far from LED bulb runs through insulating layer and the top of integrated circuit board is electrically connected, the top of the insulating layer Several cooling fins are fitted with, the bottom end of the cooling fin is fixed with several heating column connecting columns, and described in several Heating column connecting column is located in several apertures opened up on insulating layer.

As the optimal technical scheme of the utility model, several heating columns are fixed at the top of the aluminum base plate, Several described heating columns in matrix be distributed, the top of several heating columns run through shielded layer and with thermal insulation layer Bottom is fixedly connected, and the heating column sequentially passes through integrated circuit board, thermal insulation layer, shielded layer and fixes with aluminum base plate Connection.

As the optimal technical scheme of the utility model, the insulating layer is made of isolation protective material, and the insulation is protected Protective material is crosslinked polyethylene.

As the optimal technical scheme of the utility model, the shielded layer is made of copper material, and the shielded layer is by copper Warp is cross-woven with copper weft.

As the optimal technical scheme of the utility model, the thermal insulation layer is heat conductive silica gel insulating trip, and each institute Thermal insulation layer is stated to be made of three layers of heat conductive silica gel insulating trip superposition.

As the optimal technical scheme of the utility model, the surface of the aluminum base plate is coated with thermal dispersant coatings, described to dissipate Hot coating is made of copper material.

The beneficial effects of the utility model are: this kind of high-power LED composite aluminum substrate, first by two lamps of LED bulb Bubble pin is connected in integrated circuit board, and thermal insulation layer is arranged at the back of integrated circuit board, is then passing through heating column Increase the contact area between aluminum base plate and thermal insulation layer, is conducive to radiate in this way, and the centre of the device is embedded with Shielded layer can effectively completely cut off the interference of electromagnetic field in external environment by the barrier of shielded layer, guarantee LED bulb with this Normal work.

Detailed description of the invention

Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:

Fig. 1 is the structural schematic diagram of the utility model high-power LED composite aluminum substrate；

Fig. 2 is the partition structural schematic diagram of the utility model high-power LED composite aluminum substrate；

Fig. 3 is the heat sink structure illustration of the utility model high-power LED composite aluminum substrate；

Fig. 4 is the side elevational cross-section of the utility model high-power LED composite aluminum substrate.

In figure: 1, aluminum base plate；101, heating column；2, LED bulb；201, light bulb pin；3, shielded layer；4, insulating heat-conductive Layer；5, integrated circuit board；6, insulating layer；7, cooling fin；8, heating column connecting column；9, aperture.

Specific embodiment

It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.

Embodiment: as shown in Figure 1, Figure 2, Figure 3 and Figure 4, the utility model high-power LED composite aluminum substrate, including aluminum Substrate 1 and several LED bulbs 2, the top of aluminum base plate 1 are fixed with shielded layer 3, and the top of shielded layer 3 is fixed with absolutely Edge heat-conducting layer 4, the top of thermal insulation layer 4 are fixed with integrated circuit board 5, and the top of integrated circuit board 5 is fixed with insulation The top fixation of layer 6, insulating layer 6 is plugged with several LED bulbs 2, and the bottom of each LED bulb 2 is fixed with two lamps Pin 201 is steeped, the top electricity of insulating layer 6 and integrated circuit board 5 is run through in two one end of light bulb pin 201 far from LED bulb 2 Property connection, the top of insulating layer 6 is fitted with several cooling fins 7, and the bottom end of cooling fin 7 is fixed with several heating columns company Column 8 is connect, and several heating column connecting columns 8 are located in several apertures 9 opened up on insulating layer 6, is dissipated by what is be equipped with Backing 7 can be with assist absorption heat.

Wherein, the top of aluminum base plate 1 is fixed with several heating columns 101, several heating columns 101 are in matrix point Cloth, the top of several heating columns 101 are run through shielded layer 3 and are fixedly connected with the bottom of thermal insulation layer 4, several are arranged Heating column 101 can effectively increase rate of heat exchange between aluminum base plate 1 and thermal insulation layer 4, improve radiating efficiency, thermally conductive Column 8 sequentially passes through integrated circuit board 5, thermal insulation layer 4, shielded layer 3 and is fixedly connected with aluminum base plate 1, and cooling fin 7 assists Heat a part of absorption can be conducted by heating column 8 to aluminum base plate 1, distributed by aluminum base plate 1, further mentioned High cooling efficiency.

Wherein, insulating layer 6 is made of isolation protective material, and isolation protective material is crosslinked polyethylene, crosslinked polyethylene knot Even if structure similarly has very strong non-deformability at high temperature, in the high temperature environment can be to LED bulb 2 and integrated circuit Electronic component in plate 5 is effectively protected.

Wherein, shielded layer 3 is made of copper material, and shielded layer 3 is cross-woven by copper warp and copper weft, can be with The interference for effectively avoiding external electromagnetic field, is effectively protected the normal work of LED bulb 2.

Wherein, thermal insulation layer 4 is heat conductive silica gel insulating trip, and each thermal insulation layer 4 is exhausted by three layers of heat conductive silica gel Embolium superposition be made, heat conductive silica gel insulating trip have stronger stretching resistance, superior wear-resisting and insulation performance, surface tack free, Thickness is thin, and can be made into any shape according to demand, is easy to use.

Wherein, the surface of aluminum base plate 1 is coated with thermal dispersant coatings, and thermal dispersant coatings are made of copper material, copper material tool There is good heating conduction, the heat in aluminum base plate 1 can quickly be exported, is imitated so as to improve the heat dissipation of aluminum base plate 1 Rate.

When work, which is used as ontology by aluminum base plate 1, and two light bulb pins 201 of LED bulb 2 are passed through tin It welds and is fixedly connected with the incoming end at 5 top of integrated circuit board, ensure that the stability and good electric conductivity of connection, insulate simultaneously Layer 6 is made of crosslinked polyethylene, even if crosslinked polyethylene structure similarly has very strong non-deformability at high temperature, in height The electronic component in LED bulb 2 and integrated circuit board 5 can be effectively protected in warm environment can guarantee high-power shape In addition the normal operation of state installs shielded layer 3 additional between aluminum base plate 1 and thermal insulation layer 4, shielded layer 3 is by copper warp and copper Matter weft is cross-woven, it is possible to prevente effectively from the interference of external electromagnetic field, carries out the normal work of LED bulb 2 effective Protection, between shielded layer 3 and integrated circuit board 5 be arranged thermal insulation layer 4, thermal insulation layer 4 be heat conductive silica gel insulating trip, Heat conductive silica gel insulating trip has stronger stretching resistance, and superior wear-resisting and insulation performance, surface tack free, thickness is thin, and can root It is made into any shape according to demand, is easy to use, and good insulation can be played while guaranteeing good heating conduction The surface of protective effect, last aluminum base plate 1 is coated with thermal dispersant coatings, and thermal dispersant coatings are made of copper material, copper material tool There is good heating conduction, the heat in aluminum base plate 1 can quickly be exported, is imitated so as to improve the heat dissipation of aluminum base plate 1 Rate.

Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims (6)

1. high-power LED composite aluminum substrate, including aluminum base plate (1) and several LED bulbs (2), which is characterized in that the aluminium It is fixed with shielded layer (3) at the top of substrate (1) processed, is fixed with thermal insulation layer (4), institute at the top of the shielded layer (3) It states and is fixed at the top of thermal insulation layer (4) integrated circuit board (5), is fixed at the top of the integrated circuit board (5) absolutely The top fixation of edge layer (6), the insulating layer (6) is plugged with several LED bulbs (2), the bottom of each LED bulb (2) Portion is fixed with two light bulb pins (201), and two light bulb pins (201) are run through far from the one end of LED bulb (2) The top of insulating layer (6) and integrated circuit board (5) is electrically connected, and the top of the insulating layer (6) is fitted with several heat dissipations Piece (7), the bottom end of the cooling fin (7) are fixed with several heating column connecting columns (8), and several described heating column connections Column (8) is located in several apertures (9) opened up on insulating layer (6).

2. high-power LED composite aluminum substrate according to claim 1, which is characterized in that the top of the aluminum base plate (1) Several heating columns (101) are fixed with, several described heating columns (101) are distributed in matrix, several described heating columns (101) top is run through shielded layer (3) and is fixedly connected with the bottom of thermal insulation layer (4), the heating column connecting column (8) integrated circuit board (5), thermal insulation layer (4), shielded layer (3) are sequentially passed through and is fixedly connected with aluminum base plate (1).

3. high-power LED composite aluminum substrate according to claim 1, which is characterized in that the insulating layer (6) is protected by insulation Protective material is made, and the isolation protective material is crosslinked polyethylene.

4. high-power LED composite aluminum substrate according to claim 1, which is characterized in that the shielded layer (3) is by copper material It is made, the shielded layer (3) is cross-woven by copper warp and copper weft.

5. high-power LED composite aluminum substrate according to claim 1, which is characterized in that the thermal insulation layer (4) is to lead Hot silicone insulation piece, and each thermal insulation layer (4) is made of three layers of heat conductive silica gel insulating trip superposition.

6. high-power LED composite aluminum substrate according to claim 1, which is characterized in that the surface of the aluminum base plate (1) Thermal dispersant coatings are coated with, the thermal dispersant coatings are made of copper material.